400 MHz to 4000 MHz ½ Watt RF Driver Amplifier ADL5324 Data Sheet FEATURES FUNCTIONAL BLOCK DIAGRAM Operation from 400 MHz to 4000 MHz Gain of 14.6 dB at 2140 MHz OIP3 of 43.1 dBm at 2140 MHz P1dB of 29.1 dBm at 2140 MHz Noise figure of 3.8 dB Dynamically adjustable bias Adjustable power supply bias: 3.3 V to 5 V Low power supply current: 62 mA to 133 mA No bias resistor needed Operating temperature range of −40°C to +105°C SOT-89 package, MSL-1 rated ESD rating of ±3 kV (Class 2) GND (2) ADL5324 2 3 RFIN GND RFOUT 10562-001 BIAS 1 Figure 1. APPLICATIONS Wireless infrastructure Automated test equipment ISM/AMR applications GENERAL DESCRIPTION –30 –35 –40 –45 –50 –55 SOURCE VCC = 3.3V VCC = 5V –60 –65 –70 –75 –80 –85 –20 –15 –10 –5 0 5 10 15 20 POUT (dBm) 25 10562–055 The ADL5324 is also rated to operate across the wide temperature range of −40°C to +105°C for reliable performance in designs that experience higher temperatures, such as power amplifiers. The ½ W driver amplifier also covers the wide frequency range of 400 MHz to 4000 MHz, and only requires a few external components to be tuned to a specific band within that wide range. This high performance broadband RF driver amplifier is well suited for a variety of wired and wireless applications, including cellular infrastructure, ISM band power amplifiers, defense equipment, and instrumentation equipment. A fully populated evaluation board is available. The ADL5324 also delivers excellent ACPR vs. output power and bias voltage. The driver can deliver greater than 17 dBm of output power at 2140 MHz, while achieving an ACPR of −55 dBc at 5 V. If the bias is reduced to 3.3 V, the −55 dBc ACPR output power only minimally reduces to 15 dBm. ACPR @ 5MHz CARRIER OFFSET (dBc) The ADL5324 incorporates a dynamically adjustable biasing circuit that allows for the customization of OIP3 and P1dB performance from 3.3 V to 5 V, without the need for an external bias resistor. This feature gives the designer the ability to tailor driver amplifier performance to the specific needs of the design. This feature also creates the opportunity for dynamic biasing of the driver amplifier where a variable supply is used to allow for full 5 V biasing under large signal conditions, and then reduced supply voltage when signal levels are smaller and lower power consumption is desirable. This scalability reduces the need to evaluate and inventory multiple driver amplifiers for different output power requirements, from 25 dBm to 29 dBm output power levels. Figure 2. ACPR vs. Output Power, Single Carrier W-CDMA, TM1-64 at 2140 MHz Rev. B Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners. One Technology Way, P.O. Box 9106, Norwood, MA 02062−9106, U.S.A. Tel: 781.329.4700 www.analog.com Fax: 781.461.3113 ©2012 Analog Devices, Inc. All rights reserved. ADL5324 Data Sheet TABLE OF CONTENTS Features .............................................................................................. 1 Typical Performance Characteristics ..............................................8 Applications ....................................................................................... 1 High Temperature Operation ................................................... 12 Functional Block Diagram .............................................................. 1 Applications Information .............................................................. 13 General Description ......................................................................... 1 Basic Layout Connections ......................................................... 13 Revision History ............................................................................... 2 Soldering Information and Recommended PCB Land Pattern. 13 Specifications..................................................................................... 3 Matching Procedure ................................................................... 15 Typical Scattering Parameters..................................................... 5 W-CDMA ACPR Performance ................................................ 