TC1070/TC1071/TC1187 50 mA, 100 mA and 150 mA Adjustable CMOS LDOs with Shutdown Features: Description: • • • • The TC1070, TC1071 and TC1187 devices are adjustable LDOs designed to supersede a variety of older (bipolar) voltage regulators. Total supply current is typically 50 µA at full load (20 to 60 times lower than in bipolar regulators). • • • • 50 µA Ground Current for Longer Battery Life Adjustable Output Voltage Very Low Dropout Voltage Choice of 50 mA (TC1070), 100 mA (TC1071) and 150 mA (TC1187) Output Power-Saving Shutdown mode Overcurrent and Overtemperature Protection Space-Saving 5-Pin SOT-23 Package Pin Compatible with Bipolar Regulators Applications: • • • • • • • Battery Operated Systems Portable Computers Medical Instruments Instrumentation Cellular/GSM/PHS Phones Linear Post-Regulators for SMPS Pagers The TC1070, TC1071 and TC1187 devices are stable with an output capacitor of only 1 µF and have a maximum output current of 50 mA, 100 mA and 150 mA, respectively. For higher output versions please see the TC1174 (IOUT = 300 mA) data sheet (DS21363). Typical Application VIN 1 VIN Package Type VOUT SHDN 5 5-Pin SOT-23 VOUT C1 + 1 µF TC1070 TC1071 TC1187 2 GND 3 The devices’ key features include ultra low-noise operation, very low dropout voltage – typically 85 mV (TC1070), 180 mV (TC1071) and 270 mV (TC1187) at full load and fast response to step changes in load. Supply current is reduced to 0.5 µA (maximum) when the shutdown input is low. The devices incorporate both overtemperature and overcurrent protection. Output voltage is programmed with a simple resistor divider from VOUT to ADJ to GND. VOUT ADJ 5 4 R1 ADJ TC1070 TC1071 TC1187 4 R2 1 VIN Shutdown Control (from Power Control Logic) 2 3 GND SHDN R1 V OUT = V REF ------- + 1 R2 2010 Microchip Technology Inc. DS21353E-page 1 TC1070/TC1071/TC1187 1.0 ELECTRICAL CHARACTERISTICS † Notice: Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions above those indicated in the operation sections of the specifications is not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability. Absolute Maximum Ratings† Input Voltage .........................................................6.5V Output Voltage........................... (-0.3V) to (VIN + 0.3V) Power Dissipation................Internally Limited (Note 5) Maximum Voltage on Any Pin ........VIN +0.3V to -0.3V Operating Temperature Range...... -40°C < TJ < 125°C Storage Temperature..........................-65°C to +150°C ELECTRICAL SPECIFICATIONS Electrical Characteristics: VIN = VOUT + 1V, IL = 0.1 mA, CL = 3.3 µF, SHDN > VIH, TA = +25°C, unless otherwise noted. Boldface type specifications apply for junction temperatures of -40°C to +125°C. Parameter Input Operating Voltage Maximum Output Current Adjustable Output Voltage Range Symbol Min Typ Max Units Test Conditions VIN 2.7 — 6.0 V Note 6 IOUTmax 50 — — mA TC1070 100 — — TC1071 150 — — TC1187 VOUT VREF — 5.5 V VREF 1.165 1.20 1.235 V VREF/T — 40 — ppm/°C Line Regulation VOUT/VIN — 0.05 0.35 % (VR + 1V) VIN6V Load Regulation (Note 2) VOUT/VOUT — 0.5 2 % TC1070, TC1071 IL = 0.1 mA to IOUTmax — 0.5 3 Reference Voltage VREF Temperature Coefficient Note 1: 2: 3: 4: 5: 6: Note 1 TC1187 IL = 0.1 mA to IOUTmax TC VOUT = (VOUTmax – VOUTMIN) x 106 VOUTx T Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested over a load range from 0.1 mA to the maximum specified output current. Changes in output voltage due to heating effects are covered by the thermal regulation specification. Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value. Thermal Regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied, excluding load or line regulation effects. Specifications are for a current pulse equal to Ilmax at VIN = 6V for T = 10 ms. The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction-to-air (i.e., Ta, Tj, ja). Exceeding the maximum allowable power dissipation causes the device to initiate thermal shutdown. Please see Section 5.0 “Thermal Considerations” for more details. The minimum VIN has to justify the conditions: VIN VR + VDROPOUT and VIN 2.7V for IL = 0.1 mA to IOUTMAX. DS21353E-page 2 2010 Microchip Technology Inc. TC1070/TC1071/TC1187 ELECTRICAL SPECIFICATIONS (CONTINUED) Electrical Characteristics: VIN = VOUT + 1V, IL = 0.1 mA, CL = 3.3 µF, SHDN > VIH, TA = +25°C, unless otherwise noted. Boldface type specifications apply for junction temperatures of -40°C to +125°C. Parameter Dropout Voltage (Note 3) Supply Current Shutdown Supply Current Power Supply Rejection Ratio Symbol Min Typ Max Units VIN-VOUT — 2 — mV IIN Test Conditions IL = 0.1 mA — 65 — IL = 20 mA — 85 120 IL = 50 mA — 180 250 TC1071, TC1187 IL = 100 mA — 270 400 TC1187 IL = 150 mA — 50 80 µA SHDN = VIH, IL = 0 IINSD — 0.05 0.5 µA SHDN = 0V PSRR — 64 — dB FRE1 kHz IOUTSC — 300 450 mA VOUT = 0V Thermal Regulation VOUT/PD — 0.04 — V/W Note 4 Thermal Shutdown Die Temperature TSD — 160 — °C TSD — 10 — °C eN — 260 — nV/Hz SHDN Input High Threshold VIH 45 — — %VIN VIN = 2.5V to 6.5V SHDN Input Low Threshold VIL — — 15 %VIN VIN = 2.5V to 6.5V IADJ — 50 — pA Output Short Circuit Current Thermal Shutdown Hysteresis Output Noise IL = IOUTmax SHDN Input ADJ Input Adjust Input Leakage Current Note 1: 2: 3: 4: 5: 6: TC VOUT = (VOUTmax – VOUTMIN) x 106 VOUTx T Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested over a load range from 0.1 mA to the maximum specified output current. Changes in output voltage due to heating effects are covered by the thermal regulation specification. Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value. Thermal Regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied, excluding load or line regulation effects. Specifications are for a current pulse equal to Ilmax at VIN = 6V for T = 10 ms. The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction-to-air (i.e., Ta, Tj, ja). Exceeding the maximum allowable power dissipation causes the device to initiate thermal shutdown. Please see Section 5.0 “Thermal Considerations” for more details. The minimum VIN has to justify the conditions: VIN VR + VDROPOUT and VIN 2.7V for IL = 0.1 mA to IOUTMAX. TERMPERATURE CHARACTERISTICS Parameters Thermal Resistance, 5L-SOT-23 2010 Microchip Technology Inc. Sym Min Typ Max Units JA — 256 — °C/W Conditions DS21353E-page 3 TC1070/TC1071/TC1187 2.0 TYPICAL CHARACTERISTICS Note: The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. Note: Unless otherwise specified, all parts are measured at temperature = +25°C. DROPOUT VOLTAGE (V) 0.018 Dropout Voltage vs. Temperature (VOUT = 3.3V) ILOAD = 10mA 0.090 0.016 0.014 0.012 0.010 0.008 0.006 0.004 0.002 0.100 DROPOUT VOLTAGE (V) 0.020 CIN = 1μF COUT = 1μF -20 0 20 50 TEMPERATURE (°C) 70 0.030 0.020 0.300 CIN = 1μF COUT = 1μF 0.012 0.010 0.008 0.006 0.004 CIN = 1μF COUT = 1μF -40 -20 0 20 50 TEMPERATURE (°C) 70 125 60 50 40 30 20 CIN = 1μF COUT = 1μF 0 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 6.5 7 7.5 VIN (V) 0.250 0.200 0.150 0.100 0.050 90 CIN = 1μF COUT = 1μF -20 0 20 50 TEMPERATURE (°C) 70 125 Ground Current vs. VIN (VOUT = 3.3V) ILOAD = 100mA 80 GND CURRENT (μA) 70 DS21353E-page 4 70 Dropout Voltage vs. Temperature (VOUT = 3.3V) -40 ILOAD = 10mA 10 0 20 50 TEMPERATURE (°C) 0.000 125 Ground Current vs. VIN (VOUT = 3.3V) 80 -20 ILOAD = 150mA 0.000 GND CURRENT (μA) 0.040 ILOAD = 10mA 0.014 90 0.050 -40 Dropout Voltage vs. Temperature (VOUT = 3.3V) 0.016 0.002 0.060 125 DROPOUT VOLTAGE (V) DROPOUT VOLTAGE (V) 0.018 0.070 0.000 -40 0.020 ILOAD = 50mA 0.080 0.010 0.000 Dropout Voltage vs. Temperature (VOUT = 3.3V) 70 60 50 40 30 20 CIN = 1μF COUT = 1μF 10 0 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 6.5 7 7.5 VIN (V) 2010 Microchip Technology Inc. TC1070/TC1071/TC1187 Note: Unless otherwise specified, all parts are measured at temperature = +25°C. Ground Current vs. VIN (VOUT = 3.3V) 80 ILOAD = 0 ILOAD = 150mA 3 60 2.5 50 VOUT (V) GND CURRENT (μA) 70 40 30 2 1.5 1 20 0.5 CIN = 1μF COUT = 1μF 10 0 CIN = 1μF COUT = 1μF 0 0 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 6.5 7 7.5 VIN (V) 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 6.5 7 VIN (V) VOUT vs. VIN (VOUT = 3.3V) 3.5 3.0 VOUT vs. VIN (VOUT = 3.3V) 3.5 Output Voltage vs. Temperature (VOUT = 3.3V) 3.320 ILOAD = 100mA ILOAD = 10mA 3.315 3.310 3.305 VOUT (V) VOUT (V) 2.5 2.0 1.5 3.300 3.295 3.290 1.0 3.285 0.5 CIN = 1μF COUT = 1μF 0.0 0 3.290 3.288 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 6.5 7 VIN (V) CIN = 1μF COUT = 1μF VIN = 4.3V 3.280 3.275 -40 -20 -10 0 20 40 85 125 TEMPERATURE (°C) Output Voltage vs. Temperature (VOUT = 3.3V) ILOAD = 150mA VOUT (V) 3.286 3.284 3.282 3.280 3.278 3.276 CIN = 1μF COUT = 1μF VIN = 4.3V 3.274 -40 -20 -10 0 20 40 85 125 TEMPERATURE (°C) 2010 Microchip Technology Inc. DS21353E-page 5 TC1070/TC1071/TC1187 Note: Unless otherwise specified, all parts are measured at temperature = +25°C. Output Voltage vs. Temperature (VOUT = 5V) 5.025 5.015 4.990 4.988 5.010 4.986 5.005 5.000 4.995 4.990 4.985 4.984 4.982 4.980 4.978 VIN = 6V CIN = 1μF COUT = 1μF -40 ILOAD = 150mA 4.992 ILOAD = 10mA VOUT (V) VOUT (V) 5.020 Output Voltage vs. Temperature (VOUT = 5V) 4.994 VIN = 6V CIN = 1μF COUT = 1μF 4.976 4.974 -20 -10 0 20 40 85 125 -40 -20 -10 TEMPERATURE (°C) Temperature vs. Quiescent Current (VOUT = 5V) 70 GND CURRENT (μA) GND CURRENT (μA) 60 50 40 30 20 VIN = 6V CIN = 1μF COUT = 1μF 10 -20 -10 0 20 40 TEMPERATURE (°C) 85 125 ILOAD = 150mA 50 40 30 20 VIN = 6V CIN = 1μF COUT = 1μF -40 125 -10 Stability Region vs. Load Current RLOAD = 50Ω COUT = 1μF CIN = 1μF 1.0 -20 20 40 85 125 Power Supply Rejection Ratio -30 -35 COUT = 1μF to 10μF -40 100 -45 10 1 0 TEMPERATURE (°C) 1000 COUT ESR (Ω) NOISE (μV/√Hz) 85 0 Output Noise vs. Frequency 10.0 40 60 10 0 -40 20 Temperature vs. Quiescent Current (VOUT = 5V) 80 ILOAD = 10mA Stable Region PSRR (dB) 70 0 TEMPERATURE (°C) -50 IOUT = 10mA VINDC = 4V VINAC = 100mVp-p VOUT = 3V CIN = 0 COUT = 1μF -55 -60 -65 0.1 -70 0.1 -75 0.0 0.01K 0.1K 0.01 1K 10K 100K 1000K FREQUENCY (Hz) 0 10 20 30 40 50 60 70 80 90 100 LOAD CURRENT (mA) -80 0.01K 0.1K 1K 10K 100K 1000K FREQUENCY (Hz) Note: Unless otherwise specified, all parts are measured at temperature = +25°C. DS21353E-page 6 2010 Microchip Technology Inc. TC1070/TC1071/TC1187 Measure Rise Time of 3.3V LDO Measure Fall Time of 3.3V LDO Conditions: CIN = 1μF, COUT = 1μF, ILOAD = 100mA, VIN = 4.3V, Temp = 25°C, Fall Time = 184μS Conditions: CIN = 1μF, COUT = 1μF, ILOAD = 100mA, VIN = 4.3V, Temp = 25°C, Fall Time = 52μS VSHDN VSHDN VOUT VOUT Measure Rise Time of 5.0V