ETC ATJ2001

ATJ2001 PDA+MP3 Decoder
Actions Semiconductor Co.,LTD
1. Pin descriptions
Pin No.
Pin Name
I/O
Type
Reset
Default
1
LOSCI
AI
/
Low frequency crystal OSC input
2
LOSCO
AO
/
Low frequency crystal OSC output
3
GND
PWR
/
Digital signal ground
4
4(1)
A15
O
L
Bit15 of ext. memory address bus
CLE
O
L
Command latch enable of Nand type flash
AC’97RST-
O
H
Reset to AC’97 block
ATA_RST-
O
H
ATA device reset
A16
O
L
Bit16 of ext. memory address bus
ALE
O
L
Address latch enable of Nand type flash
GIOB0
BI
Z
Bit0 of general purpose I/O port B
DAC_BCK
O
Z
Ext.
A17
O
L
Bit17 of ext. memory address bus
ATAD8
BI
L
Bit8 of ATA device data bus
GIOB1
BI
Z
Bit1 of general purpose I/O port B
DAC_LR
O
Z
Ext.
10
10(1)
A18
O
L
Bit18 of ext. memory address bus
ATAD9
BI
L
Bit9 of ATA device data bus
11
11(1)
GIOB2
BI
Z
Bit2 of general purpose I/O port B
DAC_SDATA
O
Z
Ext.
12
12(1)
A19
O
L
Bit19 of ext. memory address bus
ATAD10
BI
L
Bit10 of ATA device data bus
13
13(1)
GIOB3
BI
Z
Bit3 of general purpose I/O port B
DAC_FS256
O
Z
Ext.
14
14(1)
A20
O
L
Bit20 of ext. memory address bus
ATAD11
BI
L
Bit11 of ATA device data bus
15
15(1)
GIOB4
BI
Z
Bit4 of general purpose I/O port B
AC’97BITCK
O
Z
AC’97 codec bit clock
16
16(1)
A21
O
L
Bit21 of ext. memory address bus
ATAD12
BI
L
Bit12 of ATA device data bus
17
GIOB5
BI
Z
Bit5 of general purpose I/O port B
5
5(1)
6
6(1)
7
7(1)
8
8(1)
9
9(1)
3
Short Description
DAC bit clock output
DAC left/right channel output
DAC serial data output
DAC 256x over sampling clock
Tel
86-756-3392353
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ATJ2001 PDA+MP3 Decoder
Actions Semiconductor Co.,LTD
17(1)
AC’97SYNC
O
4
Z
AC’97 codec sample SYNC
18
18(1)
A22
O
L
Bit22 of ext. memory address bus
ATAD13
BI
L
Bit13 of ATA device data bus
19
19(1)
19(2)
GIOB6
BI
Z
Bit6 of general purpose I/O port B
AC’97SDI
I
Z
AC’97 codec serial data input
DAC3LO
O
Z
Int.
20
20(1)
A23
O
L
Bit23 of ext. memory address bus
ATAD14
BI
L
Bit14 of ATA device data bus
21
21(1)
A24
O
L
Bit24 of ext. memory address bus
ATAD15
BI
L
Bit15 of ATA device data bus
22
22(1)
22(2)
GIOB7
BI
Z
Bit7 of general purpose I/O port B
AC’97SDO
O
Z
AC’97 codec serial data output
DAC3RO
O
Z
Int.
23
VCC
PWR
24
USBD-
A
/
USB negative connect
25
USBD+
A
/
USB positive connect
26
USBVBUS
I
L
USB cable power signal
27
PVDD
A
/
Bypass capacitor for power amplifier
28
PAOR
A
/
Output of right channel power amplifier
29
PAOL
A
/
Output of
30
PGND
PWR
/
Ground for power amplifier circuits
31
PAIR
A
/
Input of right channel power amplifier
32
PAIL
A
/
Input of
33
AOUTR
A
/
Int. sigma-dalta DAC right channel analog
output
34
AOUTL
A
/
Int. sigma-dalta DAC left channel analog
output
35
VRDA
A
/
Reference voltage for DAC
36
VLAD
A
/
Low voltage for Touch Panel
37
VRAD
A
/
Reference voltage for ADC
38
AGCI
A
/
Microphone ADC amplifier input
39
MICOUT
A
/
Microphone pre-amplifier output
40
MICIN
A
/
Microphone pre-amplifier input
41
VMIC
A
/
Power supply for microphone & Touch Panel
DAC3 right channel digital output
DAC3 right channel digital output
Power supply for Pads circuits (3.15v)
Tel
left channel power amplifier
left channel power amplifier
86-756-3392353
Fax
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ATJ2001 PDA+MP3 Decoder
Actions Semiconductor Co.,LTD
42
AGND
PWR
5
/
Analog ground for record, touch panel and
