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Product / Package Information
Environmental Information
Package
Body Size (mm)
LeadCount
Terminal Finish
RoHS Compliant
High Temperature Compliant
Halogen Free Compliant
JIG Material Content Compliant
LFCSP - Punched
10 X 10 X 0.85 (7.16 EP)
84
100 Sn
Yes
Yes
Yes
Level A Compliant
Materials Declaration
Molding Compound
Homogeneous Material Level
Substance
Description
Other inorganic materials
Thermosets
Other inorganic materials
Subtotal
Silica
Epoxy & Phenol Resin
Carbon black
CAS#
60676-86-0
Proprietary
1333-86-4
Component Level
Weight (g)
Percentage (%)
PPM
Percentage (%)
86.91
12.78
0.31
100.00
869100
127800
3100
1000000
31.80
4.68
0.11
36.59
8.68E-02
1.28E-02
3.10E-04
9.99 E-02
PPM
318011
46763
1134
365908
Leadframe
Homogeneous Material Level
Substance
Description
Copper & its alloys
Copper & its alloys
Copper & its alloys
Copper & its alloys
Copper & its alloys
Subtotal
Copper
Nickel
Silicon
Zinc
Silver
CAS#
7440-50-8
7440-02-0
7440-21-3
7440-66-7
7440-22-4
Component Level
Weight (g)
Percentage (%)
PPM
Percentage (%)
96.37
2.50
0.60
0.50
0.03
100.00
963700
25000
6000
5000
300
1000000
50.20
1.30
0.31
0.26
0.02
52.09
1.37 E-01
3.55 E-03
8.53 E-04
7.11 E-04
4.27 E-05
1.42 E-01
PPM
502031
13024
3126
2605
156
520941
Internal Leadframe Plating
Homogeneous Material Level
Substance
Description
Precious metals
CAS#
7440-22-4
Silver
Component Level
Weight (g)
Percentage (%)
PPM
Percentage (%)
100.0
1000000
0.23
6.30 E-04
PPM
2308
External Leadframe Plating
Component Level
Homogeneous Material Level
Description
Tin & its alloys
Substance
Tin
CAS#
7440-31-5
Weight (g)
Percentage (%)
PPM
Percentage (%)
100.0
1000000
0.21
5.60 E-04
PPM
2052
Bond Wires
Homogeneous Material Level
Description
Precious metals
Substance
Gold
CAS#
7440-57-5
Component Level
Weight (g)
Percentage (%)
PPM
Percentage (%)
100.0
1000000
1.29
3.52 E-03
PPM
12898
Chip
Component Level
Homogeneous Material Level
Description
Other inorganic materials
Substance
Doped Silicon
CAS#
7440-21-3
Weight (g)
Percentage (%)
PPM
Percentage (%)
100.0
1000000
9.15
2.50 E-02
PPM
91459
Die Attach
Homogeneous Material Level
Description
Thermoset
Others
Subtotal
Package Totals
Substance
Epoxy Resin
Polymeric Resin
CAS#
Proprietary
Proprietary
Component Level
Weight (g)
Percentage (%)
PPM
Percentage (%)
66.00
34.00
100.0
660000
340000
1000000
0.29
0.15
0.44
7.99 E-04
4.11 E-04
1.21 E-03
Weight (g)
2.73 E-01
Note: The information provided in this declaration are true to the best of ADI's knowledge.
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary
Percentage (%)
100.00
PPM
2926
1507
4434
PPM
1000000