Features • EE Programmable 1,048,576 x 1-bit Serial Memory Designed to Store Configuration • • • • • • • • • • • • Programs for Field Programmable Gate Arrays (FPGAs) Very Low-power CMOS EEPROM Process In-System Programmable (ISP) via Two-Wire Bus Simple Interface to SRAM FPGAs Compatible with AT40K Devices Cascadable Read-back to Support Additional Configurations or Higher-density Arrays Programmable Reset Polarity Low-power Standby Mode High-reliability – Endurance: 5,104 Erase/Write Cycles – Data Retention: 10 Years No Single Event Latch-up below a LET Threshold of 80 MeV/mg/cm2 @125°C Tested up to a Total Dose of (according to MIL STD 883 Method 1019) – 20 krads (Si) Read-only mode when Biased – 60 krads (Si) Read-only mode when Unbiased Operating Range: 3.0V to 3.6V, -55°C to +125°C Available in 400 mils Wide 28 Pins DIL Flat Pack Space FPGA Configuration EEPROM AT17LV010-10DP Description The AT17LV010-10DP is a FPGA Configuration Serial EEPROM which provides an easy-to-use, cost-effective configuration memory for Field Programmable Gate Arrays. It is packaged in a 28-pin 400 mils wide Flat Pack package. The configurator uses a simple serial link to configure one or more FPGA devices. The user can select the polarity of the reset function by programming four EEPROM bytes. Since the default setting is RESET low and OE high, this document will describe RESET/OE. The device also supports a write-protection mechanism within its programming mode. 4265G–AERO–09/14 Block Diagram SER_EN WP1 WP2 PROGRAMMING DATA SHIFT REGISTER PROGRAMMING MODE LOGIC ROW ADDRESS COUNTER POWER ON RESET ROW DECODER BIT COUNTER EEPROM CELL MATRIX COLUMUN DECODER TC CLK READY RESET/OE CE CEO (A2) DATA Device Description The control signals for the configuration EEPROM (CE, RESET/OE and CCLK) interface directly with the FPGA device control signals. All FPGA devices can control the entire configuration process and retrieve data from the configuration EEPROM without requiring an external intelligent controller. The configuration EEPROM RESET/OE and CE pins control the tri-state buffer on the DATA output pin and enable the address counter. When RESET/OE is driven low, the configuration EEPROM resets its address counter and tri-states its DATA pin. The CE pin also controls the output of the configurator. If CE is held high after the RESET/OE reset pulse, the counter is disabled and the DATA output pin is tri-stated. When RESET/OE is subsequently driven high, the counter and the DATA output pin are enabled. When RESET/OE is driven low again, the address counter is reset and the DATA output pin is tri-stated, regardless of the state of CE. When the configurator has driven out all of its data and CEO is driven low, the device tri-states the DATA pin to avoid contention with other configurators. Upon power-up, the address counter is automatically reset. 2 AT17LV010-10DP 4265G–AERO–09/14 AT17LV010-10DP Pin Configuration RESET/OE 1 28 Reserved NC 2 27 NC WP2 3 26 WP1 CE 4 25 CLK GND 5 24 DATA NC 6 23 NC NC 7 22 NC NC 8 21 NC NC 9 20 NC Reserved 10 19 VCC CE0(A2) 11 18 Reserved NC 12 17 SER_EN NC 13 16 NC READY 14 15 NC Figure 1. 28-pin Flat Pack Note: Package lid is NOT connected to GND Pin Description RESET / OE Output Enable (active high) and RESET (active low) when SER_EN is high. A low level on RESET/OE resets both the address and bit counters. A high level (with CE low) enables the data output driver. The logic polarity of this input is programmable as either RESET/OE or RESET/OE. Since almost all FPGAs use RESET low and OE high, this document describes the pin as RESET/OE. This is the default setting for the device. WP2 WRITE PROTECT (2). Used to protect portions of memory during programming. Disabled by default due to internal pull-down resistor. This input pin is not used during FPGA loading operations. CE Chip Enable input (active low). A low level (with RESET/OE high) allows CLK to increment the address counter and enables the data output driver. A high level on CE disables both the address and bit counters and forces the device into a low-power standby mode. Note that this pin does not enable/disable the device in the Two-Wire Serial Programming mode (SER_EN low). CEO Chip Enable Output (active low). This output goes low when the address counter has reached its maximum value. In a daisy chain of AT17LV010-10DP devices, the CEO pin of one device must be connected to the CE input of the next device in the chain. It stays low as long as CE is low and RESET/OE is high. It then follows CE until RESET/OE goes low. Thereafter, CEO stays high until the entire EEPROM is read again. 