REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Drawing updated to reflect current requirements. -ro 02-01-11 R. MONNIN B Five year review requirement. -rrp 09-11-10 C. SAFFLE C Update drawing to current MIL-PRF-38535 requirements. -rrp 15-10-19 C. SAFFLE REV SHEET REV SHEET REV STATUS REV C C C C C C C C C C C C C OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 PMIC N/A PREPARED BY RICK C. OFFICER STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 http://www.landandmaritime.dla.mil CHECKED BY RAJESH R. PITHADIA APPROVED BY THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE AMSC N/A MICHAEL A. FRYE DRAWING APPROVAL DATE 94-03-01 REVISION LEVEL C MICROCIRCUIT, LINEAR, LOW NOISE WIDEBAND VARIABLE GAIN AMPLIFIER, MONOLITHIC SILICON SIZE CAGE CODE A 67268 SHEET DSCC FORM 2233 APR 97 5962-94572 1 OF 13 5962-E018-16 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device class Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels is reflected in the PIN. 1.2 PIN. The PIN is as shown in the following example: 5962 - 94572 Federal stock class designator \ RHA designator (see 1.2.1) 01 M E A Device type (see 1.2.2) Device class designator (see 1.2.3) Case outline (see 1.2.4) Lead finish (see 1.2.5) / \/ Drawing number 1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number 01 02 03 Circuit function AD600 AD602 AD603 Dual, low noise, 35 MHz variable gain amplifier Dual, low noise, 35 MHz variable gain amplifier Single, low noise, 90 MHz variable gain amplifier 1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as follows: Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, nonJAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter E P Descriptive designator GDIP1-T16 or CDIP2-T16 GDIP1-T8 or CDIP2-T8 Terminals 16 8 Package style Dual-in-line Dual-in-line 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-94572 A REVISION LEVEL C SHEET 2 1.3 Absolute maximum ratings. 1/ Total supply voltage (±VS) ............................................................. ±7.5 V Input voltages: C1LO, C2LO, C2HI, and C1HI pins ........................................... ±VS A1HI, A1LO, A2LO, and A2HI pins ............................................ ±2 V continuous; ±VS for 10 ms GAT1 and GAT2 pins ................................................................ ±VS Internal power dissipation (PD): Case E ....................................................................................... Case P ....................................................................................... Transistor count: Device types 01 and 02 ............................................................. Device type 03 ........................................................................... Storage temperature range ............................................................ Lead temperature range (soldering 60 seconds) ........................... Thermal resistance, junction-to-case (θJC) ................................... 600 mW 400 mW 415 BJT 100 BJT -65°C to +150°C +300°C See MIL-STD-1835 Thermal resistance, junction-to-ambient (θJA): Case E ....................................................................................... 120°C/W Case P ....................................................................................... 140°C/W 1.4 Recommended operating conditions. Ambient operating temperature range (TA) ................................... -55°C to +125°C 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 MIL-STD-1835 - Test Method Standard Microcircuits. Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 MIL-HDBK-780 - List of Standard Microcircuit Drawings. Standard Microcircuit Drawings. (Copies of these documents are available online at http://quicksearch.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. ________ 1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-94572 A REVISION LEVEL C SHEET 3 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with MIL-PRF-38535 as specified herein, or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M. 3.2.1 Case outline. The case outline shall be in accordance with 1.2.4 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full ambient operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are defined in table I. 3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the "5962-" on the device. For RHA product using this option, the RHA designator shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be in accordance with MIL-PRF-38535, appendix A. 3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a "QML" or "Q" as required in MIL-PRF-38535. The compliance mark for device class M shall be a "C" as required in MIL-PRF-38535, appendix A. 3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6.2 herein). The certificate of compliance submitted to DLA Land and Maritime-VA prior to listing as an approved source of supply for this drawing shall affirm that the manufacturer's product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein. 3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change for device class M. For device class M, notification to DLA Land and Maritime-VA of change of product (see 6.2 herein) involving devices acquired to this drawing is required for any change that affects this drawing. 