Product / Package Information Environmental Information Package Body Size (mm) Lead Count Terminal Finish RoHS Compliant High Temperature Compliant Halogen Free Compliant REACH SVHC Compliant LFCSP - Sawn 6 X 6 X 0.75 (3.9 EP) 36 100 Sn Yes Yes Yes Yes Materials Declaration Molding Compound Homogeneous Material Level Substance Description Other inorganic materials Thermosets Thermosets Other inorganic materials Other inorganic materials Subtotal Silica Epoxy resin Phenol resin Metal Hydroxide Carbon black CAS# Component Level Weight (g) 60676-86-0 Proprietary Proprietary Proprietary 1333-86-4 5.12E-02 3.56E-03 3.56E-03 8.90E-04 1.78E-04 5.94 E-02 Percentage (%) PPM Percentage (%) 86.2 6.0 6.0 1.5 0.3 100.00 862000 60000 60000 15000 3000 1000000 40.90 2.85 2.85 0.71 0.14 47.45 PPM 408981 28467 28467 7117 1423 474455 Leadframe Homogeneous Material Level Substance Description Copper & its alloys Copper & its alloys Copper & its alloys Copper & its alloys Subtotal Copper Iron Zinc Phosphorus CAS# Component Level Weight (g) 7440-50-8 7439-89-6 7440-66-6 7723-14-0 5.66 E-02 1.36 E-03 6.97 E-05 1.74 E-05 5.81 E-02 Percentage (%) PPM Percentage (%) 97.50 2.35 0.12 0.03 100.00 975000 23500 1200 300 1000000 45.24 1.09 0.06 0.01 46.40 PPM 452446 10905 557 139 464048 Internal Leadframe Plating Homogeneous Material Level Description Precious metals Substance CAS# 7440-22-4 Silver Component Level Weight (g) 5.81 E-05 Percentage (%) PPM Percentage (%) 100.0 1000000 0.05 PPM 464 External Leadframe Plating Homogeneous Material Level Substance Description Tin & its alloys Tin CAS# Component Level Weight (g) 7440-31-5 3.02 E-03 Percentage (%) PPM Percentage (%) 100.0 1000000 2.42 PPM 24170 Bond Wires Component Level Homogeneous Material Level Substance Description Precious metals Gold CAS# Weight (g) 7.47 E-04 7440-57-5 Percentage (%) PPM Percentage (%) 100.0 1000000 0.60 PPM 5970 Chip Component Level Homogeneous Material Level Description Other inorganic materials Substance Doped Silicon CAS# Weight (g) 7440-21-3 3.33 E-03 Percentage (%) PPM Percentage (%) 100.0 1000000 2.66 PPM 26589 Die Attach Homogeneous Material Level Description Precious metals Thermoset Other organic materials Other organic materials Other organic materials Other organic materials Other organic materials Other inorganic materials Other organic materials Subtotal Package Totals Substance Silver Epichlorohydrin-formaldehyde-phenol copolymer Epoxy resin, epichlorohydrin-dimer fatty acid Butyrolactone, gammaPoly(oxypropylene)diamine 2,6-Diglycidyl phenyl allyl ether oligomer Organosilane Copper(II) oxide Epoxy resin modifier CAS# Component Level Weight (g) 7440-22-4 9003-36-5 68475-94-5 96-48-0 9046-10-0 Unassigned TS ref# 10001 1317-38-0 TS ref# 10038 4.18 E-04 1.67 E-05 1.67 E-05 1.67 E-05 1.67 E-05 1.67 E-05 1.67 E-05 1.67 E-05 2.80 E-06 5.38 E-04 Weight (g) 1.25 E-01 Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary Percentage (%) PPM Percentage (%) 77.71 3.11 3.11 3.11 3.11 3.11 3.11 3.11 0.52 100.0 777100 31100 31100 31100 31100 31100 31100 31100 5200 1000000 0.33 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.002 0.43 Percentage (%) 100 PPM 3344 134 134 134 134 134 134 134 22 4303 PPM 1000000