700 MHz to 2700 MHz 1 W RF Driver Amplifier ADL5604 Data Sheet 14 GND 13 GND 16 GND FUNCTIONAL BLOCK DIAGRAM Operation from 700 MHz to 2700 MHz Gain of 12.2 dB at 2630 MHz OIP3 of 42.2 dBm at 2630 MHz P1dB of 29.1 dBm at 2630 MHz Noise figure of 4.6 dB at 2630 MHz Single 5 V power supply Low quiescent current of 318 mA Internal active biasing Fast power-down/up time of 50 ns Easily externally matched Compact 4 mm × 4 mm LFCSP ESD rating of ±1 kV (Class 1C) 15 GND FEATURES ADL5604 RFIN 1 12 RFOUT RFIN 2 11 RFOUT VBIAS 3 10 RFOUT BIAS 8 GND 9 RFOUT 14 16 08220-001 7 GND 5 GND 6 4 GND VCC2 Figure 1. GENERAL DESCRIPTION The ADL5604 can be quickly powered down or up in 50 ns for applications requiring TX shutdown, such as TDD systems. The ADL5604 operates on a single 5 V supply voltage and draws only 318 mA of supply current. The driver is fabricated on a GaAs HBT process and operates from −40°C to +85°C. A fully populated evaluation board is available. Rev. B 2140 MHz 1966 MHz 946 MHz –45 –50 –55 –60 –65 –70 –75 –80 0 2 4 6 8 10 12 18 POUT (dBm) 20 08220-002 For thermal management, the ADL5604 uses an exposed paddle, and the upper and lower pins of the package are all grounded, which gives the ADL5604 excellent thermal transfer characteristics. –40 ACPR (dBc) The ADL5604 is a very broadband RF driver amplifier that operates over the wide frequency range of 700 MHz to 2700 MHz. The ADL5604 is also highly linear and has a very low power consumption, enabling the driver to be packaged in a compact 16-lead, 4 mm × 4 mm LFCSP. Figure 2. ACPR vs. Output Power, 3GPP 3.5 TM1-64 Document Feedback Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. 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Technical Support www.analog.com ADL5604 Data Sheet TABLE OF CONTENTS Features .............................................................................................. 1 Applications Information .............................................................. 15 Functional Block Diagram .............................................................. 1 Basic Layout Connections ......................................................... 15 General Description ......................................................................... 1 ADL5604 Match ......................................................................... 16 Revision History ............................................................................... 2 ACPR and EVM ......................................................................... 19 Specifications..................................................................................... 3 Thermal Considerations............................................................ 19 Typical Scattering Parameters ..................................................... 5 Absolute Maximum Ratings............................................................ 