Product / Package Information Environmental Information Package Body Size (mm) Lead Count Terminal Finish RoHS Compliant High Temperature Compliant Halogen Free Compliant REACH SVHC Compliant LFCSP - Sawn 9 X 9 X 0.75 (7.6 EP) 64 100 Sn Yes Yes Yes Yes Materials Declaration Molding Compound Homogeneous Material Level Substance Description Other inorganic materials Thermosets Other inorganic materials Subtotal Silica Epoxy & Phenol Resin Carbon black CAS# Component Level Weight (g) 60676-86-0 Proprietary 1333-86-4 1.32E-01 1.94E-02 4.71E-04 1.52 E-01 Percentage (%) PPM Percentage (%) 86.9 12.8 0.3 100.00 869100 127800 3100 1000000 28.47 4.19 0.10 32.76 PPM 284683 41862 1015 327560 Leadframe Homogeneous Material Level Substance Description Copper & its alloys Copper & its alloys Copper & its alloys Copper & its alloys Subtotal Copper Iron Zinc Phosphorus CAS# Component Level Weight (g) 7440-50-8 7439-89-6 7440-66-6 7723-14-0 2.43 E-01 5.86 E-03 2.99 E-04 7.48 E-05 2.49 E-01 Percentage (%) PPM Percentage (%) 97.50 2.35 0.12 0.03 100.00 975000 23500 1200 300 1000000 52.38 1.26 0.06 0.02 53.73 PPM 523844 12626 645 161 537276 Internal Leadframe Plating Component Level Homogeneous Material Level Description Precious metals Substance Silver CAS# Weight (g) 7440-22-4 2.49 E-03 Percentage (%) PPM Percentage (%) 100.0 1000000 0.54 PPM 5373 External Leadframe Plating Homogeneous Material Level Description Tin & its alloys Substance Tin Component Level Weight (g) CAS# 7440-31-5 9.38 E-03 Percentage (%) PPM Percentage (%) 100.0 1000000 2.02 PPM 20210 Bond Wires Homogeneous Material Level Substance Description Precious metals Precious metals Gold Palladium CAS# Component Level Weight (g) 1.44 E-03 1.45 E-05 1.45 E-03 7440-57-5 7440-05-3 Percentage (%) PPM Percentage (%) 99.0 1.0 100.0 990000 10000 1000000 0.3101 0.0031 0.31 PPM 3101 31 3132 Chip Component Level Homogeneous Material Level Description Other inorganic materials Substance Doped Silicon CAS# Weight (g) 7440-21-3 4.29 E-02 Percentage (%) PPM Percentage (%) 100.0 1000000 9.24 PPM 92386 Die Attach Homogeneous Material Level Description Precious metals Other organic materials Others Other organic materials Other organic materials Others Others Subtotal Substance Silver Epoxy resin A Anhydride 2,6-Diglycidyl phenyl allyl ether oligomer Epoxy resin B Epoxy resin modifier Anhydride CAS# Component Level Weight (g) 7440-22-4 TS ref# 10013 TS ref# 10181 Unassigned TS ref# 10237 TS ref# 10038 TS ref# 10180 4.80 E-03 4.80 E-04 4.80 E-04 1.92 E-04 1.92 E-04 1.92 E-04 1.92 E-04 6.53 E-03 Weight (g) 4.64 E-01 Package Totals Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary Percentage (%) PPM Percentage (%) 73.54 7.35 7.35 2.94 2.94 2.94 2.94 100.0 735400 73500 73500 29400 29400 29400 29400 1000000 1.03 0.10 0.10 0.04 0.04 0.04 0.04 1.41 Percentage (%) 100 PPM 10342 1034 1034 413 413 413 413 14063 PPM 1000000