Data Sheet

Freescale Semiconductor, Inc.
Data Sheet: Technical Data
3-Axis Digital Angular Rate
Gyroscope
FXAS21002C
Rev. 2.1, 5/2015
FXAS21002C
FXAS21002C is a small, low-power, yaw, pitch, and roll angular
rate gyroscope with 16 bit ADC resolution. The full-scale range is
adjustable from ±250°/s to ±2000°/s. It features both I2C and SPI
interfaces.
FXAS21002C is capable of measuring angular rates up to
±2000°/s, with output data rates (ODR) from 12.5 to 800 Hz. An
integrated Low-Pass Filter (LPF) allows the host application to
limit the digital signal bandwidth. The device may be configured
to generate an interrupt when a user-programmable angular rate
threshold is crossed on any one of the enabled axes.
24 QFN
4 mm x 4 mm x 1 mm
Case 2209-01
FXAS21002C is available in a plastic, 24-lead QFN package; the
device is guaranteed to operate over the extended temperature
range of –40 °C to +85 °C.
•
•
•
•
•
•
•
RSVD_GND
RSVD_GND
RSVD_GND
22
21
20
19
© 2014-2015 Freescale Semiconductor, Inc. All rights reserved.
SCL / SCLK
SDA / MOSI
/ SPI_DATA
•
•
•
23
RSVD_GND
•
•
24
1
RSVD_GND
•
GND1
GND4
Supply voltage (VDD) from 1.95 V to 3.6 V
INT2 / 2
18 VDDIO
PWR_CTRL
Interface Supply voltage (VDDIO) from 1.62 V to VDD + 0.3 V
17 SPI_CS_B
INT1 3
16-bit digital output resolution
16 VREGD
RST_B 4
±250/500/1000/2000°/s configurable full-scale dynamic
15 VDD
GND2 5
ranges
14 GND3
RSVD_GND 6
Full-Scale Range boost function enables FSR's up to
13 SA0 /
RSVD_GND 7
±4000 dps
9
10
8
11
12
MISO
Angular rate sensitivity of 0.0625°/s in ±2000°/s FSR mode
Noise spectral density of 25 mdps/√Hz at 64 Hz bandwidth
(200 Hz ODR)
Current consumption in Active mode is 2.7 mA
Fast transition from Standby to Active mode (60 ms)
Pin Connections
Supported digital interfaces include:
• I2C Standard and Fast Mode (100/400 kHz)
• SPI Interface (3- and 4-wire modes, up to 2 MHz)
FIFO buffer is 192 bytes (32 X/Y/Z samples) with stop and circular operating modes
Output Data Rates (ODR) from 12.5 to 800 Hz; programmable low-pass filter to further limit digital output
data bandwidth
Low power standby mode
Power mode transition control via external pin for accelerometer-based power management (motion
interrupt)
Rate Threshold interrupt function
Integrated self-test function
8-bit temperature sensor
I2C_B / SPI
•
•
•
•
RSVD_GND
Features
RSVD_GND
Top View
Typical Applications
• Industrial and consumer grade robots, UAVs, and RC vehicles
• Game controller
• Gyro-stabilized electronic compass
• Orientation determination
• Gesture-based user interfaces and Human Machine Interface (HMI)
• Indoor navigation
• Mobile phones and tablets
• Virtual and augmented reality devices (including glasses)
Ordering Information
Part Number
Temperature Range
Package Description
Shipping
FXAS21002CQR1
–40 °C to +85 °C
QFN
Tape and reel (1 k)
Related Documentation
The FXAS21002C device features and operations are described in a variety of reference manuals, user guides,
and application notes. To find the most-current versions of these documents, go to freescale.com/
FXAS21002C, and then click on the Documentation tab.
2
Freescale Semiconductor, Inc.
3-Axis Digital Angular Rate Gyroscope, Rev. 2.1, 5/2015
Table of Contents
1 General Description.............................................................. 4
1.1 Block Diagram............................................................. 4
1.2 Pinout...........................................................................4
1.3 System Connections....................................................5
1.3.1 Typical Application Circuit—I2C Mode.............5
1.3.2 Typical Application Circuit—SPI Mode............ 6
1.4 Sensitive Axes Orientations and Polarities.................. 7
2 Mechanical and Electrical Specifications.............................. 8
2.1 Absolute Maximum Ratings......................................... 8
2.2 Operating Conditions................................................... 9
2.3 Mechanical Characteristics..........................................9
2.4 Electrical Characteristics............................................. 10
2.5 Temperature Sensor Characteristics........................... 11
3 Digital Interfaces................................................................... 12
3.1 I²C Interface................................................................. 12
3.1.1 I²C Operation................................................... 14
3.1.2 I²C Read Operations........................................ 15
3.1.3 I²C Write Operations........................................ 15
3.2 SPI Interface................................................................ 17
3.2.1 General SPI Operation.................................... 17
3.2.2 SPI Write Operations with 3- and 4-Wire
Modes.............................................................. 18
3.2.3 SPI Read Operations with 4-Wire Mode.......... 20
3.2.4 SPI Read Operations with 3-Wire Mode.......... 21
3.2.5 SPI Timing Specifications (4-wire mode)......... 21
3.2.6 SPI Timing Specifications (3-wire mode)......... 23
4 Modes of Operation...............................................................24
5 Functionality.......................................................................... 26
5.1 FIFO Data Buffer......................................................... 27
5.2 Rate Threshold Detection Function............................. 28
3-Axis Digital Angular Rate Gyroscope, Rev. 2.1, 5/2015
6 Register Descriptions............................................................ 30
6.1 0x00: STATUS.............................................................30
6.2 0x01–0x06: OUT_X_MSB, OUT_X_LSB,
OUT_Y_MSB, OUT_Y_LSB, OUT_Z_MSB,
OUT_Z_LSB................................................................ 31
6.3 0x07: DR_STATUS......................................................33
6.4 0x08: F_STATUS.........................................................35
6.5 0x09: F_SETUP...........................................................35
6.6 0x0A: F_EVENT.......................................................... 36
6.7 0x0B: INT_SOURCE_FLAG........................................ 37
6.8 0x0C: WHO_AM_I....................................................... 38
6.9 0x0D: CTRL_REG0..................................................... 38
6.10 0x0E: RT_CFG............................................................ 40
6.11 0x0F: RT_SRC............................................................ 41
6.12 0x10: RT_THS............................................................. 43
6.13 0x11: RT_COUNT....................................................... 44
6.14 0x12: TEMP................................................................. 44
6.15 0x13: CTRL_REG1......................................................45
6.16 0x14: CTRL_REG2......................................................47
6.17 0x15:CTRL_REG3.......................................................48
7 Printed Circuit Board Layout and Device Mounting.............. 50
7.1 Printed Circuit Board Layout........................................50
7.2 Overview of Soldering Considerations.........................51
7.3 Halogen Content..........................................................52
8 Package Information............................................................. 52
8.1 Product Identification Markings....................................52
8.2 Tape and Reel Information.......................................... 52
8.3 Package Description....................................................53
9 Revision History.................................................................... 55
3
Freescale Semiconductor, Inc.
General Description
1 General Description
1.1 Block Diagram
Charge
Pump
Ωx,y,z
Drive Z
X/Y Vibrating
Mass
Voltage References
and Regulators
VDDIO
GND
C2V
MUX
Gain
LPF
AAF
MUX
ADC-16
Digital
Signal
Processing
Angular Rate
Demod
Z-
Oscillators,
Clock
Generator
Configuration
and Control
Registers
Temperature
Sensor
Fd
Z Vibrating
Mass
Y-
X-
Programmable
32 Sample
FIFO
Buffer
Self-Test
Z+
Y+
X+
Drive X/Y
NVM,
Trim Logic
Digital I/O
VDD
INT1
I2C/SPI Interface
INT2/
SPI/I2C_B
PWR_CTRL
SCL/SCLK SDA/MOSI/ SA0/MISO
SPI_DATA
SPI_CS_B RST_B
Figure 1. Block Diagram
RSVD_GND
RSVD_GND
RSVD_GND
RSVD_GND
RSVD_GND
1.2 Pinout
24
23
22
21
20
VDDIO
INT1
3
17
SPI_CS_B
RST_B
4
16
VREGD
GND2
5
15
VDD
RSVD_GND
6
14
GND3
RSVD_GND
7
13
SA0 /
MISO
9
10
11
12
SDA / MOSI
/ SPI_DATA
8
SCL / SCLK
GND4
18
RSVD_GND
19
2
RSVD_GND
1
I2C_B / SPI
GND1
INT2 /
PWR_CTRL
Figure 2. Device pinout (top view)
4
Freescale Semiconductor, Inc.
3-Axis Digital Angular Rate Gyroscope, Rev. 2.1, 5/2015
General Description
Table 1. Pin functions
Pin
Name
1
GND1
Ground
2
PWR_CTRL1
Interrupt Output 2 / Power state transition control input
INT2 /
Function
3
INT1
4
RST_B
Reset input, active low. Connect this pin to VDDIO if unused.
5
GND2
Ground
6
RSVD_GND
Reserved - Must be tied to ground
7
RSVD_GND
Reserved - Must be tied to ground
8
I2C_B / SPI
Digital interface selection pin. This pin must be tied high to select SPI interface
mode, or low to select I2C interface mode.
9
RSVD_GND
Reserved pin—must be tied to ground
10
RSVD_GND
Reserved pin—must be tied to ground
11
SCL/SCLK
12
Interrupt Output 1
I2C / SPI clock
SDA / MOSI / SPI_Data I2C data / SPI 4-wire Master Out Slave In / SPI 3-wire data In/Out2
I2C address bit0 / SPI 4-wire Master In Slave Out
13
SA0/MISO
14
GND3
15
VDD
16
VREGD
Digital regulator output. Connect a 0.1 μF capacitor between this pin and ground
17
SPI_CS_B
SPI chip select input, active low. This pin must be held logic high when operating
in I2C interface mode (I2C_B/SPI set to ground) to ensure correct operation.
18
VDDIO
Interface supply voltage
19
GND4
Ground
20
RSVD_GND
Reserved - Must be tied to ground
21
RSVD_GND
Reserved - Must be tied to ground
22
RSVD_GND
Reserved - Must be tied to ground
23
RSVD_GND
Reserved - Must be tied to ground
24
RSVD_GND
Reserved - Must be tied to ground
Ground
Supply voltage
1. INT2/PWR_CTRL becomes a high-impedance input with weak internal pull-up resistor when
CTRLREG3[EXTCTRLEN] = 1; the pull-up resistor is referenced to VDDIO.
2. MOSI becomes a bidirectional data pin when FXAS21002C is operated in 3-wire SPI mode with
CTRL_REG0[SPIW]=1.
1.3 System Connections
The FXAS21002C offers the choice of interfacing with a host processor through
either I2C or SPI interfaces. Figure 3 and Figure 4 show the recommended circuit
connections for implementing both interface options.
3-Axis Digital Angular Rate Gyroscope, Rev. 2.1, 5/2015
5
Freescale Semiconductor, Inc.
General Description
47 kΩ
(optional)
INT2 / PWR_CTRL
INT1
23
22
21
20
RSVD_GND
RSVD_GND
RSVD_GND
RSVD_GND
VDDIO
24
RSVD_GND
1.3.1 Typical Application Circuit—I2C Mode
1
GND1
2
INT2 / PWR_CTRL
3
INT1
VDDIO
(1.62 to VDD + 0.3 V)
GND4
19
VDDIO
18
SPI_CS_B
17
VREGD
16
VDD
15
GND3
14
0.1 μF
100 nF
4
RST_B
5
GND2
6
RSVD_GND
7
RSVD_GND
RST_B
RSVD_GND
SCL/SCLK
SDA/MOSI
8
RSVD_GND
VDDIO
VDD (1.95 to 3.6 V)
0.1 μF
I2C_B / SPI
Note: Connect RST_B pin to VDDIO
if unused in the application. A pull-up
resistor may be also used if desired.
9
10
11
12
1.0 μF
SAO
SAO/MISO 13
Note: The logic level on SA0 sets the
7-bit I2C slave address as follows:
SA0 = GND -> 0x20
SA0 = VDDIO -> 0x21
4.7 kΩ
VDDIO
SCL
4.7 kΩ
SDA
Figure 3. I2C mode electrical connections
6
Freescale Semiconductor, Inc.
3-Axis Digital Angular Rate Gyroscope, Rev. 2.1, 5/2015
General Description
47 kΩ
(Optional)
23
22
21
20
RSVD_GND
RSVD_GND
RSVD_GND
RSVD_GND
VDDIO
24
RSVD_GND
1.3.2 Typical Application Circuit—SPI Mode
1
GND1
INT2 /
PWR_CTRL
2
INT2 / PWR_CTRL
INT1
3
INT1
4
RST_B
5
GND2
6
RSVD_GND
7
RSVD_GND
VDDIO
(1.62 to VDD + 0.3 V)
GND4 19
0.1 μF
VDDIO
18
SPI_CS_B
17
VREGD
16
VDD
15
Host SPI
Chip Select
100 nF
RST_B
0.1 μF
1.0 μF
RSVD_GND
RSVD_GND
SCL/SCLK
SDA/MOSI
GND3 14
I2C_B / SPI
Note: Connect RST_B pin to VDDIO
if unused in the application. A pull-up
resistor may also be used if desired.
VDD
(1.95 to 3.6 V)
8
9
10
11
12
SAO/MISO 13
MISO
VDDIO
MOSI
SCLK
Note:
MOSI becomes a bidirectional data pin when
FXAS21002 is operated in 3-wire SPI mode
with CTRL_REG0[SPIW] = 1.
Figure 4. SPI mode electrical connections
1.4 Sensitive Axes Orientations and Polarities
+ΩZ
+ΩY
FX
AS
210
02
+ΩX
Figure 5. Reference frame for rotational measurement
3-Axis Digital Angular Rate Gyroscope, Rev. 2.1, 5/2015
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Freescale Semiconductor, Inc.
Mechanical and Electrical Specifications
2 Mechanical and Electrical Specifications
2.1 Absolute Maximum Ratings
Absolute maximum ratings are the limits the device can be exposed to without
permanently damaging it. Absolute maximum ratings are stress ratings only; functional
operation at these ratings is not guaranteed. Exposure to absolute maximum ratings
conditions for extended periods may affect device reliability.
This device contains circuitry to protect against damage due to high static voltage or
electrical fields. It is advised, however, that normal precautions be taken to avoid
application of any voltages higher than maximum-rated voltages to this high-impedance
circuit. Reliability of operation is enhanced if unused inputs are tied to an appropriate
logic voltage level (for instance, either GND or VDD).
Table 2. Absolute maximum ratings
Rating
Symbol
Min
Max
Unit
VDD
–0.3
3.6
V
VDDIO
–0.3
3.6
V
VIN
–0.3
VDDIO +0.3
V
Maximum Acceleration (all axes, 100 μs)
gmax
—
5000
g
Operating temperature
TOP
–40
+85
°C
Storage temperature
TSTG
–40
+125
°C
Supply voltage
Interface supply voltage
Input voltage on any control pin (SA0, SCL, SDA, RST_B, PWR_CTRL)
Table 3. ESD and latch-up protection characteristics
Rating
Symbol
Value
Unit
Human body model (HBM)
VHBM
±2000
V
Machine model (MM)
VMM
±200
V
Charge device model (CDM)
VCDM
±500
V
Latch-up current at T = 85 °C
ILU
±100
mA
Caution
This device is sensitive to mechanical shock, improper handling can cause permanent damage to the part.
8
Freescale Semiconductor, Inc.
3-Axis Digital Angular Rate Gyroscope, Rev. 2.1, 5/2015
Mechanical and Electrical Specifications
Caution
This is an ESD sensitive device, improper handling can cause permanent damage to the part.
2.2 Operating Conditions
Table 4. Nominal operating conditions
Rating
Supply voltage
Interface supply voltage
Symbol
Min
Typ
Max
Unit
VDD
1.95
—
3.6
V
VDDIO
1.62
—
VDD + 0.3
V
Digital high level input voltage: SCL/SCLK,
SDA/MOSI/SPI_DATA, SA0/MISO, SPI/
I2C_B, RST_B, INT2/PWR_CTRL,
SPI_CS_B pins
VIH
0.7 * VDDIO
—
—
V
Digital low level input voltage: SCL/SCLK,
SDA/MOSI/SPI_DATA, SA0/MISO, SPI/
I2C_B, RST_B, INT2/PWR_CTRL,
SPI_CS_B pins
VIL
—
—
0.3 * VDDIO
V
Operating temperature
Top
–40
+25
+85
°C
2.3 Mechanical Characteristics
Table 5. Mechanical characteristics
Parameter
ADC Resolution
Symbol
Test Conditions
Min
Typ
Max
Unit
n
—
—
16
—
bits
—
dps
—
mdps/LSB
—
%/°C
CTRL_REG0[FS] = 00
Full-scale range
FSR
Sensitivity
So
CTRL_REG0[FS] = 01
CTRL_REG0[FS] = 10
±2000
—
±1000
±500
CTRL_REG0[FS] = 11
±250
CTRL_REG0[FS] = 00
62.5
CTRL_REG0[FS] = 01
CTRL_REG0[FS] = 10
—
CTRL_REG0[FS] = 11
31.25
15.625
7.8125
XY: ±0.08
Sensitivity Temperature Coefficient
εT
–40 to +85 °C
—
Zero-rate Offset
DO
CTRL_REG0[FS] = 00
—
±25
—
LSB
DO-PBM
CTRL_REG0[FS] = 00
—
±50
—
LSB
Zero-rate Offset, Post-Board
Mount1
Z: ±0.01
Table continues on the next page...
3-Axis Digital Angular Rate Gyroscope, Rev. 2.1, 5/2015
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Freescale Semiconductor, Inc.
Mechanical and Electrical Specifications
Table 5. Mechanical characteristics (continued)
Parameter
Symbol
Test Conditions
Min
Max
Unit
DT
–40 to +85 °C
—
—
dps/°C
CAS
max(SXY, SXZ, SYX, SYZ,
SZX, SZY)
—
±1.5
—
%
INL
CTRL_REG0[FS] = 00
—
±0.5
—
%FSR
STOC
CTRL_REG0[FS] = 00
7000
16000
25000
LSB
ODRMAX
—
—
800
—
Hz
ND
ODR = 200 Hz,
CTRL_REG0[FS] = 00,
CTRL_REG0[BW] = 00
—
0.025
—
dps/√Hz
Zero Rate Bias Temperature
Coefficient
Cross axis sensitivity
Integral nonlinearity
(deviation from linear response)
Self-test output change2
Maximum output data rate
Noise density
Typ
XY: ±0.02
Z: ±0.01
Test conditions (unless otherwise noted):
• VDD = 2.5 V
• VDDIO = 1.8 V
• T = 25 °C
1. Post Board Mount Offset Specifications are based on an eight-layer PCB.
2. The Self-Test function can be used to verify the correct functioning of the ASIC measurement chain and gyro drive
circuitry. The Self-Test function will only produce a meaningful result when the device is maintained stationary during the
test. The Self-Test output value will be either positive or negative due to factory trimming, therefore, the absolute value
of the Self-Test result should be used.
2.4 Electrical Characteristics
Table 6. Electrical characteristics
Parameter
Symbol
Test conditions
Min
Typ
Max
Unit
Supply voltage
VDD
—
1.95
2.5
3.6
V
Interface supply
VDDIO
—
1.62
—
VDD+0.3
V
Current consumption in Active
mode
IddAct
Active mode
—
2.7
—
mA
Current consumption in Ready
mode
IddRdy
Ready mode
—
1.6
—
mA
Supply current drain in
Standby mode
IddStby
Standby mode
—
2.8
—
µA
IDDSTBY-OT
–40 ≤ T ≤ 85 °C
—
—
7.5
µA
VIH
—
0.7 * VDDIO
—
—
V
Supply current in Standby
mode over temperature
Digital high level input voltage
SCL/SCLK, SDA/MOSI/
SPI_DATA, SA0/MISO, SPI/
I2C_B, RST_B, INT2/
PWR_CTRL, SPI_CS_B
Table continues on the next page...
10
Freescale Semiconductor, Inc.
3-Axis Digital Angular Rate Gyroscope, Rev. 2.1, 5/2015
Mechanical and Electrical Specifications
Table 6. Electrical characteristics (continued)
Parameter
Symbol
Test conditions
Min
Typ
Max
Unit
VIL
—
—
—
0.3 * VDDIO
V
High-level output voltage
INT1, INT2/PWR_CTRL,
SDA/MOSI/SPI_DATA, SA0/
MISO
VOH
IO = 1 mA
0.9 * VDDIO
—
—
V
Low-level output voltage INT1,
INT2/PWR_CTRL, SDA/
MOSI/SPI_DATA, SA0/MISO
VOL
IO = 1 mA
—
—
0.1 * VDDIO
V
VOLSDA1
IO = 3 mA, VDDIO ≥ 2V
—
—
0.4 * VDDIO
VOLSDA2
IO = 3 mA, VDDIO < 2V
—
—
0.2 * VDDIO
ODRTOL
—
—
±2.5
—
% ODR
Output Signal bandwidth
BW
—
4
< ODR/2
256
Hz
Standby to Active mode
transition time
TStdy-Act
—
—
1/ODR + 60
—
ms
Ready to Active mode
transition time
TRdy-Act
—
—
1/ODR + 5
—
ms
Digital low level input voltage
SCL/SCLK, SDA/MOSI/
SPI_DATA, SA0/MISO, SPI/
I2C_B, RST_B, INT2/
PWR_CTRL, SPI_CS_B
Low-level output voltage SDA
Output Data Rate frequency
tolerance
V
Test conditions (unless otherwise noted):
• VDD = 2.5 V
• VDDIO = 1.8 V
• T = 25°C
2.5 Temperature Sensor Characteristics
Table 7. Temperature sensor characteristics
Characteristic
Symbol
Condition(s)
Min
Typ
Max
Unit
Full-scale range
TFSR
—
–40
—
+85
°C
Operating temperature
TOP
—
–40
+25
+85
°C
TSENS
—
—
1
—
°C/LSB
Sensitivity
Test conditions (unless otherwise noted):
• VDD = 2.5 V
• VDDIO = 1.8 V
3-Axis Digital Angular Rate Gyroscope, Rev. 2.1, 5/2015
11
Freescale Semiconductor, Inc.
Digital Interfaces
3 Digital Interfaces
The registers embedded inside the device are accessed through either an I2C or an SPI
serial interface. To enable either interface, the VDDIO line must be connected to the
interface supply voltage. If VDD is not present and VDDIO is present, FXAS21002C is in
shutdown mode and communications on the interface are ignored. If VDDIO is
maintained, VDD can be powered off and the communications pins will be in a high
impedance state. This will allow communications to continue on the bus with other
devices.
Table 8. Serial interface pin descriptions
Pin name
Pin description
VDDIO
Digital interface power
SPI_CS_B
SPI chip select
SCL/SCLK
I2C/SPI serial clock
SDA/MOSI/SPI Data
I2C serial data/SPI master serial data out slave serial data in /SPI 3-wire data input/output
SA0/MISO
I2C least significant bit of the device address/SPI master serial data in slave serial data out
I2C_B/SPI
Digital interface mode selection pin
3.1 I²C Interface
To use the I2C interface, the I2C_B/SPI (pin 8) pin must be connected to GND
(logic low) and the SPI_CS_B (pin 17) must be made logic high (by providing it a
voltage equal to VDDIO). FXAS21002C's I2C interface is compliant with I2C interface
specification for Standard and Fast modes as outlined in the I2C-bus specification and
user manual - Rev 4, published by NXP Semiconductors. The 7-bit slave addresses that
may be assigned to the device are 0x20 (with SA0 = 0) and 0x21 (with SA0 = 1). When
I2C_B/SPI is held low, the SA0/MISO pin is used to define the LSB of this I2C address.
This part does not implement clock stretching. See Table 9 for the I2C slave addresses.
Table 9. I2C Slave Addresses
Command
Device Address Bit[0] (SA0
pin state)
Slave Address
Bits[6:0]
R/W Bit
Slave Address Byte Transmitted
by Master
Read
0
0x20
1
0x41
Write
0
0x20
0
0x40
Read
1
0x21
1
0x43
Write
1
0x21
0
0x42
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Freescale Semiconductor, Inc.
3-Axis Digital Angular Rate Gyroscope, Rev. 2.1, 5/2015
Digital Interfaces
The key bus timing constraints are shown in Table 10. The I2C timing diagram is
shown in Figure 6.