3 4265G–AERO–09/14 A2 Device selection input. This is used to enable (or select) the device during programming (i.e., when SER_EN is low). This pin has an internal pull-down resistor. READY Open collector reset state indicator. Driven low during power-up reset, released when power-up is complete. It is recommended to use a 4.7 kΩ pull-up resistor when this pin is used. SER_EN Serial enable must be held high during FPGA loading operations. Bringing SER_EN low enables the Two-Wire Serial Programming Mode. For non-ISP applications, SER_EN should be tied to VCC. DATA Tri-state DATA output for configuration. Open-collector bi-directional pin for programming. CLK Clock input. Used to increment the internal address and bit counter for reading and programming. WP1 WRITE PROTECT (1). Used to protect portions of memory during programming. Disabled by default due to internal pull-down resistor. This input pin is not used during FPGA loading operations. VCC 3.3V (±0.3V). A 0.2 µF decoupling capacitor between VCC and GND is recommended GND Ground pin. NC These pins are not connected internally. It is recommended to connect them to a power supply (GND or Vcc). Reserved These pins are connected internally for manufacturing testing - DO NOT CONNECT. 4 AT17LV010-10DP 4265G–AERO–09/14 AT17LV010-10DP FPGA Master Serial Mode Summary The I/O and logic functions of any SRAM-based FPGA are established by a configuration program. The program is loaded either automatically upon power-up, or on command, depending on the state of the FPGA mode pins. In Master mode, the FPGA automatically loads the configuration program from an external memory. The Serial Configuration EEPROM has been designed for compatibility with the Master Serial mode. This section discusses the Atmel AT40KEL applications. Control of Configuration Most connections between the FPGA device and the Serial EEPROM are simple and selfexplanatory. • The DATA output of the configurator drives the DATA input of the FPGA devices. • The master FPGA CCLK output drives the CLK input of the configurator. • The FPGA CON output drives the CE input of the configurator. • The FPGA INIT output drives the RESET/OE input of the configurator. • The A2 input of the configurator must be left unconnected (thanks to the internal pull down resistor) or tied to Vcc depending on the TWI address configuration. • SER_EN must be connected to VCC (except during ISP). • The READY pin is available as an open-collector indicator of the device’s reset status; it is driven low while the device is in its power-on reset cycle and released (tri-stated) when the cycle is complete. Figure 2. Single Device Configuration Schematic 4.7 K In-System Programming interface 4.7 K DATA CLK 4.7 K RESETn 4.7 K AT17LV010 DATA CLK CE RESET/OE SER_EN CS0 A2/CEO READY 5 4265G–AERO–09/14 Cascading Serial Configuration EEPROMs For multiple FPGAs configured as a daisy-chain, or for FPGAs requiring larger configuration memories, cascaded configurators provide additional memory. After the last bit from the first configurator is read, the clock signal to the configurator asserts its CEO output low and disables its DATA line driver. The second configurator recognizes the low level on its CE input and enables its DATA output. After configuration is complete, the address counters of all cascaded configurators are reset if the RESET/OE on each configurator is driven to its active (low) level. If the address counters are not to be reset upon completion, then the RESET/OE input can be tied to its inactive (high) level. Figure 3. Cascaded Devices Configuration Schematic 4.7 K 4.7 K In-System Programming interface 4.7 K CLK RESET DATA AT17LV010 #1 4.7 K SER_EN AT17LV010 CS0 #2 SER_EN 4.7 K AT17LV010 #3 4.7 K SER_EN AT17LV010 CS1 #4 SER_EN 4.7 K 6 AT17LV010-10DP 4265G–AERO–09/14 AT17LV010-10DP Reset Polarity The configurator allows the user to program the reset polarity as either RESET/OE or RESET/OE. This feature is supported by industry-standard programmer algorithms. Programming Mode The programming mode is entered by bringing SER_EN low. In this mode the chip can be programmed by the Two-Wire serial bus (TWI). The programming is done at V CC supply only. Programming super voltages are generated inside the chip. For more information see application note: http://www.atmel.com/dyn/resources/prod_documents/doc0437.pdf Standby Mode The configurator enters a low-power standby mode whenever CE is asserted high. In this mode, the configurator consumes less than 100 µA of current at 3.3V. The output remains in a highimpedance state regardless of the state of the RESET/OE input. 