7 Soldering Information and Recommended PCB Land Pattern ................................................................................ 19 ESD Caution .................................................................................. 7 Evaluation Board ............................................................................ 20 Pin Configuration and Function Descriptions ............................. 8 Outline Dimensions ....................................................................... 23 Typical Performance Characteristics ............................................. 9 Ordering Guide .......................................................................... 23 REVISION HISTORY 9/13—Rev. A to Rev. B Added Figure 33; Renumbered Sequentially .............................. 13 Updated Outline Dimensions ....................................................... 23 2/11—Rev. 0 to Rev. A Changes to Figure 29, Figure 30, Figure 31 ................................. 13 Changed L2 Value at 880 MHz to 2.4 nH, Table 6 ..................... 16 Changes to Figure 41 ...................................................................... 18 Changes to ACPR and EVM Section ........................................... 19 4/10—Revision 0: Initial Version Rev. B | Page 2 of 24 Data Sheet ADL5604 SPECIFICATIONS VCC1 1 = 5 V and TA = 25°C, unless otherwise noted. Table 1. Parameter OVERALL FUNCTION Frequency Range FREQUENCY = 748 MHz Gain 2 vs. Frequency Output 1 dB Compression Point Output Third-Order Intercept Noise Figure FREQUENCY = 881 MHz Gain2 vs. Frequency Output 1 dB Compression Point Output Third-Order Intercept Noise Figure FREQUENCY = 942 MHz Gain2 vs. Frequency vs. Temperature vs. Supply Output 1 dB Compression Point ACP Output Third-Order Intercept Noise Figure FREQUENCY = 1960 MHz Gain2 vs. Frequency vs. Temperature vs. Supply Output 1 dB Compression Point ACP Output Third-Order Intercept Noise Figure FREQUENCY = 2140 MHz Gain2 vs. Frequency vs. Temperature vs. Supply Output 1 dB Compression Point ACP Output Third-Order Intercept Noise Figure Test Conditions/Comments Min Typ 700 ±20 MHz ∆f = 1 MHz, POUT = 14 dBm per tone ±13 MHz ∆f = 1 MHz, POUT = 14 dBm per tone MHz 15.3 0.38 29.1 42.8 8.5 dB dB dBm dBm dB 20.3 0.35 28.8 42.2 4.5 dB dB dBm dBm dB 21.3 dB dB dB dB dBm dBm dBm dB 13.7 14.4 ±0.2 ±0.7 ±0.02 28.8 −57 42.1 3.6 15.2 dB dB dB dB dBm dBm dBm dB 13.2 14.0 ±0.1 ±0.6 ±0.03 28.6 −60 42.1 3.8 14.9 dB dB dB dB dBm dBm dBm dB ±30 MHz −40°C ≤ TA ≤ +85°C 4.75 V to 5.25 V POUT =15 dBm, 3GPP 3.5 TM1-64, freq = 1966 MHz ∆f = 1 MHz, POUT = 14 dBm per tone Rev. B | Page 3 of 24 2700 20.5 ±0.1 ±0.6 ±0.03 28.3 −56 41.2 3.8 POUT =15 dBm, 3GPP 3.5 TM1-64, freq = 946 MHz ∆f = 1 MHz, POUT = 14 dBm per tone POUT =15 dBm, 3GPP 3.5 TM1-64 ∆f = 1 MHz, POUT = 14 dBm per tone Unit 19.8 ±18 MHz −40°C ≤ TA ≤ +85°C 4.75 V to 5.25 V ±30 MHz −40°C ≤ TA ≤ +85°C 4.75 V to 5.25 V Max ADL5604 Parameter FREQUENCY = 2630 MHz Gain2 vs. Frequency Output 1 dB