Table 10. Slave timing values
Parameter
Symbol
I2C Standard Mode1, 2
I2C Fast Mode1, 2
Unit
Min
Max
Min
Max
SCL clock frequency
fSCL
0
100
0
400
kHz
Bus free time between STOP and
START conditions
tBUF
4.7
—
1.3
—
µs
Hold time (repeated) START condition
tHD;STA
4.0
—
0.6
—
µs
Set-up time for a repeated START
condition
tSU;STA
4.7
—
0.6
—
µs
Set-up time for a STOP condition
tSU;STO
4.0
—
0.6
—
µs
—
3.453
—
0.93
µs
—
3.453
—
0.93
µs
—
ns
SDA valid
time2
tVD;DAT
SDA valid acknowledge
time4
tVD;ACK
tSU;DAT
250
—
1005
SCL clock low time
tLOW
4.7
—
1.3
—
µs
SCL clock high time
tHIGH
4.0
—
0.6
—
µs
tr
—
1000
20
300
ns
tf
—
300
20*(VDDIO/5.5 V)
300
ns
Cb
—
400
—
400
pF
tSP
0
50
0
50
ns
SDA setup time
SDA and SCL rise time
SDA and SCL fall
time6
Capacitive load for each bus
line7
Pulse width of spikes on SDA and SCL
that must be suppressed by the internal
input filter
1. All values refer to VIH (min) and VIL (max) levels.
2. tVD;DAT refers to the time for data signal from SCL LOW to SDA output (HIGH or LOW, depending on which one is
worse).
3. The maximum tHD;DAT could be 3.45 µs and 0.9 µs for Standard mode and Fast mode, but must be less than the
maximum of tVD;DAT or tVD;ACK by a transition time.
4. tVD;ACK = time for acknowledgement signal from SCL LOW to SDA output (HIGH or LOW, depending on which one is
worse).
5. A Fast-mode I2C device can be used in a Standard-mode I2C system, but the requirement tSU;DAT 250 ns must then
be met. Also, the acknowledge timing must meet this set-up time.
6. The maximum tf for the SDA and SCL bus lines is specified at 300 ns. The maximum fall time for the SDA output
stage tf is specified at 250 ns. This allows series protection resistors to be connected between the SDA and the SCL
pins and the SDA/SCL bus lines without exceeding the maximum specified tf.
7. Cb is the total capacitance of one bus line in pF; the maximum bus capacitance allowable may vary from this value
depending on the application operating voltage and frequency.
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Digital Interfaces
tr
SDA
tSU:DAT
tr
70%
30%
70%
30%
tHD :DAT
tr
tVD:DAT
tHIGH
tr
70%
30%
SCL
70%
30%
70%
30%
tSET
S
70%
30%
tLOW
1 / fSCL
st
1 clock cycle
9th clock
tBUF
SDA
tSU:STA
SCL
tHD:STA
Sr
tVD:ACK
tSP
tSU:STO
70%
30%
9th clock
P
S
Figure 6. I2C timing diagram
3.1.1 I²C Operation
There are two signals associated with the I2C bus: the serial clock line (SCL) and the
serial data line (SDA). The SDA is a bidirectional line used for sending and receiving
the data to and from the interface. External pull-up resistors connected to VDDIO are
required for SDA and SCL. When the bus is free, the lines are high.
The maximum practical operating frequency for I2C in a given system implementation
depends on several factors including the pull-up resistor values, and the total bus
capacitance (trace + parasitic device capacitances).
A transaction on the bus is started through a start condition (ST) signal, which is
defined as a HIGH-to-LOW transition on the data line while the SCL line is held HIGH.
After the ST signal has been transmitted by the master, the bus is considered busy. The
next byte of data transmitted contains the slave address in the first seven bits, and the
eighth bit, the read/write bit, indicates whether the master is receiving data from the
slave or transmitting data to the slave. When an address is sent, each device in the
system compares the first seven bits after the ST condition with its own address. If they
match, the device considers itself addressed by the master. The ninth clock pulse,
following the slave address byte (and each subsequent byte) is the acknowledge (ACK).
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Digital Interfaces
The transmitter must release the SDA line during the ACK period. The receiver must
then pull the data line low so that it remains consistently low during the high period of
the acknowledge clock period. The number of bytes per transfer is unlimited. If a
receiver can't receive another complete byte of data until it has performed some other
function, it can hold the clock line, SCL, low to force the transmitter into a wait state.
Data transfer only continues when the receiver is ready for another byte and releases
the data line. This delay action is called clock stretching. Not all receiver devices
support clock stretching. Not all master devices recognize clock stretching.
A LOW-to-HIGH transition on the SDA line while SCL is high is defined as a stop
condition (SP) signal. A write or burst write is always terminated by the master
issuing the SP signal. A master should properly terminate a read by not
acknowledging a byte at the appropriate time in the protocol. A master may also issue
a repeated start signal (SR) during a transfer.
3.1.2 I²C Read Operations
3.1.2.1
Single-Byte Read
The master (or MCU) transmits an ST to the FXAS21002C, followed by the slave
address, with the R/W bit set to “0” for a write, and the FXAS21002C sends an
acknowledgement. Then, the MCU transmits the address of the register to read and the
FXAS21002C sends an acknowledgement. The MCU transmits an SR, followed by
the byte containing the slave address and the R/W bit set to “1” for a read from the
previously selected register. The FXAS21002C then acknowledges and transmits the
data from the requested register. The master transfers a NACK followed by an SP,
signaling an end of transmission.
3.1.2.2
Multiple-Byte Read
When performing a multiple-byte or burst read, the FXAS21002C increments the
register address read pointer after a read command is received. Therefore, after
following the steps of a single-byte read, multiple bytes of data can be read from
sequential registers after each FXAS21002C ACK is received. This continues until the
master transfers a NACK followed by an SP, signaling an end of transmission.
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Digital Interfaces
3.1.3 I²C Write Operations
3.1.3.1
Single-Byte Write
To start a write command, the master transmits an ST to the FXAS21002C, followed by
the slave address with the R/W bit set to “0” for a write, and the FXAS21002C sends an
ACK. Then, the master transmits the address of the register to write to, and the
FXAS21002C sends an ACK. Then, the master transmits the 8-bit data to write to the
designated register and the FXAS21002C sends an ACK that it has received the data.
Since this transmission is complete, the master transmits an SP to end the data transfer.
The data sent to the FXAS21002C is now stored in the appropriate register.
3.1.3.2
Multiple-Byte Write
The FXAS21002C automatically increments the register address write pointer after a
write command is received. Therefore, after following the steps of a single-byte write,
multiple bytes of data can be written to sequential registers after each FXAS21002C
ACK is received.
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Digital Interfaces
3.1.3.3
I²C Data Sequence Diagrams
<Single Byte Read>
Master
ST
Register Address[7:0]
W
Device Address[6:0]
Slave
ACK
SR
Device Address[6:0]
NACK SP
R
ACK
ACK
Data[7:0]
<Multiple Byte Read>
Master
ST
Register Address[7:0]
W
Device Address[6:0]
SR
Device Address[6:0]
R
ACK
continued
Slave
ACK
Master
Slave
ACK
Data[7:0]
Data[7:0]
NACK SP
ACK
Data[7:0]
ACK
ACK
Data[7:0]
<Single Byte Write>
Master
ST
Device Address[6:0]
Slave
Data[7:0]
Register Address[7:0]
W
ACK
ACK
SP
ACK
<Multiple Byte Write>
Master
ST
Device Address[6:0]
Slave
Legend
ST: Start Condition
ACK
SP: Stop Condition
Data[7:0]
Register Address[7:0]
W
ACK: Acknowledge
ACK
NACK: No Acknowledge
Data[7:0]
ACK
W: Write = 0
SP
ACK
SR: Repeated Start Condition
Figure 7. I²C data sequence diagram
3.2 SPI Interface
The SPI interface is a classical Master/Slave serial port. FXAS21002C is always
considered to be the slave device and thus never initiates a communication with the
host processor.
The SPI interface of FXAS21002C is compatible with SPI interface mode 00,
corresponding to CPOL = 0 and CPHA = 0.
For CPOL = 0, the idle value of the clock is zero, and the active value of the clock is
1. For CPHA = 0, data is captured on the clock's rising edge (low to high transition)
and data is propagated on the clock’s falling edge (high to low transition).
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Digital Interfaces
3.2.1 General SPI Operation
The SPI_CS_B pin is driven low at the start of a transaction, held low for the duration
of the transfer, and then driven high again after the transaction is completed. During a
transaction, the master toggles the clock (SCLK). The SCLK polarity is defined as
having an idle value that is low, and an active phase that is high (CPOL = 0). Serial
input and output data is captured on the clock's rising edge and propagated on the
falling edge (CPHA = 0). Single byte read and single byte write operations are
completed in 16 SCLK cycles; multiple byte reads and writes are completed in
additional multiples of 8 SCLK cycles. The first SCLK cycle latches the most
significant bit on MOSI to select whether the desired operation is a read (R/W = 1) or a
write (R/W = 0). The following seven SCLK cycles are used to latch the slave register
read or write address.
NOTE
4-wire SPI interface mode is the default out of POR or after a
hard/soft reset. The 3-wire interface mode may be selected by
setting CTRL_REG0[SPIW] = 1.
3.2.2 SPI Write Operations with 3- and 4-Wire Modes
A write operation is initiated by transmitting a 0 for the R/W bit. Then, the 7-bit register
write address, A[6:0], is transmitted in MSb first order. The data byte to be written is
then transferred during the second 8 SCLK cycle period (again, with MSb first). Figure
8 and Figure 9 shows the bus protocol for a single byte register write operation in either
3- or 4-wire SPI modes.
SPI_CS_B
SCLK
MOSI
2
3
R/W A6
A5
1
4
A4
5
6
7
8
9
A3
A2
A1
A0
D7
10
D6
11
D5
12
D4
13
D3
14
D2
15
D1
16
D0
MISO
Figure 8. SPI single byte write protocol diagram (4-wire mode), R/W = 0
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Freescale Semiconductor, Inc.
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Digital Interfaces
SPI_CS_B
SCLK
2
3
R/W A6
A5
1
MOSI
4
A4
5
6
7
8
9
A3
A2
A1
A0
D7
10
D6
11
D5
12
D4
13
D3
14
D2
15
D1
16
D0
High-Impedance
MISO
Figure 9. SPI single byte write protocol diagram (3-wire mode), R/W = 0
Multiple-byte write operations are performed similarly to the single-byte write
sequence, but with additional data bytes transferred over every 8 SCLK cycle period.
The register write address is internally auto-incremented by FXAS21002C so that
every eighth clock edge will latch the address for the next register write address.
When the desired number of bytes has been written, the rising edge on the SPI_CS_B
pin terminates the transaction. Figure 10 and Figure 11 show the bus protocol for
multiple byte register write operation in either 3- or 4-wire SPI modes.
SPI_CS_B
SCLK
MOSI
1
2
R/W A6
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
A5
A4
A3
A2
A1
A0
D7
D6
D5
D4
D3
D2
D1
D0
D7
D6
D5
D4
D3
D2
D1
D0
MISO
Figure 10. SPI multiple byte write protocol diagram (4-wire mode), R/W = 0
SPI_CS_B
SCLK
MOSI
1
2
R/W A6
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
A5
A4
A3
A2
A1
A0
D7
D6
D5
D4
D3
D2
D1
D0
D7
D6
D5
D4
D3
D2
D1
D0
MISO
High-Impedance
Figure 11. SPI multiple byte write protocol diagram (3-wire mode), R/W = 0
3-Axis Digital Angular Rate Gyroscope, Rev. 2.1, 5/2015
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Freescale Semiconductor, Inc.
Digital Interfaces
3.2.3 SPI Read Operations with 4-Wire Mode
NOTE
This description pertains only to the default SPI 4-wire
interface mode (with CTRL_REG0[SPIW] = 0). This mode is
the default out of POR, or after a hard/soft reset.
A register read operation is initiated by transmitting a 1 for the R/W bit. Then, the 7-bit
register read address, A[6:0] is encoded in the first byte. The data is read from the
MISO pin (MSB first). Figure 12 shows the bus protocol for a single byte read
operation.
SPI_CS_B
SCLK
1
2
R/W A6
MOSI
3
4
5
6
7
8
A5
A4
A3
A2
A1
A0
MISO
9
10
11
12
13
14
15
16
D7
D6
D5
D4
D3
D2
D1
D0
Figure 12. SPI single byte read protocol diagram (4-wire mode), R/W = 1
Multiple-byte read operations are performed similarly to single-byte reads; additional
bytes are read in multiples of eight SCLK cycles. The register read address is autoincremented by FXAS21002C so that every eighth clock edge will latch the address of
the next register read address. When the desired number of bytes has been read, the
rising edge on the SPI_CS_B terminates the transaction.
