Analog Devices Welcomes Hittite Microwave Corporation NO CONTENT ON THE ATTACHED DOCUMENT HAS CHANGED www.analog.com www.hittite.com Report Title: Qualification Test Report Report Type: See Attached Date: See Attached QTR: 2014-00393 Package: MS8G HMC204MS8G HMC213AMS8G HMC270MS8G HMC278MS8G HMC279MS8G HMC280MS8G HMC284AMS8G HMC284MS8G HMC310MS8G HMC318MS8G HMC320MS8G HMC324MS8G HMC326MS8G HMC327MS8G HMC336MS8G HMC346MS8G HMC349MS8G HMC358MS8G HMC393MS8G HMC406MS8G HMC407MS8G HMC410AMS8G Rev: 02 HMC410MS8G HMC585MS8G HMC411MS8G HMC784MS8G HMC412AMS8G HMC412BMS8G HMC412MS8G HMC414MS8G HMC422MS8 HMC423MS8 HMC435MS8G HMC436MS8G HMC437MS8G HMC438MS8G HMC469MS8G HMC471MS8G HMC483MS8G HMC484MS8G HMC485AMS8G HMC485MS8G HMC488MS8G HMC536MS8G HMC546MS8G HMC549MS8G QTR: 2014-00393 Package: MS8G Rev: 02 Introduction The Reliability tests summarized in this report are designed to satisfy the reliability requirements designated by Hittite Microwave Corporation. The testing was devised to simulate exposure to environments the product may experience during assembly, test, and life in the end user application. The pass/fail criteria are dependent upon DC and critical RF parameters determined by the appropriate catalog specifications. A complete data sheet for the devices tested can be found at www.hittite.com. The Package Reliability Plan is as follows: Package Reliability QTR: 2014-00393 Package: MS8G Rev: 02 Glossary of Terms & Definitions: 1. HTOL: High Temperature Operating Life. This test is used to determine the effects of bias conditions and temperature on semiconductor devices over time. It simulates the devices’ operating condition in an accelerated way, through high temperature and/or bias voltage, and is primarily for device qualification and reliability monitoring. This test was performed in accordance with JEDEC JESD22-A108. 2. HTSL: High Temperature Storage Life. Devices are subjected to 1000 hours at 150oC. This test is performed in accordance with JEDEC JESD22-A103. 3. MSL Preconditioning: Moisture sensitivity level pre-conditioning is performed in accordance with JEDEC JESD22-A113, lead free, 260°C peak temperature (see Appendix 1 for reflow profile). 4. Physical Dimensions: Devices are inspected to the current package outline drawing to ensure all package dimensions are within specification (see Appendix 2 for applicable outline drawings). 5. Solderability: Devices are subjected to 8 hours of steam age and Method 1 Dip and Look testing in accordance with JEDEC JESD22-B102. 6. Temperature Cycle: Devices are subjected to 500 non-operating temperature cycling from -65°C to 150°C in accordance with JEDEC JESD22-A104. 7. THB: Temperature Humidity Bias. Devices are subjected to 1000 hours of 85% relative humidity at a temperature of 85°C, while DC biased. This test is performed in accordance with JESD22-A101. 8. UHAST: Unbiased Highly Accelerated Stress Test. Devices are subjected to 96 hours of 85% relative humidity at a temperature of 130°C and pressure (18.6 PSIG). This test was performed in accordance with JEDEC JESD22A118. 9. X-Ray Analysis: Devices are inspected to the current assembly drawing to ensure devices are assembled correctly and are free of any assembly anomalies. Qualification Sample Selection: All qualification devices used were manufactured and tested on standard production processes and met pre-stress acceptance test requirements. QTR: 2014-00393 Package: MS8G Rev: 02 Summary of Qualification Tests: HMC284AMS8G (QTR2012-00461) TEST QTY IN QTY OUT PASS / FAIL Initial Electrical 448 448 Complete HTOL, 1000 hours 160 160 Complete HTOL Final Test 160 160 Pass HTSL, 1000 hours 80 80 Complete HTSL Final Test 80 80 Pass MSL1 Preconditioning 208 208 Complete MSL1 Preconditioning Final Test 208 208 Pass Temperature Cycle (Preconditioned) 80 80 Complete Temperature Cycle Final Test 80 80 Pass UHAST (Preconditioned) 50 50 Complete UHAST Final Test 50 50 Pass THB (Preconditioned) 78 78 Complete THB Final Test 78 78 Pass NOTES QTR: 2014-00393 Package: MS8G Rev: 02 HMC784MS8G (QTR2013-00040) TEST QTY IN QTY OUT PASS / FAIL Physical Dimensions 15 15 Pass Solderability 6 6 Pass X-Ray 15 15 Pass QTY OUT PASS / FAIL HMC784MS8G (QTR2013-00055) TEST QTY IN Physical Dimensions 15 15 Pass Solderability 6 6 Pass X-Ray 15 15 Pass QTY OUT PASS / FAIL HMC784MS8G (QTR2013-00056) TEST QTY IN Physical Dimensions 15 15 Pass Solderability 6 6 Pass X-Ray 15 15 Pass NOTES NOTES NOTES QTR: 2014-00393 Package: MS8G Rev: 02 Cumulative Summary of All MS8G Package Tests TEST Total Units Total Units Tested Passed Total Units Failed HTOL, 1000 hours 160 160 0 HTSL, 1000 hours 80 80 0 UHAST (Preconditioned) 50 50 0 Temperature Cycle (Preconditioned) 80 80 0 THB (Preconditioned) 78 78 0 Solderability 18 18 0 Physical Dimensions 45 45 0 X-Ray 45 45 0 Comments QTR: 2014-00393 Package: MS8G Rev: 02 Appendix 1 Reflow Profile for MSL Preconditioning Temperature (°C) Time (seconds) QTR: 2014-00393 Package: MS8G Rev: 02 Appendix 2 MS8G Outline