Footprint for wave soldering

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HTQFP, HLQFP, LQFP, MSQFP FOOTPRINT (WAVE SOLDERING)
Philips Semiconductors
6.50
handbook, full pagewidth
0.75
0.75
Ax
C
Bx
P((N−x)x)
1/2 D1
0.75
solder lands
C
solder resist
occupied area
P((Ny−1)x)
Ay
By
solder thief
THD
(6x)
45 o
6.50
0.40
(2x)
D2
(8x)
P((Nx−1)x)
D1
0.50
re
d
di
0.75
ar
bo
2.00
(2x)
n
io
ct
MLC750
Wave soldering
PHILIPS
OUTLINE CODE
FOOTPRINT DIMENSIONS (mm)
Nx
Ny
P
Ax
Ay
Bx
By
C
D1
SOT-547-1
Not suitable for wave soldering.
HTQFP32
SOT547-2
Not suitable for wave soldering.
HTQFP48
SOT545-2
Not suitable for wave soldering.
HTQFP80
SOT513-1
Not suitable for wave soldering.
HLQFP100
SOT470-1
Not suitable for wave soldering.
THS
W
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PDF: 2001 Feb 16
HTQFP32
D2
PLACEMENT
ACCURACY
PC board footprint
PACKAGE
NAME
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SOT358-1
SOT401-1
8
8
0.80
10.95
10.95
7.15
7.15
1.90
0.40
LQFP44
SOT389-1
LQFP48
SOT313-2
Not suitable for wave soldering.
LQFP64
SOT314-2
Not suitable for wave soldering.
LQFP64
SOT414-1
Not suitable for wave soldering.
LQFP80
SOT315-1
Not suitable for wave soldering.
LQFP100
SOT407-1
Not suitable for wave soldering.
LQFP128
SOT420-1
Not suitable for wave soldering.
LQFP128
SOT425-1
Not suitable for wave soldering.
LQFP144
SOT486-1
Not suitable for wave soldering.
LQFP160
SOT435-1
Not suitable for wave soldering.
LQFP176
SOT506-1
Not suitable for wave soldering.
LQFP208
SOT459-1
Not suitable for wave soldering.
MSQFP240
SOT474-2
Not suitable for wave soldering.
0.40
0.40
0.20
±0.15
0.40
0.40
0.20
±0.15
Not suitable for wave soldering.
11
11
0.80
13.90
13.90
10.10
10.10
1.90
0.40
Philips Semiconductors
LQFP32
LQFP32
PDF: 2001 Feb 16
PC board footprint
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