Materials Declaration Package Body Size LeadCount Option Item Silica Epoxy and Phenol resin Carbon black Subtotal Item Cu Ni Si Mg Subtotal LQFP_EP 20 X 20 X 1.4 144 Pb-free Molding Compound % of Compound 86.91 12.78 0.31 Leadframe % of Leadframe 96.2 3 0.65 0.15 Weight (g) 8.89 E-01 1.31 E-01 3.17 E-03 1.02 E+00 PPM 676187 99432 2412 778030 Weight (g) 1.87 E-01 5.84 E-03 1.27 E-03 2.92 E-04 1.95 E-01 PPM 142469 4443 963 222 148097 Ag Internal Leadframe Plating % of Plating Weight (g) 1.93 E-03 100 Sn External Leadframe Plating Weight (g) % of Plating 100 2.60 E-02 Item PPM Item Pb Cd Hg Cr+6 PBB PBDE PPM Not Detected Not Detected Not Detected Not Detected Not Detected Not Detected Molding Compound Method EPA 3051/3052. ICP-OES EPA 3051/3052. ICP-OES EPA 3051/3052. ICP-OES EPA 3060A & 7196A. UV-VIS EPA 3550C/3540C. GC/MS EPA 3550C/3540C. GC/MS Die Attach Paste Method USEPA 3052. ICP-OES USEPA 3052. ICP-OES USEPA 3052. ICP-OES EPA 3060A & 7196A. UV-VIS USEPA 3550C/3540C. GC/MS USEPA 3550C/3540C. GC/MS PPM 19774 Bond Wires % of Wire 99.99 Weight (g) 7.38 E-04 PPM Si Chip % of Chip 100 Weight (g) 6.00 E-02 PPM 45631 Weight (g) 6.13 E-03 1.53 E-03 5.75 E-04 2.29 E-04 8.47 E-03 PPM Die Attach % of Die Attach 72.4 18.1 6.8 2.7 PPM Not Detected Not Detected Not Detected Not Detected Not Detected Not Detected 1467 Au Item Ag Epoxy compound Anhydrides Polymeric material Subtotal Item Pb Cd Hg Cr+6 PBB PBDE 561 4662 1166 437 174 6439 Package Totals Weight (g) PPM 1000000 1.31 E+00 Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary Materials Declaration Package Body Size LeadCount Option Item Silica Epoxy and Phenol resin Carbon black Subtotal Item Cu Ni Si Mg Subtotal LQFP_EP 20 X 20 X 1.4 144 SnPb Molding Compound % of Compound 86.91 12.78 0.31 Leadframe % of Leadframe 96.2 3 0.65 0.15 Weight (g) 8.89 E-01 1.31 E-01 3.17 E-03 1.02 E+00 PPM 676187 99432 2412 778030 Weight (g) 1.87 E-01 5.84 E-03 1.27 E-03 2.92 E-04 1.95 E-01 PPM 142469 4443 963 222 148097 Ag Internal Leadframe Plating % of Plating Weight (g) 1.93 E-03 100 Sn Pb Subtotal External Leadframe Plating Weight (g) % of Plating 85 2.21 E-02 15 3.90 E-03 2.60 E-02 Item PPM Item PPM Not Detected Not Detected Not Detected Not Detected Not Detected Not Detected Molding Compound Method EPA 3051/3052. ICP-OES EPA 3051/3052. ICP-OES EPA 3051/3052. ICP-OES EPA 3060A & 7196A. UV-VIS EPA 3550C/3540C. GC/MS EPA 3550C/3540C. GC/MS Die Attach Paste Pb Cd Hg Cr+6 PBB PBDE Method USEPA 3052. ICP-OES USEPA 3052. ICP-OES USEPA 3052. ICP-OES EPA 3060A & 7196A. UV-VIS USEPA 3550C/3540C. GC/MS USEPA 3550C/3540C. GC/MS PPM 16808 2966 19774 Bond Wires % of Wire 99.99 Weight (g) 7.38 E-04 PPM Si Chip % of Chip 100 Weight (g) 6.00 E-02 PPM 45631 Weight (g) 6.13 E-03 1.53 E-03 5.75 E-04 2.29 E-04 8.47 E-03 PPM Die Attach % of Die Attach 72.4 18.1 6.79 2.71 PPM Not Detected Not Detected Not Detected Not Detected Not Detected Not Detected 1467 Au Item Ag Epoxy compound Anhydrides Polymeric material Subtotal Item Pb Cd Hg Cr+6 PBB PBDE 561 4662 1166 437 174 6439 Package Totals Weight (g) PPM 1000000 1.31 E+00 Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary