SP4T Antenna Switch for GSM / CDMA / UMTS CXM3569XR Description The CXM3569XR is a high power SP4T antenna switch for GSM / CDMA / UMTS applications. The antenna port can be routed to either of the 4TRx ports. The low insertion loss on transmit means increased talk time as the Tx power amplifier can be operated at a lower output level. Built-in decoder reduces component count and simplifies PCB layout by allowing direct connection of the switch to digital base band control lines with the 1.8 V CMOS logic levels. The Sony GaAs JPHEMT MMIC Process is used for low insertion loss and high linearity. Features ◆ Low Insertion Loss: 0.31 dB typical (Cellular / GSM Low Band) 0.41 dB typical (PCS / GSM High Band) 0.46 dB typical (IMT2000) ◆ High Linearity: IIP3=70 dBm ◆ No DC Blocking Capacitors Required on RF ports. ◆ Small Package Size: XQFN-20P (2.5 mm × 2.5 mm × 0.35 mm Typ.) ◆ Lead-Free and RoHS Compliant Structure GaAs JPHEMT MMIC Absolute Maximum Ratings ◆ Bias Voltage Vdd 4 V (Ta = 25 C) ◆ Control Voltage Vctl 3.6 V (Ta = 25 C) ◆ Maximum input power [Ant, RF1, RF2, RF3, RF4] 35 dBm (410 to 2690 MHz, Ta = 25 C) -35 C to +90 C ◆ Operating Temperature -65 C to +150 C ◆ Storage Temperature ◆ Maximum power dissipation PD 500 mW ◆ Copper-clad lamination of glass board(4 layer) 30 mm, t=0.8 mm, FR-4 *NOTICE Please use this product without exceeding PD value showed on it's specification. If it is used with exceeding PD value even for a moment, there are possibilities of degradation or breakdown because of the heat generated by product operation. GaAs MMICs are ESD sensitive devices. Special handling precautions are required. 1 CXM3569XR Block Diagram RF1 RF2 RF3 RF4 ANT MMIC Switch CTL A/B VDD CMOS Decoder Block Diagram of RF Switch Ant RF1 F1 F5 RF2 F2 F6 RF3 F3 F7 RF4 F4 F8 2 CXM3569XR Truth Table ON Path CTLA ANT – RF1 L ANT – RF2 H ANT – RF3 L ANT – RF4 H CTLB L L H H F1 ON OFF OFF OFF F2 OFF ON OFF OFF F3 OFF OFF ON OFF F4 OFF OFF OFF ON F5 OFF ON ON ON F6 ON OFF ON ON Ant GND RF1 10 GND GND Pin Configuration 9 8 7 6 Vdd 11 5 GND 4 RF3 3 GND CTLB 14 2 RF4 15 1 GND GND XQFN-20P PKG (2.5 mm × 2.5 mm x 0.35 mm Typ.) 12 CTLA 13 18 19 20 RF2 17 GND GND 16 GND GND N/C Top View DC Bias Conditions Ta = 25 °C Parameter Vdd Vctl(H) Vctl(L) Min. 2.5 1.35 0 Typ. 2.8 1.8 - Max. 3.3 3.3 0.3 Unit V V V 3 F7 ON ON OFF ON F8 ON ON ON OFF CXM3569XR Electrical Characteristics 1 Vdd = 2.5 V, Vctl = 0/1.8 V Ta = 25 °C Item Symbo Path ANT – RF1 ANT – RF2 Insertion Loss IL ANT – RF3 ANT – RF4 ANT – RF1 Isolation ISO. ANT – RF2, 3, 4 Condition *1 *2 *3 *4 *1 *2 *3 *4 *1 *2 *3 *4 *1 *2 *3 *4 *1 *2 *3 *4 *1 *2 *3 *4 Min. 25 19 18 16 30 24 23 20 Electrical Characteristics are measured with all RF ports terminated in 50 Ω. *1 *2 *3 *4 freq = 698 to 960 MHz freq = 1710 to 1990 MHz freq = 2110 to 2170 MHz freq = 2500 to 2690 MHz 4 Typ. 0.31 0.41 0.41 0.46 0.33 0.43 0.43 0.46 0.32 0.42 0.42 0.46 0.35 0.45 0.45 0.49 30 23 22 20 36 29 28 25 Max. 0.46 0.56 0.56 0.66 0.48 0.58 0.58 0.66 0.47 0.57 0.57 0.66 0.50 0.60 0.60 0.69 - Unit dB dB CXM3569XR Electrical Characteristics 2 Vdd = 2.5 V, Vctl = 0/1.8 V Ta = 25 °C Item VSWR Harmonics P0.2dB Compression Inter Modulation Product Power in Rx Band Symbo Path VSWR 2fo 3fo 2fo 3fo 2fo 3fo 2fo 3fo P0.2dB IMD2 IMD3 Condition 698 to 2170 MHz 2500 to 2690 Mhz *1 *2 *3 *4 ANT-RF1, 2, 3, 4 ANT-RF1, 2, 3, 4 ANT-RF1, 2, 3, 4 Input IP3 IIP3 Control Current Supply Current Switching Time Ictl Idd Swt RF1, 2, 3, 4 Wakeup Time Wkt