Product / Package Information Environmental Compliance Information Package Body Size (mm) Lead Count Terminal Finish RoHS Compliant High Temperature Compliant Halogen Free Compliant REACH SVHC Compliant LFCSP - Punched 8 X 8 X 0.85 (5.0 EP) 56 100 Sn Yes Yes Yes Yes Materials Declaration Molding Compound Homogeneous Material Level Description Other inorganic materials Thermosets Other inorganic materials Subtotal Substance Silica Epoxy & Phenol Resin Carbon black CAS# Component Level Weight (g) 60676-86-0 Proprietary 1333-86-4 7.17E-02 1.05E-02 2.56E-04 8.25 E-02 CAS# Weight (g) Percentage (%) PPM Percentage (%) 86.91 12.78 0.31 100.00 869100 127800 3100 1000000 33.66 4.95 0.12 38.74 PPM 336650 49504 1201 387355 Leadframe Component Level Homogeneous Material Level Description Copper & its alloys Copper & its alloys Copper & its alloys Copper & its alloys Subtotal Substance Copper Iron Zinc Phosphorus 7440-50-8 7439-89-6 7440-66-6 7723-14-0 Percentage (%) PPM Percentage (%) 97.5 2.35 0.12 0.03 100.00 975000 23500 1200 300 1000000 52.96 1.28 0.07 0.02 54.31 1.13 E-01 2.72 E-03 1.39 E-04 3.47 E-05 1.16 E-01 PPM 529551 12764 652 163 543130 Internal Leadframe Plating Component Level Homogeneous Material Level Description Precious metals Substance Silver CAS# 7440-22-4 Weight (g) Percentage (%) PPM Percentage (%) 100.0 1000000 0.54 1.16 E-03 PPM 5431 External Leadframe Plating Component Level Homogeneous Material Level Substance Description Tin & its alloys Tin CAS# 7440-31-5 Weight (g) Percentage (%) PPM Percentage (%) 100.0 1000000 1.28 2.73 E-03 PPM 12823 Bond Wires Component Level Homogeneous Material Level Substance Description Precious metals Gold CAS# 7440-57-5 Weight (g) Percentage (%) PPM Percentage (%) 100.0 1000000 0.72 1.54 E-03 PPM 7233 Chip Homogeneous Material Level Description Other inorganic materials Substance Doped Silicon CAS# 7440-21-3 Component Level Weight (g) Percentage (%) PPM Percentage (%) 100.0 1000000 3.85 8.19 E-03 PPM 38480 Die Attach Component Level Homogeneous Material Level Description Precious metals Thermoset Other organic materials Other organic materials Other organic materials Other organic materials Other organic materials Subtotal Package Totals Substance Silver Epoxy resin Aliphatic acid anhydride 2,6 diglycidyl phenyl allyl ether oligomer Epoxy derivative 1,4-bis(2,3-epoxypropoxy)butane Hexahydromethylphthalic anhydride CAS# 7440-22-4 Proprietary Proprietary Proprietary Proprietary Proprietary Proprietary Weight (g) Percentage (%) PPM Percentage (%) 66.34 5.61 5.61 5.61 5.61 5.61 5.61 100.0 663400 56100 56100 56100 56100 56100 56100 1000000 0.37 0.03 0.03 0.03 0.03 0.03 0.03 0.55 7.84 E-04 6.63 E-05 6.63 E-05 6.63 E-05 6.63 E-05 6.63 E-05 6.63 E-05 1.18 E-03 Weight (g) 2.13 E-01 Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary Percentage (%) 100 PPM 3681 311 311 311 311 311 311 5549 PPM 1000000