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Materials Declaration
Package
Body Size
LeadCount
Option
Item
SiO2 Filler
Resin
Carbon black
Subtotal
Item
Cu
Ni
Si
Mg
Subtotal
Ag
Item
Sn
TQFP_EP
7 x 7 x 1.0 (5.1 mm exposed pad)
48
Pb-free
Molding Compound
% of Compound
Weight (g)
86.91
7.61 E-02
12.78
1.12 E-02
0.31
2.72 E-04
8.76 E-02
Leadframe
% of Leadframe
96.20
3.00
0.65
0.15
Molding Compound
PPM
524680
77153
1875
603708
Weight (g)
3.22 E-02
1.00 E-03
2.17 E-04
5.00 E-05
3.34 E-02
PPM
221803
6914
1496
345
230557
Internal Leadframe Plating
% of Plating
Weight (g)
3.31 E-04
100.0
PPM
2282
External Leadframe Plating
Weight (g)
% of Plating
100.0
5.26 E-03
PPM
36230
Au
Bond Wires
% of Wire
99.99
Si
% of Chip
100.0
Weight (g)
1.10 E-03
PPM
7610
Weight (g)
1.47 E-02
PPM
101589
Weight (g)
1.89 E-03
4.73 E-04
1.78 E-04
7.10 E-05
2.62 E-03
PPM
13048
3260
1227
489
18025
Package Totals
Weight (g)
1.45 E-01
PPM
1000000
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
PPM
None Detected
None Detected
None Detected
None Detected
None Detected
None Detected
Method
EPA Method 3051A/3052. ICP-OES
EPA Method 3051A/3052. ICP-OES
EPA Method 3051A/3052. ICP-OES
EPA Method 3060A & 7196A. UV-VIS.
EPA Method 3540C/3550C. GC/MS.
EPA Method 3540C/3550C. GC/MS.
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
PPM
None Detected
None Detected
None Detected
None Detected
None Detected
None Detected
Die Attach Paste
Method
EPA Method 3051A/3052. ICP-OES
EPA Method 3051A/3052. ICP-OES
EPA Method 3051A/3052. ICP-OES
EPA Method 3060A & 7196A. UV-VIS.
EPA Method 3540C/3550C. GC/MS.
EPA Method 3540C/3550C. GC/MS.
Chip
Item
Ag
Epoxy compound
Anhydrides
Polymeric material
Subtotal
Die Attach
% of Die Attach
72.4
18.1
6.8
2.7
Note: The information provided in this declaration are true to the best of ADI's knowledge.
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary