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Product / Package Information
Environmental Information
Package
Body Size (mm)
Lead Count
Terminal Finish
RoHS Compliant
High Temperature Compliant
Halogen Free Compliant
REACH SVHC Compliant
LFCSP - Sawn
5 X 5 X 1.45
32
100 Sn
Yes with exemption
Yes
Yes
Yes
Materials Declaration
Molding Compound
Homogeneous Material Level
Description
Other inorganic materials
Thermosets
Thermosets
Other inorganic materials
Subtotal
Substance
Silica
Epoxy resin
Phenol resin
Carbon black
CAS#
60676-86-0
Proprietary
Proprietary
1333-86-4
Component Level
Weight (g)
5.53E-02
1.77E-03
1.77E-03
1.77E-04
5.90E-02
Percentage (%)
PPM
Percentage (%)
93.7
3.0
3.0
0.3
100.00
937000
30000
30000
3000
1000000
51.95
1.66
1.66
0.17
55.44
PPM
519516
16633
16633
1663
554446
Leadframe
Homogeneous Material Level
Description
Copper & its alloys
Copper & its alloys
Copper & its alloys
Copper & its alloys
Subtotal
Substance
Copper
Nickel
Silicon
Magnesium
CAS#
7440-50-8
7440-02-0
7440-21-3
7439-95-4
Component Level
Weight (g)
2.84 E-02
8.86 E-04
1.92 E-04
4.43 E-05
2.95 E-02
Percentage (%)
PPM
Percentage (%)
96.20
3.00
0.65
0.15
100.00
962000
30000
6500
1500
1000000
26.69
0.83
0.18
0.04
27.75
PPM
266914
8324
1803
416
277458
Internal Leadframe Plating
Homogeneous Material Level
Description
Precious metals
Substance
Silver
CAS#
7440-22-4
Component Level
Weight (g)
3.50 E-04
Percentage (%)
PPM
Percentage (%)
100.0
1000000
0.33
PPM
3290
External Leadframe Plating
Homogeneous Material Level
Substance
Description
Tin & its alloys
Tin
CAS#
7440-31-5
Component Level
Weight (g)
2.50 E-04
Percentage (%)
PPM
Percentage (%)
100.0
1000000
0.23
PPM
2350
Bond Wires
Homogeneous Material Level
Description
Precious metals
Precious metals
Subtotal
Substance
Gold
Palladium
CAS#
7440-57-5
7440-05-3
Component Level
Weight (g)
8.32 E-04
8.40 E-06
8.40 E-04
Percentage (%)
PPM
Percentage (%)
99.0
1.00
100.0
990000
10000
1000000
0.78
0.008
0.79
PPM
7816
79
7895
Chip
Homogeneous Material Level
Description
Other inorganic materials
Substance
Doped Silicon
CAS#
7440-21-3
Component Level
Weight (g)
8.40 E-03
Percentage (%)
PPM
Percentage (%)
100.0
1000000
7.90
PPM
78951
Die Attach
Homogeneous Material Level
Description
Other organic materials
Other organic materials
Other organic materials
Subtotal
Substance
Resin
Ethene, tetrafluoro-,homopolymer
[3-(2,3-Epoxypropoxy)propyl]trimethoxysilane
CAS#
Proprietary
9002-84-0
2530-83-8
Component Level
Weight (g)
3.58 E-03
3.22 E-03
3.58 E-04
7.16 E-03
Percentage (%)
PPM
Percentage (%)
50
45
5
100.0
500000
450000
50000
1000000
3.36
3.03
0.34
6.73
PPM
33648
30284
3365
67297
Seal Glass
Description
Ceramics/Glass
Ceramics/Glass
Package Totals
Substance
Lead borosilicate glass
Aluminosilicate glass
CAS#
Weight (g)
65997-17-3
65997-17-3
7.74 E-04
1.11 E-04
8.85 E-04
Weight (g)
1.06 E-01
Note: The information provided in this declaration are true to the best of ADI's knowledge.
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary
Homogeneous Material Level
Percentage (%)
PPM
87.5
875000
12.5
125000
Component Level
Percentage (%)
0.73
0.10
0.83
PPM
Percentage (%)
100
PPM
1000000
7274
1039
8314