7 4265G–AERO–09/14 Electrical Characteristics Absolute Maximum Ratings* Operating Temperature....................................-55⋅C to +125⋅C *NOTICE: Storage Temperature .......................................-65⋅C to +150⋅C Voltage on Any Pin with Respect to Ground .............................. -0.1V to VDD +0.5V Supply Voltage (VCC) .........................................-0.5V to +7.0V Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions beyond those listed under operating conditions is not implied. Exposure to Absolute Maximum Rating conditions for extended periods of time may affect device reliability. Maximum Soldering Temp. (10 sec. @ 1/16 in.)............. 260⋅C ESD (RZAP = 1.5K, CZAP = 100 pF)................................. 2000V Operating Conditions 3.3V Symbol Description Min Max Units VDD -55 to +125°C 3.0 3.6 V DC Characteristics VDD = 3.3V ± 0.3V Symbol 8 Description AT17LV010-10DP Min Max Units VIH High-level Input Voltage 2.0 VDD V VIL Low-level Input Voltage 0 0.8 V VOH High-level Output Voltage (IOH = -2 mA) VOL Low-level Output Voltage (IOL = +3 mA) ICCOP Supply Current, Active Mode IL Input or Output Leakage Current (VIN = VDD or GND) ICCS Supply Current, Standby Mode 2.4 -10 V 0.4 V 5 mA 10 µA 150 µA AT17LV010-10DP 4265G–AERO–09/14 AT17LV010-10DP AC Characteristics CE TSCE TSCE THCE RESET/OE TLC THOE THC CLK TOE TOH TCAC TDF TCE DATA TOH AC Characteristics when Cascading RESET/OE CE CLK TCDF DATA FIRST BIT LAST BIT TOCK TOCE TOOE CEO TOCE 9 4265G–AERO–09/14 AC Characteristics VCC = 3.3V ± 0.3V Military Symbol Description Max Units OE to Data Delay 55 ns CE to Data Delay 60 ns CLK to Data Delay 60 ns (1) TCE(1) TCAC(1) TOH Data Hold from CE, OE, or CLK TOE TDF (2) Min 0 ns CE or OE to Data Float Delay 50 ns TLC CLK Low Time 25 ns THC CLK High Time 25 ns TSCE CE Setup Time to CLK (to guarantee proper counting) 35 ns THCE CE Hold Time from CLK (to guarantee proper counting) 0 ns THOE OE High Time (guarantees counter is reset) 25 ns FMAX Maximum Clock Frequency Notes: 10 MHz 1. AC test lead = 60 pF. 2. Float delays are measured with 5 pF AC loads. Transition is measured ± 200 mV from steadystate active levels. AC Characteristics when Cascading VCC = 3.3V ± 0.3V Military Symbol (2) Min Max Units CLK to Data Float Delay 50 ns TOCK(1) CLK to CEO Delay 55 ns TOCE(1) CE to CEO Delay 40 ns TOOE(1) RESET/OE to CEO Delay 40 ns FMAX Maximum Clock Frequency 10 MHz TCDF Notes: 10 Description 1. AC test lead = 60 pF. 2. Float delays are measured with 5 pF AC loads. Transition is measured ± 200 mV from steadystate active levels. AT17LV010-10DP 4265G–AERO–09/14 AT17LV010-10DP Ordering Information Memory Size Ordering Code Package Operation Range 1 Mbit AT17LV010-10DP-E 28-pin Flat Pack Engineering Samples 1 Mbit AT17LV010-10DP-MQ 28-pin Flat Pack Military Level B 1 Mbit AT17LV010-10DP-SV 28-pin Flat Pack Space Level B 11 4265G–AERO–09/14 Packaging Information DP (FP28.4) 12 AT17LV010-10DP 4265G–AERO–09/14 AT17LV010-10DP DOCUMENT REVISION HISTORY Changes from Rev. C to Rev. D Update : signal RESET/OE changed to RESET/OE in whole document as the RESET signal is configured active low by default to be compatible with the dump mode of AT40K devices. Add-on: Figure 2 on page 5 Add-on: Figure 3 on page 6 Update: document template Changes from Rev. D to Rev. E Update: description section on first page Update: Figure 2 on page 5 Update: Figure 3 on page 6 Udpate: signal RESET/OE changed to RESET/OE on the Block Diagram Changes from Rev. E to Rev F Update : Three NC pins renamed as Reserved on Figure 1 on page 3 Update : Notes underneath Figure 1 on page 3 changed Update : Addition of NC and Reserved in Pin Description section Changes from Rev. F to Rev G Update : fixed an error in the endurance parameter definition on page 1 13 4265G–AERO–09/14 Headquarters International Atmel Corporation 2325 Orchard Parkway San Jose, CA 95131 USA Tel: 1(408) 441-0311 Fax: 1(408) 487-2600 Atmel Asia Room 1219 Chinachem Golden Plaza 77 Mody Road Tsimshatsui East Kowloon Hong Kong Tel: (852) 2721-9778 Fax: (852) 2722-1369 Atmel Europe Le Krebs 8, Rue Jean-Pierre Timbaud BP 309 78054 Saint-Quentin-enYvelines Cedex France Tel: (33) 1-30-60-70-00 Fax: (33) 1-30-60-71-11 Atmel Japan 9F, Tonetsu Shinkawa Bldg. 1-24-8 Shinkawa Chuo-ku, Tokyo 104-0033 Japan Tel: (81) 3-3523-3551 Fax: (81) 3-3523-7581 Technical Support Enter Product Line E-mail Sales Contact www.atmel.com/contacts Product Contact Web Site www.atmel.com Literature Requests www.atmel.com/literature Disclaimer: The information in this document is provided in connection with Atmel products. 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