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Product / Package Information
Environmental Compliance Information
Package
Body Size (mm)
Lead Count
Terminal Finish
RoHS Compliant
High Temperature Compliant
Halogen Free Compliant
REACH SVHC Compliant
LFCSP - Sawn
5 X 5 X 0.75 (3.6 EP)
32
100 Sn
Yes
Yes
Yes
Yes
Materials Declaration
Molding Compound
Homogeneous Material Level
Description
Other inorganic materials
Thermosets
Thermosets
Other inorganic materials
Other inorganic materials
Subtotal
Substance
Silica
Epoxy resin
Phenol resin
Metal Hydroxide
Carbon black
CAS#
60676-86-0
Proprietary
Proprietary
Proprietary
1333-86-4
Component Level
Weight (g)
3.53E-02
2.45E-03
2.45E-03
6.14E-04
1.23E-04
4.09E-02
Percentage (%)
PPM
Percentage (%)
86.2
6.0
6.0
1.5
0.3
100.00
862000
60000
60000
15000
3000
1000000
37.62
2.62
2.62
0.65
0.13
43.65
PPM
376226
26187
26187
6547
1309
436457
Leadframe
Homogeneous Material Level
Description
Copper & its alloys
Copper & its alloys
Copper & its alloys
Copper & its alloys
Subtotal
Substance
Copper
Iron
Zinc
Phosphorus
CAS#
7440-50-8
7439-89-6
7440-66-6
7723-14-0
Component Level
Weight (g)
4.34 E-02
1.05 E-03
5.34 E-05
1.34 E-05
4.45 E-02
Percentage (%)
PPM
Percentage (%)
97.5
2.35
0.12
0.03
100.00
975000
23500
1200
300
1000000
46.30
1.12
0.06
0.01
47.49
PPM
463002
11160
570
142
474874
Internal Leadframe Plating
Component Level
Homogeneous Material Level
Substance
Description
Precious metals
Silver
CAS#
7440-22-4
Weight (g)
4.45 E-04
Percentage (%)
PPM
Percentage (%)
100.0
1000000
0.47
PPM
4749
External Leadframe Plating
Component Level
Homogeneous Material Level
Substance
Description
Tin & its alloys
Tin
CAS#
7440-31-5
Weight (g)
2.96 E-03
Percentage (%)
PPM
Percentage (%)
100.0
1000000
3.16
PPM
31631
Bond Wires
Homogeneous Material Level
Description
Precious metals
Substance
Gold
CAS#
7440-57-5
Component Level
Weight (g)
6.00 E-04
Percentage (%)
PPM
Percentage (%)
100.0
1000000
0.64
PPM
6403
Chip
Homogeneous Material Level
Description
Other inorganic materials
Substance
Doped Silicon
CAS#
7440-21-3
Component Level
Weight (g)
3.60 E-03
Percentage (%)
PPM
Percentage (%)
100.0
1000000
3.84
PPM
38417
Die Attach
Component Level
Homogeneous Material Level
Description
Precious metals
Thermoset
Other organic materials
Other organic materials
Other organic materials
Other organic materials
Other organic materials
Subtotal
Package Totals
Substance
Silver
Epoxy resin
Aliphatic acid anhydride
2,6 diglycidyl phenyl allyl ether oligomer
Epoxy derivative
1,4-bis(2,3-epoxypropoxy)butane
Hexahydromethylphthalic anhydride
CAS#
7440-22-4
Proprietary
Proprietary
Proprietary
Proprietary
Proprietary
Proprietary
Weight (g)
4.64 E-04
3.93 E-05
3.93 E-05
3.93 E-05
3.93 E-05
3.93 E-05
3.93 E-05
7.00 E-04
Weight (g)
9.37 E-02
Note: The information provided in this declaration are true to the best of ADI's knowledge
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary
Percentage (%)
PPM
Percentage (%)
66.34
5.61
5.61
5.61
5.61
5.61
5.61
100.0
663400
56100
56100
56100
56100
56100
56100
1000000
0.50
0.04
0.04
0.04
0.04
0.04
0.04
0.75
Percentage (%)
100
PPM
4956
419
419
419
419
419
419
7470
PPM
1000000