Product / Package Information Environmental Compliance Information Package Body Size (mm) Lead Count Terminal Finish RoHS Compliant High Temperature Compliant Halogen Free Compliant REACH SVHC Compliant LFCSP - Sawn 5 X 5 X 0.75 (3.6 EP) 32 100 Sn Yes Yes Yes Yes Materials Declaration Molding Compound Homogeneous Material Level Description Other inorganic materials Thermosets Thermosets Other inorganic materials Other inorganic materials Subtotal Substance Silica Epoxy resin Phenol resin Metal Hydroxide Carbon black CAS# 60676-86-0 Proprietary Proprietary Proprietary 1333-86-4 Component Level Weight (g) 3.53E-02 2.45E-03 2.45E-03 6.14E-04 1.23E-04 4.09E-02 Percentage (%) PPM Percentage (%) 86.2 6.0 6.0 1.5 0.3 100.00 862000 60000 60000 15000 3000 1000000 37.62 2.62 2.62 0.65 0.13 43.65 PPM 376226 26187 26187 6547 1309 436457 Leadframe Homogeneous Material Level Description Copper & its alloys Copper & its alloys Copper & its alloys Copper & its alloys Subtotal Substance Copper Iron Zinc Phosphorus CAS# 7440-50-8 7439-89-6 7440-66-6 7723-14-0 Component Level Weight (g) 4.34 E-02 1.05 E-03 5.34 E-05 1.34 E-05 4.45 E-02 Percentage (%) PPM Percentage (%) 97.5 2.35 0.12 0.03 100.00 975000 23500 1200 300 1000000 46.30 1.12 0.06 0.01 47.49 PPM 463002 11160 570 142 474874 Internal Leadframe Plating Component Level Homogeneous Material Level Substance Description Precious metals Silver CAS# 7440-22-4 Weight (g) 4.45 E-04 Percentage (%) PPM Percentage (%) 100.0 1000000 0.47 PPM 4749 External Leadframe Plating Component Level Homogeneous Material Level Substance Description Tin & its alloys Tin CAS# 7440-31-5 Weight (g) 2.96 E-03 Percentage (%) PPM Percentage (%) 100.0 1000000 3.16 PPM 31631 Bond Wires Homogeneous Material Level Description Precious metals Substance Gold CAS# 7440-57-5 Component Level Weight (g) 6.00 E-04 Percentage (%) PPM Percentage (%) 100.0 1000000 0.64 PPM 6403 Chip Homogeneous Material Level Description Other inorganic materials Substance Doped Silicon CAS# 7440-21-3 Component Level Weight (g) 3.60 E-03 Percentage (%) PPM Percentage (%) 100.0 1000000 3.84 PPM 38417 Die Attach Component Level Homogeneous Material Level Description Precious metals Thermoset Other organic materials Other organic materials Other organic materials Other organic materials Other organic materials Subtotal Package Totals Substance Silver Epoxy resin Aliphatic acid anhydride 2,6 diglycidyl phenyl allyl ether oligomer Epoxy derivative 1,4-bis(2,3-epoxypropoxy)butane Hexahydromethylphthalic anhydride CAS# 7440-22-4 Proprietary Proprietary Proprietary Proprietary Proprietary Proprietary Weight (g) 4.64 E-04 3.93 E-05 3.93 E-05 3.93 E-05 3.93 E-05 3.93 E-05 3.93 E-05 7.00 E-04 Weight (g) 9.37 E-02 Note: The information provided in this declaration are true to the best of ADI's knowledge ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary Percentage (%) PPM Percentage (%) 66.34 5.61 5.61 5.61 5.61 5.61 5.61 100.0 663400 56100 56100 56100 56100 56100 56100 1000000 0.50 0.04 0.04 0.04 0.04 0.04 0.04 0.75 Percentage (%) 100 PPM 4956 419 419 419 419 419 419 7470 PPM 1000000