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Product / Package Information
Environmental Information
Package
Body Size (mm)
Lead Count
Terminal Finish
RoHS Compliant
High Temperature Compliant
Halogen Free Compliant
REACH SVHC Compliant
LFCSP - Sawn
6 X 6 X 0.75 (3.9 EP)
36
100 Sn
Yes
Yes
Yes
Yes
Materials Declaration
Molding Compound
Homogeneous Material Level
Substance
Description
Other inorganic materials
Thermosets
Thermosets
Other inorganic materials
Other inorganic materials
Subtotal
Silica
Epoxy resin
Phenol resin
Metal Hydroxide
Carbon black
CAS#
Component Level
Weight (g)
60676-86-0
Proprietary
Proprietary
Proprietary
1333-86-4
5.12E-02
3.56E-03
3.56E-03
8.90E-04
1.78E-04
5.94 E-02
Percentage (%)
PPM
Percentage (%)
86.2
6.0
6.0
1.5
0.3
100.00
862000
60000
60000
15000
3000
1000000
40.90
2.85
2.85
0.71
0.14
47.45
PPM
408981
28467
28467
7117
1423
474455
Leadframe
Homogeneous Material Level
Substance
Description
Copper & its alloys
Copper & its alloys
Copper & its alloys
Copper & its alloys
Subtotal
Copper
Iron
Zinc
Phosphorus
CAS#
Component Level
Weight (g)
7440-50-8
7439-89-6
7440-66-6
7723-14-0
5.66 E-02
1.36 E-03
6.97 E-05
1.74 E-05
5.81 E-02
Percentage (%)
PPM
Percentage (%)
97.50
2.35
0.12
0.03
100.00
975000
23500
1200
300
1000000
45.24
1.09
0.06
0.01
46.40
PPM
452446
10905
557
139
464048
Internal Leadframe Plating
Homogeneous Material Level
Description
Precious metals
Substance
CAS#
7440-22-4
Silver
Component Level
Weight (g)
5.81 E-05
Percentage (%)
PPM
Percentage (%)
100.0
1000000
0.05
PPM
464
External Leadframe Plating
Homogeneous Material Level
Substance
Description
Tin & its alloys
Tin
CAS#
Component Level
Weight (g)
7440-31-5
3.02 E-03
Percentage (%)
PPM
Percentage (%)
100.0
1000000
2.42
PPM
24170
Bond Wires
Component Level
Homogeneous Material Level
Substance
Description
Precious metals
Gold
CAS#
Weight (g)
7.47 E-04
7440-57-5
Percentage (%)
PPM
Percentage (%)
100.0
1000000
0.60
PPM
5970
Chip
Component Level
Homogeneous Material Level
Description
Other inorganic materials
Substance
Doped Silicon
CAS#
Weight (g)
7440-21-3
3.33 E-03
Percentage (%)
PPM
Percentage (%)
100.0
1000000
2.66
PPM
26589
Die Attach
Homogeneous Material Level
Description
Precious metals
Thermoset
Other organic materials
Other organic materials
Other organic materials
Other organic materials
Other organic materials
Other inorganic materials
Other organic materials
Subtotal
Package Totals
Substance
Silver
Epichlorohydrin-formaldehyde-phenol copolymer
Epoxy resin, epichlorohydrin-dimer fatty acid
Butyrolactone, gammaPoly(oxypropylene)diamine
2,6-Diglycidyl phenyl allyl ether oligomer
Organosilane
Copper(II) oxide
Epoxy resin modifier
CAS#
Component Level
Weight (g)
7440-22-4
9003-36-5
68475-94-5
96-48-0
9046-10-0
Unassigned
TS ref# 10001
1317-38-0
TS ref# 10038
4.18 E-04
1.67 E-05
1.67 E-05
1.67 E-05
1.67 E-05
1.67 E-05
1.67 E-05
1.67 E-05
2.80 E-06
5.38 E-04
Weight (g)
1.25 E-01
Note: The information provided in this declaration are true to the best of ADI's knowledge.
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary
Percentage (%)
PPM
Percentage (%)
77.71
3.11
3.11
3.11
3.11
3.11
3.11
3.11
0.52
100.0
777100
31100
31100
31100
31100
31100
31100
31100
5200
1000000
0.33
0.01
0.01
0.01
0.01
0.01
0.01
0.01
0.002
0.43
Percentage (%)
100
PPM
3344
134
134
134
134
134
134
134
22
4303
PPM
1000000