Product / Package Information Environmental Information Package Body Size (mm) LeadCount Terminal Finish RoHS Compliant High Temperature Compliant Halogen Free Compliant JIG Material Content Compliant LFCSP - Punched 10 X 10 X 0.85 (7.16 EP) 84 100 Sn Yes Yes Yes Level A Compliant Materials Declaration Molding Compound Homogeneous Material Level Substance Description Other inorganic materials Thermosets Other inorganic materials Subtotal Silica Epoxy & Phenol Resin Carbon black CAS# 60676-86-0 Proprietary 1333-86-4 Component Level Weight (g) Percentage (%) PPM Percentage (%) 86.91 12.78 0.31 100.00 869100 127800 3100 1000000 31.80 4.68 0.11 36.59 8.68E-02 1.28E-02 3.10E-04 9.99 E-02 PPM 318011 46763 1134 365908 Leadframe Homogeneous Material Level Substance Description Copper & its alloys Copper & its alloys Copper & its alloys Copper & its alloys Copper & its alloys Subtotal Copper Nickel Silicon Zinc Silver CAS# 7440-50-8 7440-02-0 7440-21-3 7440-66-7 7440-22-4 Component Level Weight (g) Percentage (%) PPM Percentage (%) 96.37 2.50 0.60 0.50 0.03 100.00 963700 25000 6000 5000 300 1000000 50.20 1.30 0.31 0.26 0.02 52.09 1.37 E-01 3.55 E-03 8.53 E-04 7.11 E-04 4.27 E-05 1.42 E-01 PPM 502031 13024 3126 2605 156 520941 Internal Leadframe Plating Homogeneous Material Level Substance Description Precious metals CAS# 7440-22-4 Silver Component Level Weight (g) Percentage (%) PPM Percentage (%) 100.0 1000000 0.23 6.30 E-04 PPM 2308 External Leadframe Plating Component Level Homogeneous Material Level Description Tin & its alloys Substance Tin CAS# 7440-31-5 Weight (g) Percentage (%) PPM Percentage (%) 100.0 1000000 0.21 5.60 E-04 PPM 2052 Bond Wires Homogeneous Material Level Description Precious metals Substance Gold CAS# 7440-57-5 Component Level Weight (g) Percentage (%) PPM Percentage (%) 100.0 1000000 1.29 3.52 E-03 PPM 12898 Chip Component Level Homogeneous Material Level Description Other inorganic materials Substance Doped Silicon CAS# 7440-21-3 Weight (g) Percentage (%) PPM Percentage (%) 100.0 1000000 9.15 2.50 E-02 PPM 91459 Die Attach Homogeneous Material Level Description Thermoset Others Subtotal Package Totals Substance Epoxy Resin Polymeric Resin CAS# Proprietary Proprietary Component Level Weight (g) Percentage (%) PPM Percentage (%) 66.00 34.00 100.0 660000 340000 1000000 0.29 0.15 0.44 7.99 E-04 4.11 E-04 1.21 E-03 Weight (g) 2.73 E-01 Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary Percentage (%) 100.00 PPM 2926 1507 4434 PPM 1000000