Product / Package Information Environmental Information Package Body Size (mm) Lead Count Terminal Finish RoHS Compliant High Temperature Compliant Halogen Free Compliant REACH SVHC Compliant LFCSP - Sawn 6 X 6 X 0.75 (4.3 EP) 40 100 Sn Yes Yes Yes Yes Materials Declaration Molding Compound Homogeneous Material Level Substance Description Other inorganic materials Thermosets Thermosets Other inorganic materials Other inorganic materials Subtotal Silica Epoxy resin Phenol resin Metal Hydroxide Carbon black CAS# Component Level Weight (g) 60676-86-0 Proprietary Proprietary Proprietary 1333-86-4 5.12E-02 3.56E-03 3.56E-03 8.90E-04 1.78E-04 5.94 E-02 CAS# Weight (g) Percentage (%) PPM Percentage (%) 86.2 6.0 6.0 1.5 0.3 100.00 862000 60000 60000 15000 3000 1000000 47.63 3.32 3.32 0.83 0.17 55.25 PPM 476277 33152 33152 8288 1658 552526 Leadframe Homogeneous Material Level Substance Description Copper & its alloys Copper & its alloys Copper & its alloys Copper & its alloys Subtotal Copper Iron Zinc Phosphorus 7440-50-8 7439-89-6 7440-66-6 7723-14-0 Component Level Percentage (%) PPM Percentage (%) 97.50 2.35 0.12 0.03 100.00 975000 23500 1200 300 1000000 35.83 0.86 0.04 0.01 36.74 3.85 E-02 9.28 E-04 4.74 E-05 1.18 E-05 3.95 E-02 PPM 358254 8635 441 110 367440 Internal Leadframe Plating Component Level Homogeneous Material Level Description Precious metals Substance Silver CAS# 7440-22-4 Weight (g) Percentage (%) PPM Percentage (%) 100.0 1000000 0.04 3.95 E-05 PPM 368 External Leadframe Plating Component Level Homogeneous Material Level Description Tin & its alloys Substance Tin CAS# 7440-31-5 Weight (g) 3.02 E-03 Percentage (%) PPM Percentage (%) 100.0 1000000 2.81 PPM 28148 Bond Wires Component Level Homogeneous Material Level Substance Description Precious metals Gold CAS# 7440-57-5 Weight (g) 3.07 E-04 Percentage (%) PPM Percentage (%) 100.0 1000000 0.29 PPM 2859 Chip Homogeneous Material Level Description Other inorganic materials Substance Doped Silicon CAS# 7440-21-3 Component Level Weight (g) 4.24 E-03 Percentage (%) PPM Percentage (%) 100.0 1000000 3.94 PPM 39420 Die Attach Component Level Homogeneous Material Level Description Precious metals Thermoset Other organic materials Other organic materials Other organic materials Other organic materials Other organic materials Subtotal Package Totals Substance Silver Epoxy resin Aliphatic acid anhydride 2,6 diglycidyl phenyl allyl ether oligomer Epoxy derivative 1,4-bis(2,3-epoxypropoxy)butane Hexahydromethylphthalic anhydride CAS# 7440-22-4 Proprietary Proprietary Proprietary Proprietary Proprietary Proprietary Weight (g) 6.59 E-04 5.57 E-05 5.57 E-05 5.57 E-05 5.57 E-05 5.57 E-05 5.57 E-05 9.93 E-04 Weight (g) 1.07 E-01 Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary Percentage (%) PPM Percentage (%) 66.34 5.61 5.61 5.61 5.61 5.61 5.61 100.0 663400 56100 56100 56100 56100 56100 56100 1000000 0.61 0.05 0.05 0.05 0.05 0.05 0.05 0.92 Percentage (%) 100 PPM 6130 518 518 518 518 518 518 9240 PPM 1000000