LDO Measure Fall Time of 5.0V LDO Conditions: CIN = 1μF, COUT = 1μF, ILOAD = 100mA, VIN = 6V, Temp = 25°C, Fall Time = 192μS Conditions: CIN = 1μF, COUT = 1μF, ILOAD = 100mA, VIN = 6V, Temp = 25°C, Fall Time = 88μS VSHDN VSHDN VOUT VOUT Thermal Shutdown Response of 5.0V LDO Conditions: VIN = 6V, CIN = 0μF, COUT = 1μF VOUT ILOAD was increased until temperature of die reached about 160°C, at which time integrated thermal protection circuitry shuts the regulator off when die temperature exceeds approximately 160°C. The regulator remains off until die temperature drops to approximately 150°C. 2010 Microchip Technology Inc. DS21353E-page 7 TC1070/TC1071/TC1187 3.0 PIN DESCRIPTIONS The descriptions of the pins are listed in Table 3-1. TABLE 3-1: PIN FUNCTION TABLE TC1070/TC1071/TC1187 Symbol Description SOT-23 1 3.1 VIN 2 GND 3 SHDN Unregulated supply input Ground terminal Shutdown control input 4 ADJ Output voltage adjust terminal 5 VOUT Regulated voltage output Input Voltage Supply (VIN) Connect unregulated input supply to the VIN pin. If there is a large distance between the input supply and the LDO regulator, some input capacitance is necessary for proper operation. A 1 µF capacitor connected from VIN to ground is recommended for most applications. 3.2 Ground (GND) 3.4 Output Voltage Adjust (ADJ) Output voltage setting is programmed with a resistor divider from VOUT to this input. 3.5 Regulated Voltage Output (VOUT) Connect the output load to VOUT of the LDO. Also connect the positive side of the LDO output capacitor as close as possible to the VOUT pin. Connect the unregulated input supply ground return to GND. Also connect the negative side of the 1 µF typical input decoupling capacitor close to GND and the negative side of the output capacitor C1 to GND. 3.3 Shutdown Control Input (SHDN) The regulator is fully enabled when a logic high is applied to this input. The regulator enters shutdown when a logic low is applied to this input. During shutdown, output voltage falls to zero and supply current is reduced to 0.5 µA (maximum). DS21353E-page 8 2010 Microchip Technology Inc. TC1070/TC1071/TC1187 4.0 DETAILED DESCRIPTION 4.1 The TC1070, TC1071 and TC1187 are adjustable output voltage regulators. (If a fixed version is desired, please see the TC1014/TC1015/TC1185 data sheet – DS21335.) Unlike bipolar regulators, the TC1070, TC1071 and TC1187 supply current does not increase with load current. In addition, VOUT remains stable and within regulation over the entire 0 mA to IOUTmax operating load current range (an important consideration in RTC and CMOS RAM battery back-up applications). Figure 4-1 shows a typical application circuit. The regulator is enabled any time the shutdown input (SHDN) is at or above VIH, and shutdown (disabled) when SHDN is at or below VIL. SHDN may be controlled by a CMOS logic gate or I/O port of a microcontroller. If the SHDN input is not required, it should be connected directly to the input supply. While in shutdown, supply current decreases to 0.05 µA (typical) and VOUT falls to zero volts. 3.0V + Battery 5 1 V VOUT + C1 IN C2 + 1 µF TC1070 1 µF TC1071 TC1187 2 GND 3 SHDN ADJ +2.45V R1 470K 4 R2 470K Shutdown Control (from Power Control Logic) FIGURE 4-1: Battery-Operated Supply. 2010 Microchip Technology Inc. Adjust Input The output voltage setting is determined by the values of R1 and R2 (see Equation 4-1). The ohmic values of these resistors should be between 470K and 3M to minimize bleeder current. The output voltage setting is calculated using the following equation: EQUATION 4-1: R1 V OUT = VREF ------ 1 R2 The voltage adjustment range of the TC1070, TC1071 and TC1187 is from VREF to (VIN – 0.05V). 4.2 Output Capacitor A 1 µF (minimum) capacitor from VOUT to ground is recommended. The output capacitor should have an effective series resistance greater than 0.1 and less than 5.0, and a resonant frequency above 1 MHz. Aluminum electrolytic or tantalum capacitor types can be used. (Since many aluminum electrolytic capacitors freeze at approximately -30°C, solid tantalums are recommended for applications operating below -25°C.) When operating from sources other than batteries, supply-noise rejection and transient response can be improved by increasing the value of the input and output capacitors and employing passive filtering techniques. 4.3 Input Capacitor A 1 µF capacitor should be connected from VIN to GND if there is more than 10 inches of wire between the regulator and the AC filter capacitor, or if a battery is used as power source. DS21353E-page 9 TC1070/TC1071/TC1187 5.0 THERMAL CONSIDERATIONS 5.1 Thermal Shutdown Integrated thermal protection circuitry shuts the regulator off when die temperature exceeds 160°C. The regulator remains off until the die temperature drops to approximately 150°C. 5.2 Equation 5-1 can be used in conjunction with Equation 5-2 to ensure regulator thermal operation is within limits. For example: Given: Power Dissipation The amount of power the regulator dissipates is primarily a function of input and output voltage, and output current. The following equation is used to calculate worst-case actual power dissipation: VINmax = 3.0V ±10% VOUTmin = 2.7V – 2% ILOADmax = 40 mA TJmax = +125°C TAmax = +55°C Find: 1. Actual power dissipation 2. Maximum allowable dissipation Actual power dissipation: EQUATION 5-1: PD (VINmax – VOUTmin)ILOADmax P D (VINmax – VOUTmin)ILOADmax = [(3.0 x 1.10) – (2.7 x .0.98)]40 x 10–3 Where: = 26.2 mW PD = Worst-case actual power dissipation VINmax = Maximum voltage on VIN Maximum allowable power dissipation: T Jmax – T Amax PDmax = ---------------------------------------- VOUTmin = Minimum regulator output voltage JA ILOADmax = Maximum output (load) current The maximum allowable power dissipation (Equation 5-2) is a function of the maximum ambient temperature (TAmax), the maximum allowable die temperature (TJmax) and the thermal resistance from junction-to-air (JA). The 5-Pin SOT-23 package has a JA of approximately 220° C/Watt. EQUATION 5-2: T Jmax – T Amax P Dmax = ---------------------------------------- JA where all terms are previously defined. DS21353E-page 10 125 – 55 = ------------------------220 = 318 mW In this example, the TC1070 dissipates a maximum of 26.2 mW which is below the allowable limit of 318 mW. In a similar manner, Equation 5-1 and Equation 5-2 can be used to calculate maximum current and/or input voltage limits. 5.3 Layout Considerations The primary path of heat conduction out of the package is via the package leads. Therefore, layouts having a ground plane, wide traces at the pads, and wide power supply bus lines combine to lower JA and therefore increase the maximum allowable power dissipation limit. 2010 Microchip Technology Inc. TC1070/TC1071/TC1187 6.0 PACKAGING INFORMATION 6.1 Package Marking Information 5-Lead SOT-23-5 Example: XXNN (V) Adjustable Legend: XX...X Y YY WW NNN e3 * Note: 6.2 TC1070 Code TC1071 Code TC1187 Code BANN BBNN R9NN XXNN Customer-specific information Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week ‘01’) Alphanumeric traceability code Pb-free JEDEC designator for Matte Tin (Sn) This package is Pb-free. The Pb-free JEDEC designator ( e3 ) can be found on the outer packaging for this package. In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. Taping Form Component Taping Orientation for 5-Pin SOT-23 (EIAJ SC-74A) Devices User Direction of Feed Device Marking W PIN 1 P Standard Reel Component Orientation for TR Suffix Device (Mark Right Side Up) Carrier Tape, Number of Components Per Reel and Reel Size: Package Carrier Width (W) Pitch (P) Part Per Full Reel Reel Size 8 mm 4 mm 3000 7 in. 5-Pin SOT-23 2010 Microchip Technology Inc. DS21353E-page 11 TC1070/TC1071/TC1187 /HDG3ODVWLF6PDOO2XWOLQH7UDQVLVWRU&7>627@ 1RWH )RUWKHPRVWFXUUHQWSDFNDJHGUDZLQJVSOHDVHVHHWKH0LFURFKLS3DFNDJLQJ6SHFLILFDWLRQORFDWHGDW KWWSZZZPLFURFKLSFRPSDFNDJLQJ b N E E1 3 2 1 e e1 D A2 A c φ A1 L L1 8QLWV 'LPHQVLRQ/LPLWV 1XPEHURI3LQV 0,//,0(7(56 0,1 120 0$; 1 /HDG3LWFK H %6& 2XWVLGH/HDG3LWFK H 2YHUDOO+HLJKW $ ± 0ROGHG3DFNDJH7KLFNQHVV $ ± 6WDQGRII $ ± 2YHUDOO:LGWK ( ± 0ROGHG3DFNDJH:LGWK ( ± 2YHUDOO/HQJWK ' ± )RRW/HQJWK / ± )RRWSULQW / ± )RRW$QJOH ± /HDG7KLFNQHVV F ± %6& /HDG:LGWK E ± 1RWHV 'LPHQVLRQV'DQG(GRQRWLQFOXGHPROGIODVKRUSURWUXVLRQV0ROGIODVKRUSURWUXVLRQVVKDOOQRWH[FHHGPPSHUVLGH 'LPHQVLRQLQJDQGWROHUDQFLQJSHU$60(<0 %6& %DVLF'LPHQVLRQ7KHRUHWLFDOO\H[DFWYDOXHVKRZQZLWKRXWWROHUDQFHV 0LFURFKLS 7HFKQRORJ\ 'UDZLQJ &% DS21353E-page 12 2010 Microchip Technology Inc. TC1070/TC1071/TC1187 5-Lead Plastic Small Outline Transistor (CT) [SOT-23] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 2010 Microchip Technology Inc. DS21353E-page 13 TC1070/TC1071/TC1187 APPENDIX A: REVISION HISTORY Revision E (November 2010) The following is the list of modifications: 1. 2. 3. 4. Added thermal package resistance in Termperature Characteristics table. Updated Section 3.4 “Output Voltage Adjust (ADJ)”. Updated Figure 4-1. Added new section Section 4.3 “Input Capacitor”. Revision D (March 2007) The following is the list of modifications: 1. 2. 3. 4. Ground current changed to 50 µA. Package type changed to SOT-23. Section 3.0 “Pin Descriptions”: Added pin descriptions. Section 6.0 “Packaging Information”: Updated packaging information. Revision C (January 2006) • Undocumented changes. Revision B (May 2002) • Undocumented changes. Revision A (March 2002) • Original Release of this Document. DS21353E-page 14 2010 Microchip Technology Inc. TC1070/TC1071/TC1187 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. X XXXXX Device Temperature Range Package Device: TC1070: 50 mA, Adjustable CMOS LDO w/Shutdown TC1071: 100 mA, Adjustable CMOS LDO w/Shutdown TC1187: 150 mA, Adjustable CMOS LDO w/Shutdown Temperature Range: V Package: Examples: a) TC1070VCT713: b) TC1071VCT713: c) TC1187VCT713: 50 mA, Adjustable 5LD SOT-23 package 100 mA, Adjustable, 5LD SOT-23 package 150 mA, Adjustable 5LD SOT-23 package = -40C to +125C CT713 = 2010 Microchip Technology Inc. Plastic small outline transistor (CT) SOT-23, 5 lead, (tape and reel). DS21353E-page 15 Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, dsPIC, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART, PIC32 logo, rfPIC and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor, MXDEV, MXLAB, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Application Maestro, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial Programming, ICSP, Mindi, MiWi, MPASM, MPLAB Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit, PICtail, REAL