16 Absolute Maximum Ratings ............................................................ 6 Evaluation Board ............................................................................ 17 Thermal Resistance ...................................................................... 6 Outline Dimensions ....................................................................... 20 ESD Caution .................................................................................. 6 Ordering Guide .......................................................................... 20 Pin Configuration and Function Descriptions ............................. 7 REVISION HISTORY 9/12—Rev. A to Rev. B 8/12—Rev. 0 to Rev. A Changes to Figure 27 ...................................................................... 11 Changed Figure 30 Tex t Reference to Figure 33 Text Reference ... 12 Changed Table 7 Text Reference to Table 6 ................................. 15 Changed Table 9 Text Reference to Table 10 and Table 10 Text Reference to Table 11 ..................................................................... 17 Changes to Figure 44 ...................................................................... 18 Change 5 V Supply Current from 140 mA to 133 mA and 5 V Power Dissipation from 700 mW to 665 mW, Table 1 .................4 Changes to Supply Current from 140 mA to 133 mA ............... 13 3/12—Revision 0: Initial Version Rev. B | Page 2 of 20 Data Sheet ADL5324 SPECIFICATIONS VSUP = 5 V and TA = 25°C, unless otherwise noted. Table 1. Parameter FREQUENCY = 457 MHz Gain vs. Frequency vs. Temperature vs. Supply Output 1 dB Compression Point Output Third-Order Intercept Noise Figure FREQUENCY = 748 MHz Gain vs. Frequency vs. Temperature vs. Supply Output 1 dB Compression Point Output Third-Order Intercept Noise Figure FREQUENCY = 915 MHz Gain 1 vs. Frequency vs. Temperature vs. Supply Output 1 dB Compression Point Output Third-Order Intercept Noise Figure FREQUENCY = 1935 MHz Gain vs. Frequency vs. Temperature vs. Supply Output 1 dB Compression Point Output Third-Order Intercept Noise Figure FREQUENCY = 2140 MHz Gain1 vs. Frequency vs. Temperature vs. Supply Output 1 dB Compression Point Output Third-Order Intercept Noise Figure Test Conditions/Comments ±37 MHz −40°C ≤ TA ≤ +85°C 3.15 V to 3.45 V, 4.75 V to 5.25 V ∆f = 1 MHz, POUT = 10 dBm per tone ±20 MHz −40°C ≤ TA ≤ +85°C 3.15 V to 3.45 V, 4.75 V to 5.25 V ∆f = 1 MHz, POUT = 10 dBm per tone ±46 MHz −40°C ≤ TA ≤ +85°C 3.15 V to 3.45 V, 4.75 V to 5.25 V ∆f = 1 MHz, POUT = 10 dBm per tone ±55 MHz −40°C ≤ TA ≤ +85°C 3.15 V to 3.45 V, 4.75 V to 5.25 V ∆f = 1 MHz, POUT = 10 dBm per tone ±30 MHz −40°C ≤ TA ≤ +85°C 3.15 V to 3.45 V, 4.75 V to 5.25 V ∆f = 1 MHz, POUT = 10 dBm per tone Rev. B | Page 3 of 20 Min 3.3 V Typ Max Min 5V Typ Max Unit 17.2 +0.0/−0.4 ±0.6 ±0.3 24.2 30.1 5.6 18.4 +0.0/−0.2 ±0.6 ±0.07 28.0 40.1 6.8 dB dB dB dB dBm dBm dB 16.5 +0.0/−0.2 ±0.4 ±0.2 24.2 36.0 4.0 17.5 +0.0/−0.2 ±0.4 ±0.06 28.0 45.8 5.2 dB dB dB dB dBm dBm dB 15.8 ±0.1 ±0.4 ±0.2 24.2 39.3 4.1 16.0 13.9 +0.0/−0.1 ±0.5 ±0.2 23.2 34.6 3.1 13.6 +0.1/−0.0 ±0.6 ±0.2 25.3 34.4 3.2 16.8 +0.1/−0.3 ±0.4 ±0.06 27.7 45.6 5.1 17.6 15.0 +0.0/−0.1 ±0.5 ±0.07 27.2 45.5 3.6 13.5 14.6 ±0.1 ±0.6 ±0.06 29.1 43.1 3.8 dB dB dB dB dBm dBm dB dB dB dB dB dBm dBm dB 15.7 dB dB dB dB dBm dBm dB ADL5324 Parameter FREQUENCY = 2630 MHz Gain1 vs. Frequency vs. Temperature vs. Supply Output 1 dB Compression Point Output Third-Order Intercept Noise Figure FREQUENCY = 3600 MHz Gain vs. Frequency vs. Temperature vs. Supply Output 1 dB Compression Point Output Third-Order Intercept Noise Figure POWER INTERFACE Supply Voltage Supply Current vs. Temperature Power Dissipation 1 Data Sheet Test Conditions/Comments Min 3.3 V Typ Max 12.1 ±0.1 ±0.7 ±0.2 23.6 32.4 3.6 ±60 MHz −40°C ≤ TA ≤ +85°C 3.15 V to 3.45 V, 4.75 V to 5.25 V ∆f = 1 MHz, POUT = 10 dBm per tone Min 11.8 11.0 +0.0/−0.7 ±1.0 ±0.2 25.0 29.3 3.8 ±100 MHz −40°C ≤ TA ≤ +85°C 3.15 V to 3.45 V, 4.75 V to 5.25 V ∆f = 1 MHz, POUT = 10 dBm per tone 5V Typ 13.3 +0.0/−0.2 ±0.7 ±0.07 27.8 42.0 4.3 Max Unit 14.6 dB dB dB dB dBm dBm dB 12.0 +0.0/−0.8 ±1.0 ±0.05 28.5 36.6 4.4 dB dB dB dB dBm dBm dB Pin RFOUT 