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Product / Package Information
Environmental Information
Package
Body Size (mm)
Lead Count
Terminal Finish
RoHS Compliant
High Temperature Compliant
Halogen Free Compliant
REACH SVHC Compliant
LFCSP - Sawn
6 X 6 X 0.75 (4.3 EP)
40
100 Sn
Yes
Yes
Yes
Yes
Materials Declaration
Molding Compound
Homogeneous Material Level
Substance
Description
Other inorganic materials
Thermosets
Thermosets
Other inorganic materials
Other inorganic materials
Subtotal
Silica
Epoxy resin
Phenol resin
Metal Hydroxide
Carbon black
CAS#
Component Level
Weight (g)
60676-86-0
Proprietary
Proprietary
Proprietary
1333-86-4
5.12E-02
3.56E-03
3.56E-03
8.90E-04
1.78E-04
5.94 E-02
CAS#
Weight (g)
Percentage (%)
PPM
Percentage (%)
86.2
6.0
6.0
1.5
0.3
100.00
862000
60000
60000
15000
3000
1000000
47.63
3.32
3.32
0.83
0.17
55.25
PPM
476277
33152
33152
8288
1658
552526
Leadframe
Homogeneous Material Level
Substance
Description
Copper & its alloys
Copper & its alloys
Copper & its alloys
Copper & its alloys
Subtotal
Copper
Iron
Zinc
Phosphorus
7440-50-8
7439-89-6
7440-66-6
7723-14-0
Component Level
Percentage (%)
PPM
Percentage (%)
97.50
2.35
0.12
0.03
100.00
975000
23500
1200
300
1000000
35.83
0.86
0.04
0.01
36.74
3.85 E-02
9.28 E-04
4.74 E-05
1.18 E-05
3.95 E-02
PPM
358254
8635
441
110
367440
Internal Leadframe Plating
Component Level
Homogeneous Material Level
Description
Precious metals
Substance
Silver
CAS#
7440-22-4
Weight (g)
Percentage (%)
PPM
Percentage (%)
100.0
1000000
0.04
3.95 E-05
PPM
368
External Leadframe Plating
Component Level
Homogeneous Material Level
Description
Tin & its alloys
Substance
Tin
CAS#
7440-31-5
Weight (g)
3.02 E-03
Percentage (%)
PPM
Percentage (%)
100.0
1000000
2.81
PPM
28148
Bond Wires
Component Level
Homogeneous Material Level
Substance
Description
Precious metals
Gold
CAS#
7440-57-5
Weight (g)
3.07 E-04
Percentage (%)
PPM
Percentage (%)
100.0
1000000
0.29
PPM
2859
Chip
Homogeneous Material Level
Description
Other inorganic materials
Substance
Doped Silicon
CAS#
7440-21-3
Component Level
Weight (g)
4.24 E-03
Percentage (%)
PPM
Percentage (%)
100.0
1000000
3.94
PPM
39420
Die Attach
Component Level
Homogeneous Material Level
Description
Precious metals
Thermoset
Other organic materials
Other organic materials
Other organic materials
Other organic materials
Other organic materials
Subtotal
Package Totals
Substance
Silver
Epoxy resin
Aliphatic acid anhydride
2,6 diglycidyl phenyl allyl ether oligomer
Epoxy derivative
1,4-bis(2,3-epoxypropoxy)butane
Hexahydromethylphthalic anhydride
CAS#
7440-22-4
Proprietary
Proprietary
Proprietary
Proprietary
Proprietary
Proprietary
Weight (g)
6.59 E-04
5.57 E-05
5.57 E-05
5.57 E-05
5.57 E-05
5.57 E-05
5.57 E-05
9.93 E-04
Weight (g)
1.07 E-01
Note: The information provided in this declaration are true to the best of ADI's knowledge.
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary
Percentage (%)
PPM
Percentage (%)
66.34
5.61
5.61
5.61
5.61
5.61
5.61
100.0
663400
56100
56100
56100
56100
56100
56100
1000000
0.61
0.05
0.05
0.05
0.05
0.05
0.05
0.92
Percentage (%)
100
PPM
6130
518
518
518
518
518
518
9240
PPM
1000000