ADC blocks
43
Y2
AI
/
Connect to touch panel Y2
44
Y1
AI
/
Connect to touch panel Y1
45
X1
AI
/
Connect to touch panel X1
46
X2
AI
/
Connect to touch panel X2
47
AVCC
PWR
Power supply for record, touch panel and
ADC blocks (3.15v)
48
BATSEL
I
Battery select, 0:one battery 1:two batteries
49
IBIAS
I
Int. bias pin with a ext.R(1.5Mohm) to
ground
50
VREFI
A
Reference voltage input (1.5v)
51
VL0
AI
Battery monitor reference voltage input
(1.40v)
52
VL1
AI
Battery monitor reference voltage input
(1.30v)
53
VL2
AI
Battery monitor reference voltage input
(1.15v)
54
VL3
AI
Battery monitor reference voltage input
(1.05v)
55
DCDIS
I
56
VBAT
I
57
DCF3
AI
/
The third DC-DC feedback pin
58
DCF2
AI
/
VCC(3.15V) DC-DC feedback pin
59
DCF1
AI
/
VDD(2.35V) DC-DC feedback pin
60
VP1
PWR
Power supply for int. regulator
61
VDD
PWR
Power supply for core (2.35v)
62
VP2
AI
/
Input for int. power switch
63
DCOP2
AO
/
VCC(3.15V) DC-DC pulse output
64
DCOP3
AO
/
The third DC-DC pulse output
65
DCOP1
AO
/
VDD(2.35V) DC-DC pulse output
66
AVDD
PWR
67
AVSS
PWR
/
Ground for PLL analog circuits
68
HOSCI
AI
/
High frequency crystal OSC input
69
HOSCO
AO
/
High frequency crystal OSC output
70
GND
PWR
/
Digital signal ground
L
Int DC-DC convertor disable,
0:enable 1:disable
Battery signal input
(1.0-1.5v)
Power supply for PLL analog circuits (2.35v)
Tel
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ATJ2001 PDA+MP3 Decoder
Actions Semiconductor Co.,LTD
71
CKOUT2
O
6
L
High frequency clock output
72
72(1)
GIOC0
BI
Z
Bit0 of general purpose I/O port C
SIN1
I
Z
UART1 serial input
73
73(1)
XSCLK
O
H
TCP LCM XSCLK output
LCDCK
O
H
TCP2 LCD module CK
74
74(1)
GIOC1
BI
Z
Bit1 of general purpose I/O port C
SOUT1
O
Z
UART1 serial output
75
75(1)
DISPOFF
O
Z
TCP LCM display off control output
FMIFIN
I
Z
FM radio IF counter input
76
VDD
PWR
77
77(1)
77(2)
FRAME
O
Z
TCP LCM frame signal output
V2
O
Z
Int. 4comX28seg LCD driver V2
LCM_CE
O
Z
MC141803 CE
78
VCC
PWR
79
79(1)
79(2)
YSCLK_LP
O
L
TCP LCM YSCLK/LP signal output
LCM_RW-
O
L
MC141803 RW-
LCDCE
O
L
TCP2 LCD module CE
80
80(1)
80(2)
GIOC2
BI
Z
Bit2 of general purpose I/O port C
SIN2
I
Z
UART2 serial input
IRRX
I
Z
IR receive input
81
81(1)
81(2)
YDU
O
Z
TCP LCM YDU signal output
V1
O
Z
Int. 4comX28seg LCD driver V1
LCM_CS-
O
Z
MC141803 CS-
82
82(1)
82(2)
GIOC3
BI
Z
Bit3 of general purpose I/O port C
SOUT2
O
Z
UART2 serial output
IRTX
O
Z
IR transmit output
83
83(1)
83(2)
GIOF7
BI
Z
Bit7 of general purpose I/O port F
SEG19
O
Z
SEG19 of int. 4comX28seg LCD driver
KEYO7
O
Z
Bit7 of key scan circuit output
84
GIOC4
BI
Z
Bit4 of general purpose I/O port C
85
85(1)
85(2)
GIOF6
BI
Z
Bit6 of general purpose I/O port F
SEG18
O
Z
SEG18 of int. 4comX28seg LCD driver
KEYO6
O
Z
Bit6 of key scan circuit output
86
GIOC5
BI
Z
Bit5 of general purpose I/O port C
Power supply for core (2.35v)
Power supply for Pads circuits (3.15v)
Tel
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ATJ2001 PDA+MP3 Decoder
Actions Semiconductor Co.,LTD
87
GIOF5
BI
(1)
87
SEG17
O
87(2)
KEYO5
O
7
Z
Bit5 of general purpose I/O port F
Z
SEG17 of int. 4comX28seg LCD driver
Z
Bit5 of key scan circuit output
88
88(1)
88(2)
GIOF4
BI
Z
Bit4 of general purpose I/O port F
SEG16
O
Z
SEG16 of int. 4comX28seg LCD driver
KEYO4
O
Z
Bit4 of key scan circuit output
89
VCC
PWR
90