SPI_CS_B
SCLK
MOSI
1
2
3
R/W A6
A5
4
A4
MISO
5
6
7
8
A3
A2
A1
A0
9
D7
10
D6
11
D5
12
D4
13
D3
14
D2
15
D1
16
D0
17
D7
18
D6
19
D5
20
D4
21
D3
22
D2
23
D1
24
D0
Figure 13. SPI multiple byte read protocol diagram (4-wire mode), R/W = 1
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3-Axis Digital Angular Rate Gyroscope, Rev. 2.1, 5/2015
Digital Interfaces
3.2.4 SPI Read Operations with 3-Wire Mode
NOTE
This description pertains only to the 3-wire SPI interface
mode (with CTRL_REG0[SPIW] = 1). This interface mode
is not the default and must be selected after a POR, or hard/
soft reset.
FXAS21002C can be configured to operate in 3-wire SPI mode. In this mode the
MISO pin is left unconnected or high-z, and the MOSI pin becomes a bi-directional
input/output pin (SPI_DATA). 3-wire mode is selected by setting the SPIW bit in
CTRL_REG0. Read operations in 3-wire mode are the same as in 4-wire mode
except that at the end of address cycle, the MOSI (SPI_DATA) pin automatically
switches from an input to an output.
SPI_CS_B
SCLK
2
1
R/W A6
SPI_DATA
3
4
5
6
7
8
9
10
11
12
13
14
15
16
A5
A4
A3
A2
A1
A0
D7
D6
D5
D4
D3
D2
D1
D0
MISO
High-Impedance
Figure 14. SPI single byte read protocol diagram (3-wire mode)
SPI_CS_B
SCLK
MOSI
2
3
R/W A6
A5
1
4
A4
5
6
7
8
9
A3
A2
A1
A0
D7
10
D6
MISO
11
D5
12
D4
13
D3
14
D2
15
D1
16
D0
17
D7
18
D6
19
D5
20
D4
21
D3
22
D2
23
D1
24
D0
High-Impedance
Figure 15. SPI multiple byte read protocol diagram (3-wire mode)
3-Axis Digital Angular Rate Gyroscope, Rev. 2.1, 5/2015
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Freescale Semiconductor, Inc.
Digital Interfaces
3.2.5 SPI Timing Specifications (4-wire mode)
Table 11 and Figure 16 specify and illustrate the minimum and maximum timing
parameter values for correct SPI interface functionality when FXAS21002C is operated
in 4-wire SPI mode. The timing delays given in Table 11 are taken at 70% of the rising
edge and 30% of the falling edge. FXAS21002C only supports SPI mode 00,
corresponding to CPOL = 0, and CPHA = 0. In this mode, the active state of the clock
is high and the idle state is low. Data is latched on the rising edge of the clock and
propagated on the falling edge. Please note that the timing parameters shown in Table
11 are based on simulations performed across process, voltage, and temperature with a
total bus capacitance of 80 pF and a 10 kΩ pull-up resistor to VDDIO on each SPI
interface pin (SCL/SCLK, SDA/MOSI/SPI_DATA, SA0/MISO, and SPI_CS_B).
NOTE
In 4-wire SPI mode the MISO pin is always placed in a high
impedance state when CS_B is not asserted (logic high level).
Table 11. Slave timing values
Label
Description
fSCLK
SCLK frequency
tSCLK
Specifications
Unit
Min.
Max.
0
2
MHz
SCLK Period
500
—
ns
tSCLKH
SCLK high time
210
—
ns
tSCLKL
SCLK low time
210
—
ns
tSZ
Setup time for MISO signal (transition out of
high-z state)
—
130
tHZ
Hold time for MISO signal (transition back to
high-z state)
—
110
tSCS
Setup time for SPI_CS_B signal
250
—
ns
tHCS
Hold time for SPI_CS_B signal
200
—
ns
tWCS
Inactive time for SPI_CS_B signal
110
—
ns
tSET
Data setup time for MOSI signal
20
—
ns
tHOLD
Data hold time for MOSI signal
200
—
ns
tDDLY
Data setup time for MISO signal
—
210
ns
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Digital Interfaces
tWCS
SPI_CS_B
tSCS
tSCLK
tSCLKH
tHCS
tSCLKL
SCLK
tSET
MOSI
tHOLD
tDDLY
MISO
Figure 16. SPI timing diagram (4-wire mode)
3.2.6 SPI Timing Specifications (3-wire mode)
Table 12 and Figure 17 specify and illustrate the minimum and maximum timing
parameter values for correct SPI interface functionality when FXAS21002C is
operated in 3-wire SPI mode. The timing delays given in Table 12 are taken at 70% of
the rising edge and 30% of the falling edge. FXAS21002C only supports SPI mode
‘00’, corresponding to CPOL = 0, and CPHA = 0. In this mode, the active state of the
clock is high and the idle state is low. Data is latched on the rising edge of the clock
and propagated on the falling edge. Please note that the timing parameters shown in
Table 12 are based on simulations performed across process, voltage, and temperature
with a total bus capacitance of 80pF and a 10 kΩ pull-up resistor to VDDIO on each
SPI interface pin (SCL/SCLK, SDA/MOSI/SPI_DATA, SA0/MISO, and SPI_CS_B).
NOTE
When FXAS21002C is operated in 3-wire SPI mode - by
setting CTRL_REG0[SPIW] = 1 - the SA0/MISO pin is
always placed in a high impedance (high-z) state.
Table 12. Slave timing values
Label
Description
Specifications
Unit
Min.
Max.
0
1.4
MHz
fSCLK
SCLK frequency
tSCLK
SCLK Period
714
—
ns
SCLK high time
300
—
ns
tSCLKH
Table continues on the next page...
3-Axis Digital Angular Rate Gyroscope, Rev. 2.1, 5/2015
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Modes of Operation
Table 12. Slave timing values (continued)
Label
Description
tSCLKL
Specifications
SCLK low time
tHZ
Hold time for MISO signal (transition back to
high-z state)
Min.
Max.
300
—
—
200
Unit
ns
tSCS
Setup time for SPI_CS_B signal
250
—
ns
tHCS
Hold time for SPI_CS_B signal
200
—
ns
tWCS
Inactive time for SPI_CS_B signal
200
—
ns
tSET
Data setup time for MOSI signal
20
—
ns
tHOLD
Data hold time for MOSI signal
200
—
ns
tDDLY
Data setup time for MISO signal
—
280
ns
tWCS
SPI_CS_B
tSCS
tSCLK
tSCLKH
tSCLKL
tHCS
SCLK
tDDLY
tSET
MOSI
tHOLD
High-Impedance
MISO
Figure 17. SPI timing diagram (3-wire mode)
4 Modes of Operation
The device may be placed into one of three functional modes:
• Standby: Some digital blocks are enabled; I2C/SPI communication is possible.
This mode is the minimum power consumption state for the device and is the
default mode entered on POR or hard/soft reset. A transition from Standby mode to
Active mode takes 1/ODR + 60 ms, typical.
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Freescale Semiconductor, Inc.
3-Axis Digital Angular Rate Gyroscope, Rev. 2.1, 5/2015
Modes of Operation
• Active: All blocks are enabled (digital and analog); the device is actively
measuring the angular rate at the ODR specified in 0x13: CTRL_REG1. This is
the maximum power consumption state of the device.
• Ready: This mode is entered by setting CTRL_REG1[Ready] = 1. In this mode,
the drive circuits are running but no measurements are being made. This mode
offers the user the ability to significantly reduce the current draw of the device
while providing a fast transition into Active mode within 1/ODR + 5 ms.
NOTE
When CTRL_REG3[EXTCTRLEN] = 0, the Active mode
is entered/exited using the register interface
(CTRL_REG1[ACTIVE] bit). When
CTRL_REG3[EXTCTRLEN] = 1, the Active mode is
entered/exited via the logic state on the PWR_CTRL input
pin (pin 2).
The functional mode is selected using CTRL_REG1. After a POR (Power on Reset), a
boot sequence is performed by the device and the registers are loaded with their preset
values. After the boot sequence completes, the default operating mode of
FXAS21002C is Standby mode.
Boot
POR (VDD > 1.95 V)
Start-up sequence
Functional modes
Boot_end = 1
Standby
CTRL_REG1[ACTIVE] = 0
and
CTRL_REG1[READY] = 0
CTRL_REG1[ACTIVE] = 1
CTRL_REG1[ACTIVE] = 0
and
CTRL_REG1[READY] = 0
Active
CTRL_REG1[ACTIVE] = 0
and
CTRL_REG1[READY] = 1
CTRL_REG1[ACTIVE] =0
and
CTRL_REG1[READY] = 1
CTRL_REG1[ACTIVE] = 1
Ready
Figure 18. Functional mode transition diagram with CTRL_REG3[EXTCTRLEN] = 0
3-Axis Digital Angular Rate Gyroscope, Rev. 2.1, 5/2015
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Freescale Semiconductor, Inc.
Functionality
Boot
POR (VDD > 1.95 V)
Start-up sequence
Boot_end = 1
Functional modes
Standby
PWR_CTRL = Low
and
CTRL_REG1[READY] = 0
PWR_CTRL = HIGH
PWR_CTRL = Low
and
CTRL_REG1[READY] = 0
Active
PWR_CTRL = Low
and
CTRL_REG1[READY] = 1
PWR_CTRL = Low
and
CTRL_REG1[READY] = 1
PWR_CTRL = HIGH
Ready
Figure 19. Functional mode transition diagram with CTRL_REG3[EXTCTRLEN] = 1
5 Functionality
The FXAS21002C is a low-power, digital-output, 3-axis gyroscope with both I2C and
SPI interfaces. The functionality includes the following:
• 16-bit output data presented in 2's complement format
• Configurable full scale ranges of ±250, ±500, ±1000 and ±2000 dps; optional FSRs
of ±500, ±1000, ±2000 and ±4000 by setting CTRL_REG3[FS_DOUBLE] = 1
• Configurable output data rates from 12.5 to 800 Hz
• Internal low-pass filter with programmable cut-off frequency to limit the output
data bandwidth
• Angular rate sensitivity of 0.0625°/s in ±2000°/s FSR mode
• Internal high-pass filter with programmable cut-off frequency
• Embedded rate threshold detection function with programmable debounce time
• 32-sample FIFO configurable in Circular or Stop data collection modes
• 2 external interrupt pins that are configurable to signal data-ready, Rate Threshold
or FIFO events
• Self-test function for indication of device health
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Freescale Semiconductor, Inc.
3-Axis Digital Angular Rate Gyroscope, Rev. 2.1, 5/2015
Functionality
Data for each axis must be read from the respective data registers, two bytes at a time;
for example, one byte for most significant byte and one byte for least significant.
Combining these two bytes results in a 16-bit 2's complement signed integer with the
sign bit in bit location #15 and the least significant bit in location 0. See the tables
below:
Bit
15
14
13
12
11
10
9
8
Data bit
D15
D14
D13
D12
D11
D10
D9
D8
Sign bit
Bit
7
6
5
4
3
2
1
0
Data bit
D7
D6
D3
D4
D3
D2
D1
D0
LSB
The conversion from counts to units of dps is done by first adjusting the byte order of
the output data (if needed). On a big-endian processor, no byte order changes are
needed. On a little-endian processor, the byte order (MSB, LSB) must be swapped.
Following this step, the 16-bit value is multiplied by the appropriate sensitivity value
for the selected full scale range. See Table 35 for nominal sensitivity values.
5.1 FIFO Data Buffer
FXAS21002C contains a FIFO data buffer that is 192 bytes (32 X/Y/Z samples) and is
useful for reducing the frequency of transactions on the I2C/SPI bus. The FIFO can
also provide system level power savings by allowing the host processor/MCU to go
into a sleep/low-power mode while the FXAS21002C collects up to 32 samples of 3axis angular rate data.
The FIFO is configured to operate in Circular Buffer mode or Stop mode, depending
on the settings made in the 0x09: F_SETUP register. The Circular Buffer mode allows
the FIFO to be filled with a new sample, replacing the oldest sample in the buffer. The
most recent 32 samples will be stored in the buffer. This is useful in situations where
the processor is waiting for a specific interrupt to indicate that the data must be
flushed to analyze the event.
The FXAS21002C FIFO Buffer has a configurable watermark, allowing an interrupt
to be signaled to the processor after a configurable number of samples enter the buffer
(1 to 32).
3-Axis Digital Angular Rate Gyroscope, Rev. 2.1, 5/2015
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Functionality
5.2 Rate Threshold Detection Function
The embedded rate detection function can be used to detect an angular rate event that
exceeds a programmed threshold on any one of the enabled axes for longer than the
programmed debounce time, triggering an interrupt on one of the INT1/INT2 pins (if
enabled).
