pdf

Materials Declaration
Package
Body Size
LeadCount
Option
Item
Silica
Epoxy and Phenol resin
Carbon black
Subtotal
Item
Cu
Ni
Si
Mg
Subtotal
LQFP_EP
20 X 20 X 1.4
144
Pb-free
Molding Compound
% of Compound
86.91
12.78
0.31
Leadframe
% of Leadframe
96.2
3
0.65
0.15
Weight (g)
8.89 E-01
1.31 E-01
3.17 E-03
1.02 E+00
PPM
676187
99432
2412
778030
Weight (g)
1.87 E-01
5.84 E-03
1.27 E-03
2.92 E-04
1.95 E-01
PPM
142469
4443
963
222
148097
Ag
Internal Leadframe Plating
% of Plating
Weight (g)
1.93 E-03
100
Sn
External Leadframe Plating
Weight (g)
% of Plating
100
2.60 E-02
Item
PPM
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
PPM
Not Detected
Not Detected
Not Detected
Not Detected
Not Detected
Not Detected
Molding Compound
Method
EPA 3051/3052. ICP-OES
EPA 3051/3052. ICP-OES
EPA 3051/3052. ICP-OES
EPA 3060A & 7196A. UV-VIS
EPA 3550C/3540C. GC/MS
EPA 3550C/3540C. GC/MS
Die Attach Paste
Method
USEPA 3052. ICP-OES
USEPA 3052. ICP-OES
USEPA 3052. ICP-OES
EPA 3060A & 7196A. UV-VIS
USEPA 3550C/3540C. GC/MS
USEPA 3550C/3540C. GC/MS
PPM
19774
Bond Wires
% of Wire
99.99
Weight (g)
7.38 E-04
PPM
Si
Chip
% of Chip
100
Weight (g)
6.00 E-02
PPM
45631
Weight (g)
6.13 E-03
1.53 E-03
5.75 E-04
2.29 E-04
8.47 E-03
PPM
Die Attach
% of Die Attach
72.4
18.1
6.8
2.7
PPM
Not Detected
Not Detected
Not Detected
Not Detected
Not Detected
Not Detected
1467
Au
Item
Ag
Epoxy compound
Anhydrides
Polymeric material
Subtotal
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
561
4662
1166
437
174
6439
Package Totals
Weight (g)
PPM
1000000
1.31 E+00
Note: The information provided in this declaration are true to the best of ADI's knowledge.
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary
Materials Declaration
Package
Body Size
LeadCount
Option
Item
Silica
Epoxy and Phenol resin
Carbon black
Subtotal
Item
Cu
Ni
Si
Mg
Subtotal
LQFP_EP
20 X 20 X 1.4
144
SnPb
Molding Compound
% of Compound
86.91
12.78
0.31
Leadframe
% of Leadframe
96.2
3
0.65
0.15
Weight (g)
8.89 E-01
1.31 E-01
3.17 E-03
1.02 E+00
PPM
676187
99432
2412
778030
Weight (g)
1.87 E-01
5.84 E-03
1.27 E-03
2.92 E-04
1.95 E-01
PPM
142469
4443
963
222
148097
Ag
Internal Leadframe Plating
% of Plating
Weight (g)
1.93 E-03
100
Sn
Pb
Subtotal
External Leadframe Plating
Weight (g)
% of Plating
85
2.21 E-02
15
3.90 E-03
2.60 E-02
Item
PPM
Item
PPM
Not Detected
Not Detected
Not Detected
Not Detected
Not Detected
Not Detected
Molding Compound
Method
EPA 3051/3052. ICP-OES
EPA 3051/3052. ICP-OES
EPA 3051/3052. ICP-OES
EPA 3060A & 7196A. UV-VIS
EPA 3550C/3540C. GC/MS
EPA 3550C/3540C. GC/MS
Die Attach Paste
Pb
Cd
Hg
Cr+6
PBB
PBDE
Method
USEPA 3052. ICP-OES
USEPA 3052. ICP-OES
USEPA 3052. ICP-OES
EPA 3060A & 7196A. UV-VIS
USEPA 3550C/3540C. GC/MS
USEPA 3550C/3540C. GC/MS
PPM
16808
2966
19774
Bond Wires
% of Wire
99.99
Weight (g)
7.38 E-04
PPM
Si
Chip
% of Chip
100
Weight (g)
6.00 E-02
PPM
45631
Weight (g)
6.13 E-03
1.53 E-03
5.75 E-04
2.29 E-04
8.47 E-03
PPM
Die Attach
% of Die Attach
72.4
18.1
6.79
2.71
PPM
Not Detected
Not Detected
Not Detected
Not Detected
Not Detected
Not Detected
1467
Au
Item
Ag
Epoxy compound
Anhydrides
Polymeric material
Subtotal
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
561
4662
1166
437
174
6439
Package Totals
Weight (g)
PPM
1000000
1.31 E+00
Note: The information provided in this declaration are true to the best of ADI's knowledge.
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary