Product / Package Information Environmental Information Package Body Size (mm) Lead Count Terminal Finish RoHS Compliant High Temperature Compliant Halogen Free Compliant JIG Material Content Compliant LFCSP - Sawn 7 X 7 X 0.75 (5.1 EP) 48 100 Sn Yes Yes Yes Level A & B Compliant Materials Declaration Molding Compound Homogeneous Material Level Description Other inorganic materials Thermosets Other inorganic materials Subtotal Substance Silica Epoxy & Phenol Resin Carbon black CAS# Component Level Weight (g) 60676-86-0 Proprietary 1333-86-4 3.78E-02 5.56E-03 1.35E-04 4.35E-02 CAS# Weight (g) Percentage (%) PPM Percentage (%) 86.91 12.78 0.31 100.00 869100 127800 3100 1000000 28.94 4.25 0.10 33.29 PPM 289358 42550 1032 332940 Leadframe Component Level Homogeneous Material Level Description Copper & its alloys Copper & its alloys Copper & its alloys Copper & its alloys Subtotal Substance Copper Iron Zinc Phosphorus 7440-50-8 7439-89-6 7440-66-6 7723-14-0 7.60 E-02 1.83 E-03 9.35 E-05 2.34 E-05 7.79 E-02 CAS# Weight (g) Percentage (%) PPM Percentage (%) 97.5 2.35 0.12 0.03 100.00 975000 23500 1200 300 1000000 58.16 1.40 0.07 0.02 59.65 PPM 581608 14018 716 179 596521 Internal Leadframe Plating Component Level Homogeneous Material Level Description Precious metals Substance Silver 7440-22-4 Percentage (%) PPM Percentage (%) 100.0 1000000 0.35 4.60 E-04 PPM 3522 External Leadframe Plating Component Level Homogeneous Material Level Description Tin & its alloys Substance Tin CAS# 7440-31-5 Weight (g) Percentage (%) PPM Percentage (%) 100.0 1000000 2.22 2.90 E-03 PPM 22201 Bond Wires Homogeneous Material Level Substance Description Precious metals Precious metals Subtotal Gold Palladium CAS# Component Level Weight (g) 7440-57-5 7440-05-3 5.94 E-04 6.00 E-06 6.00 E-04 CAS# Weight (g) Percentage (%) PPM Percentage (%) 99.0 1.0 100.0 990000 10000 1000000 0.45 0.00 0.46 PPM 4547 46 4593 Chip Homogeneous Material Level Description Other inorganic materials Substance Doped Silicon 7440-21-3 Component Level Percentage (%) PPM Percentage (%) 100.0 1000000 2.76 3.60 E-03 PPM 27560 Die Attach Component Level Homogeneous Material Level Description Precious metals Thermoset Other inorganic materials Others Other organic materials Subtotal Package Totals Substance Silver Epoxy Resin Metal oxide Curing and hardening agent Gamma Butyrolactone CAS# 7440-22-4 Proprietary Proprietary Proprietary 96-48-0 Weight (g) Percentage (%) PPM Percentage (%) 73.40 18.35 2.75 2.75 2.75 100.0 734000 183500 27500 27500 27500 972500 0.93 0.23 0.03 0.03 0.03 1.24 1.22 E-03 3.05 E-04 4.57 E-05 4.57 E-05 4.57 E-05 1.66 E-03 Weight (g) 1.31 E-01 Percentage (%) 100 Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary PPM 9328 2332 349 349 349 12708 PPM 1000000