ELE
Sign
Data
RT_Pol
LATCH
|x|
>
CNT
RT_THS
DBCNTM
>
LATCH
RT
RT_COUNT
ELE
Output data rate (Hz)
ODR and counter clock period (ms)
Event debounce time range (s)
800
1.25
0 – 0.32
400
2.5
0 – 0.64
200
5
0 – 1.28
100
10
0 – 2.56
50
20
0 – 5.12
25
40
0 – 10.24
12.5
80
0 – 20.48
If the debounce counter reaches the value stored in RT_COUNT, the rate threshold
event is detected. The interrupt flag can be either latched or updated in real-time
depending on the state of the ELE bit. The examples illustrated in Figure 20 through
Figure 23 show the use of the rate threshold function with the various settings for the
DBCNTM and ELE control bits:
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3-Axis Digital Angular Rate Gyroscope, Rev. 2.1, 5/2015
Functionality
Data
RT_THS
Counter control
Counter value
RT_COUNT
RT
t
Figure 20. ELE = 0 and DBCNTM = 0
Data
RT_THS
Counter control
Counter value
RT_COUNT
RT
t
Figure 21. ELE = 0 and DBCNTM = 1
Data
RT_THS
Counter control
Counter value
RT_COUNT
RT
Resetting the flag
t
Figure 22. ELE = 1 and DBCNTM = 0
Data
RT_THS
Counter control
Counter value
RT_COUNT
RT
Resetting the flag
t
Figure 23. ELE = 1 and DBCNTM = 1
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Register Descriptions
6 Register Descriptions
Table 13. Register address map
Name
STATUS
Type
Register
address
Auto-increment
address
Default
value
Comment
R
0x00
0x01
0x00
Alias for DR_STATUS or F_STATUS
[7:0] are 8 MSBs of 16 bit X-axis data sample
OUT_X_MSB
R
0x01
0x02
0x001
OUT_X_LSB
R
0x02
0x03
0x001
[7:0] are 8 MSBs of 16 bit X-axis data sample
OUT_Y _MSB
R
0x03
0x04
0x001
[7:0] are 8 MSBs of 16 bit Y-axis data sample
0x05
0x001
[7:0] are 8 MSBs of 16 bit Y-axis data sample
0x06
0x001
[7:0] are 8 MSBs of 16 bit Z-axis data sample
[7:0] are 8 MSBs of 16 bit Z-axis data sample;
Auto-increment address depends on the
setting made in CTRL_REG3[WRAPTOONE]
(defaults to 0x00)
OUT_Y_LSB
OUT_Z_MSB
R
0x04
R
0x05
OUT_Z_LSB
R
0x06
0x00/0x01
0x001
DR_STATUS
R
0x07
0x08
0x00
Data-ready status information
F_STATUS
R
0x08
0x09
0x00
FIFO Status
F_SETUP
R/W
0x09
0x0A
0x00
FIFO setup
F_EVENT
R
0x0A
0x0B
0x00
FIFO event
INT_SRC_FLAG
R
0x0B
0x0C
0x00
Interrupt event source status flags
WHO_AM_I
R
0x0C
0x0D
0xD7
Device ID
CTRL_REG0
R/W
0x0D
0x0E
0x00
Control register 0: Full-scale range selection,
high-pass filter setting, SPI mode selection
RT_CFG
R/W
0x0E
0x0F
0x00
Rate threshold function configuration
RT_SRC
R
0x0F
0x10
0x00
Rate threshold event flags status register
RT_THS
R/W
0x10
0x11
0x00
Rate threshold function threshold register
RT_COUNT
R/W
0x11
0x12
0x01
Rate threshold function debounce counter
R
0x12
0x13
0x00
Device temperature in °C
CTRL_REG1
R/W
0x13
0x14
0x00
Control register 1: Operating mode, ODR
selection, self-test and soft reset
CTRL_REG2
R/W
0x14
0x15
0x00
Control register 2: Interrupt configuration
settings
CTRL_REG3
R/W
0x15
0x00
0x00
Control Register 3: Auto-increment address
configuration, external power control, FSR
expansion
RESERVED
—
0x16 – 0xFF
address + 1
—
TEMP
Factory reserved register space
1. As shown on POR. On hard/soft reset, the default value cannot be determined.
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3-Axis Digital Angular Rate Gyroscope, Rev. 2.1, 5/2015
Register Descriptions
6.1 0x00: STATUS
The STATUS register content depends on the FIFO mode setting. It is a copy of either
0x07: DR_STATUS or 0x08: F_STATUS. This allows for easy reading of the
relevant status register before reading the current sample output data, or the first
sample stored in the FIFO.
6.2 0x01–0x06: OUT_X_MSB, OUT_X_LSB, OUT_Y_MSB,
OUT_Y_LSB, OUT_Z_MSB, OUT_Z_LSB
The X-axis, Y-axis, and Z-axis output rate data are represented in 16-bit, 2's
complement format. The output data registers are arranged in a contiguous big endian
format, with the MSB of each axis’s data located at the lower register address. The
output data registers are either updated at the selected output data rate (with
F_SETUP[F_MODE] equal to 0b00 ), or alternately, point to the head of the FIFO
buffer (with F_SETUP[F_MODE] greater than 0b00 ). When reading a data sample
with F_MODE equal to 0b00, the host must always start by reading the MSB of each
axis first to ensure that the corresponding LSB register is also updated with the current
sample data. When F_MODE is greater than 0b00, the OUT_X_MSB register must be
read out first in order for the other five output data registers (OUT_X_LSB through
OUT_Z_LSB) to be updated with sample data stored at the head of the FIFO. The
FIFO head pointer is only incremented to point to the next stored sample when the
host reads the OUT_Z_MSB register.
NOTE
To avoid the loss of data, the user must burst-read all six
bytes of sample data (three axes) in a single I2C or SPI
transaction.
Table 14. 0x01: OUT_X_MSB
Bit
7
6
5
4
Read
3
2
1
0
0
0
0
0
XD[15:8]
Write
Reset1
0
0
0
0
1. As shown on POR. On hard/soft reset, the default value cannot be determined.
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Register Descriptions
Table 15. 0x02: OUT_X_LSB
Bit
7
6
5
4
Read
3
2
1
0
0
0
0
3
2
1
0
0
0
0
0
3
2
1
0
0
0
0
0
3
2
1
0
0
0
0
0
3
2
1
0
0
0
0
0
XD[7:0]
Write
Reset1
0
0
0
0
1. As shown on POR. On hard/soft reset, the default value cannot be determined.
Table 16. 0x03: OUT_Y_MSB
Bit
7
6
5
4
Read
YD[15:8]
Write
Reset1
0
0
0
0
1. As shown on POR. On hard/soft reset, the default value cannot be determined.
Table 17. 0x04: OUT_Y_LSB
Bit
7
6
5
4
Read
YD[7:0]
Write
Reset1
0
0
0
0
1. As shown on POR. On hard/soft reset, the default value cannot be determined.
Table 18. 0x05: OUT_Z_MSB
Bit
7
6
5
4
Read
ZD[15:8]
Write
Reset1
0
0
0
0
1. As shown on POR. On hard/soft reset, the default value cannot be determined.
Table 19. 0x06: OUT_Z_LSB
Bit
7
6
5
4
Read
ZD[7:0]
Write
Reset1
0
0
0
0
1. As shown on POR. On hard/soft reset, the default value cannot be determined.
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Register Descriptions
NOTE
After this register is read, the next read register by the autoincrement process is STATUS at 0x00, when
CTRL_REG3[WRAPTOONE] = 0, or OUT_X_MSB when
CTRL_REG3[WRAPTOONE] = 1.
Data output LSB registers only contain valid data after a
read of the corresponding axis MSB data register. When
F_SETUP[F_MODE] > 0b00, a data read operation must
start by reading the OUT_X_MSB register in order for the
contents of the other output data registers to be updated for
the currently indexed buffered sample. With
F_SETUP[F_MODE] > 0b00, the OUT_Z_MSB register
must be read in order to advance the internal buffer read
pointer to index the next sample stored in the FIFO.
6.3 0x07: DR_STATUS
The DR_STATUS register provides the sample data acquisition status and reflects the
real-time updates to the OUT_X, OUT_Y, and OUT_Z registers. The content of this
register is reset upon a transition from Standby to Active or from Ready to Active
modes.
Table 20. DR_STATUS register
Bit
7
6
5
4
3
2
1
0
Read
ZYXOW
ZOW
YOW
XOW
ZYXDR
ZDR
YDR
XDR
0
0
0
0
0
0
0
0
Write
Reset
Table 21. DR_STATUS field descriptions
Field
7
ZYXOW
Description
X-, Y-, Z-axis data overwrite
• Asserted whenever new X-, Y-, and Z-axis data is acquired before completing the retrieval of the
previous set.
• Cleared after the high-bytes of the data of all channels (OUT_X_MSB, OUT_Y_MSB,
OUT_Z_MSB) are read.
0: No data overwrite has occurred
1: X, Y, and Z data overwrite occurred before the previous data was read
Table continues on the next page...
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Register Descriptions
Table 21. DR_STATUS field descriptions (continued)
Field
6
ZOW
Description
Z-axis data overwrite
• Asserted whenever a new Z-axis acquisition is completed before the retrieval of the previous data.
When this occurs, the previous data is overwritten.
• Cleared anytime the OUT_Z_MSB (and respectively OUT_Y_MSB, OUT_X_MSB) register is read.
0: No data overwrite has occurred
1: Z-axis data overwrite occurred before the previous data was read
5
YOW
Y-axis data overwrite
• Asserted whenever a new Y-axis acquisition is completed before the retrieval of the previous data.
When this occurs, the previous data is overwritten.
• Cleared anytime the OUT_Z_MSB (and respectively OUT_Y_MSB, OUT_X_MSB) register is read.
0: No data overwrite has occurred
1: Y-axis data overwrite occurred before the previous data was read
4
XOW
X-axis data overwrite
• Asserted whenever a new X-axis acquisition is completed before the retrieval of the previous data.
When this occurs, the previous data is overwritten.
• Cleared anytime the OUT_Z_MSB (and respectively OUT_Y_MSB, OUT_X_MSB) register is read.
0: No data overwrite has occurred
1: X-axis data overwrite occurred before the previous data was read
3
ZYXDR
X-, Y-, and Z-axis data available
• Signals that a new acquisition for any of the channels is available.
• Cleared when the high-bytes of the data of all channels (OUT_X_MSB, OUT_Y_MSB,
OUT_Z_MSB) are read.
0: No new data is ready
1: New data is ready
2
ZDR
Z-axis new data available
• Asserted whenever a new Z-axis data acquisition is completed.
• Cleared anytime the OUT_Z_MSB register is read.
0: No new Z-axis data is ready
1: New Z-axis data is ready
1
YDR
Y-axis new data available
• Asserted whenever a new Y-axis data acquisition is completed.
• Cleared anytime the OUT_Y_MSB register is read.
0: No new Y-axis data is ready
1: New Y-axis data is ready
0
XDR
X-axis new data available
• Asserted whenever a new X-axis data acquisition is completed.
• Cleared anytime the OUT_X_MSB register is read.
0: No new X-axis data is ready
1: New X-axis data is ready
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Register Descriptions
6.4 0x08: F_STATUS
When the FIFO is enabled, the F_STATUS register indicates the current status of the
FIFO. Also, the STATUS register (address 0x00) contains the same content as
F_STATUS to facilitate the emptying of the FIFO by the host processor. The content
of this register is reset upon a transition from Standby to Active or from Ready to
Active modes.
Table 22. F_STATUS register
Bit
7
6
Read
F_OVF
F_WMKF
5
0
0
4
3
2
1
0
0
0
0
F_CNT[5:0]
Write
Reset
0
0
0
Table 23. F_Status field descriptions
Field
7
F_OVF
Description
FIFO overflow flag
• A FIFO overflow event, such as when F_CNT = 32 and a new sample arrives, asserts the F_OVF
flag.
• Cleared when the FIFO sample count goes below 32.
0: No overflow detected
1: Overflow detected
6
F_WMKF
FIFO watermark flag
• A FIFO sample count greater than or equal to the sample count watermark (determined by the
F_WMRK field in register 0x09: F_SETUP) asserts the F_WMKF event flag.
• Cleared when FIFO sample count goes below the sample count watermark (set by the value of
F_SETUP[F_WMRK] field).
