Product / Package Information Environmental Information Package Body Size (mm) Lead Count Terminal Finish RoHS Compliant High Temperature Compliant Halogen Free Compliant REACH SVHC Compliant LFCSP - Punched, Stacked Die 6 X 6 X 0.85 (4.5 EP) 40 100 Sn Yes Yes Yes Yes Materials Declaration Molding Compound Component Level Homogeneous Material Level Substance Description Other inorganic materials Thermosets Other inorganic materials Subtotal Silica Epoxy & Phenol Resin Carbon black CAS# Weight (g) 60676-86-0 Proprietary 1333-86-4 3.76E-02 5.53E-03 1.34E-04 4.32E-02 Percentage (%) PPM Percentage (%) 86.91 12.78 0.31 100.00 869100 127800 3100 1000000 31.11 4.57 0.11 35.79 PPM 311094 45746 1110 357949 Leadframe Homogeneous Material Level Substance Description Copper & its alloys Copper & its alloys Copper & its alloys Copper & its alloys Subtotal Copper Iron Zinc Phosphorus CAS# Component Level Weight (g) 7440-50-8 7439-89-6 7440-66-6 7723-14-0 6.34 E-02 1.53 E-03 7.80 E-05 1.95 E-05 6.50 E-02 Percentage (%) PPM Percentage (%) 97.50 2.35 0.12 0.03 100.00 975000 23500 1200 300 1000000 52.50 1.27 0.06 0.02 53.84 PPM 524985 12653 646 162 538447 Internal Leadframe Plating Homogeneous Material Level Description Precious metals Substance Silver CAS# Component Level Weight (g) 7440-22-4 6.50 E-04 Percentage (%) PPM Percentage (%) 100.0 1000000 0.54 PPM 5384 External Leadframe Plating Homogeneous Material Level Description Tin & its alloys Substance Tin CAS# 7440-31-5 Component Level Weight (g) 2.21 E-03 Percentage (%) PPM Percentage (%) 100.0 1000000 1.83 PPM 18306 Bond Wires Homogeneous Material Level Description Precious metals Substance Gold CAS# 7440-57-5 Component Level Weight (g) 9.46 E-04 Percentage (%) PPM Percentage (%) 100.0 1000000 0.78 PPM 7830 Chip Homogeneous Material Level Substance Description Other inorganic materials Doped Silicon CAS# 7440-21-3 Component Level Weight (g) 7.61 E-03 Percentage (%) PPM Percentage (%) 100.0 1000000 6.30 PPM 63030 Die Attach 1 Homogeneous Material Level Description Precious metals Other organic materials Others Other organic materials Other organic materials Others Others Subtotal Substance Silver Epoxy resin A Anhydride 2,6-Diglycidyl phenyl allyl ether oligomer Epoxy resin B Epoxy resin modifier Anhydride CAS# 7440-22-4 TS ref# 10013 TS ref# 10181 Unassigned TS ref# 10237 TS ref# 10038 TS ref# 10180 Component Level Weight (g) 7.79 E-04 7.78 E-05 7.78 E-05 3.11 E-05 3.11 E-05 3.11 E-05 3.11 E-05 1.06 E-03 Percentage (%) PPM Percentage (%) 73.54 7.35 7.35 2.94 2.94 2.94 2.94 100.0 735400 73500 73500 29400 29400 29400 29400 1000000 0.64 0.064 0.064 0.026 0.026 0.026 0.026 0.88 PPM 6446 644 644 258 258 258 258 8766 Die Attach 2 Component Level Homogeneous Material Level Description Other organic materials Other organic materials Other organic materials Subtotal Package Totals Substance Resin Ethene, tetrafluoro-,homopolymer [3-(2,3-Epoxypropoxy)propyl]trimethoxysilane CAS# Proprietary 9002-84-0 2530-83-8 Weight (g) 1.73 E-05 1.56 E-05 1.73 E-06 3.47 E-05 Weight (g) 1.21 E-01 Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary Percentage (%) PPM Percentage (%) 50.0 45.0 5.0 100.0 500000 450000 50000 1000000 0.01 0.01 0.001 0.03 Percentage (%) 100 PPM 143 129 14 287 PPM 1000000