Materials Declaration Package Body Size LeadCount Option LQFP 24 X 24 X 1.4 176 Pb-free, Halide-free Substance Silica Epoxy and Phenol resin Carbon black Subtotal Molding Compound % of Compound 86.91 12.78 0.31 100 Weight (g) 1.29 E+00 1.90 E-01 4.60 E-03 1.48 E+00 PPM 652071 95886 2326 750283 Substance Copper Nickel Silicon Magnesium Subtotal Leadframe % of Leadframe 96.20 3.00 0.65 0.15 100 Weight (g) 4.26 E-01 1.33 E-02 2.88 E-03 6.64 E-04 4.43 E-01 PPM 215420 6718 1456 336 223929 Substance Internal Leadframe Plating % of Plating Weight (g) 4.38 E-03 100 PPM Silver Substance PPM Tin External Leadframe Plating Weight (g) % of Plating 100 1.79 E-02 Molding Compound PPM Not Detected Not Detected Not Detected Not Detected Not Detected Not Detected Draft IEC62321. Draft IEC62321. Draft IEC62321. Draft IEC62321. Draft IEC62321. Draft IEC62321. Method ICP-OES. ICP-OES. ICP-OES. UV-VIS. GC-MSD. GC-MSD. Substance Lead Cadmium Mercury Chromium+6 Polybrominated biphenyls (PBB) Polybrominated Diphenyl Ethers (PBDE) Die Attach Paste PPM Not Detected Not Detected Not Detected Not Detected Not Detected Not Detected Draft IEC62321. Draft IEC62321. Draft IEC62321. Draft IEC62321. Draft IEC62321. Draft IEC62321. Method ICP-OES. ICP-OES. ICP-OES. UV-VIS. GC-MSD. GC-MSD. 2218 9056 Weight (g) 4.37 E-03 PPM Gold Bond Wires % of Wire 99.99 Substance Doped Silicon Chip % of Chip 100 Weight (g) 2.01 E-02 PPM 10183 Substance Silver Epoxy compound Anhydrides Polymeric material Subtotal Die Attach % of Die Attach 72.4 18.1 6.8 2.7 100.0 Weight (g) 3.04 E-03 7.59 E-04 2.85 E-04 1.14 E-04 4.20 E-03 PPM Substance Substance Lead Cadmium Mercury Chromium+6 Polybrominated biphenyls (PBB) Polybrominated Diphenyl Ethers (PBDE) 2209 1536 384 144 58 2122 Package Totals Weight (g) PPM 1000000 1.98 E+00 Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary Materials Declaration Package Body Size LeadCount Option LQFP 24 X 24 X 1.4 176 with Pb, Halide-free Substance Silica Epoxy and Phenol resin Carbon black Subtotal Molding Compound % of Compound 86.91 12.78 0.31 100 Weight (g) 1.29 E+00 1.90 E-01 4.60 E-03 1.48 E+00 PPM 652071 95886 2326 750283 Substance Copper Nickel Silicon Magnesium Subtotal Leadframe % of Leadframe 96.20 3.00 0.65 0.15 100 Weight (g) 4.26 E-01 1.33 E-02 2.88 E-03 6.64 E-04 4.43 E-01 PPM 215420 6718 1456 336 223929 Silver Internal Leadframe Plating % of Plating Weight (g) 4.38 E-03 100 Substance Tin Lead Subtotal External Leadframe Plating % of Plating 85 15 100 Substance PPM Substance Lead Cadmium Mercury Chromium+6 Polybrominated biphenyls (PBB) Polybrominated Diphenyl Ethers (PBDE) 2218 Weight (g) 1.52 E-02 2.69 E-03 1.79 E-02 PPM 7698 1358 9056 Bond Wires % of Wire 99.99 Weight (g) 4.37 E-03 PPM Gold Substance Doped Silicon Chip % of Chip 100 Weight (g) 2.01 E-02 PPM 10183 Substance Silver Epoxy compound Anhydrides Polymeric material Subtotal Die Attach % of Die Attach 72.4 18.1 6.79 2.71 100 Weight (g) 3.04 E-03 7.59 E-04 2.85 E-04 1.14 E-04 4.20 E-03 PPM Substance Substance Lead Cadmium Mercury Chromium+6 Polybrominated biphenyls (PBB) Polybrominated Diphenyl Ethers (PBDE) 2209 1536 384 144 58 2122 Package Totals Weight (g) PPM 1000000 1.98 E+00 Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary Molding Compound PPM Not Detected Not Detected Not Detected Not Detected Not Detected Not Detected Method Draft IEC62321. ICP-OES. Draft IEC62321. ICP-OES. Draft IEC62321. ICP-OES. Draft IEC62321. UV-VIS. Draft IEC62321. GC-MSD. Draft IEC62321. GC-MSD. Die Attach Paste PPM Not Detected Not Detected Not Detected Not Detected Not Detected Not Detected Method Draft IEC62321. ICP-OES. Draft IEC62321. ICP-OES. Draft IEC62321. ICP-OES. Draft IEC62321. UV-VIS. Draft IEC62321. GC-MSD. Draft IEC62321. GC-MSD.