3.9 Verification and review for device class M. For device class M, DLA Land and Maritime, DLA Land and Maritime’s agent, and the acquiring activity retain the option to review the manufacturer's facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in microcircuit group number 49 (see MIL-PRF-38535, appendix A). STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-94572 A REVISION LEVEL C SHEET 4 TABLE I. Electrical performance characteristics. Test Conditions -55°C ≤ TA ≤ +125°C Symbol VS = ±5.0 V Group A subgroups Device type 1,2,3 01 95 02 95 03 97 unless otherwise specified Minimum input resistance RIN Min A1HI to A1LO pins and A2LO to A2HI pins VIN to COMM pins Maximum input resistance RIN 1,2,3 A1HI to A1LO pins and A2LO to A2HI pins VIN to COMM pins Peak output 2/ 3/ VOS Limits 1/ 1,2,3 RL ≥ 500 Ω, CL = 5 pF Unit Max Ω 01 105 02 105 03 103 01,02 ±2.5 03 ±2.3 Ω V min Gain error GE1 min GE1 max GE2 min GE2 max 0 dB to +3 dB gain 1,2,3 01 -1.5 -10 dB to -7 dB gain 02 -1.5 0 dB to +3 dB gain 01 +2.5 -10 dB to –7 dB gain 02 +2.5 +3 dB to +37 dB gain 01 -1.5 -7 dB to +27 dB gain 02 -1.5 +3 dB to +37 dB gain 01 +1.5 -7 dB to +27 dB gain 02 +1.5 dB See footnotes at end of table. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-94572 A REVISION LEVEL C SHEET 5 TABLE I. Electrical performance characteristics – Continued. Test Conditions -55°C ≤ TA ≤ +125°C Symbol Group A subgroups VS = ±5.0 V Device type unless otherwise specified Gain error GE3 min GE3 max GE min Min +37 dB to +40 dB gain 1,2,3 VOSO1 VOSO2 Output offset variation VOSV +27 dB to +30 dB gain 02 -2.5 +37 dB to +40 dB gain 01 +1.5 +27 dB to +30 dB gain 02 +1.5 VG = -500 mV to +500 mV 03 -2.0 Gain scaling factor SF min SF max dB +2.0 1,2,3 01 75 02 55 03 30 1,2,3 01,02 ±500 mV 1,2,3 01 75 mV 02 55 03 30 01 29 -7 dB to +27 dB gain 02 29 -500 mV to +500 mV 03 37 01 35 -7 dB to +27 dB gain 02 35 -500 mV to +500 mV 03 43 VG = -625 mV to +625 mV VG = -625 mV to +625 mV VG = -500 mV to +500 mV Gain scaling factor Max -2.5 VG = -500 mV to +500 mV Output offset voltage gain off Unit 01 GE max Output offset voltage 4/ Limits 1/ +3 dB to +37 dB gain 1,2,3 +3 dB to +37 dB gain 1,2,3 mV dB/V dB/V See footnotes at end of table. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-94572 A REVISION LEVEL C SHEET 6 TABLE I. Electrical performance characteristics – Continued. Test Conditions -55°C ≤ TA ≤ +125°C Symbol Group A subgroups VS = ±5.0 V Device type unless otherwise specified Limits 1/ Min Logic input “LOW” (output ON) VIL 2/ 1,2,3 01,02 Logic input “HIGH” (output ON) VIH 2/ 1,2,3 01,02 Specified operating voltage VS 2/ 1,2,3 All Unit Max 0.8 2.4 V V 5.25 V max -4.75 VS min Quiescent current 1,2,3 IQ 01,02 30 03 20 mA 1/ The limiting terms "min" (minimum) and "max" (maximum) shall be considered to apply to magnitudes only. Negative current shall be defined as conventional current flow out of a device terminal. 2/ If not tested, shall be guaranteed to the limits specified in table I herein. 3/ Use resistive loads of 500 Ω or greater, or with the addition of a 1 kΩ pull-down resistor when driving lower loads. 4/ The dc gain of the main amplifier in device type 01 is 113 times; thus an input offset of only 100 µV becomes an 11.3 mV output offset. In device types 02 and 03, amplifier's gain is 35.7 times; thus, an input offset of 100 µV becomes a 3.57 mV output offset. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-94572 A REVISION LEVEL C SHEET 7 Device types 01 and 02 03 Case outlines E P Terminal number 1 Terminal symbol C1LO GPOS 2 A1HI GNEG 3 A1LO VIN 4 GAT1 COMM 5 GAT2 FDBK 6 A2LO VNEG 7 A2HI VOUT 8 C2LO VPOS 9 C2HI --- 10 A2CM --- 11 A2OP --- 12 VNEG --- 13 VPOS --- 14 A1OP --- 15 A1CM --- 16 C1HI --- FIGURE 1. Terminal connections. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-94572 A REVISION LEVEL C SHEET 8 Device types 01 and 02 Terminal symbol C1LO Description A2OP Channel 1 gain control input “LOW”. Positive voltage reduces CH1 gain. Channel 1 signal input “HIGH”. Positive voltage increases CH1 output. Channel 1 signal input “LOW”. Usually taken to CH1 input ground. Channel 1 gating input. A logic “HIGH” shuts off channel 1 signal path. Channel 2 gating input. A logic “HIGH” shuts off channel 2 signal path. Channel 2 signal input “LOW”. Usually taken to channel 2 input ground. Channel 2 signal input “HIGH”. Positive voltage increases channel 2 output. Channel 2 gain control input “LOW”. Positive voltage reduces channel 2 gain. Channel 2 gain controlled input “HIGH”. Positive voltage increases channel 2 gain. Channel 2 common. Usually taken to channel 2 output ground. Channel 2 output. VNEG Negative supply for both amplifiers. VPOS Positive supply for both amplifiers. A1OP Channel 1 output. A1CM Channel 1 common. Usually taken to channel 1 output ground. Channel 1 gain control input “HIGH”. Positive voltage increases channel 1 gain. A1HI A1LO GAT1 GAT2 A2LO A2HI C2LO C2HI A2CM C1HI FIGURE 1. Terminal connections – continued. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-94572 A REVISION LEVEL C SHEET 9 Device type 03 Terminal symbol GPOS Description GNEG VIN Gain control input “HIGH”. Positive voltage increases gain. Gain control input “LOW”. Negative voltage increases gain. Amplifier input. COMM Amplifier ground. FDBK Connection to feedback network. VNEG Negative supply input. VOUT Amplifier output. VPOS Positive supply input. FIGURE 1. Terminal connections – Continued. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-94572 A REVISION LEVEL C SHEET 10 4. VERIFICATION 4.1 Sampling and inspection. For device classes Q and V, sampling and inspection procedures shall be in accordance with MIL-PRF-38535 or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. For device class M, sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. For device classes Q and V, screening shall be in accordance with MIL-PRF-38535, and shall be conducted on all devices prior to qualification and technology conformance inspection. For device class M, screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. 4.2.1 Additional criteria for device class M. a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition B. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015 of MIL-STD-883. (2) TA = +125°C, minimum. b. Interim and final electrical test parameters shall be as specified in table II herein. 4.2.2 Additional criteria for device classes Q and V. a. The burn-in test duration, test condition and test temperature, or approved alternatives shall be as specified in the device manufacturer's QM plan in accordance with MIL-PRF-38535. The burn-in test circuit shall be maintained under document revision level control of the device manufacturer's Technology Review Board (TRB) in accordance with MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015 of MIL-STD-883. b. Interim and final electrical test parameters shall be as specified in table II herein. c. Additional screening for device class V beyond the requirements of device class Q shall be as specified in MIL-PRF-38535, appendix B. 4.3 Qualification inspection for device classes Q and V. Qualification inspection for device classes Q and V shall be in accordance with MIL-PRF-38535. Inspections to be performed shall be those specified in MIL-PRF-38535 and herein for groups A, B, C, D, and E inspections (see 4.4.1 through 4.4.4). 4.4 Conformance inspection. Technology conformance inspection for classes Q and V shall be in accordance with MIL-PRF-38535 including groups A, B, C, D, and E inspections, and as specified herein. Quality conformance inspection for device class M shall be in accordance with MIL-PRF-38535, appendix A and as specified herein. Inspections to be performed for device class M shall be those specified in method 5005 of MIL-STD-883 and herein for groups A, B, C, D, and E inspections (see 4.4.1 through 4.4.4). 4.4.1 Group A inspection. a. Tests shall be as specified in table II herein. b. Subgroups 4, 5, 6, 7, 8, 9, 10, and 11 in table I, method 5005 of MIL-STD-883 shall be omitted. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-94572 A REVISION LEVEL C SHEET 11 TABLE II. Electrical test requirements. Test requirements Interim electrical parameters (see 4.2) Final electrical parameters (see 4.2) Group A test requirements (see 4.4) Group C end-point electrical parameters (see 4.4) Group D end-point electrical parameters (see 4.4) Group E end-point electrical parameters (see 4.4) Subgroups (in accordance with MIL-STD-883, method 5005, table I) Device class M 1 Subgroups (in accordance with MIL-PRF-38535, table III) 1 1, 2, 3 1/ 1, 2, 3 1, 2, 3 1, 2, 3 1, 2, 3 1 1 1, 2, 3 1 1 1, 2, 3 Device class Q --- Device class V 1 1/ 1, 2, 3 --- 1/ --- 1/ PDA applies to subgroup 1. 4.4.2 Group C inspection. The group C inspection end-point electrical parameters shall be as specified in table II herein. 4.4.2.1 Additional criteria for device class M. Steady-state life test conditions, method 1005 of MIL-STD-883: a. Test condition B. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1005 of MILSTD-883. b. TA = +125°C, minimum. c. Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883. 