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Product / Package Information
Environmental Information
Package
Body Size (mm)
Lead Count
Terminal Finish
RoHS Compliant
High Temperature Compliant
Halogen Free Compliant
REACH SVHC Compliant
LFCSP - Punched, Stacked Die
6 X 6 X 0.85 (4.5 EP)
40
100 Sn
Yes
Yes
Yes
Yes
Materials Declaration
Molding Compound
Component Level
Homogeneous Material Level
Substance
Description
Other inorganic materials
Thermosets
Other inorganic materials
Subtotal
Silica
Epoxy & Phenol Resin
Carbon black
CAS#
Weight (g)
60676-86-0
Proprietary
1333-86-4
3.76E-02
5.53E-03
1.34E-04
4.32E-02
Percentage (%)
PPM
Percentage (%)
86.91
12.78
0.31
100.00
869100
127800
3100
1000000
31.11
4.57
0.11
35.79
PPM
311094
45746
1110
357949
Leadframe
Homogeneous Material Level
Substance
Description
Copper & its alloys
Copper & its alloys
Copper & its alloys
Copper & its alloys
Subtotal
Copper
Iron
Zinc
Phosphorus
CAS#
Component Level
Weight (g)
7440-50-8
7439-89-6
7440-66-6
7723-14-0
6.34 E-02
1.53 E-03
7.80 E-05
1.95 E-05
6.50 E-02
Percentage (%)
PPM
Percentage (%)
97.50
2.35
0.12
0.03
100.00
975000
23500
1200
300
1000000
52.50
1.27
0.06
0.02
53.84
PPM
524985
12653
646
162
538447
Internal Leadframe Plating
Homogeneous Material Level
Description
Precious metals
Substance
Silver
CAS#
Component Level
Weight (g)
7440-22-4
6.50 E-04
Percentage (%)
PPM
Percentage (%)
100.0
1000000
0.54
PPM
5384
External Leadframe Plating
Homogeneous Material Level
Description
Tin & its alloys
Substance
Tin
CAS#
7440-31-5
Component Level
Weight (g)
2.21 E-03
Percentage (%)
PPM
Percentage (%)
100.0
1000000
1.83
PPM
18306
Bond Wires
Homogeneous Material Level
Description
Precious metals
Substance
Gold
CAS#
7440-57-5
Component Level
Weight (g)
9.46 E-04
Percentage (%)
PPM
Percentage (%)
100.0
1000000
0.78
PPM
7830
Chip
Homogeneous Material Level
Substance
Description
Other inorganic materials
Doped Silicon
CAS#
7440-21-3
Component Level
Weight (g)
7.61 E-03
Percentage (%)
PPM
Percentage (%)
100.0
1000000
6.30
PPM
63030
Die Attach 1
Homogeneous Material Level
Description
Precious metals
Other organic materials
Others
Other organic materials
Other organic materials
Others
Others
Subtotal
Substance
Silver
Epoxy resin A
Anhydride
2,6-Diglycidyl phenyl allyl ether oligomer
Epoxy resin B
Epoxy resin modifier
Anhydride
CAS#
7440-22-4
TS ref# 10013
TS ref# 10181
Unassigned
TS ref# 10237
TS ref# 10038
TS ref# 10180
Component Level
Weight (g)
7.79 E-04
7.78 E-05
7.78 E-05
3.11 E-05
3.11 E-05
3.11 E-05
3.11 E-05
1.06 E-03
Percentage (%)
PPM
Percentage (%)
73.54
7.35
7.35
2.94
2.94
2.94
2.94
100.0
735400
73500
73500
29400
29400
29400
29400
1000000
0.64
0.064
0.064
0.026
0.026
0.026
0.026
0.88
PPM
6446
644
644
258
258
258
258
8766
Die Attach 2
Component Level
Homogeneous Material Level
Description
Other organic materials
Other organic materials
Other organic materials
Subtotal
Package Totals
Substance
Resin
Ethene, tetrafluoro-,homopolymer
[3-(2,3-Epoxypropoxy)propyl]trimethoxysilane
CAS#
Proprietary
9002-84-0
2530-83-8
Weight (g)
1.73 E-05
1.56 E-05
1.73 E-06
3.47 E-05
Weight (g)
1.21 E-01
Note: The information provided in this declaration are true to the best of ADI's knowledge.
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary
Percentage (%)
PPM
Percentage (%)
50.0
45.0
5.0
100.0
500000
450000
50000
1000000
0.01
0.01
0.001
0.03
Percentage (%)
100
PPM
143
129
14
287
PPM
1000000