90(1)
GIOG0
BI
Z
Bit0 of general purpose I/O port G
SEG20
O
Z
SEG20 of int. 4comX28seg LCD driver
91
91(1)
91(2)
GIOF3
BI
Z
Bit3 of general purpose I/O port F
SEG15
O
Z
SEG15 of int. 4comX28seg LCD driver
KEYO3
O
Z
Bit3 of key scan circuit output
92
92(1)
92(2)
GIOF2
BI
Z
Bit2 of general purpose I/O port F
SEG14
O
Z
SEG14 of int. 4comX28seg LCD driver
KEYO2
O
Z
Bit2 of key scan circuit output
93
93(1)
93(2)
GIOF1
BI
Z
Bit1 of general purpose I/O port F
SEG13
O
Z
SEG13 of int. 4comX28seg LCD driver
KEYO1
O
Z
Bit1 of key scan circuit output
94
94(1)
94(2)
GIOF0
BI
Z
Bit0 of general purpose I/O port F
SEG12
O
Z
SEG12 of int. 4comX28seg LCD driver
KEYO0
O
Z
Bit0 of key scan circuit output
95
95(1)
GIOG1
BI
Z
Bit1 of general purpose I/O port G
SEG21
O
Z
SEG21 of int. 4comX28seg LCD driver
96
96(1)
96(2)
GIOE7
BI
Z
Bit7 of general purpose I/O port E
SEG11
O
Z
SEG11 of int. 4comX28seg LCD driver
KEYI11
I
Z
Bit11 of key scan circuit input
97
97(1)
97(2)
GIOE6
BI
Z
Bit6 of general purpose I/O port E
SEG10
O
Z
SEG10 of int. 4comX28seg LCD driver
KEYI10
I
Z
Bit10 of key scan circuit input
98
98(1)
98(2)
GIOE5
BI
Z
Bit5 of general purpose I/O port E
SEG9
O
Z
SEG9 of int. 4comX28seg LCD driver
KEYI9
I
Z
Bit9 of key scan circuit input
99
99(1)
GIOE4
BI
Z
Bit4 of general purpose I/O port E
SEG8
O
Z
SEG8 of int. 4comX28seg LCD driver
Power supply for Pads circuits (3.15v)
Tel
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ATJ2001 PDA+MP3 Decoder
Actions Semiconductor Co.,LTD
99(2)
KEYI8
I
100
100(1)
100(2)
Bit8 of key scan circuit input
GIOE3
BI
Z
Bit3 of general purpose I/O port E
SEG7
O
Z
SEG7 of int. 4comX28seg LCD driver
KEYI7
I
Z
Bit7 of key scan circuit input
GIOG2
BI
Z
Bit2 of general purpose I/O port G
SEG22
O
Z
SEG22 of int. 4comX28seg LCD driver
GIOE2
BI
Z
Bit2 of general purpose I/O port E
SEG6
O
Z
SEG6 of int. 4comX28seg LCD driver
KEYI6
I
Z
Bit6 of key scan circuit input
GIOE1
BI
Z
Bit1 of general purpose I/O port E
SEG5
O
Z
SEG5 of int. 4comX28seg LCD driver
KEYI5
I
Z
Bit5 of key scan circuit input
GIOE0
BI
Z
Bit0 of general purpose I/O port E
SEG4
O
Z
SEG4 of int. 4comX28seg LCD driver
KEYI4
I
Z
Bit4 of key scan circuit input
GIOD7
BI
Z
Bit7 of general purpose I/O port D
SEG3
O
Z
SEG3 of int. 4comX28seg LCD driver
TCPD7
O
Z
Bit7 of TCP data bus
KEYI3
I
Z
Bit3 of key scan circuit input
GIOD6
BI
Z
Bit6 of general purpose I/O port D
SEG2
O
Z
SEG2 of int. 4comX28seg LCD driver
TCPD6
O
Z
Bit6 of TCP data bus
KEYI2
I
Z
Bit2 of key scan circuit input
GIOG3
BI
Z
Bit3 of general purpose I/O port G
SEG23
O
Z
SEG23 of int. 4comX28seg LCD driver
GIOD5
BI
Z
Bit5 of general purpose I/O port D
SEG1
O
Z
SEG1 of int. 4comX28seg LCD driver
TCPD5
O
Z
Bit5 of TCP data bus
KEYI1
I
Z
Bit1 of key scan circuit input
109
GND
PWR
/
Digital signal ground
110
110(1)
110(2)
110(3)
GIOD4
BI
Z
Bit4 of general purpose I/O port D
SEG0
O
Z
SEG0 of int. 4comX28seg LCD driver
TCPD4
O
Z
Bit4 of TCP data bus
KEYI0
I
Z
Bit0 of key scan circuit input
101
101(1)
102
102(1)
102(2)
103
103(1)
103(2)
104
104(1)
104(2)
105
105(1)
105(2)
105(3)
106
106(1)
106(2)
106(3)
107
107(1)
108
108(1)
108(2)
108(3)
8
Z
Tel
86-756-3392353
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ATJ2001 PDA+MP3 Decoder
Actions Semiconductor Co.,LTD
111
VDD
PWR
112
112(1)
112(2)
112(3)
113
113(1)
113(2)
113(3)
114
114(1)
115
