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Product / Package Information
Environmental Information
Package
Body Size (mm)
Lead Count
Terminal Finish
MS Number
RoHS Compliant
High Temperature Compliant
Halogen Free Compliant
REACH SVHC Compliant
MQFP_PQ4
32 X 32 X 3.5 (+2.6)
240
100 Sn
MS011415B
Yes
Yes
Yes
Yes
Materials Declaration
Molding Compound
Homogeneous Material Level
Substance
Description
Other inorganic materials
Thermosets
Other inorganic materials
Subtotal
Silica
Epoxy & Phenol Resin
Carbon black
CAS#
60676-86-0
Proprietary
1333-86-4
Component Level
Weight (g)
3.83E+00
5.63E-01
1.37E-02
4.41 E+00
Percentage (%)
PPM
Percentage (%)
86.91
12.78
0.31
100.00
869100
127800
3100
1000000
45.73
6.72
0.16
52.62
PPM
457282
67243
1631
526156
Leadframe
Homogeneous Material Level
Substance
Description
Copper & its alloys
Copper & its alloys
Copper & its alloys
Copper & its alloys
Subtotal
Copper
Chromium
Tin
Zinc
CAS#
7440-50-8
7440-47-3
7440-31-5
7440-66-6
Component Level
Weight (g)
9.61 E-01
2.90 E-03
2.42 E-03
1.94 E-03
9.68 E-01
Percentage (%)
PPM
Percentage (%)
99.25
0.30
0.25
0.20
100.00
992500
3000
2500
2000
1000000
11.47
0.03
0.03
0.02
11.56
PPM
114708
347
289
231
115575
Internal Leadframe Plating
Component Level
Homogeneous Material Level
Description
Precious metals
Substance
Silver
CAS#
7440-22-4
Weight (g)
2.86 E-03
Percentage (%)
PPM
Percentage (%)
100.0
1000000
0.03
PPM
342
External Leadframe Plating
Component Level
Homogeneous Material Level
Description
Tin & its alloys
Substance
Tin
CAS#
7440-31-5
Weight (g)
3.46 E-02
Percentage (%)
PPM
Percentage (%)
100.0
1000000
0.41
PPM
4133
Bond Wires
Component Level
Homogeneous Material Level
Substance
Description
Precious metals
Gold
CAS#
7440-57-5
Weight (g)
2.06 E-02
Percentage (%)
PPM
Percentage (%)
100.0
1000000
0.25
PPM
2459
Chip
Component Level
Homogeneous Material Level
Description
Other inorganic materials
Substance
Doped Silicon
CAS#
7440-21-3
Weight (g)
2.88 E-01
Percentage (%)
PPM
Percentage (%)
100.0
1000000
3.44
PPM
34409
Die Attach
Homogeneous Material Level
Substance
Description
Precious metals
Other organic materials
Others
Other organic materials
Other organic materials
Others
Others
Subtotal
Silver
Epoxy resin A
Anhydride
2,6-Diglycidyl phenyl allyl ether oligomer
Epoxy resin B
Epoxy resin modifier
Anhydride
CAS#
7440-22-4
TS ref# 10013
TS ref# 10181
Unassigned
TS ref# 10237
TS ref# 10038
TS ref# 10180
Component Level
Weight (g)
1.85 E-02
1.85 E-03
1.85 E-03
7.39 E-04
7.39 E-04
7.39 E-04
7.39 E-04
2.52 E-02
Percentage (%)
PPM
Percentage (%)
73.54
7.35
7.35
2.94
2.94
2.94
2.94
100.0
735400
73500
73500
29400
29400
29400
29400
1000000
0.22
0.02
0.02
0.01
0.01
0.01
0.01
0.30
PPM
2208
221
221
88
88
88
88
3003
Heat Sink
Homogeneous Material Level
Description
Aluminum & its alloys
Package Totals
Substance
Aluminum
CAS#
7429-90-5
Component Level
Weight (g)
2.63 E+00
Weight (g)
8.37 E+00
Note: The information provided in this declaration are true to the best of ADI's knowledge.
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary
Percentage (%)
PPM
Percentage (%)
100.00
1.00 E+06
31.39
Percentage (%)
100
PPM
313924
PPM
1000000