pdf

Product / Package Information
Environmental Information
Package
Body Size (mm)
Lead Count
Terminal Finish
RoHS Compliant
High Temperature Compliant
Halogen Free Compliant
REACH SVHC Compliant
LFCSP - Sawn
9 X 9 X 0.75 (7.6 EP)
64
100 Sn
Yes
Yes
Yes
Yes
Materials Declaration
Molding Compound
Homogeneous Material Level
Substance
Description
Other inorganic materials
Thermosets
Other inorganic materials
Subtotal
Silica
Epoxy & Phenol Resin
Carbon black
CAS#
Component Level
Weight (g)
60676-86-0
Proprietary
1333-86-4
1.32E-01
1.94E-02
4.71E-04
1.52 E-01
Percentage (%)
PPM
Percentage (%)
86.9
12.8
0.3
100.00
869100
127800
3100
1000000
28.47
4.19
0.10
32.76
PPM
284683
41862
1015
327560
Leadframe
Homogeneous Material Level
Substance
Description
Copper & its alloys
Copper & its alloys
Copper & its alloys
Copper & its alloys
Subtotal
Copper
Iron
Zinc
Phosphorus
CAS#
Component Level
Weight (g)
7440-50-8
7439-89-6
7440-66-6
7723-14-0
2.43 E-01
5.86 E-03
2.99 E-04
7.48 E-05
2.49 E-01
Percentage (%)
PPM
Percentage (%)
97.50
2.35
0.12
0.03
100.00
975000
23500
1200
300
1000000
52.38
1.26
0.06
0.02
53.73
PPM
523844
12626
645
161
537276
Internal Leadframe Plating
Component Level
Homogeneous Material Level
Description
Precious metals
Substance
Silver
CAS#
Weight (g)
7440-22-4
2.49 E-03
Percentage (%)
PPM
Percentage (%)
100.0
1000000
0.54
PPM
5373
External Leadframe Plating
Homogeneous Material Level
Description
Tin & its alloys
Substance
Tin
Component Level
Weight (g)
CAS#
7440-31-5
9.38 E-03
Percentage (%)
PPM
Percentage (%)
100.0
1000000
2.02
PPM
20210
Bond Wires
Homogeneous Material Level
Substance
Description
Precious metals
Precious metals
Gold
Palladium
CAS#
Component Level
Weight (g)
1.44 E-03
1.45 E-05
1.45 E-03
7440-57-5
7440-05-3
Percentage (%)
PPM
Percentage (%)
99.0
1.0
100.0
990000
10000
1000000
0.3101
0.0031
0.31
PPM
3101
31
3132
Chip
Component Level
Homogeneous Material Level
Description
Other inorganic materials
Substance
Doped Silicon
CAS#
Weight (g)
7440-21-3
4.29 E-02
Percentage (%)
PPM
Percentage (%)
100.0
1000000
9.24
PPM
92386
Die Attach
Homogeneous Material Level
Description
Precious metals
Other organic materials
Others
Other organic materials
Other organic materials
Others
Others
Subtotal
Substance
Silver
Epoxy resin A
Anhydride
2,6-Diglycidyl phenyl allyl ether oligomer
Epoxy resin B
Epoxy resin modifier
Anhydride
CAS#
Component Level
Weight (g)
7440-22-4
TS ref# 10013
TS ref# 10181
Unassigned
TS ref# 10237
TS ref# 10038
TS ref# 10180
4.80 E-03
4.80 E-04
4.80 E-04
1.92 E-04
1.92 E-04
1.92 E-04
1.92 E-04
6.53 E-03
Weight (g)
4.64 E-01
Package Totals
Note: The information provided in this declaration are true to the best of ADI's knowledge.
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary
Percentage (%)
PPM
Percentage (%)
73.54
7.35
7.35
2.94
2.94
2.94
2.94
100.0
735400
73500
73500
29400
29400
29400
29400
1000000
1.03
0.10
0.10
0.04
0.04
0.04
0.04
1.41
Percentage (%)
100
PPM
10342
1034
1034
413
413
413
413
14063
PPM
1000000