Product / Package Information Environmental Information Package Body Size (mm) Lead Count Terminal Finish MS Number RoHS Compliant High Temperature Compliant Halogen Free Compliant REACH SVHC Compliant MQFP_PQ4 32 X 32 X 3.5 (+2.6) 240 100 Sn MS011415B Yes Yes Yes Yes Materials Declaration Molding Compound Homogeneous Material Level Substance Description Other inorganic materials Thermosets Other inorganic materials Subtotal Silica Epoxy & Phenol Resin Carbon black CAS# 60676-86-0 Proprietary 1333-86-4 Component Level Weight (g) 3.83E+00 5.63E-01 1.37E-02 4.41 E+00 Percentage (%) PPM Percentage (%) 86.91 12.78 0.31 100.00 869100 127800 3100 1000000 45.73 6.72 0.16 52.62 PPM 457282 67243 1631 526156 Leadframe Homogeneous Material Level Substance Description Copper & its alloys Copper & its alloys Copper & its alloys Copper & its alloys Subtotal Copper Chromium Tin Zinc CAS# 7440-50-8 7440-47-3 7440-31-5 7440-66-6 Component Level Weight (g) 9.61 E-01 2.90 E-03 2.42 E-03 1.94 E-03 9.68 E-01 Percentage (%) PPM Percentage (%) 99.25 0.30 0.25 0.20 100.00 992500 3000 2500 2000 1000000 11.47 0.03 0.03 0.02 11.56 PPM 114708 347 289 231 115575 Internal Leadframe Plating Component Level Homogeneous Material Level Description Precious metals Substance Silver CAS# 7440-22-4 Weight (g) 2.86 E-03 Percentage (%) PPM Percentage (%) 100.0 1000000 0.03 PPM 342 External Leadframe Plating Component Level Homogeneous Material Level Description Tin & its alloys Substance Tin CAS# 7440-31-5 Weight (g) 3.46 E-02 Percentage (%) PPM Percentage (%) 100.0 1000000 0.41 PPM 4133 Bond Wires Component Level Homogeneous Material Level Substance Description Precious metals Gold CAS# 7440-57-5 Weight (g) 2.06 E-02 Percentage (%) PPM Percentage (%) 100.0 1000000 0.25 PPM 2459 Chip Component Level Homogeneous Material Level Description Other inorganic materials Substance Doped Silicon CAS# 7440-21-3 Weight (g) 2.88 E-01 Percentage (%) PPM Percentage (%) 100.0 1000000 3.44 PPM 34409 Die Attach Homogeneous Material Level Substance Description Precious metals Other organic materials Others Other organic materials Other organic materials Others Others Subtotal Silver Epoxy resin A Anhydride 2,6-Diglycidyl phenyl allyl ether oligomer Epoxy resin B Epoxy resin modifier Anhydride CAS# 7440-22-4 TS ref# 10013 TS ref# 10181 Unassigned TS ref# 10237 TS ref# 10038 TS ref# 10180 Component Level Weight (g) 1.85 E-02 1.85 E-03 1.85 E-03 7.39 E-04 7.39 E-04 7.39 E-04 7.39 E-04 2.52 E-02 Percentage (%) PPM Percentage (%) 73.54 7.35 7.35 2.94 2.94 2.94 2.94 100.0 735400 73500 73500 29400 29400 29400 29400 1000000 0.22 0.02 0.02 0.01 0.01 0.01 0.01 0.30 PPM 2208 221 221 88 88 88 88 3003 Heat Sink Homogeneous Material Level Description Aluminum & its alloys Package Totals Substance Aluminum CAS# 7429-90-5 Component Level Weight (g) 2.63 E+00 Weight (g) 8.37 E+00 Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary Percentage (%) PPM Percentage (%) 100.00 1.00 E+06 31.39 Percentage (%) 100 PPM 313924 PPM 1000000