80 QF P SOT318-2 plastic quad flat package; 80 leads (lead length 1.95 mm); body 14 x 20 x 2.8 mm 8 February 2016 Package information 1. Package summary Terminal position code Q (quad) Package type descriptive code QFP80 Package type industry code QFP80 Package style descriptive code QFP (quad flat package) Package style suffix code NA (not applicable) Package body material type P (plastic) JEDEC package outline code MO-112 Mounting method type S (surface mount) Issue date 25-2-2003 Table 1. Package summary Symbol Parameter Min Typ Nom Max Unit D package length 19.9 - 20 20.1 mm E package width 13.9 - 14 14.1 mm A seated height 2.65 - 2.75 2.9 mm A2 package height [tbd] - 2.8 [tbd] mm n2 actual quantity of termination - - 80 - SOT318-2 NXP Semiconductors plastic quad flat package; 80 leads (lead length 1.95 mm); body 14 x 20 x 2.8 mm 2. Package outline QFP80: plastic quad flat package; 80 leads (lead length 1.95 mm); body 14 x 20 x 2.8 mm SOT318-2 c y X 64 A 41 40 65 ZE e E HE A A2 (A 3) A1 wM pin 1 index θ Lp bp 80 L 25 detail X 24 1 wM bp e ZD v M A D B HD v M B 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HD HE L Lp v w y mm 3.2 0.25 0.05 2.90 2.65 0.25 0.45 0.30 0.25 0.14 20.1 19.9 14.1 13.9 0.8 24.2 23.6 18.2 17.6 1.95 1.0 0.6 0.2 0.2 0.1 Z D (1) Z E (1) 1.0 0.6 1.2 0.8 θ 7o 0o Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT318-2 REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-25 MO-112 Fig. 1. Package outline QFP80 (SOT318-2) SOT318-2 Package information All information provided in this document is subject to legal disclaimers. 8 February 2016 © NXP Semiconductors N.V. 2016. All rights reserved 2/6 SOT318-2 NXP Semiconductors plastic quad flat package; 80 leads (lead length 1.95 mm); body 14 x 20 x 2.8 mm 3. Soldering Footprint information for reflow soldering of QFP80 package SOT318-2 Hx Gx P2 Hy (0.125) P1 Gy By Ay C D2 (8×) D1 Bx Ax Generic footprint pattern Refer to the package outline drawing for actual layout solder land occupied area DIMENSIONS in mm P1 0.800 P2 Ax Ay Bx By 0.850 25.300 19.300 20.900 14.900 C D1 2.200 0.500 D2 Gx Gy Hx Hy 0.600 20.500 14.500 25.550 19.550 sot318-2_fr Fig. 2. Reflow soldering footprint for QFP80 (SOT318-2) SOT318-2 Package information All information provided in this document is subject to legal disclaimers. 8 February 2016 © NXP Semiconductors N.V. 2016. All rights reserved 3/6 SOT318-2 NXP Semiconductors plastic quad flat package; 80 leads (lead length 1.95 mm); body 14 x 20 x 2.8 mm 6.50 0.75 0.75 Ax C Bx P((N- x)x) 1/2 D1 0.75 solder lands C solder resist occupied area Ay 6.50 P((Ny- 1)x) By 0.40 (2x) solder thief THD (6x) 45 o D2 (8x) D1 P((Nx- 1)x) MLC750 d ar n bo io ct re di 0.50 0.75 2.00 (2x) Fig. 3. Wave soldering footprint for QFP80 (SOT318-2) SOT318-2 Package information All information provided in this document is subject to legal disclaimers. 8 February 2016 © NXP Semiconductors N.V. 2016. All rights reserved 4/6 SOT318-2 NXP Semiconductors plastic quad flat package; 80 leads (lead length 1.95 mm); body 14 x 20 x 2.8 mm 4. Legal information Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. SOT318-2 Package information All information provided in this document is subject to legal disclaimers. 8 February 2016 © NXP Semiconductors N.V. 2016. All rights reserved 5/6 SOT318-2 NXP Semiconductors plastic quad flat package; 80 leads (lead length 1.95 mm); body 14 x 20 x 2.8 mm 5. Contents 1. Package summary........................................................ 1 2. Package outline............................................................ 2 3. Soldering....................................................................... 3 4. Legal information......................................................... 5 © NXP Semiconductors N.V. 2016. All rights reserved For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 8 February 2016 SOT318-2 Package information All information provided in this document is subject to legal disclaimers. 8 February 2016 © NXP Semiconductors N.V. 2016. All rights reserved 6/6