Compression Point Output Third-Order Intercept Noise Figure POWER INTERFACE Supply Voltage Supply Current vs. Temperature POWER DOWN INTERFACE Turn-On Time Turn-Off Time 1 2 Data Sheet Test Conditions/Comments Min Typ Max 12.2 4.8 29.1 42.2 4.6 ±60 MHz ∆f = 1 MHz, POUT = 14 dBm per tone Unit dB dB dBm dBm dB Pin RFOUT 4.75 −40°C ≤ TA ≤ +85°C 5 318 ±7 50% of control pulse to 50% of RFOUT 50% of control pulse to 50% of RFOUT 50 50 VCC1 is the supply voltage to the ADL5604 through the RFOUT pins. Guaranteed maximum and minimum specified limits on this parameter are based on 6 sigma calculations. Rev. B | Page 4 of 24 5.25 345 V mA mA nS nS Data Sheet ADL5604 TYPICAL SCATTERING PARAMETERS VCC1 1 = 5 V and TA = 25°C; the effects of the test fixture have been de-embedded up to the pins of the device. Table 2. Frequency (MHz) 50 100 150 200 250 300 350 400 450 500 550 600 650 700 750 800 850 900 950 1000 1050 1100 1150 1200 1250 1300 1350 1400 1450 1500 1550 1600 1650 1700 1750 1800 1850 1900 1950 2000 2050 2100 2150 2200 2250 2300 2350 S11 Magnitude (dB) −0.74 −0.67 −0.63 −0.59 −0.56 −0.54 −0.53 −0.52 −0.50 −0.50 −0.49 −0.49 −0.48 −0.49 −0.49 −0.49 −0.50 −0.50 −0.51 −0.51 −0.52 −0.53 −0.54 −0.55 −0.56 −0.57 −0.58 −0.59 −0.59 −0.60 −0.61 −0.63 −0.64 −0.65 −0.67 −0.68 −0.69 −0.70 −0.72 −0.73 −0.75 −0.77 −0.78 −0.80 −0.82 −0.84 −0.86 Angle (°) −177.7 −179.4 179.6 178.7 177.9 177.0 176.2 175.4 174.7 173.9 173.1 172.4 171.6 170.8 170.0 169.3 168.5 167.8 167.0 166.3 165.6 164.8 164.1 163.3 162.6 161.9 161.2 160.5 159.7 158.9 158.2 157.4 156.7 155.9 155.2 154.4 153.6 152.8 152.1 151.3 150.5 149.7 148.9 148.1 147.3 146.5 145.7 S21 Magnitude (dB) 21.45 19.30 18.18 17.10 16.08 15.12 14.18 13.30 12.51 11.77 11.09 10.46 9.89 9.35 8.85 8.39 7.95 7.55 7.16 6.81 6.47 6.15 5.85 5.57 5.29 5.05 4.80 4.60 4.40 4.21 4.03 3.86 3.70 3.55 3.41 3.29 3.17 3.06 2.96 2.86 2.77 2.70 2.62 2.57 2.52 2.48 2.44 Angle (°) 134.7 134.8 129.6 123.5 117.8 112.6 108.2 104.5 101.2 98.3 95.6 93.2 90.9 88.7 86.7 84.7 82.8 81.0 79.2 77.5 75.8 74.0 72.4 70.8 69.2 67.7 66.1 64.6 63.0 61.4 59.9 58.2 56.7 55.1 53.6 51.9 50.3 48.6 47.0 45.3 43.7 42.0 40.4 38.7 37.0 35.1 33.4 Rev. B | Page 5 of 24 S12 Magnitude (dB) −39.97 −39.81 −39.69 −39.55 −39.47 −39.53 −39.29 −39.05 −39.02 −39.24 −39.27 −38.98 −38.95 −38.90 −38.78 −38.65 −38.58 −38.51 −38.44 −38.34 −38.26 −38.20 −38.14 −38.00 −37.97 −37.87 −37.87 −37.69 −37.55 −37.45 −37.33 −37.20 −37.15 −37.09 −36.97 −36.86 −36.75 −36.65 −36.54 −36.42 −36.30 −36.19 −36.08 −35.95 −35.83 −35.70 −35.58 Angle (°) 10.6 6.4 4.9 4.0 3.2 2.8 3.4 1.6 −1.6 0.3 0.3 0.5 −0.7 −0.5 −1.0 −1.5 −2.3 −2.8 −3.4 −4.1 −4.5 −5.0 −5.6 −6.2 −7.3 −7.3 −8.1 −8.2 −9.4 −10.1 −10.7 −11.9 −12.8 −13.7 −14.3 −15.2 −16.1 −17.0 −18.1 −19.0 −20.1 −21.2 −22.2 −23.3 −24.5 −25.7 −26.9 S22 Magnitude (dB) −2.71 −2.34 −1.93 −1.61 −1.39 −1.26 −1.19 −1.14 −1.11 −1.09 −1.10 −1.12 −1.11 −1.13 −1.15 −1.18 −1.21 −1.23 −1.27 −1.28 −1.32 −1.35 −1.39 −1.43 −1.47 −1.50 −1.55 −1.57 −1.60 −1.64 −1.68 −1.74 −1.78 −1.82 −1.88 −1.92 −1.97 −2.02 −2.10 −2.17 −2.23 −2.31 −2.40 −2.45 −2.51 −2.61 −2.72 Angle (°) −153.2 −163.2 −167.2 −170.3 −172.9 −175.3 −177.3 −179.0 179.5 178.0 176.6 175.4 174.2 173.0 172.0 171.0 170.0 169.1 168.2 167.3 166.3 165.4 164.6 163.7 162.8 162.0 161.2 160.4 159.5 158.5 157.7 156.8 156.0 155.1 154.4 153.3 152.3 151.4 150.6 149.5 148.7 147.8 146.8 145.8 144.9 143.9 142.8 ADL5604 Frequency (MHz) 2400 2450 2500 2550 2600 2650 2700 2750 2800 2850 2900 2950 3000 3050 3100 3150 3200 3250 3300 3350 3400 3450 3500 3550 3600 3650 3700 3750 3800 3850 3900 3950 4000 1 Data Sheet S11 Magnitude (dB) −0.88 −0.90 −0.92 −0.94 −0.96 −0.99 −1.01 −1.04 −1.07 −1.10 −1.13 −1.16 −1.19 −1.22 −1.25 −1.29 −1.32 −1.36 −1.40 −1.44 −1.47 −1.51 −1.55 −1.59 −1.63 −1.67 −1.71 −1.75 −1.79 −1.82 −1.84 −1.86 −1.88 Angle (°) 144.9 144.1 143.2 142.4 141.6 140.8 139.9 139.1 138.3 137.4 136.6 135.7 134.9 134.1 133.2 132.4 131.5 130.7 129.8 129.0 128.1 127.3 126.4 125.6 124.8 124.0 123.2 122.3 121.5 120.7 119.9 119.1 118.3 S21 Magnitude (dB) 2.40 2.37 2.35 2.33 2.32 2.32 2.32 2.33 2.34 2.36 2.37 2.39 2.42 2.45 2.48 2.52 2.55 2.59 2.63 2.67 2.72 2.76 2.80 2.84 2.89 2.93 2.97 3.01 3.05 3.09 3.13 3.17 3.22 Angle (°) 31.5 29.7 27.8 26.0 24.0 22.1 20.1 18.0 15.9 13.9 11.7 9.5 7.3 5.1 2.8 0.4 −2.0 −4.4 −6.9 −9.4 −12.0 −14.7 −17.3 −20.0 −22.7 −25.5 −28.4 −31.2 −34.1 −37.1 −40.0 −43.0 −46.1 VCC1 is the supply to the ADL5604 through the RFOUT pins. Rev. B | Page 6 of 24 S12 Magnitude (dB) −35.46 −35.34 −35.21 −35.08 −34.96 −34.83 −34.71 −34.58 −34.45 −34.31 −34.18 −34.05 −33.94 −33.81 −33.69 −33.55 −33.44 −33.32 −33.21 −33.10 −32.98 −32.86 −32.73 −32.61 −32.51 −32.39 −32.28 −32.18 −32.10 −32.02 −31.94 −31.85 −31.79 Angle (°) −28.4 −29.8 −31.0 −32.5 −34.0 −35.5 −37.2 −38.8 −40.5 −42.2 −44.1 −45.9 −47.9 −49.9 −51.9 −54.0 −56.3 −58.5 −60.8 −63.2 −65.6 −68.0 −70.7 −73.3 −76.1 −79.0 −82.0 −85.1 −88.3 −91.5 −94.8 −98.2 −101.7 S22 Magnitude (dB) −2.81 −2.91 −3.03 −3.15 −3.26 −3.38 −3.52 −3.66 −3.81 −3.99 −4.16 −4.34 −4.54 −4.75 −4.96 −5.20 −5.45 −5.71 −5.99 −6.29 −6.62 −6.96 −7.31 −7.71 −8.12 −8.57 −9.02 −9.54 −10.09 −10.63 −11.24 −11.86 −12.48 Angle (°) 141.7 140.8 139.7 138.7 137.7 136.7 135.6 134.4 133.3 132.3 131.1 130.1 129.0 127.9 126.9 125.8 124.8 123.8 122.7 121.8 120.9 120.0 119.4 118.8 118.2 117.7 117.5 117.6 117.7 118.4 119.5 120.9 123.2 Data Sheet ADL5604 ABSOLUTE MAXIMUM RATINGS ESD CAUTION Table 3. Parameter Supply Voltage, VSUP Input Power (50 Ω Impedance) Internal Power Dissipation (Paddle Soldered) θJA (Junction to Air) θJC (Junction to Paddle) Maximum Junction Temperature Lead Temperature (Soldering, 60 sec) Operating Temperature Range Storage Temperature Range Rating 6.5 V +25 dBm 3.9 W 32.1°C/W 6°C/W 150°C 240°C −40°C to +85°C −65°C to +150°C Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Rev. B | Page 7 of 24 ADL5604 Data Sheet GND 8 9 RFOUT NOTES 1. THE PADDLE SHOULD BE CONNECTED TO BOTH THERMAL AND ELECTRICAL GROUND. 