115(1)
115(2)
115(3)
116
116(1)
116(2)
116(3)
117
117(1)
9
Power supply for core (2.35v)
GIOD3
BI
Z
Bit3 of general purpose I/O port D
COM3
O
Z
COM3 of int. 4comX28seg LCD driver
TCPD3
O
Z
Bit3 of TCP data bus
LCDD3
O
Z
Bit3 of TCP2 data bus
GIOD2
BI
Z
Bit2 of general purpose I/O port D
COM2
O
Z
COM2 of int. 4comX28seg LCD driver
TCPD2
O
Z
Bit2 of TCP data bus
LCDD2
O
Z
Bit2 of TCP2 data bus
GIOG4
BI
Z
Bit4 of general purpose I/O port G
SEG24
O
Z
SEG24 of int. 4comX28seg LCD driver
GIOD1
BI
Z
Bit1 of general purpose I/O port D
COM1
O
Z
COM1 of int. 4comX28seg LCD driver
TCPD1
O
Z
Bit1 of TCP data bus
LCDD1
O
Z
Bit1 of TCP2 data bus
GIOD0
BI
Z
Bit0 of general purpose I/O port D
COM0
O
Z
COM0 of int. 4comX28seg LCD driver
TCPD0
O
Z
Bit0 of TCP data bus
LCDD0
O
Z
Bit0 of TCP2 data bus
MWR-
BI
H
Ext. memory write active signal
WE-
O
H
Nand type flash write enable
118
118(1)
MRD-
BI
H
Ext. memory read active signal
RE
O
H
Nand type flash read enable
119
A0
BI
L
Bit0 of ext. memory address bus
120
120(1)
GIOG5
BI
Z
Bit5 of general purpose I/O port G
SEG25
O
Z
SEG25 of int. 4comX28seg LCD driver
121
A1
BI
L
Bit1 of ext. memory address bus
122
A2
BI
L
Bit2 of ext. memory address bus
123
A3
BI
L
Bit3 of ext. memory address bus
124
A4
BI
L
Bit4 of ext. memory address bus
125
A5
BI
L
Bit5 of ext. memory address bus
126
126(1)
GIOG6
BI
Z
Bit6 of general purpose I/O port G
SEG26
O
Z
SEG26 of int. 4comX28seg LCD driver
127
A6
BI
L
Bit6 of ext. memory address bus
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ATJ2001 PDA+MP3 Decoder
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128
A7
BI
10
L
Bit7 of ext. memory address bus
129
A8
BI
L
Bit8 of ext. memory address bus
130
ENMI-
SIU
H
Ext. non-maskable interrupt input
131
131(1)
GIOG7
BI
Z
Bit7 of general purpose I/O port G
SEG27
O
Z
SEG27 of int. 4comX28seg LCD driver
132
GND
PWR
/
Digital signal ground
133
VCC
PWR
134
A9
BI
L
Bit9 of ext. memory address bus
135
A10
BI
L
Bit10 of ext. memory address bus
136
A11
BI
L
Bit11 of ext. memory address bus
137
SIRQ-
SIU
H
Ext. maskable interrupt input
138
A12
BI
L
Bit12 of ext. memory address bus
139
A13
BI
L
Bit13 of ext. memory address bus
140
STANDBY-
O
L
System in standby mode output signal
141
ZICEDO
O
L
Debug pin, data output from DSU
142
ZICEDI
SIU
H
Debug pin, data input to DSU
143
ZICECK
SIU
H
Debug pin, clock into DSU
144
CE2-
O
H
Ext. memory chip select 2
145
TEST
SI
L
Test mode control, 0:normal mode 1:test
mode
146
ZICERST-
SIU
H
Debug pin, to reset DSU
147
CE3-
O
H
Ext. memory chip select 3
148
ZICEEN-
SIU
H
Debug pin, to enable DSU
149
CE4-
O
H
Ext. memory chip select 4
150
RESET-
SI
H
System reset input
151
A14
O
L
Bit14 of ext. memory address bus
152
CE5-
O
H
Ext. memory chip select 5
153
GND
PWR
/
Digital signal ground
154
D0
BI
Z
Bit0 of ext. memory data bus
155
155(1)
GIOA0
BI
Z
Bit0 of general purpose I/O port A
CD0
I
Z
IDE card detection
156
D1
BI
Z
Bit1 of ext. memory data bus
157
157(1)
GIOA1
BI
Z
Bit1 of general purpose I/O port A
IOCS16-
I
Z
IDE 8 or 16 data bus indicate
Power supply for Pads circuits (3.15v)
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ATJ2001 PDA+MP3 Decoder
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158
D2
BI
159
159(1)
159(2)
176
11
Z
Bit2 of ext. memory data bus
GIOA2
BI
Z
Bit2 of general purpose I/O port A
CS1-
