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Materials Declaration
Package
Body Size
LeadCount
Option
TQFP - EP
10 X 10 X 1.0 (6.5 EP)
52
Pb-free, Halide-free
Substance
Silica
Epoxy & Phenol Resin
Carbon black
Subtotal
Molding Compound
% of Compound
88
11.5
0.5
100.0
Weight (g)
1.36 E-01
1.78 E-02
7.72 E-04
1.54 E-01
PPM
479561
62669
2723
544953
Substance
Copper
Chromium
Tin
Zinc
Subtotal
Leadframe
% of Leadframe
99.25
0.3
0.25
0.2
100
Weight (g)
9.37 E-02
2.83 E-04
2.36 E-04
1.89 E-04
9.44 E-02
PPM
330602
998
832
667
333099
Substance
Internal Leadframe Plating
Weight (g)
% of Plating
1.04 E-03
100
PPM
3668
Substance
External Leadframe Plating
% of Plating
Weight (g)
7.67 E-03
100
PPM
27036
Silver
Tin
Gold
Bond Wires
% of Wire
99.99
Weight (g)
8.83 E-04
PPM
3115
Substance
Doped Silicon
Chip
% of Chip
100
Weight (g)
2.06 E-02
PPM
72619
Substance
Silver
Epoxy compound
Anhydrides
Polymeric material
Subtotal
Die Attach
% of Die Attach
72.40
18.10
6.79
2.71
100.00
Weight (g)
3.18 E-03
7.96 E-04
2.99 E-04
1.19 E-04
4.40 E-03
PPM
11229
2807
1053
420
15509
Substance
Substance
Lead
Cadmium
Mercury
Chromium+6
Polybrominated biphenyls (PBB)
Polybrominated Diphenyl Ethers (PBDE)
Molding Compound
PPM
Not Detected
Not Detected
Not Detected
Not Detected
Not Detected
Not Detected
Substance
Lead
Cadmium
Mercury
Chromium+6
Polybrominated biphenyls (PBB)
Polybrominated Diphenyl Ethers (PBDE)
Die Attach Paste
PPM
Not Detected
Not Detected
Not Detected
Not Detected
Not Detected
Not Detected
Package Totals
PPM
Weight (g)
1000000
2.84 E-01
Note: The information provided in this declaration are true to the best of ADI's knowledge.
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary
Method
Draft IEC 62321. ICP
Draft IEC 62321. ICP
Draft IEC 62321. ICP
Draft IEC 62321. Colorimetric Method.
Draft IEC 62321. GC-MS.
Draft IEC 62321. GC-MS.
Method
IEC 62321. ICP-AES.
IEC 62321. ICP-AES.
IEC 62321. ICP-AES.
IEC 62321. UV-VIS.
IEC 62321. LC-MS.
IEC 62321. LC-MS.
Materials Declaration
Package
Body Size
LeadCount
Option
TQFP - EP
10 X 10 X 1.0 (6.5 EP)
52
with Pb, Halide-free
Substance
Silica
Epoxy & Phenol Resin
Carbon black
Subtotal
Molding Compound
% of Compound
88
11.5
0.5
100
Weight (g)
1.36 E-01
1.78 E-02
7.72 E-04
1.54 E-01
PPM
478500
62530
2717
543747
Substance
Copper
Chromium
Tin
Zinc
Subtotal
Leadframe
% of Leadframe
99.25
0.3
0.25
0.2
100
Weight (g)
9.37 E-02
2.83 E-04
2.36 E-04
1.89 E-04
9.44 E-02
PPM
329870
996
831
665
332362
Silver
Internal Leadframe Plating
Weight (g)
% of Plating
1.04 E-03
100
Substance
Tin
Lead
Subtotal
External Leadframe Plating
% of Plating
85
15
100
Substance
PPM
Molding Compound
Method
PPM
Not Detected
Draft IEC 62321. ICP
Not Detected
Draft IEC 62321. ICP
Not Detected
Draft IEC 62321. ICP
Not Detected
Draft IEC 62321. Colorimetric Method.
Not Detected
Draft IEC 62321. GC-MS.
Not Detected
Draft IEC 62321. GC-MS.
Substance
Lead
Cadmium
Mercury
Chromium+6
Polybrominated biphenyls (PBB)
Polybrominated Diphenyl Ethers (PBDE)
Die Attach Paste
PPM
Not Detected
IEC 62321. ICP-AES.
Not Detected
IEC 62321. ICP-AES.
Not Detected
IEC 62321. ICP-AES.
Not Detected
IEC 62321. UV-VIS.
Not Detected
IEC 62321. LC-MS.
Not Detected
IEC 62321. LC-MS.
3660
Weight (g)
7.05 E-03
1.24 E-03
8.29 E-03
PPM
24812
4378
29190
Gold
Bond Wires
% of Wire
99.99
Weight
(g)
8.83 E 04
PPM 3108
Substance
Doped Silicon
Chip
% of Chip
100
Weight (g)
2.06 E-02
PPM
72458
Substance
Silver
Epoxy compound
Anhydrides
Polymeric material
Subtotal
Die Attach
% of Die Attach
72.40
18.10
6.79
2.71
100.00
Weight (g)
3.18 E-03
7.96 E-04
2.99 E-04
1.19 E-04
4.40 E-03
PPM
11204
2801
1051
419
15475
Substance
Substance
Lead
Cadmium
Mercury
Chromium+6
Polybrominated biphenyls (PBB)
Polybrominated Diphenyl Ethers (PBDE)
Package Totals
PPM
Weight (g)
1000000
2.84 E-01
Note: The information provided in this declaration are true to the best of ADI's knowledge.
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary
Method