3.15 −40°C ≤ TA ≤ +85°C VSUP = 5 V 3.3 62 +4/−6 205 Guaranteed maximum and minimum specified limits on this parameter are based on six sigma calculations. Rev. B | Page 4 of 20 3.45 4.75 5 133 +5/−7 665 5.25 V mA mA mW Data Sheet ADL5324 TYPICAL SCATTERING PARAMETERS VSUP = 5 V and TA = 25°C; the effects of the test fixture have been de-embedded up to the pins of the device. Table 2. Freq (MHz) 400 500 600 700 800 900 1000 1100 1200 1300 1400 1500 1600 1700 1800 1900 2000 2100 2200 2300 2400 2500 2600 2700 2800 2900 3000 3100 3200 3300 3400 3500 3600 3700 3800 3900 4000 S11 Magnitude (dB) −0.73518 −0.6682 −0.69026 −0.73622 −0.78026 −0.8238 −0.8703 −0.9211 −0.97114 −1.05332 −1.13807 −1.23342 −1.34406 −1.47125 −1.61396 −1.78541 −1.98158 −2.19535 −2.43367 −2.68863 −2.95983 −3.25472 −3.56594 −3.90734 −4.28173 −4.69306 −5.13012 −5.54712 −5.86482 −5.98131 −5.80159 −5.34159 −4.7127 −4.03208 −3.37391 −2.79798 −2.30194 Angle (°) −178.582 178.6472 176.9348 175.8152 175.0847 174.5898 174.2026 173.9872 173.3143 172.9788 172.418 171.5538 170.302 168.6736 166.5204 163.8113 160.6247 157.0149 153.0489 148.8413 144.5491 140.354 136.4445 133.0736 130.4779 128.952 128.7774 130.3019 133.6487 138.5443 144.0974 149.2672 153.2749 155.8906 157.3335 157.8681 157.7622 S21 Magnitude (dB) 13.3917 12.83594 12.14674 11.44082 10.7709 10.17296 9.636511 9.182607 8.797653 8.493785 8.268673 8.117951 8.030017 7.998348 8.012977 8.0503 8.103461 8.162658 8.207579 8.231765 8.231791 8.199665 8.141897 8.052657 7.925075 7.778394 7.590076 7.355608 7.062082 6.680613 6.20792 5.63213 4.988874 4.279792 3.543499 2.803935 2.085365 Angle (°) 135.7023 125.9539 117.8626 111.0321 105.1552 99.91559 95.21821 91.01039 86.68882 82.89921 79.01047 74.96804 70.69309 66.16438 61.23666 55.89288 50.12853 43.95115 37.39437 30.52801 23.39294 16.05117 8.510386 0.787456 −7.06584 −15.0835 −23.2924 −31.6367 −40.2413 −48.9518 −57.556 −65.9828 −73.9355 −81.4065 −88.1911 −94.5028 −100.344 Rev. B | Page 5 of 20 S12 Magnitude (dB) −34.6804 −34.2707 −34.1019 −34.0009 −33.9042 −33.7964 −33.6656 −33.5057 −33.3176 −33.0916 −32.8261 −32.5253 −32.1979 −31.8306 −31.4647 −31.0967 −30.7409 −30.4109 −30.1134 −29.872 −29.6822 −29.5353 −29.4496 −29.4307 −29.451 −29.5362 −29.673 −29.8658 −30.1507 −30.5191 −30.9857 −31.5373 −32.1461 −32.7942 −33.4212 −33.9833 −34.3781 Angle (°) 12.40754 8.733014 6.416618 5.053048 3.90523 3.162531 2.580227 2.111382 1.186726 0.689198 −0.26086 −1.43036 −3.08241 −5.10232 −7.75224 −10.9203 −14.671 −19.0255 −23.849 −29.1849 −35.0026 −41.1796 −47.7908 −54.7743 −62.1914 −69.9289 −78.1809 −86.8436 −96.2073 −106.08 −116.217 −126.686 −137.413 −148.125 −158.775 −169.303 −179.983 S22 Magnitude (dB) −3.04567 −3.13245 −3.13132 −3.11375 −3.08891 −3.05337 −3.01719 −2.98741 −2.94972 −2.9749 −2.99624 −3.02533 −3.04592 −3.05748 −3.08106 −3.12034 −3.15588 −3.18172 −3.19212 −3.17831 −3.13204 −3.05541 −2.94631 −2.79325 −2.57604 −2.31023 −2.00734 −1.69231 −1.37649 −1.0663 −0.80053 −0.58238 −0.41604 −0.30331 −0.23714 −0.20674 −0.20598 Angle (°) 175.7277 175.9202 176.4634 177.3131 178.3368 179.4021 −179.377 −177.773 −176.469 −174.745 −173.189 −171.783 −170.675 −169.736 −169.23 −169.149 −169.657 −170.862 −172.621 −174.879 −177.553 179.4875 176.2481 172.8794 169.6831 166.7304 164.1571 162.0214 160.0906 158.4485 157.172 156.1642 155.491 155.1641 155.0734 155.156 155.3378 ADL5324 Data Sheet ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE Table 3. Parameter Supply Voltage, VSUP Input Power (50 Ω Impedance) Internal Power Dissipation (Paddle Soldered) Maximum Junction Temperature Operating Temperature Range Storage Temperature Range Rating 6.5 V 20 dBm 1.9 W 150°C −40°C to +105°C −65°C to +150°C Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Table 4 lists the junction-to-air thermal resistance (θJA) and the junction-to-paddle thermal resistance (θJC) for the ADL5324. Table 4. Thermal Resistance Package Type 3-Lead SOT-89 θJA1 37 1 θJC2 9 Unit °C/W Measured on Analog Devices evaluation board. For more information about board layout, see the Soldering Information and Recommended PCB Land Pattern section. 