O
Z
IDE chip select 1
FX_SS-
O
Z
Active low slave select of FLEX decoder
160
D3
BI
Z
Bit3 of ext. memory data bus
161
D4
BI
Z
Bit4 of ext. memory data bus
162
162(1)
162(2)
GIOA3
BI
Z
Bit3 of general purpose I/O port A
IORDY
I
Z
IDE IORDY
FX_READY-
I
Z
FLEX decoder SPI packet ready
163
D5
BI
Z
Bit5 of ext. memory data bus
164
A25
BI
L
Bit25 of ext. memory address bus
165
VCC
PWR
166
D6
BI
Z
Bit6 of ext. memory data bus
167
167(1)
167(2)
GIOA4
BI
Z
Bit4 of general purpose I/O port A
CS0-
O
Z
IDE chip select 0
FX_SCK
O
Z
Message shift clock of FLEX decoder
168
D7
BI
Z
Bit7 of ext. memory data bus
169
CE0-
O
H
Ext. memory chip select 0
170
170(1)
170(2)
GIOA5
BI
Z
Bit5 of general purpose I/O port A
IRQ
I
Z
IDE IRQ
FX_MOSI
I
Z
Message input from FLEX decoder
171
CE1-
O
H
Ext. memory chip select 1
172
CE6-
O
H
Ext. memory chip select 6
173
173(1)
173(2)
GIOA6
BI
Z
Bit6 of general purpose I/O port A
IOW-
O
Z
IDE IOW-
FX_MOSO
O
Z
Message output to FLEX decoder
174
CE7-
O
H
Ext. memory chip select 7
175
175(1)
175(2)
GIOA7
BI
Z
Bit7 of general purpose I/O port A
IOR-
O
Z
IDE IOR-
FX_CKOUT1
O
Z
FLEX decoder clock (76.8KHz)
VDD
PWR
Power supply for Pads circuits (3.15v)
Power supply for core (2.35v)
Tel 86-756-3392353
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ATJ2001 PDA+MP3 Decoder
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Note:
PWR : power
A
: analog pad
AI
: analog input
AO : analog output
Z
: high resistant
I
: digital input
O
: digital output
BI : bidirectional input/output
SI : schmitt input
SIU : schmitt input with int. pull-up resistant
DSU: Developing Support Unit
xxx(m) : multiplex pin’s function m
TCP: Tape Carrier Package , such as SEIKO EPSON LCD module
TCP2: ASIC2/3 LCD module
Note2: key in pads have int. pull-up resistants when key in mode enable.
note3: Avoid AC’97 ATE TEST MODE
AC’97_SYNC : output ‘L’ after 3 system clocks, go “Z”
AC’97_SDO : output ‘L’ after 3 system clocks, go “Z”
AC’97_RST- : output ‘L’ after 3 system clocks, go “H”
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132
131
130
129
128
127
126
125
124
123
122
121
120
119
118
117
116
115
114
113
112
111
110
109
108
107
106
105
104
103
102
101
100
99
98
97
96
95
94
93
92
91
90
89
Actions Semiconductor Co.,LTD
GIOF4
GIOF5
GIOC5
GIOF6
GIOC4
GIOF7
GIOC3
YDU
GIOC2
YSCLK/LP
VCC
FRAME
VDD
DISOFF
GIOC1
XSCLK
GIOC0
CKOUT2
GND
HOSCO
HOSCI
AVSS
AVDD
DCOP1
DCOP3
DCOP2
VP2
VDD2
VP1
DCF1
DCF2
DCF3
VBAT
DCDIS
VL3
VL2
VL1
VL0
VREFI
IBIAS
SEL
AVCC
X2
X1
LOSCI
LOSCO
GND
A15
AC97RSTA16
GIOB0
A17
GIOB1
A18
GIOB2
A19
GIOB3
A20
GIOB4
A21
GIOB5
A22
GIOB6
A23
A24
GIOB7
VCC
USBDUSBD+
USBVBUS
PVDD
PAOR
PAOL
PGND
PAIR
PAIL
AOUTR
AOUTL
VRDA
VLAD
VRAD
AGIC
MICOUT
MICIN
VMIC
AGND
Y2
Y1
VCC
A9
A10
A11
SIRQA12
A13
STANDBYZICEDO
ZICEDI
ZICECK
CE2TEST
ZICERSTCE3ZICEENCE4RESETA14
CE5GND
D0
GIOA0
D1
GIOA1
D2
GIOA2
D3
D4
GIOA3
D5
A25/IFIN
VCC
D6
GIOA4
D7
CE0GIOA5
CE1CE6GIOA6
CE7GIOA7
VDD
6
7
1
P
1
0
0
2
J
T
A
133
134
135
136
137
138
139
140
141
142
143
144
145
146
147
148
149
150
151
152
153
154
155
156
157
158
159
160
161
162
163
164
165
166
167
168
169
170
171
172
173
174
175
176
GND
GIOG7
NMIA8
A7
A6
GIOG6
A5
A4
A3
A2
A1
GIOG5
A0
MRDMWRGIOD0
GIOD1
GIOG4
GIOD2
GIOD3
VDD
GIOD4
GND
GIOD5
GIOG3
GIOD6
GIOD7
GIOE0
GIOE1
GIOE2
GIOG2
GIOE3
GIOE4
GIOE5
GIOE6
GIOE7
GIOG1
GIOF0
GIOF1
GIOF2
GIOF3
GIOG0
VCC
U?