4.4.2.2 Additional criteria for device classes Q and V. The steady-state life test duration, test condition and test temperature, or approved alternatives shall be as specified in the device manufacturer's QM plan in accordance with MIL-PRF-38535. The test circuit shall be maintained under document revision level control by the device manufacturer's TRB in accordance with MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1005 of MIL-STD-883. 4.4.3 Group D inspection. The group D inspection end-point electrical parameters shall be as specified in table II herein. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-94572 A REVISION LEVEL C SHEET 12 4.4.4 Group E inspection. Group E inspection is required only for parts intended to be marked as radiation hardness assured (see 3.5 herein). a. End-point electrical parameters shall be as specified in table II herein. b. For device classes Q and V, the devices or test vehicle shall be subjected to radiation hardness assured tests as specified in MIL-PRF-38535 for the RHA level being tested. For device class M, the devices shall be subjected to radiation hardness assured tests as specified in MIL-PRF-38535, appendix A for the RHA level being tested. All device classes must meet the postirradiation end-point electrical parameter limits as defined in table I at TA = +25°C ±5°C, after exposure, to the subgroups specified in table II herein. 5. PACKAGING 5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. 6. NOTES 6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes. 6.1.1 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractor prepared specification or drawing. 6.1.2 Substitutability. Device class Q devices will replace device class M devices. 6.2 Configuration control of SMD's. All proposed changes to existing SMD's will be coordinated with the users of record for the individual documents. This coordination will be accomplished using DD Form 1692, Engineering Change Proposal. 6.3 Record of users. Military and industrial users should inform DLA Land and Maritime when a system application requires configuration control and which SMD's are applicable to that system. DLA Land and Maritime will maintain a record of users and this list will be used for coordination and distribution of changes to the drawings. Users of drawings covering microelectronic devices (FSC 5962) should contact DLA Land and Maritime-VA, telephone (614) 692-8108. 6.4 Comments. Comments on this drawing should be directed to DLA Land and Maritime-VA, Columbus, Ohio 43218-3990, or telephone (614) 692-0540. 6.5 Abbreviations, symbols, and definitions. The abbreviations, symbols, and definitions used herein are defined in MIL-PRF-38535 and MIL-HDBK-1331. 6.6 Sources of supply. 6.6.1 Sources of supply for device classes Q and V. Sources of supply for device classes Q and V are listed in MIL-HDBK-103 and QML-38535. The vendors listed in MIL-HDBK-103 and QML-38535 have submitted a certificate of compliance (see 3.6 herein) to DLA Land and Maritime-VA and have agreed to this drawing. 6.6.2 Approved sources of supply for device class M. Approved sources of supply for class M are listed in MIL-HDBK-103. The vendors listed in MIL-HDBK-103 have agreed to this drawing and a certificate of compliance (see 3.6 herein) has been submitted to and accepted by DLA Land and Maritime-VA. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-94572 A REVISION LEVEL C SHEET 13 STANDARD MICROCIRCUIT DRAWING BULLETIN DATE: 15-10-19 Approved sources of supply for SMD 5962-94572 are listed below for immediate acquisition information only and shall be added to MIL-HDBK-103 and QML-38535 during the next revision. MIL-HDBK-103 and QML-38535 will be revised to include the addition or deletion of sources. The vendors listed below have agreed to this drawing and a certificate of compliance has been submitted to and accepted by DLA Land and Maritime-VA. This information bulletin is superseded by the next dated revision of MIL-HDBK-103 and QML-38535. DLA Land and Maritime maintains an online database of all current sources of supply at http://www.landandmaritime.dla.mil/Programs/Smcr/. Standard microcircuit drawing PIN 1/ 5962-9457201MEA Vendor CAGE number 24355 Vendor similar PIN 2/ AD600SQ/883B 5962-9457202MEA 3/ AD602SQ/883B 5962-9457203MPA 24355 AD603SQ/883B 1/ The lead finish shown for each PIN representing a hermetic package is the most readily available from the manufacturer listed for that part. If the desired lead finish is not listed contact the vendor to determine its availability. 2/ Caution. Do not use this number for item acquisition. Items acquired to this number may not satisfy the performance requirements of this drawing. 3/ Not available from an approved source of supply. Vendor CAGE number 24355 Vendor name and address Analog Devices Route 1 Industrial Park P.O. Box 9106 Norwood, MA 02062 Point of contact: 804 Woburn Street Wilmington, MA 01887-3462 The information contained herein is disseminated for convenience only and the Government assumes no liability whatsoever for any inaccuracies in the information bulletin.