Product / Package Information Environmental Information Package Body Size (mm) Lead Count Terminal Finish RoHS Compliant High Temperature Compliant Halogen Free Compliant REACH SVHC Compliant LFCSP - Sawn 5 X 5 X 1.45 32 100 Sn Yes with exemption Yes Yes Yes Materials Declaration Molding Compound Homogeneous Material Level Description Other inorganic materials Thermosets Thermosets Other inorganic materials Subtotal Substance Silica Epoxy resin Phenol resin Carbon black CAS# 60676-86-0 Proprietary Proprietary 1333-86-4 Component Level Weight (g) 5.53E-02 1.77E-03 1.77E-03 1.77E-04 5.90E-02 Percentage (%) PPM Percentage (%) 93.7 3.0 3.0 0.3 100.00 937000 30000 30000 3000 1000000 51.95 1.66 1.66 0.17 55.44 PPM 519516 16633 16633 1663 554446 Leadframe Homogeneous Material Level Description Copper & its alloys Copper & its alloys Copper & its alloys Copper & its alloys Subtotal Substance Copper Nickel Silicon Magnesium CAS# 7440-50-8 7440-02-0 7440-21-3 7439-95-4 Component Level Weight (g) 2.84 E-02 8.86 E-04 1.92 E-04 4.43 E-05 2.95 E-02 Percentage (%) PPM Percentage (%) 96.20 3.00 0.65 0.15 100.00 962000 30000 6500 1500 1000000 26.69 0.83 0.18 0.04 27.75 PPM 266914 8324 1803 416 277458 Internal Leadframe Plating Homogeneous Material Level Description Precious metals Substance Silver CAS# 7440-22-4 Component Level Weight (g) 3.50 E-04 Percentage (%) PPM Percentage (%) 100.0 1000000 0.33 PPM 3290 External Leadframe Plating Homogeneous Material Level Substance Description Tin & its alloys Tin CAS# 7440-31-5 Component Level Weight (g) 2.50 E-04 Percentage (%) PPM Percentage (%) 100.0 1000000 0.23 PPM 2350 Bond Wires Homogeneous Material Level Description Precious metals Precious metals Subtotal Substance Gold Palladium CAS# 7440-57-5 7440-05-3 Component Level Weight (g) 8.32 E-04 8.40 E-06 8.40 E-04 Percentage (%) PPM Percentage (%) 99.0 1.00 100.0 990000 10000 1000000 0.78 0.008 0.79 PPM 7816 79 7895 Chip Homogeneous Material Level Description Other inorganic materials Substance Doped Silicon CAS# 7440-21-3 Component Level Weight (g) 8.40 E-03 Percentage (%) PPM Percentage (%) 100.0 1000000 7.90 PPM 78951 Die Attach Homogeneous Material Level Description Other organic materials Other organic materials Other organic materials Subtotal Substance Resin Ethene, tetrafluoro-,homopolymer [3-(2,3-Epoxypropoxy)propyl]trimethoxysilane CAS# Proprietary 9002-84-0 2530-83-8 Component Level Weight (g) 3.58 E-03 3.22 E-03 3.58 E-04 7.16 E-03 Percentage (%) PPM Percentage (%) 50 45 5 100.0 500000 450000 50000 1000000 3.36 3.03 0.34 6.73 PPM 33648 30284 3365 67297 Seal Glass Description Ceramics/Glass Ceramics/Glass Package Totals Substance Lead borosilicate glass Aluminosilicate glass CAS# Weight (g) 65997-17-3 65997-17-3 7.74 E-04 1.11 E-04 8.85 E-04 Weight (g) 1.06 E-01 Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary Homogeneous Material Level Percentage (%) PPM 87.5 875000 12.5 125000 Component Level Percentage (%) 0.73 0.10 0.83 PPM Percentage (%) 100 PPM 1000000 7274 1039 8314