88
87
86
85
84
83
82
81
80
79
78
77
76
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
48
47
46
45
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
RA3930P176
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ELECTRICAL CHARACTERISTIC
A
Absolute Maximum Ratings (TA = 25°C)
Parameter
Symbol
Condition
Rating
Unit
VDD
2.5V
-0.5 to +3.0
V
VCC
3.3V
-0.5 to +3.9
V
Vi
VCC >= 3.3
-0.5 to +3.9
V
VCC < 3.3
-0.5 to VCC+0.6
V
Supply voltage
Input voltage
Storage temperature
Tstg
-65 to +150
Cautions 1. Do not short-circuit two or more output pins simultaneously.
2. If even one of the above parameters exceeds the absolute maximum ratings even
momentarily, the quality of the product may be degraded. The absolute maximum
ratings,therefore, specify the value exceeding which the product may be physically
damaged. Use the product well within these ratings.
The specifications and conditions shown in DC Characteristics and AC characteristics
are the ranges for normal operation and quality assurance of the product.
B
Capacitance (TA = 25°C, VCC = 0 V)
Parameter
Symbol
Input capacitance
CI
I/O capacitance
CIO
C
Condition
MIN.
MAX.
Unit
fC = 1 MHz
15
pF
Unmeasured pins returned to 0 V
15
pF
DC Characteristics (TA = -10 to +70°C, VDD = 2.35 V, VCC = 3.15 V)
Parameter
Symbol
Condition
MIN.
High-level
output voltage
VOH
IOH = -2 mA
2.4
Low-level
output voltage
VOL
IOL = 2 mA
High-level
input voltage
VIH
Low-level input
voltage
VIL
Input leakage
current
ILI
VCC = 3.6 V, VI = VCC, 0 V
±10
uA
Output
leakage
current
ILO
VCC = 3.6 V, VI = VCC, 0 V
±5
uA
Supply Current
Two
batteries
14
TYP.
MAX.
Unit
V
0.4
V
0.6*
VCC
V
VCC
+ 0.6
-0.3
0.4VC
V
C
In Fullspeed mode (MCU run
24.576MHz in internal
SRAM,DSP run 36MIPS)
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mode
In Standby mode
IVDD
50
150
200
uA
9
16
40
uA
9
18
40
uA
In Fullspeed mode (MCU run
24.576MHz in internal
SRAM,DSP run 36MIPS)
In Standby mode
Ivcc
Notes 1.
IvDD is a total power supply current for the 2.5 V power supply. IvDD is applied to the LOGIC and
PLL and OSC block.
Ivcc is a total power supply current for the 3.3 V power supply. Ivcc is applied to the USB,
IO, TP, and AD block.
D
AC Characteristics (TA = -10 to +70°C, VDD = 2 to 3 V, VCC = 2.7 to 3.6 V)
AC test input waveform
VCC
All input pins
0.6VCC
0.4VCC
0V
Test Points
0.6VCC
0.4VCC
AC test output measuring points
VCC
All output pins
0V
0.5VCC
Test Points
0.5VCC
(1) Reset parameter
Parameter
Symbol
Condition
MIN.
Reset input low-level width
tWRSL
RESET# pin
160
MAX.
Unit
µs
tWRSL
VCC
RESET#
0V
(2) Initialization parameter
Parameter
15
Symbol
Condition
MIN.
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Data sampling time
tSS
61.04
µs
(from RESET# ↑)
Output delay time (from RESET# ↑)
µs
61.04
tOD
32.768KHz
RESET#
I/O PINs
tSS tOD
Hi-Z
Normal Operation
Sampling Point
(3) GPIO interface parameter
Parameter
Symbol
Condition
MIN.
Input level width
tGPIN
Normal operation
11/ fMCUclk
GPIO input rise time
tGPRISE
200
ns
GPIO input fall time
tGPFALL
200
ns
Output level width
tGPOUT
11/ fMCUclk
MAX.
Unit
µs
ns
Notes 1. fMCUclk is the frequency that MCU is running upon.
(a) Input level width
(b) Input rise/fall time
(c) Output level width
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(4) Ordinary ROM parameter
Parameter
Symbol
Condition
MIN.
Note
tACC
HOSC=24.576MHz
102
ns
Note
tCE
HOSC=24.576MHz
82
ns
Data input setup time
tDS
HOSC=24.576MHz
0
ns
Data input hold time
tDH
HOSC=24.576MHz
0
ns
Data access time (from address)
Data access time (from CEx# ↓)
MAX.
Unit
t ACC
A[24:0]
t CE
CEn-/MRD-
t DS
t DH
D[7:0](I)
(5) External system bus parameter
Parameter
Address setup time (to command signal↓)
Note 1, 2
Address hold time (from command signal↑)Note 1, 2
Data output setup time (to command signal↓)
Note 1
Data output hold time (from command signal↑)
Data input setup time (to command signal↑)
Note 1
Note 1
Data input hold time (from command signal↑)
Note 1
Symbol
Condition
MIN. MAX. Unit
tXAS
Memory Read
0.5T
ns
tXAS
Memory Write
1.5T
ns
tXAH
0.5T
ns
tWXDS
0
T
ns
tWXDH
3
0.5T
ns
tRXDS
0
2T
ns
tRXDH
0
ns
Notes 1. MRD#, MWR# are called the command signals for the External System Bus Interface.
