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Product / Package Information
Environmental Information
Package
Body Size (mm)
Lead Count
Terminal Finish
RoHS Compliant
High Temperature Compliant
Halogen Free Compliant
REACH SVHC Compliant
LFCSP - Punched, Stacked Die
10 X 10 X 0.85 (5.3 EP)
72
100 Sn
Yes
Yes
Yes
Yes
Materials Declaration
Molding Compound
Component Level
Homogeneous Material Level
Substance
Description
Other inorganic materials
Thermosets
Other inorganic materials
Subtotal
Silica
Epoxy & Phenol Resin
Carbon black
CAS#
60676-86-0
Proprietary
1333-86-4
Weight (g)
1.16E-01
1.71E-02
4.15E-04
1.34E-01
Percentage (%)
PPM
Percentage (%)
86.91
12.78
0.31
100.00
869100
127800
3100
1000000
35.26
5.19
0.13
40.57
PPM
352608
51851
1258
405716
Leadframe
Homogeneous Material Level
Substance
Description
Copper & its alloys
Copper & its alloys
Copper & its alloys
Copper & its alloys
Subtotal
Copper
Iron
Zinc
Phosphorus
CAS#
7440-50-8
7439-89-6
7440-66-6
7723-14-0
Component Level
Weight (g)
1.76 E-01
4.25 E-03
2.17 E-04
5.42 E-05
1.81 E-01
Percentage (%)
PPM
Percentage (%)
97.50
2.35
0.12
0.03
100.00
975000
23500
1200
300
1000000
53.35
1.29
0.07
0.02
54.72
PPM
533530
12859
657
164
547210
Internal Leadframe Plating
Homogeneous Material Level
Description
Precious metals
Substance
Silver
CAS#
7440-22-4
Component Level
Weight (g)
1.81 E-04
Percentage (%)
PPM
Percentage (%)
100.0
1000000
0.05
PPM
547
External Leadframe Plating
Homogeneous Material Level
Description
Tin & its alloys
Substance
Tin
CAS#
7440-31-5
Component Level
Weight (g)
3.07 E-03
Percentage (%)
PPM
Percentage (%)
100.0
1000000
0.93
PPM
9291
Bond Wires
Homogeneous Material Level
Description
Precious metals
Substance
Gold
CAS#
7440-57-5
Component Level
Weight (g)
1.43 E-03
Percentage (%)
PPM
Percentage (%)
100.0
1000000
0.43
PPM
4335
Chip
Homogeneous Material Level
Description
Other inorganic materials
Substance
Doped Silicon
CAS#
7440-21-3
Component Level
Weight (g)
9.36 E-03
Percentage (%)
PPM
Percentage (%)
100.0
1000000
2.83
PPM
28350
Die Attach 1
Component Level
Homogeneous Material Level
Description
Precious metals
Other organic materials
Others
Other organic materials
Other organic materials
Others
Others
Subtotal
Substance
Silver
Epoxy resin A
Anhydride
2,6-Diglycidyl phenyl allyl ether oligomer
Epoxy resin B
Epoxy resin modifier
Anhydride
CAS#
7440-22-4
TS ref# 10013
TS ref# 10181
Unassigned
TS ref# 10237
TS ref# 10038
TS ref# 10180
Weight (g)
7.68 E-05
7.68 E-06
7.68 E-06
3.07 E-06
3.07 E-06
3.07 E-06
3.07 E-06
1.05 E-04
Percentage (%)
PPM
Percentage (%)
73.54
7.35
7.35
2.94
2.94
2.94
2.94
100.0
735400
73500
73500
29400
29400
29400
29400
1000000
0.02
0.002
0.002
0.001
0.001
0.001
0.001
0.03
PPM
233
23
23
9
9
9
9
317
Die Attach 2
Homogeneous Material Level
Description
Other organic materials
Other organic materials
Other organic materials
Subtotal
Package Totals
Substance
Resin
Ethene, tetrafluoro-,homopolymer
[3-(2,3-Epoxypropoxy)propyl]trimethoxysilane
CAS#
Proprietary
9002-84-0
2530-83-8
Component Level
Weight (g)
6.99 E-04
6.29 E-04
6.99 E-05
1.40 E-03
Weight (g)
3.30 E-01
Note: The information provided in this declaration are true to the best of ADI's knowledge.
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary
Percentage (%)
PPM
Percentage (%)
50.0
45.0
5.0
100.0
500000
450000
50000
1000000
0.21
0.19
0.02
0.42
Percentage (%)
100
PPM
2117
1905
212
4234
PPM
1000000