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Product / Package Information
Environmental Information
Package
Body Size (mm)
Lead Count
Terminal Finish
RoHS Compliant
High Temperature Compliant
Halogen Free Compliant
REACH SVHC Compliant
LFCSP - Punched
10 X 10 X 0.85 (8.5 EP)
72
100 Sn
Yes
Yes
Yes
Yes
Materials Declaration
Molding Compound
Component Level
Homogeneous Material Level
Substance
Description
Other inorganic materials
Thermosets
Other inorganic materials
Subtotal
Silica
Epoxy & Phenol Resin
Carbon black
CAS#
60676-86-0
Proprietary
1333-86-4
Weight (g)
9.19E-02
1.35E-02
3.28E-04
1.06E-01
Percentage (%)
PPM
Percentage (%)
86.91
12.78
0.31
100.00
869100
127800
3100
1000000
27.12
3.99
0.10
31.21
PPM
271221
39883
967
312071
Leadframe
Homogeneous Material Level
Description
Copper & its alloys
Copper & its alloys
Copper & its alloys
Copper & its alloys
Subtotal
Substance
Copper
Iron
Zinc
Phosphorus
CAS#
7440-50-8
7439-89-6
7440-66-6
7723-14-0
Component Level
Weight (g)
1.76 E-01
4.25 E-03
2.17 E-04
5.42 E-05
1.81 E-01
Percentage (%)
PPM
Percentage (%)
97.50
2.35
0.12
0.03
100.00
975000
23500
1200
300
1000000
52.01
1.25
0.06
0.02
53.34
PPM
520055
12535
640
160
533389
Internal Leadframe Plating
Component Level
Homogeneous Material Level
Description
Precious metals
Substance
Silver
CAS#
7440-22-4
Weight (g)
1.81 E-03
Percentage (%)
PPM
Percentage (%)
100.0
1000000
0.53
PPM
5334
External Leadframe Plating
Homogeneous Material Level
Description
Tin & its alloys
Substance
Tin
CAS#
7440-31-5
Component Level
Weight (g)
7.89 E-03
Percentage (%)
PPM
Percentage (%)
100.0
1000000
2.33
PPM
23293
Bond Wires
Component Level
Homogeneous Material Level
Substance
Description
Precious metals
Gold
CAS#
7440-57-5
Weight (g)
2.34 E-03
Percentage (%)
PPM
Percentage (%)
100.0
1000000
0.69
PPM
6907
Chip
Homogeneous Material Level
Description
Other inorganic materials
Substance
Doped Silicon
CAS#
7440-21-3
Component Level
Weight (g)
3.52 E-02
Percentage (%)
PPM
Percentage (%)
100.0
1000000
10.40
PPM
104008
Die Attach
Homogeneous Material Level
Description
Precious metals
Other organic materials
Others
Other organic materials
Other organic materials
Others
Others
Subtotal
Package Totals
Substance
Silver
Epoxy resin A
Anhydride
2,6-Diglycidyl phenyl allyl ether oligomer
Epoxy resin B
Epoxy resin modifier
Anhydride
CAS#
7440-22-4
TS ref# 10013
TS ref# 10181
Unassigned
TS ref# 10237
TS ref# 10038
TS ref# 10180
Component Level
Weight (g)
3.74 E-03
3.73 E-04
3.73 E-04
1.49 E-04
1.49 E-04
1.49 E-04
1.49 E-04
5.08 E-03
Weight (g)
3.39 E-01
Note: The information provided in this declaration are true to the best of ADI's knowledge
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary
Percentage (%)
PPM
Percentage (%)
73.54
7.35
7.35
2.94
2.94
2.94
2.94
100.0
735400
73500
73500
29400
29400
29400
29400
911800
1.103
0.110
0.110
0.044
0.044
0.044
0.044
1.37
Percentage (%)
100
PPM
11030
1102
1102
441
441
441
441
14999
PPM
1000000