2. T (ns) = 1000 / fMCUCLK
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MCUCLK
2
1
3
t XAS
t XAH
A[24:0]
CEn-
t RXDS
MRD-
t RXDH
D[7:0](I)
MWR-
t XAS
t XAH
D[7:0](O)
t WXDS
t WXDH
Bus Operation
(a) Instruction fetch cycle
MCU CLK
MRD#
CEn#
(b) Memory read cycle
MCU CLK
MRD#
CEn#
(b) Memory write cycle
MCU CLK
MWR#
CEn#
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(6) Keyboard interface parameter
Parameter
Symbol
Condition
MIN. MAX. Unit
KEYOUT (7:0) low-level width
tSCAN
Debounce time=2.5ms
130
µs
Voltage stabilization time
tKWAIT
Debounce time=2.5ms
0
µs
Key scan interval time
tKI
Debounce time=2.5ms
130
µs
Key input delay time (from KEYOUT n↓)
tKS
Debounce time=2.5ms
0
µs
Key input hold time (from KEYOUT n↑)
tKH
Debounce time=2.5ms
0
µs
(KEYOUT n↑→ KEYOUT (n+1)↓)
Remarks
1. KEYOUT(7:0) is multiplexed with GIOF(7:0); KEYIN(3:0) is multiplexed with GIOD(7:4); KEYIN(11:4) is
multiplexed with GIOE(7:0)
2. Keyscan Debouncing time is set thru Bit(2:0) of the MFP Configuration1 Register[0xB1h]
3. n = 0 to 7
(a) Keyboard scan parameter 1
KEYOUTn
tKWAIT
(output)
KEYOUT(n+1)
tSCAN
(output)
Remark n=0 to 6
(b) Keyboard scan parameter 2
KEYOUT0
(output)
KEYOUT1
ss
ss
(output)
KEYOUT7
tKWAIT tKI
ss
(output)
(c) Keyboard port parameter
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KEYOUTn
(output)
tKH
tKS
KEYIN(7:0)
(input)
Remark n=0 to 7
(7) S/PDIF interface parameter
X Channel A
Y Channel B
Z Channel A
Y Channel B
Sub-frame
Frame 191
Frame 0
Start of Channel Status Block
Figure 7.1.
1
0
X Channel A
0
0
1
Y Channel B
Sub-frame
Frame 1
Frame/Block Format
1
1 0 1 1 0 0 1 1 0 1 0 1
Figure 7.2. Biphase-Mark Encoding
Figure 7.3. Preamble Forms
Sub-frame
Preamble
3 4
7 8
AuxData
2728293031
Audio Data
MSB
0
LSB
bit
VUC P
Validity
User Data
Channel Status Data
Parity Bit
Figure 7.4.
Sub-frame Format
(8) Serial interface parameter
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13
Prescale Value
Baud Rate
Divisor
1.625
%Error
Divisor
1
%Error
Divisor
%Error
600
192
0.16%
-
-
-
-
1200
96
0.16%
-
-
-
-
1800
64
0.16%
-
-
-
-
2000
58
0.53%
-
-
-
-
2400
48
0.16%
-
-
-
-
3600
32
0.16%
256
0.16%
-
-
4800
24
0.16%
192
0.16%
-
-
7200
16
0.16%
128
0.16%
208
0.16%
9600
12
0.16%
96
0.16%
156
0.16%
14400
8
0.16%
64
0.16%
104
0.16%
19200
6
0.16%
48
0.16%
78
0.16%
28800
4
0.16%
32
0.16%
52
0.16%
38400
3
0.16%
24
0.16%
39
0.16%
57600
2
0.16%
16
0.16%
26
0.16%
115200
1
0.16%
8
0.16%
13
0.16%
230400
-
-
4
0.16%
-
-
460800
-
-
2
0.16%
-
-
750000
-
-
-
921600
-
-
1
1500000
-
-
-
-
2
0.16%
0.00%
-
-
-
1
0.00%
Note :
Data transfer rate per bit, which is determined by the divisor of the baud-rate generator that is set with
UART1/2 Baud Rate Registers and clock prescaler that is set with UART1/2 Control Registers.
(9) A/D Converter Characteristics (TA = -10 to +70°C, VDD = 2.0 to 3.0 V, VCC = 2.7 to 3.6 V)
Parameter
Symbol
Zero-scale error
ZSE
±4.0
LSB
Full-scale error
RSE
±5.0
LSB
Integral linearity error
INL
±3.0
LSB
Differential linearity error
DNL
±3.0
LSB
Analog input voltage
VIAN
S/N Ratio
MAX
THD+N (MAX) :
Condition
MIN.
TYP.
–0.3
MAX.
AVDD + 0.3
Unit
V
: 64dB
55dB
(10) D/A Converter Characteristics (TA =-10 to +70°C, VDD = 2.0 to 3.0 V, VCC = 2.7 to 3.6 V)
21
Parameter
Symbol
Integral linearity error
INL
Condition
MIN.
TYP.
