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Product / Package Information
Environmental Information
Package
Body Size (mm)
Lead Count
Terminal Finish
RoHS Compliant
High Temperature Compliant
Halogen Free Compliant
JIG Material Content Compliant
LFCSP - Sawn
7 X 7 X 0.75 (5.1 EP)
48
100 Sn
Yes
Yes
Yes
Level A & B Compliant
Materials Declaration
Molding Compound
Homogeneous Material Level
Description
Other inorganic materials
Thermosets
Other inorganic materials
Subtotal
Substance
Silica
Epoxy & Phenol Resin
Carbon black
CAS#
Component Level
Weight (g)
60676-86-0
Proprietary
1333-86-4
3.78E-02
5.56E-03
1.35E-04
4.35E-02
CAS#
Weight (g)
Percentage (%)
PPM
Percentage (%)
86.91
12.78
0.31
100.00
869100
127800
3100
1000000
28.94
4.25
0.10
33.29
PPM
289358
42550
1032
332940
Leadframe
Component Level
Homogeneous Material Level
Description
Copper & its alloys
Copper & its alloys
Copper & its alloys
Copper & its alloys
Subtotal
Substance
Copper
Iron
Zinc
Phosphorus
7440-50-8
7439-89-6
7440-66-6
7723-14-0
7.60 E-02
1.83 E-03
9.35 E-05
2.34 E-05
7.79 E-02
CAS#
Weight (g)
Percentage (%)
PPM
Percentage (%)
97.5
2.35
0.12
0.03
100.00
975000
23500
1200
300
1000000
58.16
1.40
0.07
0.02
59.65
PPM
581608
14018
716
179
596521
Internal Leadframe Plating
Component Level
Homogeneous Material Level
Description
Precious metals
Substance
Silver
7440-22-4
Percentage (%)
PPM
Percentage (%)
100.0
1000000
0.35
4.60 E-04
PPM
3522
External Leadframe Plating
Component Level
Homogeneous Material Level
Description
Tin & its alloys
Substance
Tin
CAS#
7440-31-5
Weight (g)
Percentage (%)
PPM
Percentage (%)
100.0
1000000
2.22
2.90 E-03
PPM
22201
Bond Wires
Homogeneous Material Level
Substance
Description
Precious metals
Precious metals
Subtotal
Gold
Palladium
CAS#
Component Level
Weight (g)
7440-57-5
7440-05-3
5.94 E-04
6.00 E-06
6.00 E-04
CAS#
Weight (g)
Percentage (%)
PPM
Percentage (%)
99.0
1.0
100.0
990000
10000
1000000
0.45
0.00
0.46
PPM
4547
46
4593
Chip
Homogeneous Material Level
Description
Other inorganic materials
Substance
Doped Silicon
7440-21-3
Component Level
Percentage (%)
PPM
Percentage (%)
100.0
1000000
2.76
3.60 E-03
PPM
27560
Die Attach
Component Level
Homogeneous Material Level
Description
Precious metals
Thermoset
Other inorganic materials
Others
Other organic materials
Subtotal
Package Totals
Substance
Silver
Epoxy Resin
Metal oxide
Curing and hardening agent
Gamma Butyrolactone
CAS#
7440-22-4
Proprietary
Proprietary
Proprietary
96-48-0
Weight (g)
Percentage (%)
PPM
Percentage (%)
73.40
18.35
2.75
2.75
2.75
100.0
734000
183500
27500
27500
27500
972500
0.93
0.23
0.03
0.03
0.03
1.24
1.22 E-03
3.05 E-04
4.57 E-05
4.57 E-05
4.57 E-05
1.66 E-03
Weight (g)
1.31 E-01
Percentage (%)
100
Note: The information provided in this declaration are true to the best of ADI's knowledge.
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary
PPM
9328
2332
349
349
349
12708
PPM
1000000