2 Based on simulation with JEDEC standard JESD51. ESD CAUTION Rev. B | Page 6 of 20 Data Sheet ADL5324 PIN CONFIGURATION AND FUNCTION DESCRIPTIONS RFIN 1 ADL5324 TOP VIEW (2) GND (Not to Scale) RFOUT 3 10562-002 GND 2 Figure 3. Pin Configuration Table 5. Pin Function Descriptions Pin No. 1 2 Mnemonic RFIN GND 3 RFOUT Description RF Input. This pin requires a dc blocking capacitor. Ground. Connect this pin to a low impedance ground plane. Note that the paddle, which is exposed, encompasses Pin 2 and the tab at the top side of the package. It should be soldered to a low impedance ground plane for electrical grounding and thermal transfer. RF Output and Supply Voltage. DC bias is provided to this pin through an inductor that is connected to the external power supply. The RF path requires a dc blocking capacitor. Rev. B | Page 7 of 20 ADL5324 Data Sheet TYPICAL PERFORMANCE CHARACTERISTICS OIP3 (dBm) 34 40 33 35 48 +85°C 32 P1dB (dBm) 25 GAIN (dB) 44 42 –40°C 30 40 29 38 +25°C 15 28 10 –40°C 36 27 34 +85°C NF (dB) 32 5 26 0 869 25 869 884 900 915 930 946 961 FREQUENCY (MHz) 884 900 915 930 30 961 946 10562-018 20 31 P1dB (dBm) 30 46 +25°C OIP3 (dBm) 45 10562-015 NOISE FIGURE, GAIN, P1DB, OIP3 (dB, dBm) 50 35 50 FREQUENCY (MHz) Figure 4. Gain, P1dB, OIP3, and Noise Figure vs. Frequency, 869 MHz to 961 MHz Figure 7. OIP3 and P1dB vs. Frequency and Temperature, 869 MHz to 961 MHz 17.5 55 –40°C 53 51 17.0 49 OIP3 (dBm) GAIN (dB) +25°C 16.5 +85°C 47 45 43 41 16.0 39 884 900 915 930 946 961 FREQUENCY (MHz) 35 –5 10562-016 15.5 869 0 5 10 15 20 POUT PER TONE (dBm) 10562-019 869MHz 915MHz 961MHz 37 Figure 8. OIP3 vs. POUT and Frequency, 869 MHz to 961 MHz Figure 5. Gain vs. Frequency and Temperature, 869 MHz to 961 MHz 0 7 –5 S22 –15 S11 –20 –25 S12 –30 +85°C 6 NOISE FIGURE (dB) S-PARAMETERS (dB) –10 +25°C 5 –40°C 4 884 900 915 930 FREQUENCY (MHz) 946 961 Figure 6. Input Return Loss (S11), Output Return Loss (S22), and Reverse Isolation (S12) vs. Frequency, 869 MHz to 961 MHz Rev. B | Page 8 of 20 3 869 884 900 915 930 946 FREQUENCY (MHz) Figure 9. Noise Figure vs. Frequency and Temperature, 869 MHz to 961 MHz 961 10562-020 –40 869 10562-017 –35 Data Sheet ADL5324 45 46 34 +25°C 40 35 44 32 25 20 42 +85°C 40 31 P1dB (dBm) P1dB (dBm) 30 30 38 –40°C +25°C 36 29 GAIN (dB) 15 28 10 34 +85°C 27 32 26 30 NF (dB) 2120 2130 2140 2150 2160 2170 FREQUENCY (MHz) 25 2110 2120 2130 2140 2150 2160 28 2170 10562-030 5 0 2110 FREQUENCY (MHz) Figure 10. Gain, P1dB, OIP3, and Noise Figure vs. Frequency, 2110 MHz to 2170 MHz Figure 13. OIP3 and P1dB vs. Frequency and Temperature, 2110 MHz to 2170 MHz 16.0 50 2110MHz 2140MHz 2170MHz 48 15.5 46 –40°C 44 OIP3 (dBm) 15.0 GAIN (dB) –40°C 33 OIP3 (dBm) OIP3 (dBm) 10562-027 NOISE FIGURE, GAIN, P1dB, OIP3 (dB, dBm) 48 35 50 +25°C 14.5 +85°C 14.0 42 40 38 36 34 13.5 2120 2130 2140 2150 2160 2170 FREQUENCY (MHz) 30 –5 10562-028 13.0 2110 0 5 10 15 20 POUT PER TONE (dBm) Figure 11. Gain vs. Frequency and Temperature, 2110 MHz to 2170 MHz 10562-031 32 Figure 14. OIP3 vs. POUT and Frequency, 2110 MHz to 2170 MHz 0 6 –10 S22 –15 S11 5 NOISE FIGURE (dB) S-PARAMETERS (dB) –5 –20 S12 –25 –30 +85°C +25°C 4 –40°C 3 2120 2130 2140 2150 FREQUENCY (MHz) 2160 2170 Figure 12. Input Return Loss (S11), Output Return Loss (S22), and Reverse Isolation (S12) vs. Frequency, 2110 MHz to 2170 MHz Rev. B | Page 9 of 20 2 2110 2120 2130 2140 2150 2160 FREQUENCY (MHz) Figure 15. Noise Figure vs. Frequency and Temperature, 2110 MHz to 2170 MHz 2170 10562-032 –40 2110 10562-029 –35 ADL5324 Data Sheet 35 31 P1dB (dBm) 32 30 P1dB (dBm) 25 20 +25°C –40°C 44 42 +85°C 40 30 38 29 –40°C 28 GAIN (dB) 15 46 33 OIP3 (dBm) 40 +25°C 36 OIP3 (dBm) 45 34 27 +85°C NF (dB) 5 2590 2610 2630 2650 2670 2690 FREQUENCY (MHz) 26 32 25 30 24 2570 2590 2610 2630 2650 2670 28 2690 10562-036 10 0 2570 FREQUENCY (MHz) Figure 16. Gain, P1dB, OIP3, and Noise Figure vs. Frequency, 2570 MHz to 2690 MHz Figure 19. OIP3 and P1dB vs. Frequency and Temperature, 2570 MHz to 2690 MHz 14.5 50 2570MHz 2630MHz 2690MHz 48 –40°C 14.0 46 44 13.5 +25°C OIP3 (dBm) GAIN (dB) 48 34 10562-033 NOISE FIGURE, GAIN, P1dB, OIP3 (dB, dBm) 50 13.0 +85°C 12.5 42 40 38 36 34 12.0 2590 2610 2630 