0: No watermark event detected
1: Watermark event detected
5:0
F_CNT
FIFO sample counter
• Indicates the number of samples currently stored in the FIFO.
• A count value of 0b000000 indicates that the FIFO is empty.
6.5 0x09: F_SETUP
The F_SETUP register is used to configure the FIFO. The FIFO update rate is set by
the selected system ODR (DR bits in 0x13: CTRL_REG1). The contents should be
modified only when the device is in Standby mode.
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Register Descriptions
Table 24. F_Setup register
Bit
7
Read
6
5
4
3
F_MODE[1:0]
Write
Reset
0
2
1
0
0
0
F_WMRK[5:0]
0
0
0
0
0
Table 25. F_SETUP field descriptions
Field
Description
FIFO operating mode selection:
00: FIFO is disabled
01: Circular Buffer mode
1x: Stop mode
Note:
• Used to select the FIFO operating mode.
• In the Circular Buffer mode, the oldest sample is discarded and replaced by the newest sample when
F_MODE
the buffer is full with F_STATUS[F_CNT] = 32.
• In the Stop mode, the FIFO will stop accepting new samples when the buffer is full with
F_STATUS[F_CNT] = 32.
• The FIFO operating mode cannot be switched between Circular and Stop modes while the FIFO is
enabled.
• To change the FIFO operating mode, the FIFO function must first be disabled by setting F_MODE[1:0] =
00.
• The FIFO is cleared whenever the FIFO is disabled.
7:6
FIFO sample count watermark setting
5:0
F_WMRK
•
•
•
•
Used to set the watermark level.
To suppress FIFO watermark event flag generation, F_WMRK[5:0] can be set to 0x00.
Disabling the FIFO clears F_WMKF
A FIFO sample count exceeding the watermark level does not stop the FIFO from accepting new data.
Default value is 0b000000.
6.6 0x0A: F_EVENT
The F_EVENT register is used to monitor the FIFO event status. The content of this
register is reset upon a transition from Standby to Active or from Ready to Active
modes.
Table 26. F_Event register
Bit
7
6
5
Read
0
0
F_EVENT
0
0
0
4
3
2
1
0
0
0
FE_TIME[4:0]
Write
Reset
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0
0
0
3-Axis Digital Angular Rate Gyroscope, Rev. 2.1, 5/2015
Register Descriptions
Table 27. F_EVENT field descriptions
Field
5
F_EVENT
Description
FIFO Event
• Indicates if either F_OVF or F_WMKF flags are set (logical OR).
• The F_STATUS register must be read to determine which event(s) occurred.
• To clear this flag, both F_OVF and F_WMKF flags must be cleared. See F_STATUS for details.
0: FIFO Event not detected
1: FIFO Event was detected
4:0
FE_TIME
Number of ODR periods elapsed since F_EVENT was set
• Indicates the number of samples acquired since a FIFO event flag (overflow or watermark) was
asserted.
• Reset when F_OVF and F_WMKF fall.
• To clear this field, the F_EVENT flag must be cleared.
6.7 0x0B: INT_SOURCE_FLAG
The INT_SOURCE_FLAG register provides the event-flag status for the interrupt
generating functions within the device. Reading the INT_SRC_FLAG register does
not reset any event-flag source bits; they are reset by reading the appropriate event
source register.
Table 28. INT_SRC register
Bit
7
6
5
4
3
2
1
0
Read
0
0
0
0
BOOTEND
SRC_FIFO
SRC_RT
SRC_DRDY
0
0
0
0
0
0
0
0
Write
Reset
Table 29. INT_SRC_FLAG field descriptions
Field
Description
Boot sequence complete event flag
• Asserted as soon as the device boot sequence has completed and remains at '1' thereafter.
3
BOOTEND
1: Boot sequence is complete
0: When one of the following occurs:
• A hard or soft reset event is triggered
• A POR event occurs
Table continues on the next page...
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Register Descriptions
Table 29. INT_SRC_FLAG field descriptions
(continued)
Field
Description
FIFO event source flag
• Indicates that the FIFO event flags triggered the interrupt
2
SRC_FIFO
1: When the FIFO event flag F_Event[F_Event] is set (F_OVF or F_WMKF are set), provided the FIFO
interrupt is enabled (CTRL_REG2[INT_EN_FIFO] = 1).
0: Cleared when F_Event flag gets cleared (whenever both F_OVF and F_WMKF get cleared).
Rate threshold event source flag
• Indicates that the rate threshold event flag(s) triggered the interrupt
1
SRC_RT
1: When the event active flag RT_SRC[EA] is set, provided the Rate Threshold interrupt is enabled
(CTRL_REG2[INT_EN_RT] = 1).
0: Cleared when the event active flag RT_SRC[EA] is cleared.
Data-ready event source flag
• Indicates that a data-ready event triggers the interrupt
0
SRC_DRDY
1: When any of the data-ready flags from DR_STATUS are set, provided the Data Ready interrupt is
enabled (CTRL_REG2[INT_EN_DRDY] = 1).
0: Cleared by reading the MSBs of the X, Y, and Z axes sample data.
6.8 0x0C: WHO_AM_I
The WHO_AM_I register contains the device identifier which is factory programmed to
0xD7.
Table 30. WHO_AM_I
Bit
7
6
5
Read
4
3
2
1
0
1
1
1
WHO_AM_I[7:0]
Write
Reset
1
1
0
1
0
6.9 0x0D: CTRL_REG0
CTRL_REG0 is used for general control and configuration of the device. The bit fields
in CTRL_REG0 should be changed only in Standby or Ready modes. Accuracy of the
output data is not guaranteed if these bits are changed when the device is in Active
mode.
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3-Axis Digital Angular Rate Gyroscope, Rev. 2.1, 5/2015
Register Descriptions
Table 31. CTRL_REG0
Bit
7
Read
6
5
BW[1:0]
Write
Reset
4
SPIW
0
0
3
2
SEL[1:0]
0
0
1
HPF_EN
0
0
FS[1:0]
0
0
0
Table 32. CTRL_REG0 field descriptions
Field
Description
Bandwidth
• Selects the cut-off frequency of the digital low-pass filter, limiting the bandwidth of the digital
output data as shown in Table 33.
7:6
BW
SPI interface mode selection
5
0: SPI 4-wire mode (default)
SPIW
1: SPI 3-wire mode (MOSI pin is used for SPI input and output signals)
4:3
High-pass filter cutoff frequency selection
• Details of the high-pass filter settings are shown in Table 34.
SEL
High-pass filter enable
• The high-pass filter is initialized on operating mode and ODR change.
• When enabled, the HPF is applied to the angular rate data supplied to the output registers/FIFO
and the embedded rate threshold function.
2
HPF_EN
0: High-pass filter disabled (default)
1: High-pass filter enabled
1:0
Full-scale range selection
• See Table 35
FS
Table 33. FXAS21002C LPF cutoff frequency
BW
ODR = 800
Hz
ODR = 400
Hz
ODR = 200
Hz
ODR = 100
Hz
ODR = 50 Hz ODR = 25 Hz ODR = 12.5 Hz
0b00
256
128
64
32
16
8
4
0b01
128
64
32
16
8
4
—
0b1x
64
32
16
8
4
—
—
Table 34. High-pass filter cutoff frequency selection
SEL1
SEL0
Cutoff Frequency in Hz versus ODR
800 Hz
400 Hz
200 Hz
100 Hz
50 Hz
25 Hz
12.5 Hz
0
0
15
7.5
3.75
1.875
0.937
0.468
0.234
0
1
7.7
3.85
1.925
0.963
0.481
0.241
0.120
1
0
3.9
1.95
0.975
0.488
0.244
0.122
0.061
1
1
1.98
0.99
0.495
0.248
0.124
0.062
0.031
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Freescale Semiconductor, Inc.
Register Descriptions
HPF_EN enables the high pass filter. Note that high-pass filter is initialized on mode
change, ODR change, and assertion of the zero rate register bit. When enabled, the
high-pass filtered data is input to both the output data registers/FIFO and the rate
threshold function.
FS[1:0] selects the full scale range of the device as shown in Table 35.
Table 35. Selectable Full Scale Ranges
FS1
FS0
Range (dps)
Nominal Sensitivity (mdps/LSB)
0
0
±2000
62.5
0
1
±1000
31.25
1
0
±500
15.625
1
1
±250
7.8125
NOTE
Setting the CTRL_REG3[FS_DOUBLE] increases the
dynamic range for each CTRL_REG0[FS] selection by a
factor of two, from ±250/500/1000/2000°/s to
±500/1000/2000/4000°/s.
6.10 0x0E: RT_CFG
The RT_CFG register is used to enable the Rate Threshold interrupt generation. The
internal state of the Rate Threshold function is reset when a transition from Standby to
Active or Ready to Active modes occurs. The contents should only be modified when
the device is in Standby mode.
Table 36. RT_ CFG Register
Bit
Read
Write
Reset
7
6
5
4
3
2
1
0
0
0
0
0
ELE
ZTEFE
YTEFE
XTEFE
0
0
0
0
0
0
0
0
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3-Axis Digital Angular Rate Gyroscope, Rev. 2.1, 5/2015
Register Descriptions
Table 37. RT_CFG field descriptions
Field
3
ELE
Description
Event latch enable
• See Functionality for more details.
0: Event flag latch disabled
1: Event flag latch enabled
2
ZTEFE
Event flag enable on Z-axis rate
• Enable bits for rate threshold event detection on the Z axis
0: Z event detection disabled
1: Z Event detection enabled
1
YTEFE
Event flag enable on Y-axis rate
• Enable bits for rate threshold event detection on the Y axis
0: Y event detection disabled
1: Y Event detection enabled
0
XTEFE
Event flag enable on X-axis rate
• Enable bits for rate threshold event detection on the X axis
0: X event detection disabled
1: X Event detection enabled
6.11 0x0F: RT_SRC
This register indicates the source of the Rate Threshold event. The content of
RT_SRC is reset upon a transition from Standby to Active or from Ready to Active
modes.
Table 38. RT_ SRC Register
Bit
7
6
5
4
3
2
1
0
Read
0
EA
ZRT
Z_RT_POL
YRT
Y_RT_POL
XRT
X_RT_POL
0
0
0
0
0
0
0
0
Write
Reset
3-Axis Digital Angular Rate Gyroscope, Rev. 2.1, 5/2015
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Freescale Semiconductor, Inc.
Register Descriptions
Table 39. RT_SRC field descriptions
Field
6
EA
Description
Event active flag
• EA indicates that a rate threshold event has been detected on at least one of the axes (OR
condition). This bit is cleared after a read of this register only if it has been latched (ELE =1).
0: No event flags have been asserted
1: One or more event flags have been asserted (XRT, YRT or ZRT)
5
ZRT
Z rate event
• Indicates that a rate threshold event (as defined in Functionality) has been detected on the Z-axis
(only if RT_CFG[ZTEFE] is 1).
• Flag is asserted a few samples (RT_COUNT) after the absolute value of the Z output rate data
goes above the RT_THS value.
• Cleared a few samples (RT_COUNT) after the absolute value of Z rate output goes below the
RT_THS value. Also cleared when the register is read, if it has been latched (ELE = 1).
0: No rate threshold event detected on Z axis
1: Rate Threshold event detected on Z axis
4
Z_RT_POL
Polarity of Z event
• Indicates the rate polarity on the Z-axis (if RT_CFG[ZTEFE] =1). If RT_CFG[ZTEFE] =1, this bit
indicates the polarity of the Z data irrespective of the rate threshold event detected on Z-axis.
• Cleared when read if it has been latched (ELE =1)
0: Z rate event was Positive
1: Z rate event was Negative
3
YRT
Y rate event
• Indicates that a rate threshold event (as defined in Functionality) has been detected on the Y-axis
(only if RT_CFG[YTEFE] =1).
• Flag is asserted few samples(RT_COUNT) after the absolute value of the Y output rate data goes
above the RT_THS value.
• Cleared a few samples (RT_COUNT) after the absolute value of Y rate output goes below the
RT_THS value. Also cleared when the register is read if it has been latched (ELE = 1).
0: No Rate Threshold event detected on Y axis
1: Rate Threshold event detected on Y axis
2
Y_RT_POL
Polarity of Y event
• Indicates the rate polarity on the Y-axis (if RT_CFG[YTEFE] =1). If RT_CFG[YTEFE] =1, this bit
indicates the polarity of the Y data irrespective of the rate threshold event detected on Y-axis.
• Cleared when read if it has been latched (ELE =1)
0: Y rate event was Positive
1: Y rate event was Negative
Table continues on the next page...
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Freescale Semiconductor, Inc.
3-Axis Digital Angular Rate Gyroscope, Rev. 2.1, 5/2015
Register Descriptions
Table 39. RT_SRC field descriptions (continued)
Field
1
XRT
Description
X rate Event
• Indicates that a rate threshold event (as defined in Functionality) has been detected on the X-axis
(only if RT_CFG[XTEFE] =1).
• Flag is asserted few samples (RT_COUNT) after the absolute value of the X output rate data goes
above the RT_THS value.
• Cleared a few samples (RT_COUNT) after the absolute value of X rate output goes below the
RT_THS value. Also cleared when the register is read if it has been latched (ELE = 1).
0: No Rate Threshold event detected on X axis
1: Rate Threshold event detected on X axis.
0
X_RT_POL
Polarity of X event
• Indicates the rate polarity on the X axis (if RT_CFG[XTEFE] =1). If RT_CFG[XTEFE] =1, this bit
indicates the polarity of the X-data irrespective of the rate threshold event detected on X-axis.
• Cleared when read if it has been latched (ELE =1)
0: X rate event was positive
1: X rate event was negative
6.12 0x10: RT_THS
The RT_THS register sets the threshold limit for the detection of the rate and the
debounce counter mode. See Functionality for more details.
Table 40. RT_THS register
Bit
Read
Write
Reset
7
6
5
4
DBCNTM
0
3
2
1
0
0
0
0
THS[6:0]
0
0
0
0
Table 41. RT_THS field descriptions
Field
7
DBCNTM
Description
Debounce counter mode selection
• The contents should only be modified when the device is in Standby mode
1: Clear counter when angular rate is below the threshold value
0: Decrement counter on every ODR cycle that the angular rate is below the threshold value
Table continues on the next page...
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Freescale Semiconductor, Inc.
Register Descriptions
Table 41. RT_THS field descriptions (continued)
Field
6:0
THS
Description
Unsigned 7-bit rate threshold value
• The contents should only be modified when the device is in Standby mode
• The internal state of the Rate Threshold function is reset when a transition from Standby to Active
or Ready to Active modes occurs.
• The rate threshold in dps is given by the following formula:
Rate Threshold (dps) = (THS+1) * 256 * Sensitivity (dps/LSB)
Rate Threshold (LSB) = (THS+1) * 256
NOTE
The sensitivity (dps/LSB) varies with the FSR setting:
CTRL_REG0[FS] and also with the FS_DOUBLE setting:
CTRL_REG3[FS_DOUBLE]. See Table 54 for more
sensitivity details on enabling FS_DOUBLE.
6.13 0x11: RT_COUNT
RT_COUNT sets the number of debounce counts. See Functionality for more details.
Table 42. RT_COUNT register
Bit
7
6
5
Read
3
2
1
0
0
0
1
RT_CNT[7:0]
Write
Reset
4
0
0
0
0
0
Table 43. RT_COUNT field descriptions
Field
7:0
RT_CNT
Description
Debounce counter value
• The contents should only be modified when the device is in Standby mode
• The internal state of the Rate Threshold function debounce counter is reset when a transition from
Standby to Active or Ready to Active modes occurs
• Stores the number of counts with the angular rate above the threshold needed before asserting the
rate threshold event flag
• The counter period is the same as the selected ODR period, allowing for a debounce time to be
calculated. For example, an RT_COUNT value of 10 (decimal) and an ODR of 100 Hz would result
in a debounce time of 100 ms.
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3-Axis Digital Angular Rate Gyroscope, Rev. 2.1, 5/2015
Register Descriptions
6.14 0x12: TEMP
The TEMP register contains an 8-bit 2's complement temperature value with a range
of –128 °C to +127 °C and a scaling of 1 °C/LSB. The temperature data is only
compensated (factory trim values applied) when the device is operating in the Active
mode and actively measuring the angular rate.
Table 44. TEMP register
Bit
7
6
5
4
Read
3
2
1
0
0
0
0
0
TEMP[7:0]
Write
Reset
0
0
0
0
6.15 0x13: CTRL_REG1
The CTRL_REG1 register is used to configure the device ODR, set the operating
mode, soft-reset the device, and exercise the Self-Test function.
NOTE
Control bits in CTRL_REG1 should be changed only in
Standby or Ready mode. Accuracy of the output data is not
guaranteed if these bits are changed while the device is in
Active mode.
Table 45. CTRL_REG1 register
Bit
Read
Write
Reset
7
6
5
—
RST
ST
0
0
0
4
3
2
DR[2:0]
0
0
0
1
0
ACTIVE
READY
0
0
Table 46. CTRL_REG1 field descriptions
Field
6
RST
Description
Software Reset:
• Used to trigger a reset of the device.
• On reset, all registers except 0x01 through 0x06 revert to their default values. Register addresses
0x01 through 0x06 contain values that cannot be determined.
• This bit is self cleared after assertion.
0: Device reset not triggered/completed
1: Device reset triggered
Table continues on the next page...
3-Axis Digital Angular Rate Gyroscope, Rev. 2.1, 5/2015
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Freescale Semiconductor, Inc.
Register Descriptions
Table 46. CTRL_REG1 field descriptions (continued)
Field
5
ST
Description
Self-Test enable
• When ST is set, a data output change will occur even if no angular rate is applied. This allows the
host application to check the functionality of the sensor and the entire measurement signal chain.
The expected Self-Test delta value is summarized in Table 4
0: Self-Test disabled
1: Self-Test enabled
4:2
DR
1
Active
0
Ready
Output Data Rate selection
• Selects the output data rate as per Table 47
Standby/Active mode selection, see Table 48
Standby/Ready mode selection, see Table 48
NOTE
On issuing a Software Reset command over an I2C interface,
the device immediately resets and does not send any
acknowledgment (ACK) of the written byte to the Master.
Table 47. Digital output data bandwidth settings
Decimal number
CTRL_REG1[DR]
ODR (Hz)
0
000
800
1
001
400
2
010
200
3
011
100
4
100
50
5
101
25
6
110
12.5
7
111
12.5
The ACTIVE and READY bits are used to control the device operating mode. In
Standby mode (ACTIVE = 0), the device is only capable of communication on the I2C
or SPI digital interfaces. In Ready mode (READY = 1), the device is ready to measure
angular rate but no data acquisitions are being made. The Ready mode can be used to
reduce the device power consumption and allow for a fast transition into the Active
mode when needed. In Active mode (ACTIVE = 1), the device is fully functional. The
ACTIVE bit has a higher priority than the READY bit as shown in Table 48.
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Freescale Semiconductor, Inc.
3-Axis Digital Angular Rate Gyroscope, Rev. 2.1, 5/2015
Register Descriptions
Table 48. Device operating mode
Active
Ready
Operating mode
0
0
Standby
0
1
Ready
1
X
Active
When CTRL_REG3[EXTCTRLEN] = 1, the ACTIVE bit is directly controlled by
the logic level input to the INT2/PWR_CTRL pin and becomes read-only via the
register interface. Thus, the device operating mode can be directly controlled by the
INT2/PWR_CTRL pin when CTRL_REG3[EXTCTRLEN] =1. The weak pull-up
resistor is internal to the IC and automatically enabled when
CTRL_REG3[EXTCTRLEN] is set to 1, hence setting the Active bit high.
6.16 0x14: CTRL_REG2
This register enables and assigns the output pin(s) and logic polarities for the various
interrupt sources available on the device.
Table 49. CTRL_REG2 register
Bit
7
Read
Write
6
5
4
3
2
INT_CFG_FIFO INT_EN_FIFO INT_CFG_RT INT_EN _RT INT_CFG_DRDY INT_EN_DRDY
Reset
0
0
0
0
0
0
1
0
IPO
L
PP_O
D
0
0
Table 50. Interrupt Enable register descriptions
Register
7
INT_CFG_FIFO
6
INT_EN_FIFO
Description
FIFO interrupt pin routing
0: Interrupt is routed to INT2 pin
1: Interrupt is routed to INT1 pin
FIFO Interrupt Enable
0: FIFO interrupt disabled
1: FIFO interrupt enabled
Table continues on the next page...
3-Axis Digital Angular Rate Gyroscope, Rev. 2.1, 5/2015
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Freescale Semiconductor, Inc.
Register Descriptions
Table 50. Interrupt Enable register descriptions (continued)
Register
5
INT_CFG_RT
4
INT_EN_RT
3
INT_CFG_DRDY
2
INT_EN_DRDY
1
IPOL
0
PP_OD
Description
Rate threshold interrupt pin routing
0: Interrupt is routed to INT2 pin
1: Interrupt is routed to INT1 pin
Rate threshold interrupt enable
0: Rate threshold interrupt disabled
1: Rate threshold interrupt enabled
Data-ready interrupt pin routing
0: Interrupt is routed to INT2 pin
1: Interrupt is routed to INT1 pin
Data ready interrupt enable
0: Data-ready interrupt disabled
1: Data-ready interrupt enabled
Interrupt logic polarity
0: Active low
1: Active high
INT1 and INT2 pin output driver configuration
0: Push-pull output driver
1: Open-drain/open-source buffer with IPOL = 0/1, respectively
Table 51. INT pin behavior as a function of PP_OD and IPOL bit settings
INT pin configuration
PP_OD
IPOL
INT asserted value
INT deasserted value
CMOS output
0
0
0
1
CMOS output
0
1
1
0
External pull-up resistor added
1
0
0
High-z1
External pull-down resistor added
1
1
1
High-z1
1. High-z = tri-state (high impedance) condition; the state of the INT pin will be defined by the external pull-up or pull-down
resistor.
6.17 0x15:CTRL_REG3
This register is used to enable the FSR expansion, external power control input, and
options to modify the auto-increment read address pointer behavior when doing burst
reads of the FIFO data.
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3-Axis Digital Angular Rate Gyroscope, Rev. 2.1, 5/2015
Register Descriptions
Table 52. CTRL_REG3 register
Bit
Read
Write
Reset
7
6
5
4
3
2
1
0
—
—
—
—
WRAPTOONE
EXTCTRLEN
—
FS_DOUBLE
—
—
—
—
0
0
—
0
NOTE
Control bits in CTRL_REG3 should only be changed when
operating in Standby or Ready mode. Accuracy of the output
data is not guaranteed if any of these bits are changed while
the device is operating in Active mode.
Table 53. CTRL_REG3 register descriptions
Register
Description
Auto-increment read address pointer roll-over behavior:
3
WRAPTOONE
0: The auto-increment read address pointer rolls over to address 0x00 (STATUS) after the Z-axis
LSB is read (default).
1: The auto-increment pointer rolls over to address 0x01 (X-axis MSB) in order to facilitate the faster
read out of the FIFO data in a single burst read operation (STATUS register only needs to be read
once).
External power mode control input:
0: INT2 pin is used as an interrupt output (default)
2
EXTCTRLEN
1: INT2 pin becomes an input pin that may be used to control the power mode. Note that when
EXTCTRLEN is set, the interrupt outputs and related settings for the INT2 pin are ignored.
EXTCTRLEN allows the device operating mode to be controlled using the INT2 pin (the pin
becomes a high impedance input when this bit is set high). The input is level sensitive, and allows
the host to transition the device operating mode from either Standby to Active or from Ready to
Active (and vice-versa) depending on the operating mode, Standby or Ready, that was configured at
the time this bit was set.
Full-scale range expansion enable:
0: Maximum full-scale range selections are as per Table 37, selected via the CTRL_REG0[FS] field.
0
FS_DOUBLE
1: Maximum full-scale range selections are doubled from what is shown in Table 37.
FS_DOUBLE increases the dynamic range for each CTRL_REG0[FS] selection by a factor of two,
from ±250/500/1000/2000°/s to ±500/1000/2000/4000°/s. This feature is provided to enable a higher
dynamic range for applications such as sports equipment monitoring (e.g. golf club or tennis racket
swings). While the full-scale range is doubled in this mode, the noise and nonlinearity of the signal
are also increased.
3-Axis Digital Angular Rate Gyroscope, Rev. 2.1, 5/2015
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Freescale Semiconductor, Inc.
Printed Circuit Board Layout and Device Mounting
Table 54. Rate sensitivity changes with FSR_DOUBLE
setting
FSR Selection
Sensitivity (mdps/LSB)
Sensitivity (mdps/LSB)
FSR_DOUBLE = 0
FSR_DOUBLE = 1
CTRL_REG0[FS] = 00
62.50
125.0
CTRL_REG0[FS] = 01
31.25
62.50
CTRL_REG0[FS] = 10
15.625
31.25
CTRL_REG0[FS] = 11
7.8125
15.625
7 Printed Circuit Board Layout and Device Mounting
Printed Circuit Board (PCB) layout and device mounting are critical to the overall
performance of the design. The footprint for the surface mount packages must be the
correct size as a base for a proper solder connection between the PCB and the package.
This, along with the recommended soldering materials and techniques, will optimize
assembly and minimize the stress on the package after board mounting.
Freescale application note AN1902, "Assembly Guidelines for QFN and DFN
Packages" discusses the QFN package used by the FXAS21002C.
7.1 Printed Circuit Board Layout
The following recommendations are meant to serve as general guidelines for realizing
an effective PCB layout. See Figure 24 for component PCB footprint dimensions.
• The PCB land pattern should be designed with Non-Solder Mask Defined (NSMD)
as shown in Figure 24.
• On the layer that the device is soldered, there should be no trace routing or vias
underneath the device's component package.
• No components or vias should be placed at a distance less than 2 mm from the
package land area. This may cause additional package stress if it is too close to the
package land area.
• Signal traces connected to pads should be as symmetric as possible. Put dummy
traces on the NC pads in order to have same length of exposed trace for all pads.
• No copper traces should be on the top layer of the PCB under the package, as this
will cause planarity issues with the board mount. Freescale QFN sensors are
compliant with Restrictions on Hazardous Substances (RoHS), having halide-free
molding compound (green) and lead-free terminations. These terminations are
50
Freescale Semiconductor, Inc.
3-Axis Digital Angular Rate Gyroscope, Rev. 2.1, 5/2015
Printed Circuit Board Layout and Device Mounting
compatible with tin-lead (Sn-Pb) as well as tin-silver-copper (Sn-Ag-Cu) solder
paste soldering processes. Reflow profiles applicable to those processes can be
used successfully for soldering the devices.
4X 2.175
4
8
24X 0.30
0.18
12
7
24X 0.8
24X 0.3
13
24X 0.725
0.525
20X 0.5
4
1
19
24
20
20X 0.5
Package outline
Package
PCB land pad
4.576
4X 2.160
Package outline
4X 1.438
24X 0.769
24X 0.269
4X 1.938
20X 0.5
4.576
Package outline
Solder stencil opening
Solder mask opening
Figure 24. Footprint
7.2 Overview of Soldering Considerations
The information provided here is based on experiments executed on QFN devices.
These experiments cannot represent exact conditions present at a customer site.
Therefore, information herein should be used for guidance purposes only. Process and
design optimizations are recommended to develop an application-specific solution.
With the proper PCB footprint and solder stencil designs, the package will self-align
during the solder reflow process.
• Stencil thickness should be 100 or 125 µm.
3-Axis Digital Angular Rate Gyroscope, Rev. 2.1, 5/2015
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Freescale Semiconductor, Inc.
Package Information
• The PCB should be rated for the multiple lead-free reflow condition with a
maximum 260 °C temperature.
• Use a standard pick-and-place process and equipment. Do not use a hand soldering
process.
• Do not use a screw-down or stacking to mount the PCB into an enclosure. These
methods could bend the PCB, which would put stress on the package.
7.3 Halogen Content
This package is designed to be Halogen Free, exceeding most industry and customer
standards. Halogen Free means that no homogeneous material within the assembled
package will contain chlorine (Cl) in excess of 700 ppm or 0.07% weight/weight or
bromine (Br) in excess of 900 ppm or 0.09% weight/weight.
8 Package Information
The FXAS21002C platform uses a 24-lead QFN package, case number 2209-01.
8.1 Product Identification Markings
Top View
Freescale code
263
F2102
ALYW
Part number
Traceability date code
Assembly site
Lot code
Work week
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Freescale Semiconductor, Inc.
3-Axis Digital Angular Rate Gyroscope, Rev. 2.1, 5/2015
Package Information
8.2 Tape and Reel Information
Figure 25. Tape dimensions
Pin 1
Direction
to unreel
Barcode label
side of reel
Figure 26. Tape and reel orientation
3-Axis Digital Angular Rate Gyroscope, Rev. 2.1, 5/2015
53
Freescale Semiconductor, Inc.
Package Information
8.3 Package Description
This drawing is located at www.freescale.com/files/shared/doc/package_info/98ASA00356D.pdf.
54
Freescale Semiconductor, Inc.
3-Axis Digital Angular Rate Gyroscope, Rev. 2.1, 5/2015
Revision History
9 Revision History
Revision
number
Revision
date
0.3
3/2014
Initial release of document
1.0
8/2014
Added the following sections:
• Mechanical and Electrical Specifications
• Digital Interfaces
• Modes of Operation
• Functionality
• Register Descriptions
• Printed Circuit Board Layout and Device Mounting
1.1
11/2014
Description
• Figure 1, removed BYP
• Table 2, removed T = 25°C from Test conditions
• Table 6, removed "Sensitivity error due to linear acceleration removed Zero Rate Offset
error due to linear acceleration Added footnote to Zero-rate Offset, Post-Board Mount"
• Section 5.2, image, added Latch and ELE connection
• Section 6.4, removed "Reading F_STATUS clears the SRC_FIFO bit in the 0x0B:
INT_SOURCE_FLAG register."
• Table 27, F_EVENT field, added bullet: To clear this flag, both F_OVF and F_WMKF
flags must be cleared. See F_STATUS for details.
• Table 27, F_EVENT field, added bullet: To clear this field, the F_EVENT flag must be
cleared.
• Table 29, SRC_FIFO field, changed flag descriptions from
1: F_OVF or F_WMKF are set, provided the FIFO interrupt is enabled
(CTRL_REG2[INT_EN_FIFO=1])
0: Cleared by reading the register
to
1: When F_Event flag is set (F_OVF or F_WMKF are set), provided the FIFO interrupt
is enabled (CTRL_REG2[INT_EN_FIFO=1])
0: Cleared when F_Event Flag gets cleared (whenever both F_OVF and F_WMKF get
cleared)
• Table 29, SRC_RT field, changed bullets from
• Indicates that the rate threshold event flag triggered the interrupt
• Cleared by reading RT_SRC register
to
• Indicates that the rate threshold event flag(s) triggered the interrupt (when XRT or
YRT or ZRT(logical OR) event threshold flags go high)
• Cleared when XRT, YRT or ZRT event threshold flags are cleared.
• Section 6.11, added: "It also clears the RT_SRC flag in the 0x0B: INT_SOURCE_FLAG
register."
• Added Table 54, Rate sensitivity changes with FSR_DOUBLE setting
1.2
11/2014
• Removed last two features items
• Minor changes to table 2, Temperature Sensor Characteristics
• In Mechanical Characteristics table, changed typical parameters for Zero-rate Offset,
Zero-rate Offset, Post-board Mount and Integral nonlinearity and updated table
footnotes.
Table continues on the next page...
3-Axis Digital Angular Rate Gyroscope, Rev. 2.1, 5/2015
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Freescale Semiconductor, Inc.
Revision History
Revision
number
Revision
date
Description
• Updated Electrical Charactristics table, for Supply current drain in Standby mode, and
Supply current drain in Standby mode over Temperature parameters. Also removed
test condition on Output Data Rate frequency tolerance parameter.
• Changed Table 8 Serial interface pin descriptions, pin currently named SDA/MOSI/
SPI_Data and modified pin description.
• changed Table 9, Slave timing values, for parameter SDA and SCL fall time, minimum
values for I2C Fast Mode.
• Added table title to Table 10. I2C Register Data Address Map.
• Section 3.1.1, I²C Operation, changed first paragraph to read “External pull-up resistors
connected to VDDIO”...
• Section 5, functionality, changed seventh bullet to read “Embedded rate threshold
detection function with programmable debounce time”
• Added new column “Auto-Increment Address” to Table 13 Register address map and
populated the column with data. Removed last two rows of table, Auto-Increment
address and Fast-read increment address.
• Modified note after Table 19 to read “After this register is read, the next read register by
the autoincrement process is STATUS at 0x00, when CTRL_REG3[WRAPTOONE] = 0,
or OUT_X_MSB when CTRL_REG3[WRAPTOONE] = 1.”
2.0
2/2015
• Moved Section 2.1 to 2.5
• Figure 12, changed "SPI_DIO" to "SPI_DATA"
• Register 0x09: F_SETUP, added "The contents should only be modified when the
device is in Standby mode."
• Table 29, Field 1, changed "...XRT, YRT or ZRT..." to "...XRT, YRT and ZRT..."
• Register 0x0E: RT_CFG, added "The internal state of the Rate Threshold function is
reset when..."
• Table 37, Field 3, deleted second and third bullet
• Register 0x0F: RT_SRC, added "The content of this register is reset upon a transition
from Standy to Active or from Ready to Active modes.
• Table 39:
Field 6
• added "only if it has been latched (ELE =1)"
• added to bit 1 "(XRT, YRT or ZRT)"
Field 5
• changed second bullet to "Flag is asserted few samples (RT_COUNT)..."
• added third bullet "Cleared when the absolute value of Z..."
• changed bit 0 from "Z rate lower than RT_THS value" to "No rate threshold event
detected on Z-axis"
• changed bit 1 from "Z rate greater than RT_THS event has occured" to "Rate
Threshold event detected on Z axis"
Field 4
• changed first bullet from "Indicates the rate polarity on the Z-axis (if ZTEFE =1). If
ZTEFE =1, this bit indicates the polarity of the Z data irrespective of the rate
threshold event detected on Z-axis." to "Indicates the rate polarity on the Z-axis (if
RT_CFG[ZTEFE] =1). If RT_CFG[ZTEFE] =1, this bit indicates the polarity of the
Z data irrespective of the rate threshold event detected on Z-axis."
Field 3
• changed second bullet to "Flag is asserted few samples (RT_COUNT)..."
• added third bullet "Cleared when the absolute value of Y..."
• changed bit 0 from "Y rate lower than RT_THS value" to "No rate threshold event
detected on Y-axis"
• changed bit 1 from "Y rate greater than RT_THS event has occured" to "Rate
Threshold event detected on Y-axis"
Field 2
Table continues on the next page...
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3-Axis Digital Angular Rate Gyroscope, Rev. 2.1, 5/2015
Revision History
Revision
number
Revision
date
Description
• changed first bullet from "Indicates the rate polarity on the Y-axis (if YTEFE =1). If
YTEFE =1, this bit indicates the polarity of the Y data irrespective of the rate
threshold event detected on Y-axis." to "Indicates the rate polarity on the Y-axis
(if RT_CFG[YTEFE] =1). If RT_CFG[YTEFE] =1, this bit indicates the polarity of
the Y data irrespective of the rate threshold event detected on Y-axis."
Field 1
• changed second bullet to "Flag is asserted few samples (RT_COUNT)..."
• added third bullet "Cleared when the absolute value of X..."
• changed bit 0 from "X rate lower than RT_THS value" to "No rate threshold event
detected on X-axis"
• changed bit 1 from "X rate greater than RT_THS event has occured" to "Rate
Threshold event detected on X-axis"
Field 0
• changed first bullet from "Indicates the rate polarity on the X-axis (if XTEFE =1). If
XTEFE =1, this bit indicates the polarity of the X data irrespective of the rate
threshold event detected on X-axis." to "Indicates the rate polarity on the X-axis
(if RT_CFG[XTEFE] =1). If RT_CFG[XTEFE] =1, this bit indicates the polarity of
the X data irrespective of the rate threshold event detected on X-axis."
• Table 41, Field 6:0, changed formula from "Rate_threshold=THS*(Full_scale/128)" to
"Rate Threshold (in dps) = (THS + 1)* 256 * Sensitivity (in dps/LSB)" and
"Rate_Threshold(in LSB) = (THS + 1)* 256"
2.1
5/2015
• Table 5, Self-test output change, Min value of 7000 added and Max value of 25000
added
• Table 6
• Digital high level input voltage, added SCLK
• Low-level output voltage, added test condition of lo = 1 mA
• Section 5, second bullet, changed CTRL_REG3[FSR_DOUBLE] = 1 to
CTRL_REG3[FS_DOUBLE] = 1
• Table 13
• F_EVENT, added the default value of 0x00
• INT_SRC_FLAG, added the default value of 0x00
• CTRL_REG3, changed Auto-increment address from 0x16 to 0x00
• RESERVED, added Auto-increment address of address + 1
3-Axis Digital Angular Rate Gyroscope, Rev. 2.1, 5/2015
57
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Document Number FXAS21002C
Revision 2.1, 5/2015