MURS220T3 D

MURS220T3G,
SURS8220T3G
Surface Mount
Ultrafast Power Rectifiers
Ideally suited for high voltage, high frequency rectification, or as
free wheeling and protection diodes in surface mount applications
where compact size and weight are critical to the system.
Features






Small Compact Surface Mountable Package with J−Bend Leads
Rectangular Package for Automated Handling
High Temperature Glass Passivated Junction
Low Forward Voltage Drop
(0.77 Volts Max @ 2.0 A, TJ = 150C)
AEC−Q101 Qualified and PPAP Capable
SURS8 Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements
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ULTRAFAST RECTIFIERS
2 AMPERES
200 VOLTS
SMB
CASE 403A
Mechanical Characteristics:
MARKING DIAGRAM
 Case: Epoxy, Molded
 Weight: 95 mg (approximately)
 Finish: All External Surfaces Corrosion Resistant and Terminal






Leads are Readily Solderable
Lead and Mounting Surface Temperature for Soldering Purposes:
260C Max. for 10 Seconds
Shipped in 12 mm Tape and Reel, 2500 units per reel
Polarity: Polarity Band Indicates Cathode Lead
Marking: U2D
These Packages are Pb-Free*
ESD Ratings:
 Machine Model = C (> 400 V)
 Human Body Model = 3B (> 8 kV)
AYWW
U2DG
G
U2D
A
Y
WW
G
= Specific Device Code
= Assembly Location
= Year
= Work Week
= Pb-Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Package
Shipping†
MURS220T3G
SMB
(Pb−Free)
2,500 /
Tape & Reel
SURS8220T3G
SMB
(Pb−Free)
2,500 /
Tape & Reel
Device
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
 Semiconductor Components Industries, LLC, 2012
January, 2012 − Rev. 3
1
Publication Order Number:
MURS220T3/D
MURS220T3G, SURS8220T3G
MAXIMUM RATINGS
Symbol
Value
Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
Rating
VRRM
VRWM
VR
200
V
Average Rectified Forward Current
IF(AV)
2.0 @ TL = 145C
A
Non−Repetitive Peak Surge Current
(Surge applied at rated load conditions halfwave, single phase, 60 Hz)
IFSM
Operating Junction Temperature Range
A
40
TJ
−65 to +175
C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance, Junction to Lead
(TL = 25C)
Symbol
Value
Unit
RJL
13
C/W
Symbol
Value
Unit
ELECTRICAL CHARACTERISTICS
Characteristic
Maximum Instantaneous Forward Voltage (Note 1)
(IF = 2.0 A, TJ = 25C)
(IF = 2.0 A, TJ = 150C)
vF
Maximum Instantaneous Reverse Current (Note 1)
(Rated dc Voltage, TJ = 25C)
(Rated dc Voltage, TJ = 150C)
IR
Maximum Reverse Recovery Time
(IF = 1.0 A, di/dt = 50 A/ms)
(IF = 0.5 A, iR = 1.0 A, IR to 0.25 A)
trr
Maximum Forward Recovery Time
(IF = 1.0 A, di/dt = 100 A/ms, Rec. to 1.0 V)
tfr
1. Pulse Test: Pulse Width = 300 ms, Duty Cycle  2.0%.
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2
Volts
0.95
0.77
2.0
50
mA
ns
35
25
ns
25
MURS220T3G, SURS8220T3G
10
10
7.0
7.0
5.0
5.0
175C
3.0
3.0
TC = 175C
2.0
TC = 25C
1.0
0.7
0.5
0.3
0.2
0.1
TC = 100C
1.0
TC = 25C
0.7
0.5
0.3
0.2
0.1
0.07
0.07
0.05
0.05
0.03
0.03
0.02
0.02
0.01
0.01
0.3 0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.1
1.2
1.3
0.3 0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.2
1.3
180
200
1.1
VF, INSTANTANEOUS VOLTAGE (VOLTS)
VF, INSTANTANEOUS VOLTAGE (VOLTS)
Figure 1. Typical Forward Voltage
Figure 2. Maximum Forward Voltage
100
80
40
20
8.0
4.0
2.0
0.8
0.4
0.2
TJ = 175C
TJ = 175C
IR, REVERSE CURRENT (m A)
IR, REVERSE CURRENT (m A)
2.0
IF , INSTANTANEOUS FORWARD CURRENT (AMPS)
I , INSTANTANEOUS FORWARD CURRENT (AMPS)
F
100C
TJ = 100C
0.08
0.04
0.02
0.008
0.004
0.002
TJ = 25C
10
TJ = 100C
1.0
TJ = 25C
0.1
0.01
0
20
40
60
80
100
120
140
160
180 200
0
20
40
60
80
100
120
140
160
VR, REVERSE VOLTAGE (VOLTS)
VR, REVERSE VOLTAGE (VOLTS)
Figure 3. Typical Reverse Current*
Figure 4. Maximum Reverse Current
* The curves shown are typical for the highest voltage device in the
voltage grouping. Typical reverse current for lower voltage selections
can be estimated from these same curves if applied VR is sufficiently
below rated VR.
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3
MURS220T3G, SURS8220T3G
50
45
NOTE: TYPICAL
CAPACITANCE AT
0 V = 45 pF
C, CAPACITANCE (pF)
40
35
30
25
20
15
10
5.0
0
0
10
20
30
40
50
60
70
80
90
100
VR, REVERSE VOLTAGE (VOLTS)
IF(AV) , AVERAGE FORWARD CURRENT (AMPS)
Figure 5. Typical Capacitance
10
RATED VOLTAGE APPLIED
RqJL = 13C/W
TJ = 175C
9.0
8.0
7.0
6.0
5.0
4.0
dc
3.0
2.0
SQUARE WAVE
1.0
0
80
90
100
110
120
130
140
150
160
170
180
TC, CASE TEMPERATURE (C)
PF(AV) , AVERAGE POWER DISSIPATION (WATTS)
Figure 6. Current Derating, Case
5.0
TJ = 175C
4.0
3.0
2.0
dc
SQUARE WAVE
1.0
0
0
0.5
1.0
1.5
2.0
IF(AV), AVERAGE FORWARD CURRENT (AMPS)
Figure 7. Power Dissipation
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4
2.5
MURS220T3G, SURS8220T3G
PACKAGE DIMENSIONS
SMB
CASE 403A−03
ISSUE H
HE
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. D DIMENSION SHALL BE MEASURED WITHIN DIMENSION P.
E
b
DIM
A
A1
b
c
D
E
HE
L
L1
D
POLARITY INDICATOR
OPTIONAL AS NEEDED
MIN
1.90
0.05
1.96
0.15
3.30
4.06
5.21
0.76
MILLIMETERS
NOM
MAX
2.20
2.28
0.10
0.19
2.03
2.20
0.23
0.31
3.56
3.95
4.32
4.60
5.44
5.60
1.02
1.60
0.51 REF
MIN
0.075
0.002
0.077
0.006
0.130
0.160
0.205
0.030
INCHES
NOM
0.087
0.004
0.080
0.009
0.140
0.170
0.214
0.040
0.020 REF
MAX
0.090
0.007
0.087
0.012
0.156
0.181
0.220
0.063
A
L
L1
A1
c
SOLDERING FOOTPRINT*
2.261
0.089
2.743
0.108
2.159
0.085
SCALE 8:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
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and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
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PUBLICATION ORDERING INFORMATION
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5
ON Semiconductor Website: www.onsemi.com
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For additional information, please contact your local
Sales Representative
MURS220T3/D