2650 2670 2690 FREQUENCY (MHz) 30 –5 10562-034 11.5 2570 0 5 10 15 20 POUT PER TONE (dBm) Figure 17. Gain vs. Frequency and Temperature, 2570 MHz to 2690 MHz 10562-037 32 Figure 20. OIP3 vs. POUT and Frequency, 2570 MHz to 2690 MHz 0 7 –5 S22 –15 6 NOISE FIGURE (dB) S-PARAMETERS (dB) –10 S11 –20 S12 –25 –30 +85°C 5 +25°C 4 –40°C 2590 2610 2630 2650 FREQUENCY (MHz) 2670 2690 Figure 18. Input Return Loss (S11), Output Return Loss (S22), and Reverse Isolation (S12) vs. Frequency, 2570 MHz to 2690 MHz Rev. B | Page 10 of 20 3 2570 2590 2610 2630 2650 2670 FREQUENCY (MHz) Figure 21. Noise Figure vs. Frequency and Temperature, 2570 MHz to 2690 MHz 2690 10562-038 –40 2570 10562-035 –35 Data Sheet ADL5324 25 30 20 20 PERCENTAGE (%) 15 10 15 10 41.2 41.6 42.0 42.4 42.8 43.2 43.6 44.0 44.4 44.8 OIP3 (dBm) 0 10562-045 0 3.45 3.55 3.60 3.65 3.70 3.75 3.80 3.85 3.90 NOISE FIGURE (dB) Figure 22. OIP3 Distribution at 2140 MHz Figure 25. Noise Figure Distribution at 2140 MHz 50 200 45 190 40 180 SUPPLY CURRENT (mA) PERCENTAGE (%) 3.50 10562-048 5 5 35 30 25 20 15 10 170 160 5.25V 150 5V 140 4.75V 130 120 110 0 100 –40 28.2 28.4 28.6 28.8 29.0 29.2 29.4 29.6 29.8 30.0 P1dB (dBm) 10562-046 5 –20 0 20 40 60 80 TEMPERATURE (°C) Figure 23. P1dB Distribution at 2140 MHz 10562-049 PERCENTAGE (%) 25 Figure 26. Supply Current vs. Supply Voltage and Temperature, 5 V (Using 2140 MHz Matching Components) 100 40 90 35 20 15 40 30 5 10 14.3 14.4 14.5 14.6 14.7 14.8 14.9 15.0 15.1 GAIN (dB) 15.2 3.15V 50 20 0 3.3V 60 10 10562-047 PERCENTAGE (%) 25 3.45V 70 0 –40 –20 0 20 40 TEMPERATURE (°C) 60 80 10562-064 SUPPLY CURRENT (mA) 80 30 Figure 27. Supply Current vs. Supply Voltage and Temperature, 3.3 V (Using 2140 MHz Matching Components) Figure 24. Gain Distribution at 2140 MHz Rev. B | Page 11 of 20 ADL5324 Data Sheet HIGH TEMPERATURE OPERATION 15.0 14.5 14.5 14.0 14.0 25°C 85°C 105°C 13.5 13.0 13.0 12.5 12.5 12.0 2110 2120 2130 2140 2150 2160 2170 12.0 2110 FREQUENCY (MHz) 33 31 43 31 29 38 P1dB (dBm) OIP3 (dBm) 33 2160 25°C 85°C 105°C 2170 43 38 29 OIP3 33 27 28 25 28 25 P1dB 2130 2140 2150 FREQUENCY (MHz) 2160 23 2170 23 2110 Figure 29. OIP3 and P1dB vs. Frequency and Temperature, 5 V Supply, 2140 MHz 2130 2140 2150 FREQUENCY (MHz) 2160 23 2170 Figure 32. OIP3 and P1dB vs. Frequency and Temperature, 3.3 V Supply, 2140 MHz 6 6 25°C 85°C 105°C 25°C 85°C 105°C 5 NOISE FIGURE (dB) 5 4 3 4 2120 2130 2140 2150 FREQUENCY (MHz) 2160 2170 2 2110 Figure 30. Noise Figure vs. Frequency and Temperature, 5 V Supply, 2140 MHz 2120 2130 2140 2150 FREQUENCY (MHz) 2160 2170 10562-139 3 10562-136 2 2110 2120 10562-138 2120 10562-135 23 2110 NOISE FIGURE (dB) P1dB (dBm) 27 2150 48 OIP3 P1dB 2140 Figure 31. Gain vs. Frequency and Temperature, 3.3 V Supply, 2140 MHz 48 25°C 85°C 105°C 2130 FREQUENCY (MHz) Figure 28. Gain vs. Frequency and Temperature, 5 V Supply, 2140 MHz 33 2120 OIP3 (dBm) 13.5 25°C 85°C 105°C 10562-137 GAIN (dB) 15.0 10562-134 GAIN (dB) The ADL5324 has excellent performance at temperatures above 85°C. At 105°C, the gain and P1dB decrease by 0.2 dB, the OIP3 decreases by 0.1 dB, and the noise figure increases by 0.31 dB compared with the data at 85°C. Figure 28 through Figure 33 show the performance at 105°C. Figure 33. Noise Figure vs. Frequency and Temperature, 3.3 V Supply, 2140 MHz Rev. B | Page 12 of 20 Data Sheet ADL5324 APPLICATIONS INFORMATION BASIC LAYOUT CONNECTIONS The basic connections for operating the ADL5324 are shown in Figure 34. Table 6 lists the required matching components. Capacitors C1, C2, and C3 are Murata GRM615 series (0402 size) High Q capacitors and C7 is a Murata GRM155 series (0402 size). Inductor L1 is a Coilcraft 0603CS series (0603 size). For all frequency bands, the placement of C1 and C2 are critical. The placement of C3 becomes critical for the following bands: 1880 MHz to 1990 MHz, 2110 MHz to 2170 MHz, 2300 MHz to 2400 MHz, 2570 MHz to 2690 MHz. and 3500 MHz to 3600 MHz. For operation from 420 MHz to 494 MHz, 728 MHz to 768 MHz, and 869 MHz to 960 MHz, R2 is replaced with a Coilcraft (0402 size) High Q inductor. Table 7 lists the recommended component placement for various