±3.0
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Differential linearity error
DNL
±3.0
LSB
I2S interface parameter
Symbol
t
Pin Name
Clock Output Frequency
SOISS
Wordstrobe Hold Time after
BCKIN,
falling edge of clock
LRCIN
Data Hold Time after falling
SOODC
S/N Ratio
edge of clock
MAX
THD+N (MAX) :
Min. Typ.
BCKIN
SOCLK
t
t
Parameter
BCKIN, DIN
Max.
651
Unit
ns
10
t
10
t
SOCLK/2
ns
SOCLK/2
ns
Test Conditions
48 kHz/s Stereo 16
bit/s
: 90dB
78dB
E. MCU/DSP Dissipation (Ivdd VS. Frequency)
1.) MCU Dissipation (Vbat=3.0V,DSP under reset, MCU runs in internal SRAM)
Clock Source
32.768KHZ
22
Divisor factor
Ivdd(Max)
/(1—1024)
350uA
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24.576MHz
/1
8.5mA
/2
4.7mA
/4
2.9mA
/8
1.8mA
/16
1.4mA
/32
1.1mA
/64
0.96mA
/128
0.88mA
/256
0.85mA
/512
0.84mA
/1024
0.83mA
2.) DSP Dissipation (Vbat=3.0V,MCU in Debug mode)
F
DSP Speed (MIPS)
Ivdd (Max)
6
11.7mA
12
18.8mA
24
30.7mA
36
43.2mA
48
55.9mA
60
67.2mA
RECOMMENDED SOLDERING CONDITIONS
The conditions listed below shall be met when soldering the ATJ2001.
Table 4-1. Soldering Conditions for Surface-Mount Devices
Soldering Process
Soldering Conditions
Peak package’s surface temperature: 235°C
Infrared ray reflow
Reflow time: 30 seconds or less (210°C or more)
Maximum allowable number of reflow processes: 2
Exposure limit: 3 days
Partial heating method
Note
(10 hours of pre-baking is required at 125°C afterward).
Terminal temperature: 300°C or less
Heat time: 3 seconds or less (for one side of a device)
Note Maximum number of days during which the product can be stored at a temperature of 25°C and a
relative humidity of 65% or less after dry-pack package is opened.
Caution Do not apply two or more different soldering methods to one chip (except for partial
heating method for terminal sections).
NOTES FOR CMOS DEVICES
1 PRECAUTION AGAINST ESD FOR SEMICONDUCTORS
Note:
Strong electric field, when exposed to a MOS device, can cause destruction of the gate oxide and
ultimately degrade the device operation. Steps must be taken to stop generation of static electricity
as much as possible, and quickly dissipate it once, when it has occurred. Environmental control
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must be adequate. When it is dry, humidifier should be used. It is recommended to avoid using
insulators that easily build static electricity. Semiconductor devices must be stored and transported
in an anti-static container, static shielding bag or conductive material. All test and measurement
tools including work bench and floor should be grounded. The operator should be grounded using
wrist strap. Semiconductor devices must not be touched with bare hands. Similar precautions need
to be taken for PW boards with semiconductor devices on it.
2 HANDLING OF UNUSED INPUT PINS FOR CMOS
Note:
No connection for CMOS device inputs can be cause of malfunction. If no connection is provided
to the input pins, it is possible that an internal input level may be generated due to noise, etc., hence
causing malfunction. CMOS devices behave differently than Bipolar or NMOS devices. Input levels
of CMOS devices must be fixed high or low by using a pull-up or pull-down circuitry. Each unused
pin should be connected to VDD or GND with a resistor, if it is considered to have a possibility of
being an output pin. All handling related to the unused pins must be judged device by device and
related specifications governing the devices.
3 STATUS BEFORE INITIALIZATION OF MOS DEVICES
Note:
Power-on does not necessarily define initial status of MOS device. Production process of MOS
does not define the initial operation status of the device. Immediately after the power source is
turned ON, the devices with reset function have not yet been initialized. Hence, power-on does
not guarantee out-pin levels, I/O settings or contents of registers. Device is not initialized until the
reset signal is received. Reset operation must be executed immediately after power-on for devices
having reset function.
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LQFP176: plastic low profile quad flat package; 176 leads; body 24 x 24 x 1.4 mm
SOT506-1
c
y
X
A
132
133
89
88
ZE
e
E HE
(A 3)
A A2 A1
θ
wM
Lp
bp
L
detail X
pin 1 index
45
176
44
1
ZD
wM
bp
e
v M A
D
B
HD
v M B
0
5
10 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (1)
e
mm
1.6
0.15
0.05
1.45
1.35
0.25
0.27
0.17
0.20
0.09
24.1
23.9
24.1
23.9
0.5
HD
HE
26.15 26.15
25.85 25.85
L
Lp
v
w
y
ZD
ZE
θ
1.0
0.75
0.45
0.12
0.08
0.08
1.43
1.08
1.43
1.08
7
0o
o
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
25
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
SOT506-1
136E25
MS-026
EUROPEAN
PROJECTION
EIAJ
ISSUE DATE
00-01-19
00-02-01
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