08220-003 14 GND 10 RFOUT GND 7 11 RFOUT TOP VIEW (Not to Scale) GND 5 VCC2 4 12 RFOUT ADL5604 GND 6 VBIAS 3 13 GND PIN 1 INDICATOR RFIN 1 RFIN 2 15 GND 16 GND PIN CONFIGURATION AND FUNCTION DESCRIPTIONS Figure 3. Pin Configuration Table 4. Pin Function Descriptions Pin No. 1, 2 5, 6, 7, 8, 13,14, 15, 16 3 Mnemonic RFIN GND VBIAS 4 VCC2 9, 10, 11, 12 RFOUT EP Description RF Input. Requires a dc blocking capacitor. Solder to a low impedance electrical and thermal ground plane. Dual Function Pin. Applying 5 V to this pin enables the bias circuit. Grounding this pin disables the device. When VBIAS is used alone to disable the ADL5604, the disable current is 13 mA. Under normal operation, this pin is connected to the power supply and draws approximately 5 mA of current. This pin can be grounded with the VBIAS pin to allow a disable current of <1 μA. RF Output and Main Supply Voltage. DC bias is provided to this pin through an inductor that is connected to the 5 V power supply. The RF path requires a dc blocking capacitor. The exposed paddle is connected internally to ground. Solder to a low impedance electrical and thermal ground plane. Rev. B | Page 8 of 24 Data Sheet ADL5604 TYPICAL PERFORMANCE CHARACTERISTICS 45 33 44 32 43 OIP3 (dBm) 35 P1dB (dBm) 25 GAIN (dB) 20 42 +25°C –40°C 30 41 +85°C 29 40 +25°C –40°C OIP3 (dBm) 31 P1dB (dBm) 30 15 28 39 +85°C 10 0.930 0.935 0.940 0.945 0.950 0.955 0.960 FREQUENCY (GHz) 26 0.925 0.930 0.945 0.940 0.935 0.950 0.955 37 0.960 08220-007 0 0.925 38 27 NF (dB) 5 08220-004 NF, GAIN, P1dB, OIP3 (dB, dBm) 40 FREQUENCY (GHz) Figure 7. OIP3 at POUT =14 dBm/Tone and P1dB vs. Frequency and Temperature Figure 4. Gain, P1dB, OIP3 at POUT =14 dBm/Tone and Noise Figure vs. Frequency 24 43 23 42 0.960GHz 0.942GHz 22 41 0.925GHz GAIN (dB) OIP3 (dBm) –40°C 21 +25°C +85°C 20 40 39 19 38 18 0.935 0.940 0.950 0.945 0.955 0.960 FREQUENCY (GHz) 36 –10 –8 –6 –4 0 –2 2 6 4 10 8 12 14 16 18 08220-008 0.930 08220-005 16 0.925 0.960 08220-009 37 17 POUT PER TONE (dBm) Figure 5. Gain vs. Frequency and Temperature Figure 8. OIP3 vs. POUT and Frequency 6 0 –5 S11 NOISE FIGURE (dB) S-PARAMETERS (dB) 5 S22 –10 –15 –20 +85°C 4 +25°C –40°C 3 –30 0.930 0.935 0.940 0.945 0.950 FREQUENCY (GHz) 0.955 0.960 0.965 08220-006 S12 –25 Figure 6. Input Return Loss (S11), Output Return Loss (S22), and Reverse Isolation (S12) vs. Frequency Rev. B | Page 9 of 24 2 0.925 0.930 0.935 0.940 0.945 0.950 0.955 FREQUENCY (GHz) Figure 9. Noise Figure vs. Frequency and Temperature ADL5604 Data Sheet 45 33 OIP3 (dBm) +25°C 32 43 –40°C 35 31 P1dB (dBm) +85°C 25 20 30 41 –40°C 29 GAIN (dB) 15 +85°C +25°C 28 40 OIP3 (dBm) 42 P1dB (dBm) 30 39 10 27 0 1.93 1.94 1.95 1.96 1.97 1.98 1.99 FREQUENCY (GHz) 38 26 1.93 1.94 1.96 1.95 37 1.99 1.98 1.97 08220-013 NF (dB) 5 08220-010 NF, GAIN, P1dB, OIP3 (dB, dBm) 40 44 FREQUENCY (GHz) Figure 13. OIP3 at