Materials Declaration Package Body Size LeadCount Option TQFP - EP 10 X 10 X 1.0 (6.5 EP) 52 Pb-free, Halide-free Substance Silica Epoxy & Phenol Resin Carbon black Subtotal Molding Compound % of Compound 88 11.5 0.5 100.0 Weight (g) 1.36 E-01 1.78 E-02 7.72 E-04 1.54 E-01 PPM 479561 62669 2723 544953 Substance Copper Chromium Tin Zinc Subtotal Leadframe % of Leadframe 99.25 0.3 0.25 0.2 100 Weight (g) 9.37 E-02 2.83 E-04 2.36 E-04 1.89 E-04 9.44 E-02 PPM 330602 998 832 667 333099 Substance Internal Leadframe Plating Weight (g) % of Plating 1.04 E-03 100 PPM 3668 Substance External Leadframe Plating % of Plating Weight (g) 7.67 E-03 100 PPM 27036 Silver Tin Gold Bond Wires % of Wire 99.99 Weight (g) 8.83 E-04 PPM 3115 Substance Doped Silicon Chip % of Chip 100 Weight (g) 2.06 E-02 PPM 72619 Substance Silver Epoxy compound Anhydrides Polymeric material Subtotal Die Attach % of Die Attach 72.40 18.10 6.79 2.71 100.00 Weight (g) 3.18 E-03 7.96 E-04 2.99 E-04 1.19 E-04 4.40 E-03 PPM 11229 2807 1053 420 15509 Substance Substance Lead Cadmium Mercury Chromium+6 Polybrominated biphenyls (PBB) Polybrominated Diphenyl Ethers (PBDE) Molding Compound PPM Not Detected Not Detected Not Detected Not Detected Not Detected Not Detected Substance Lead Cadmium Mercury Chromium+6 Polybrominated biphenyls (PBB) Polybrominated Diphenyl Ethers (PBDE) Die Attach Paste PPM Not Detected Not Detected Not Detected Not Detected Not Detected Not Detected Package Totals PPM Weight (g) 1000000 2.84 E-01 Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary Method Draft IEC 62321. ICP Draft IEC 62321. ICP Draft IEC 62321. ICP Draft IEC 62321. Colorimetric Method. Draft IEC 62321. GC-MS. Draft IEC 62321. GC-MS. Method IEC 62321. ICP-AES. IEC 62321. ICP-AES. IEC 62321. ICP-AES. IEC 62321. UV-VIS. IEC 62321. LC-MS. IEC 62321. LC-MS. Materials Declaration Package Body Size LeadCount Option TQFP - EP 10 X 10 X 1.0 (6.5 EP) 52 with Pb, Halide-free Substance Silica Epoxy & Phenol Resin Carbon black Subtotal Molding Compound % of Compound 88 11.5 0.5 100 Weight (g) 1.36 E-01 1.78 E-02 7.72 E-04 1.54 E-01 PPM 478500 62530 2717 543747 Substance Copper Chromium Tin Zinc Subtotal Leadframe % of Leadframe 99.25 0.3 0.25 0.2 100 Weight (g) 9.37 E-02 2.83 E-04 2.36 E-04 1.89 E-04 9.44 E-02 PPM 329870 996 831 665 332362 Silver Internal Leadframe Plating Weight (g) % of Plating 1.04 E-03 100 Substance Tin Lead Subtotal External Leadframe Plating % of Plating 85 15 100 Substance PPM Molding Compound Method PPM Not Detected Draft IEC 62321. ICP Not Detected Draft IEC 62321. ICP Not Detected Draft IEC 62321. ICP Not Detected Draft IEC 62321. Colorimetric Method. Not Detected Draft IEC 62321. GC-MS. Not Detected Draft IEC 62321. GC-MS. Substance Lead Cadmium Mercury Chromium+6 Polybrominated biphenyls (PBB) Polybrominated Diphenyl Ethers (PBDE) Die Attach Paste PPM Not Detected IEC 62321. ICP-AES. Not Detected IEC 62321. ICP-AES. Not Detected IEC 62321. ICP-AES. Not Detected IEC 62321. UV-VIS. Not Detected IEC 62321. LC-MS. Not Detected IEC 62321. LC-MS. 3660 Weight (g) 7.05 E-03 1.24 E-03 8.29 E-03 PPM 24812 4378 29190 Gold Bond Wires % of Wire 99.99 Weight (g) 8.83 E 04 PPM 3108 Substance Doped Silicon Chip % of Chip 100 Weight (g) 2.06 E-02 PPM 72458 Substance Silver Epoxy compound Anhydrides Polymeric material Subtotal Die Attach % of Die Attach 72.40 18.10 6.79 2.71 100.00 Weight (g) 3.18 E-03 7.96 E-04 2.99 E-04 1.19 E-04 4.40 E-03 PPM 11204 2801 1051 419 15475 Substance Substance Lead Cadmium Mercury Chromium+6 Polybrominated biphenyls (PBB) Polybrominated Diphenyl Ethers (PBDE) Package Totals PPM Weight (g) 1000000 2.84 E-01 Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary Method