frequencies. A 5 V dc bias is supplied through L1, which is connected to RFOUT (Pin 3). In addition to C4, 10 nF and 10 µF power supply decoupling capacitors are also required. The typical current consumption for the ADL5324 is 133 mA. GND SOLDERING INFORMATION AND RECOMMENDED PCB LAND PATTERN Figure 35 shows the recommended land pattern for the ADL5324. To minimize thermal impedance, the exposed paddle on the SOT-89 package underside is soldered to a ground plane along with Pin 2. If multiple ground layers exist, they should be stitched together using vias. For more information on land pattern design and layout, refer to the Application Note AN-772, A Design and Manufacturing Guide for the Lead Frame Chip Scale Package (LFCSP). This land pattern, on the ADL5324 evaluation board, provides a measured thermal resistance (θJA) of 37°C/W. To measure θJA, the temperature at the top of the SOT-89 package is found with an IR temperature gun. Thermal simulation suggests a junction temperature 10°C higher than the top of package temperature. With additional ambient temperature and I/O power measurements, θJA could be determined. 1.80mm VSUP (2) GND C6 10µF C5 10nF 3.48mm C4 100pF 3 0.20mm 5.56mm R2 C7 RFOUT 0Ω 20pF C23 2.2pF 1SEE 0.86mm THE RECOMMENDED COMPONENTS FOR BASIC CONNECTIONS TABLE FOR FREQUENCY-SPECIFIC COMPONENTS. 2SEE TABLE 6 FOR RECOMMENDED COMPONENT SPACING. 3C1, C2, AND C3 ARE MURATA HIGH Q CAPACITORS GRM615 SERIES. 0.62mm 1.27mm Figure 34. Basic Connections 1.50mm 3.00mm Figure 35. Recommended Land Pattern Rev. B | Page 13 of 20 10562-051 2 L1 15nH λ22 10562-050 C13 2pF 1 RFOUT λ12 GND C33 RFIN R1 2.4pF 0Ω RFIN ADL5324 ADL5324 Data Sheet Table 6. Recommended Components for Basic Connections Function/ Component AC Coupling Capacitors C3 = 0402 C7 = 0402 Power Supply Bypassing Capacitors C4 = 0402 C5 = 0603 C6 = 1206 DC Bias Inductor L1 = 0603CS Tuning Capacitors C1 = 0402 C2 = 0402 Jumpers R1 = 0402 R2 = 0402 Power Supply Connections VSUP GND 420 MHz to 494 MHz 728 MHz to 768 MHz 800 MHz to 960 MHz 1880 MHz to 1990 MHz 2110 MHz to 2170 MHz (Default) 2300 MHz to 2400 MHz 2560 MHz to 2690 MHz 3500 MHz to 3700 MHz 10 pF 20 pF 10pF 1 20 pF 10 pF1 20 pF 2.4 pF1 20 pF 2.4 pF1 20 pF 2.4 pF1 20 pF 2pF1 20 pF1 1pF1 20 pF 100 pF 10 nF 10 µF 120 nH 100 pF 10 nF 10 µF 18 nH 100 pF 10 nF 10 µF 18 nH 100 pF 10 nF 10 µF 15 nH 100 pF 10 nF 10 µF 15 nH 100 pF 10 nF 10 µF 15 nH 100 pF 10 nF 10 µF 15 nH 100 pF 10 nF 10 µF 15 nH 20 pF1 6.2 pF1 8 pF1 3.9 pF1 8 pF1 3.6 pF1 2.4 pF1 2.4 pF1 2.0 pF1 2.2 pF1 1.5 pF1 2.0 pF1 1.0 pF1 2.0 pF1 0.5 pF1 0.75 pF1 2Ω 5.6 nH 2 2Ω 2.4 nH 3 2Ω 2.4 nH3 0Ω 0Ω 0Ω 0Ω 0Ω 0Ω 0Ω 0Ω 0Ω 4.7 nH3 Red test loop Black test loop 1 Murata High Q capacitor. Add a 1.6 nH at input (see Figure 41). 3 Coilcraft 0402CS series. 2 Table 7. Matching Component Spacing Frequency (MHz) 420 to 494 728 to 768 869 to 961 1880 to 1990 2110 to 2170 2300 to 2400 2570 to 2690 3500 to 3700 λ1 (mils) 419 311 207 75 65 71 245 316 Rev. B | Page 14 of 20 λ2 (mils) 438 422 413 239 193 176 132 125 Data Sheet ADL5324 4. The ADL5324 is designed to achieve excellent gain and OIP3 performance. To achieve this, both input and output matching networks must present specific impedance to the device. The matching components listed in Table 6 were chosen to provide −10 dB input return loss while maximizing OIP3. The load-pull plots (see Figure 36 and Figure 37) show the load impedance points on the Smith chart where optimum OIP3, gain, and output power can be achieved. These load impedance values (that is, the impedance that the device sees when looking into the output matching network) are listed in Table 8 and Table 9 for maximum gain and maximum OIP3, respectively. The contours show how each parameter degrades as it is moved away from the optimum point. From the data shown in Table 8 and Table 9, it becomes clear that maximum gain and maximum OIP3 do not occur at the same impedance. This can also be seen on the load-pull contours in Figure 36 and Figure 37. Thus, output matching generally involves compromising between gain and OIP3. In addition, the loadpull plots demonstrate that the quality of the output impedance match must be compromised to optimize gain and/or OIP3. In most applications where line lengths are short and where the next device in the signal chain presents a low input return loss, compromising on the output match is acceptable. To adjust the output match for operation at a different frequency, or if a different trade-off between OIP3, gain, and output impedance is desired, a four-step procedure is recommended. Repeat Step 3 as necessary. Once the desired gain and return loss are realized, measure OIP3. Most likely, it will be necessary to go back and forth between return loss/gain and OIP3 measurements (probably compromising most on output return loss) until an acceptable compromise is achieved. Fixed Load Pull Freq = 2.1400 GHz ZSource_2nd (Ohms) : 50.00 + j 0.00 ZSource_3rd (Ohms) : 50.00 + j 0.00 Load Gt max = 16.06 dB at 2.97 – j 2.70 Ohms 10 contours, 0.50 dB step (11.50 to 16.00 dB) Ip3 max = 44.18 dBm at 9.44 + j 9.65 Ohms 10 contours, 1.00 dBm step (35.00 to 44.00 dBm) Specs: OFF Label: ADL5324_2P14_LP7 10562-053 MATCHING PROCEDURE Figure 36. Load-Pull Contours, 2140 MHz Fixed Load Pull Freq = 2.6300 GHz ZSource (Ohms) : 49.84 + j 4.33 ZSource_2nd (Ohms) : 37.79 + j 3.28 ZSource_3rd (Ohms) : 39.74 + j10.00 Load Gt max = 13.83 dB at 4.27 – j 1.99 Ohms 10 contours, 0.50 dB step (9.00 to 13.50 dB) Ip3 max = 45.19 dBm at 2.84 + j 5.89 Ohms 10 contours, 1.00 dBm step (36.00 to 45.00 dBm) Specs: OFF 1. 2. 3. Install the recommended tuning components for an 869 MHz to 970 MHz tuning band, but do not install C1 and C2. Connect the evaluation board to a vector network analyzer so that input and output return loss can be viewed simultaneously. Starting with the recommended values and positions for C1 and C2, adjust the positions of these capacitors along the transmission line until the return loss and gain are acceptable. In this case, push-down capacitors mounted on small sticks can be used as an alternative to soldering. If moving the component positions does not yield satisfactory results, then increase or decrease the values of C1 and C2 (in this case, the values are most likely increased because the user is tuning for a lower frequency. 26.37 + j30.90 Label: ADL5324_2p63ghZ_LP3 10562-054 For example, to optimize the ADL5324 for optimum OIP3 and gain at 750 MHz, use the following steps: Figure 37. Load-Pull Contours, 2600 MHz Table 8. Load Conditions for GainMAX Frequency (MHz) 2140 2630 ΓLoad (Magnitude) 0.888 0.0843 ΓLoad (°) −173.55 −175.41 GainMAX (dB) 16.1 13.83 Table 9. Load Conditions for OIP3 MAX Frequency (MHz) 2140 2630 Rev. B | Page 15 of 20 ΓLoad (Magnitude) 0.654 0.894 ΓLoad (°) +163.28 +166.52 IP3MAX (dBm) 44.18 45.19 ADL5324 Data Sheet –30 Figure 38 shows a plot of adjacent channel power ratio (ACPR) vs. POUT for the ADL5324. The signal type used is a single W-CDMA carrier (Test Model 1-64) at 2140 MHz. This signal is generated by a very low ACPR source. ACPR is measured at the output by a high dynamic range spectrum analyzer, which incorporates an instrument noise correction function. –35 –40 –45 –50 –55 SOURCE VCC = 3.3V VCC = 5V –60 –65 –70 –75 –80 –85 –20 –15 –10 –5 0 5 10 15 20 25 POUT (dBm) Figure 38. ACPR vs. Output Power, Single Carrier W-CDMA, TM1-64, at 2140 MHz Rev. B | Page 16 of 20 10562–155 The ADL5324 achieves an ACPR of −79 dBc at 0 dBm output, at which point device noise and not distortion is beginning to dominate the power in the adjacent channels. At an output power of 10 dBm, ACPR is still very low at −72 dBc, making the device particularly suitable for PA driver applications. ACPR @ 5MHz CARRIER OFFSET (dBc) W-CDMA ACPR PERFORMANCE Data Sheet ADL5324 EVALUATION BOARD The schematic of the ADL5324 evaluation board is shown in Figure 39. This evaluation board uses 25 mil wide traces and is made from FR4 material. The evaluation board comes tuned for operation in the 2110 MHz to 2170 MHz tuning band. Tuning options for other frequency bands are also provided in Table 10. The recommended placement for these components is provided in Table 11. The inputs and outputs should be ac-coupled with appropriately sized capacitors. dc bias is provided to the amplifier via an inductor connected to the RFOUT pin. A bias voltage of 5 V is recommended. GND 100pF C3 2.4pF R1 0Ω L1 15nH 193mils R2 0Ω C2 2.2pF C7 20pF 65mils C1 2pF VSUP (2) GND C6 10µF C5 10nF C4 100pF 1 2 RFOUT 3 C12 2pF R2 C7 0Ω 20pF RFOUT λ24 10562-057 L1 15nH Figure 40. Evaluation Board Layout and Default Component Placement for 2110 MHz to 2170 MHz C23 2.2pF 1MURATA HIGH Q CAPACITOR GRM615COG2R4B50 OR EQUIVALENT. 