RF1, 2, 3, 4 824 to 1980 MHz *5 -*8, *15 *9 -*12, *15 *13, *15 *14, *15 Vctl = 1.8 V per line Vdd = 2.5 V 50 % Ctl to 90 % RF Wakeup time from Vdd on to Active mode Electrical Characteristics are measured with all RF ports terminated in 50 Ω. Corresponding Band of TRx (UMTS/CDMA) *1 *2 *3 *4 *5 *6 *7 *8 *9 * 10 * 11 * 12 * 13 * 14 * 15 Pin = 35 dBm, freq = 824 to 915 MHz Pin = 32 dBm, freq = 1710 to 1910 MHz Pin = 27 dBm, freq = 1920 to 1980 MHz Pin = 27 dBm, freq = 2500 to 2570 MHz Pin on RF: 20 dBm, 1950 MHz, Pin on ANT: -15 dBm, 190 MHz Pin on RF: 20 dBm, 1745 MHz, Pin on ANT: -15 dBm, 95 MHz Pin on RF: 20 dBm, 1880 MHz, Pin on ANT: -15 dBm, 80 MHz Pin on RF: 20 dBm, 835 MHz, Pin on ANT: -15 dBm, 45 MHz Pin on RF: 20 dBm, 1950 MHz, Pin on ANT: -15 dBm, 1760 MHz Pin on RF: 20 dBm, 1745 MHz, Pin on ANT: -15 dBm, 1650 MHz Pin on RF: 20 dBm, 1880 MHz, Pin on ANT: -15 dBm, 1800 MHz Pin on RF: 20 dBm, 835 MHz, Pin on ANT: -15 dBm, 790 MHz Pin = 27 + 27 dBm, 835 + 836 MHz, IIP3=(3*Pout-IM3)/2+Loss Pin = 27 + 27 dBm, 1950 + 1951 MHz, IIP3=(3*Pout-IM3)/2+Loss Measured with the recommended circuit 5 Min. 33 65 65 - Typ. 1.1 1.2 -52 -43 -55 -52 -63 -63 -63 -60 -115 -115 70 70 0.005 145 3 Max. 1.4 1.6 -36 -36 -40 -40 -40 -40 -40 -40 -105 -105 1 250 5 - 20 40 Unit - dBm dBm dBm dBm μA μA μs μs CXM3569XR Electrical Characteristics 3 Vdd = 2.5 V, Vctl = 0/1.8 V Ta = 25 °C Item Symbol Condition Path PTx at RF* Triple Beat Ratio TBR ANT RF1, RF2, RF3, RF4 Pin [dBm] 21.5 21.5 13.5 PTx1 [MHz] 835.5 1880 1732 PTx2 [MHz] 836.5 1881 1733 Min. Typ. Max. Jammer at Ant -30dBm [MHz] 881.5 1960 2132 Triple Beat Product at RF* [MHz] 881.5±1 1960±1 2132±1 81 81 81 - - Electrical Characteristics are measured with all RF ports terminated in 50 Ω. Measured with the recommended circuit Electrical Characteristics 4 Vdd = 2.5 V, Vctl = 0/1.8 V Ta = 25 °C Item Symbol Input IP2 IIP2 Condition Path Ant RF1, RF2, RF3, RF4 Min. Typ. Max. Unit PTx at RF* 24dBm [MHz] 836.61 836.61 Jammer at ANT -20dBm [MHz] 1718.61 45 IM2 Product at RF* [MHz] 881.61 881.61 113.5 95.5 - - dBm 1885 3850 1965 95.5 - - 1885 80 1965 95.5 - - 1732.5 3865 2132.5 95.5 - - 1732.5 400 2132.5 95.5 - - Electrical Characteristics are measured with all RF ports terminated in 50 Ω. Measured with the recommended circuit 6 CXM3569XR Recommended Circuit GND Ant GND GND 10 9 8 7 RF1 C1 L1 6 Vdd 11 5 GND 4 RF3 3 GND 2 RF4 1 GND C2 GND 12 XQFN-20P PKG (2.5 mm × 2.5 mm × 0.35 mm Typ.) CTLA 13 Top View CTLB 14 GND 15 20 RF2 19 GND 18 N/C 17 GND GND 16 1: No DC blocking capacitors are required on all RF ports. *2: DC levels of all RF ports are GND. *3: L1(39 nH) and C1(15 pF) are recommended on Ant port for ESD protection. *4: C2(100 pF) is recommended on Vdd pin for Decoupling Capacitor. 7 CXM3569XR Recommended Land Pattern XQFN-20P-02 Macro for MMIC ・PKG Size：□2.5mm×t0.35mm ・Terminal Pitch：0.4mm ・Terminal Length：0.3mm ・Mask thickness：0.11mm :Land area :Mask open area (Solder printing area) :Board resist open area :Metal area in board (*1) :PKG Outline 2.9 □2.5（PKG Out Line) 2.9 □1.3 PKG Out Line R0.2 0.4 0.05 0.27 0. 21 0.2 0. 11 0.3 0.55 Detail A 0.1 R0.05 0.16 0.2 0.26 0.3 0.36 Detail A 8 ※R0.05:Mask corner CXM3569XR Package Outline (Unit: mm) Product Code: 875341510 9 CXM3569XR Package Outline (Unit: mm) Product Code: 875342678 10 CXM3569XR Marking Product Code: 875341510 GH 11 CXM3569XR Marking Product Code: 875342678 GH 12 CXM3569XR Note Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits 13