Product / Package Information Environmental Information Package Body Size (mm) Lead Count Terminal Finish RoHS Compliant High Temperature Compliant Halogen Free Compliant REACH SVHC Compliant LFCSP - Punched 10 X 10 X 0.85 (8.5 EP) 72 100 Sn Yes Yes Yes Yes Materials Declaration Molding Compound Component Level Homogeneous Material Level Substance Description Other inorganic materials Thermosets Other inorganic materials Subtotal Silica Epoxy & Phenol Resin Carbon black CAS# 60676-86-0 Proprietary 1333-86-4 Weight (g) 9.19E-02 1.35E-02 3.28E-04 1.06E-01 Percentage (%) PPM Percentage (%) 86.91 12.78 0.31 100.00 869100 127800 3100 1000000 27.12 3.99 0.10 31.21 PPM 271221 39883 967 312071 Leadframe Homogeneous Material Level Description Copper & its alloys Copper & its alloys Copper & its alloys Copper & its alloys Subtotal Substance Copper Iron Zinc Phosphorus CAS# 7440-50-8 7439-89-6 7440-66-6 7723-14-0 Component Level Weight (g) 1.76 E-01 4.25 E-03 2.17 E-04 5.42 E-05 1.81 E-01 Percentage (%) PPM Percentage (%) 97.50 2.35 0.12 0.03 100.00 975000 23500 1200 300 1000000 52.01 1.25 0.06 0.02 53.34 PPM 520055 12535 640 160 533389 Internal Leadframe Plating Component Level Homogeneous Material Level Description Precious metals Substance Silver CAS# 7440-22-4 Weight (g) 1.81 E-03 Percentage (%) PPM Percentage (%) 100.0 1000000 0.53 PPM 5334 External Leadframe Plating Homogeneous Material Level Description Tin & its alloys Substance Tin CAS# 7440-31-5 Component Level Weight (g) 7.89 E-03 Percentage (%) PPM Percentage (%) 100.0 1000000 2.33 PPM 23293 Bond Wires Component Level Homogeneous Material Level Substance Description Precious metals Gold CAS# 7440-57-5 Weight (g) 2.34 E-03 Percentage (%) PPM Percentage (%) 100.0 1000000 0.69 PPM 6907 Chip Homogeneous Material Level Description Other inorganic materials Substance Doped Silicon CAS# 7440-21-3 Component Level Weight (g) 3.52 E-02 Percentage (%) PPM Percentage (%) 100.0 1000000 10.40 PPM 104008 Die Attach Homogeneous Material Level Description Precious metals Other organic materials Others Other organic materials Other organic materials Others Others Subtotal Package Totals Substance Silver Epoxy resin A Anhydride 2,6-Diglycidyl phenyl allyl ether oligomer Epoxy resin B Epoxy resin modifier Anhydride CAS# 7440-22-4 TS ref# 10013 TS ref# 10181 Unassigned TS ref# 10237 TS ref# 10038 TS ref# 10180 Component Level Weight (g) 3.74 E-03 3.73 E-04 3.73 E-04 1.49 E-04 1.49 E-04 1.49 E-04 1.49 E-04 5.08 E-03 Weight (g) 3.39 E-01 Note: The information provided in this declaration are true to the best of ADI's knowledge ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary Percentage (%) PPM Percentage (%) 73.54 7.35 7.35 2.94 2.94 2.94 2.94 100.0 735400 73500 73500 29400 29400 29400 29400 911800 1.103 0.110 0.110 0.044 0.044 0.044 0.044 1.37 Percentage (%) 100 PPM 11030 1102 1102 441 441 441 441 14999 PPM 1000000