MURS260T3G, SURS8260T3G Surface Mount Ultrafast Power Rectifiers Ideally suited for high voltage, high frequency rectification, or as free wheeling and protection diodes in surface mount applications where compact size and weight are critical to the system. Features Pb−Free Package* Small Compact Surface Mountable Package with J−Bend Leads Rectangular Package for Automated Handling High Temperature Glass Passivated Junction Low Forward Voltage Drop (1.20 Volts Max @ 2.0 A, TJ = 150C) AEC−Q101 Qualified and PPAP Capable SURS8 Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements http://onsemi.com ULTRAFAST RECTIFIERS 2 AMPERES 600 VOLTS SMB CASE 403A Mechanical Characteristics MARKING DIAGRAM Case: Epoxy, Molded Weight: 95 mg (approximately) Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable Lead and Mounting Surface Temperature for Soldering Purposes: 260C Max. for 10 Seconds Polarity: Polarity Band Indicates Cathode Lead ESD Ratings: Machine Model = C (> 400 V) Human Body Model = 3B (> 8 kV) U2J A Y WW G = Specific Device Code = Assembly Location = Year = Work Week = Pb-Free Package (Note: Microdot may be in either location) MAXIMUM RATINGS Rating AYWW U2JG G Symbol Value Unit Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage VRRM VRWM VR 600 V Average Rectified Forward Current IF(AV) 2.0 @ TL = 125C A Non−Repetitive Peak Surge Current (Surge applied at rated load conditions halfwave, single phase, 60 Hz) IFSM 35 A TJ *65 to +175 C Operating Junction Temperature Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. ORDERING INFORMATION Package Shipping† MURS260T3G SMB (Pb−Free) 2,500 / Tape & Reel SURS8260T3G SMB (Pb−Free) 2,500 / Tape & Reel Device †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. Semiconductor Components Industries, LLC, 2012 January, 2012 − Rev. 3 1 Publication Order Number: MURS260T3/D MURS260T3G, SURS8260T3G THERMAL CHARACTERISTICS Characteristic Symbol Thermal Resistance, Junction−to−Lead (TL = 25C) Value RqJL Unit C/W 13 ELECTRICAL CHARACTERISTICS Characteristic Symbol Maximum Instantaneous Forward Voltage (Note 1) (iF = 2.0 A, TJ = 25C) (iF = 2.0 A, TJ = 150C) vF Maximum Instantaneous Reverse Current (Note 1) (Rated DC Voltage, TJ = 25C) (Rated DC Voltage, TJ = 150C) iR Maximum Reverse Recovery Time (iF = 1.0 A, di/dt = 50 A/ms) (iF = 0.5 A, iR = 1.0 A, IR to 0.25 A) trr Maximum Forward Recovery Time (iF = 1.0 A, di/dt = 100 A/ms, Rec. to 1.0 V) tfr Value Unit V 1.45 1.20 mA 5.0 150 ns 75 50 ns 50 1. Pulse Test: Pulse Width = 300 ms, Duty Cycle 2.0%. 10 10 7.0 7.0 175C 5.0 TC = 175C 5.0 TC = 100C 100C 3.0 3.0 TC = 25C TC = 25C 2.0 IF , INSTANTANEOUS FORWARD CURRENT ( m A) I , INSTANTANEOUS FORWARD CURRENT (AMPS) F 2.0 1.0 0.7 0.5 0.3 0.2 0.1 1.0 0.7 0.5 0.3 0.2 0.1 0.07 0.07 0.05 0.05 0.03 0.03 0.02 0.02 0.01 0.01 0.3 0.5 0.7 0.9 1.1 1.3 1.5 1.7 1.9 2.1 2.3 0.3 0.5 0.7 0.9 1.1 1.3 1.5 1.7 1.9 VF, INSTANTANEOUS VOLTAGE (VOLTS) VF, INSTANTANEOUS VOLTAGE (VOLTS) Figure 1. Typical Forward Voltage Figure 2. Maximum Forward Voltage http://onsemi.com 2 2.1 2.3 MURS260T3G, SURS8260T3G 100 100 TJ = 175C IR, REVERSE CURRENT (m A) IR, REVERSE CURRENT (m A) TJ = 175C 10 TJ = 100C 1.0 TJ = 25C 0.1 0.01 10 TJ = 100C 1.0 TJ = 25C 0.1 0.01 0 100 300 200 400 500 600 700 0 100 VR, REVERSE VOLTAGE (VOLTS) 200 300 400 500 600 700 VR, REVERSE VOLTAGE (VOLTS) Figure 3. Typical Reverse Current* Figure 4. Maximum Reverse Current * The curves shown are typical for the highest voltage device in the voltage grouping. Typical reverse current for lower voltage selections can be estimated from these same curves if applied VR is sufficiently below rated VR. NOTE: TYPICAL CAPACITANCE AT 0 V = 24 pF 20 15 10 5.0 0 0 4.0 8.0 12 16 20 24 28 32 36 40 10 RATED VOLTAGE APPLIED RqJL = 13C/W TJ = 175C 9.0 8.0 7.0 6.0 5.0 4.0 DC 3.0 2.0 SQUARE WAVE 1.0 0 0 20 40 60 80 100 120 140 160 VR, REVERSE VOLTAGE (VOLTS) TC, CASE TEMPERATURE (C) Figure 5. Typical Capacitance Figure 6. Current Derating, Case PF(AV) , AVERAGE POWER DISSIPATION (WATTS) C, CAPACITANCE (pF) IF(AV) , AVERAGE FORWARD CURRENT (AMPS) 25 5.0 SQUARE WAVE 4.0 3.0 DC TJ = 175C 2.0 1.0 0 0 0.5 1.0 1.5 2.0 IF(AV), AVERAGE FORWARD CURRENT (AMPS) Figure 7. Power Dissipation http://onsemi.com 3 2.5 180 200 MURS260T3G, SURS8260T3G PACKAGE DIMENSIONS SMB CASE 403A−03 ISSUE H HE NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. D DIMENSION SHALL BE MEASURED WITHIN DIMENSION P. E b DIM A A1 b c D E HE L L1 D POLARITY INDICATOR OPTIONAL AS NEEDED MIN 1.90 0.05 1.96 0.15 3.30 4.06 5.21 0.76 MILLIMETERS NOM MAX 2.20 2.28 0.10 0.19 2.03 2.20 0.23 0.31 3.56 3.95 4.32 4.60 5.44 5.60 1.02 1.60 0.51 REF MIN 0.075 0.002 0.077 0.006 0.130 0.160 0.205 0.030 INCHES NOM 0.087 0.004 0.080 0.009 0.140 0.170 0.214 0.040 0.020 REF MAX 0.090 0.007 0.087 0.012 0.156 0.181 0.220 0.063 A L L1 A1 c SOLDERING FOOTPRINT* 2.261 0.089 2.743 0.108 2.159 0.085 SCALE 8:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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