2MURATA HIGH Q CAPACITOR GRM615COG020B50 OR EQUIVALENT. 3MURATA HIGH Q CAPACITOR GRM615COG2R2B50 OR EQUIVALENT. 4SEE TABLE 10 FOR RECOMMENDED COMPONENT SPACING. 10562-056 λ14 GND 1 R1 C3 RFIN 0Ω 2.4pF RFIN ADL5324 Figure 39. Evaluation Board, 2110 MHz to 2170 MHz Table 10. Recommended Components for Basic Connections Function/ Component AC Coupling Capacitors C3 = 0402 C7 = 0402 Power Supply Bypassing Capacitors C4 = 0402 C5 = 0603 C6 = 1206 DC Bias Inductor L1 = 0603CS Tuning Capacitors C1 = 0402 C2 = 0402 Jumpers R1 = 0402 R2 = 0402 Power Supply Connections VSUP GND 1 2 3 420 MHz to 494 MHz 728 MHz to 768 MHz 800 MHz to 960 MHz 1880 MHz to 1990 MHz 2110 MHz to 2170 MHz (Default) 2300 MHz to 2400 MHz 2560 MHz to 2690 MHz 3500 MHz to 3700 MHz 10 pF 20 pF 10pF 1 20 pF 10 pF 20 pF 2.4 pF1 20 pF 2.4 pF1 20 pF 2.4 pF1 20 pF 2pF1 20 pF1 1pF1 20 pF 100 pF 10 nF 10 µF 120 nH 100 pF 10 nF 10 µF 18 nH 100 pF 10 nF 10 µF 18 nH 100 pF 10 nF 10 µF 15 nH 100 pF 10 nF 10 µF 15 nH 100 pF 10 nF 10 µF 15 nH 100 pF 10 nF 10 µF 15 nH 100 pF 10 nF 10 µF 15 nH 20 pF1 6.2 pF1 8 pF1 3.9 pF1 8 pF1 3.6 pF1 2.4 pF1 2.4 pF1 2.0 pF1 2.2 pF1 1.5 pF1 2.0 pF1 1.0 pF1 2.0 pF1 0.5 pF1 0.75 pF1 2Ω 5.6 nH 2 2Ω 2.4 nH 3 2Ω 2.4 nH3 0Ω 0Ω 0Ω 0Ω 0Ω 0Ω 0Ω 0Ω 0Ω 4.7 nH3 Red test loop Black test loop Murata High Q capacitor. Add a 1.6 nH at input (see Figure 41). Coilcraft 0402CS series. Rev. B | Page 17 of 20 ADL5324 Data Sheet Table 11. Recommended Component Spacing on Evaluation Board Frequency (MHz) 420 to 494 728 to 768 869 to 961 1880 to 1990 2110 to 2170 2300 to 2400 2570 to 2690 3500 to 3700 λ1 (mils) 419 311 207 75 65 71 245 316 λ2 (mils) 438 422 413 239 193 176 132 125 100pF L2 2.4nH 100 pF 248 mils 419 mils C7 20pF L1 18nH C3 10pF C2 6.2pF 311 mils 438 mils C1 8pF R1 2Ω 207mils C7 20pF C2 3.6pF 413mils 10562-042 C3 10pF L2 L1 120nH 5.6nH 10562-060 L3 R1 C1 20pF 1.6nH 2Ω Figure 43. Evaluation Board Layout and Component Placement, 869 MHz to 961 MHz Operation Figure 41. Evaluation Board Layout and Component Placement, 420 MHz to 494 MHz Operation 100pF 311 mils L2 L1 18nH 2.4nH 422 mils C3 2.4pF C7 20pF L1 15nH R1 0Ω C2 3.9pF 239mils 75mils C1 2.4pF 100pF R2 0Ω C2 2.4pF C7 20pF 10562-043 C3 10pF R1 2Ω 10562-061 C1 8pF Figure 42. Evaluation Board Layout and Component Placement, 728 MHz to 768 MHz Operation Figure 44. Evaluation Board Layout and Component Placement, 1880 MHz to 1990 MHz Operation Rev. B | Page 18 of 20 Data Sheet ADL5324 C3 2.4pF L1 15nH R1 0Ω 176mils C2 2.0pF 100pF C1 0.5pF R1 0Ω C7 20pF C3 1.0pF 316 mils L2 L1 15nH 4.7nH C2 0.75pF C7 20pF 125 mils Figure 45. Evaluation Board Layout and Component Placement, 2300 MHz to 2400 MHz Operation C3 2.0pF C1 1.0pF 245mils Figure 47. Evaluation Board Layout and Component Placement, 3500 MHz to 3700 MHz Operation 100pF C7 L1 15nH 20pF C2 132mils 2.0pF R2 0Ω 10562-063 R1 0Ω 10562-148 10562-062 71mils C1 1.5pF 100pF R2 0Ω Figure 46. Evaluation Board Layout and Component Placement, 2560 MHz to 2690 MHz Operation Rev. B | Page 19 of 20 ADL5324 Data Sheet OUTLINE DIMENSIONS *1.75 1.55 (2) 4.25 3.94 1 2 2.60 2.30 3 1.20 0.75 1.50 TYP 3.00 TYP 2.29 2.14 4.60 4.40 1.60 1.40 0.44 0.35 END VIEW *0.52 0.32 *COMPLIANT TO JEDEC STANDARDS TO-243 WITH THE EXCEPTION OF DIMENSIONS INDICATED BY AN ASTERISK. 12-18-2008-B *0.56 0.36 Figure 48. 3-Lead Small Outline Transistor Package [SOT-89] (RK-3) Dimensions shown in millimeters ORDERING GUIDE Model 1 ADL5324ARKZ-R7 ADL5324-EVALZ 1 Temperature Range −40°C to +105°C Package Description 3-Lead SOT-89, 7“ Tape and Reel Evaluation Board Z = RoHS Compliant Part. ©2012 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D10562-0-9/12(B) Rev. B | Page 20 of 20 Package Option RK-3