ICE, rfLAB, Select Mode, Total Endurance, TSHARC, UniWinDriver, WiperLock and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. © 2010, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. ISBN: 978-1-60932-685-2 Microchip received ISO/TS-16949:2002 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. DS21353E-page 16 2010 Microchip Technology Inc. Worldwide Sales and Service AMERICAS ASIA/PACIFIC ASIA/PACIFIC EUROPE Corporate Office 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support: http://support.microchip.com Web Address: www.microchip.com Asia Pacific Office Suites 3707-14, 37th Floor Tower 6, The Gateway Harbour City, Kowloon Hong Kong Tel: 852-2401-1200 Fax: 852-2401-3431 India - Bangalore Tel: 91-80-3090-4444 Fax: 91-80-3090-4123 India - New Delhi Tel: 91-11-4160-8631 Fax: 91-11-4160-8632 Austria - Wels Tel: 43-7242-2244-39 Fax: 43-7242-2244-393 Denmark - Copenhagen Tel: 45-4450-2828 Fax: 45-4485-2829 India - Pune Tel: 91-20-2566-1512 Fax: 91-20-2566-1513 France - Paris Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79 Japan - Yokohama Tel: 81-45-471- 6166 Fax: 81-45-471-6122 Germany - Munich Tel: 49-89-627-144-0 Fax: 49-89-627-144-44 Atlanta Duluth, GA Tel: 678-957-9614 Fax: 678-957-1455 Boston Westborough, MA Tel: 774-760-0087 Fax: 774-760-0088 Chicago Itasca, IL Tel: 630-285-0071 Fax: 630-285-0075 Cleveland Independence, OH Tel: 216-447-0464 Fax: 216-447-0643 Dallas Addison, TX Tel: 972-818-7423 Fax: 972-818-2924 Detroit Farmington Hills, MI Tel: 248-538-2250 Fax: 248-538-2260 Kokomo Kokomo, IN Tel: 765-864-8360 Fax: 765-864-8387 Los Angeles Mission Viejo, CA Tel: 949-462-9523 Fax: 949-462-9608 Santa Clara Santa Clara, CA Tel: 408-961-6444 Fax: 408-961-6445 Toronto Mississauga, Ontario, Canada Tel: 905-673-0699 Fax: 905-673-6509 Australia - Sydney Tel: 61-2-9868-6733 Fax: 61-2-9868-6755 China - Beijing Tel: 86-10-8528-2100 Fax: 86-10-8528-2104 China - Chengdu Tel: 86-28-8665-5511 Fax: 86-28-8665-7889 Korea - Daegu Tel: 82-53-744-4301 Fax: 82-53-744-4302 China - Chongqing Tel: 86-23-8980-9588 Fax: 86-23-8980-9500 Korea - Seoul Tel: 82-2-554-7200 Fax: 82-2-558-5932 or 82-2-558-5934 China - Hong Kong SAR Tel: 852-2401-1200 Fax: 852-2401-3431 Malaysia - Kuala Lumpur Tel: 60-3-6201-9857 Fax: 60-3-6201-9859 China - Nanjing Tel: 86-25-8473-2460 Fax: 86-25-8473-2470 Malaysia - Penang Tel: 60-4-227-8870 Fax: 60-4-227-4068 China - Qingdao Tel: 86-532-8502-7355 Fax: 86-532-8502-7205 Philippines - Manila Tel: 63-2-634-9065 Fax: 63-2-634-9069 China - Shanghai Tel: 86-21-5407-5533 Fax: 86-21-5407-5066 Singapore Tel: 65-6334-8870 Fax: 65-6334-8850 China - Shenyang Tel: 86-24-2334-2829 Fax: 86-24-2334-2393 Taiwan - Hsin Chu Tel: 886-3-6578-300 Fax: 886-3-6578-370 China - Shenzhen Tel: 86-755-8203-2660 Fax: 86-755-8203-1760 Taiwan - Kaohsiung Tel: 886-7-213-7830 Fax: 886-7-330-9305 China - Wuhan Tel: 86-27-5980-5300 Fax: 86-27-5980-5118 Taiwan - Taipei Tel: 886-2-2500-6610 Fax: 886-2-2508-0102 China - Xian Tel: 86-29-8833-7252 Fax: 86-29-8833-7256 Thailand - Bangkok Tel: 66-2-694-1351 Fax: 66-2-694-1350 Italy - Milan Tel: 39-0331-742611 Fax: 39-0331-466781 Netherlands - Drunen Tel: 31-416-690399 Fax: 31-416-690340 Spain - Madrid Tel: 34-91-708-08-90 Fax: 34-91-708-08-91 UK - Wokingham Tel: 44-118-921-5869 Fax: 44-118-921-5820 China - Xiamen Tel: 86-592-2388138 Fax: 86-592-2388130 China - Zhuhai Tel: 86-756-3210040 Fax: 86-756-3210049 08/04/10 2010 Microchip Technology Inc. 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