pdf

Product / Package Information
Environmental Compliance Information
Package
Body Size (mm)
Lead Count
Terminal Finish
RoHS Compliant
High Temperature Compliant
Halogen Free Compliant
REACH SVHC Compliant
LFCSP - Punched
8 X 8 X 0.85 (5.0 EP)
56
100 Sn
Yes
Yes
Yes
Yes
Materials Declaration
Molding Compound
Homogeneous Material Level
Description
Other inorganic materials
Thermosets
Other inorganic materials
Subtotal
Substance
Silica
Epoxy & Phenol Resin
Carbon black
CAS#
Component Level
Weight (g)
60676-86-0
Proprietary
1333-86-4
7.17E-02
1.05E-02
2.56E-04
8.25 E-02
CAS#
Weight (g)
Percentage (%)
PPM
Percentage (%)
86.91
12.78
0.31
100.00
869100
127800
3100
1000000
33.66
4.95
0.12
38.74
PPM
336650
49504
1201
387355
Leadframe
Component Level
Homogeneous Material Level
Description
Copper & its alloys
Copper & its alloys
Copper & its alloys
Copper & its alloys
Subtotal
Substance
Copper
Iron
Zinc
Phosphorus
7440-50-8
7439-89-6
7440-66-6
7723-14-0
Percentage (%)
PPM
Percentage (%)
97.5
2.35
0.12
0.03
100.00
975000
23500
1200
300
1000000
52.96
1.28
0.07
0.02
54.31
1.13 E-01
2.72 E-03
1.39 E-04
3.47 E-05
1.16 E-01
PPM
529551
12764
652
163
543130
Internal Leadframe Plating
Component Level
Homogeneous Material Level
Description
Precious metals
Substance
Silver
CAS#
7440-22-4
Weight (g)
Percentage (%)
PPM
Percentage (%)
100.0
1000000
0.54
1.16 E-03
PPM
5431
External Leadframe Plating
Component Level
Homogeneous Material Level
Substance
Description
Tin & its alloys
Tin
CAS#
7440-31-5
Weight (g)
Percentage (%)
PPM
Percentage (%)
100.0
1000000
1.28
2.73 E-03
PPM
12823
Bond Wires
Component Level
Homogeneous Material Level
Substance
Description
Precious metals
Gold
CAS#
7440-57-5
Weight (g)
Percentage (%)
PPM
Percentage (%)
100.0
1000000
0.72
1.54 E-03
PPM
7233
Chip
Homogeneous Material Level
Description
Other inorganic materials
Substance
Doped Silicon
CAS#
7440-21-3
Component Level
Weight (g)
Percentage (%)
PPM
Percentage (%)
100.0
1000000
3.85
8.19 E-03
PPM
38480
Die Attach
Component Level
Homogeneous Material Level
Description
Precious metals
Thermoset
Other organic materials
Other organic materials
Other organic materials
Other organic materials
Other organic materials
Subtotal
Package Totals
Substance
Silver
Epoxy resin
Aliphatic acid anhydride
2,6 diglycidyl phenyl allyl ether oligomer
Epoxy derivative
1,4-bis(2,3-epoxypropoxy)butane
Hexahydromethylphthalic anhydride
CAS#
7440-22-4
Proprietary
Proprietary
Proprietary
Proprietary
Proprietary
Proprietary
Weight (g)
Percentage (%)
PPM
Percentage (%)
66.34
5.61
5.61
5.61
5.61
5.61
5.61
100.0
663400
56100
56100
56100
56100
56100
56100
1000000
0.37
0.03
0.03
0.03
0.03
0.03
0.03
0.55
7.84 E-04
6.63 E-05
6.63 E-05
6.63 E-05
6.63 E-05
6.63 E-05
6.63 E-05
1.18 E-03
Weight (g)
2.13 E-01
Note: The information provided in this declaration are true to the best of ADI's knowledge.
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary
Percentage (%)
100
PPM
3681
311
311
311
311
311
311
5549
PPM
1000000