POUT =14 dBm/Tone and P1dB vs. Frequency and Temperature Figure 10. Gain, P1dB, OIP3 at POUT =14 dBm/Tone and Noise Figure vs. Frequency 18 44 17 43 1.96GHz 1.99GHz 1.93GHz 16 42 –40°C OIP3 (dBm) GAIN (dB) 15 +25°C 14 +85°C 41 40 13 39 12 1.95 1.96 1.97 1.98 1.99 FREQUENCY (GHz) 37 –10 –8 –6 –4 –2 0 2 4 6 8 10 12 14 16 18 08220-014 1.94 08220-011 10 1.93 1.99 08220-015 38 11 POUT PER TONE (dBm) Figure 11. Gain vs. Frequency and Temperature Figure 14. OIP3 vs. POUT and Frequency 6 0 –5 5 NOISE FIGURE (dB) S-PARAMETERS (dB) S11 –10 S22 –15 –20 +85°C 4 +25°C –40°C 3 –30 1.93 1.94 1.95 1.96 1.97 FREQUENCY (GHz) 1.98 1.99 08220-012 S12 –25 Figure 12. Input Return Loss (S11), Output Return Loss (S22), and Reverse Isolation (S12) vs. Frequency Rev. B | Page 10 of 24 2 1.93 1.94 1.95 1.96 1.97 1.98 FREQUENCY (GHz) Figure 15. Noise Figure vs. Frequency and Temperature Data Sheet ADL5604 50 OIP3 (dBm) 43 32 40 –40°C +25°C 42 31 35 25 20 +25°C 29 GAIN (dB) 15 41 30 –40°C 40 +85°C 28 OIP3 (dBm) P1dB (dBm) P1dB (dBm) 30 +85°C 39 10 2.13 2.14 2.15 2.16 2.17 FREQUENCY (GHz) 26 2.11 2.14 2.13 37 2.17 2.16 2.15 FREQUENCY (GHz) Figure 16. Gain, P1dB, OIP3 at POUT =14 dBm/Tone and Noise Figure vs. Frequency Figure 19. OIP3 at POUT =14 dBm/Tone and P1dB vs. Frequency and Temperature 45 18 17 16 OIP3 (dBm) –40°C 15 +25°C 14 +85°C 13 44 2.17 GHz 43 2.14 GHz 42 2.11 GHz 41 40 39 12 38 11 37 2.12 2.13 2.14 2.15 2.16 2.17 FREQUENCY (GHz) 36 –10 –8 08220-017 10 2.11 2.12 08220-019 2.12 –6 –4 –2 0 2 4 6 8 10 14 12 16 18 POUT PER TONE (dBm) 08220-020 0 2.11 38 27 NF (dB) 5 08220-016 NF, GAIN, P1dB, OIP3 (dB, dBm) 45 GAIN (dB) 44 33 Figure 20. OIP3 vs. POUT and Frequency Figure 17. Gain vs. Frequency and Temperature 0 6 –5 5 NOISE FIGURE (dB) S-PARAMETERS (dB) S11 –10 S22 –15 –20 +85°C +25°C 4 –40°C 3 S12 2.12 2.13 2.14 2.15 FREQUENCY (GHz) 2.16 2.17 Figure 18. Input Return Loss (S11), Output Return Loss (S22), and Reverse Isolation (S12) vs. Frequency Rev. B | Page 11 of 24 2 2.11 2.12 2.13 2.14 2.15 2.16 FREQUENCY (GHz) Figure 21. Noise Figure vs. Frequency and Temperature 2.17 08220-021 –30 2.11 08220-018 –25 ADL5604 Data Sheet 25 50 45 40 PERCENTAGE (%) PERCENTAGE (%) 20 15 10 35 30 25 20 15 5 10 5 41.9 42.0 42.1 42.3 42.4 0 OIP3 (dBm) 3.5 3.6 3.7 3.8 3.9 4.0 4.1 4.2 08220-025 41.8 08220-022 0 4.3 NOISE FIGURE (dB) Figure 25. Noise Figure Distribution at 2140 MHz Figure 22. OIP3 Distribution at 2140 MHz –40 30 –45 –50 –55 20 946MHz ACPR (dBc) PERCENTAGE (%) 25 15 10 –60 –65 –70 –75 SYSTEM –80 5 –85 28.5 28.6 28.7 28.8 28.9 –90 P1dB (dBm) 4 8 10 12 14 16 18 20 20 POUT (dBm) Figure 26. ACPR vs. POUT, 3GPP 3.5 TM1-64 at 946 MHz Figure 23. P1dB Distribution at 2140 MHz 35 –40 30 –45 –50 25 ACPR (dBc) 1966 MHz 20 15 –55 –60 –65 SYSTEM 10 –70 5 14.6 –80 08220-024 GAIN (dB) 14.5 14.4 14.3 14.2 14.1 14.0 13.9 13.8 13.7 0 –75 13.6 PERCENTAGE (%) 6 08220-026 28.4 08220-027 28.3 08220-023 0 0 2 4 6 8 10 12 14 16 18 POUT (dBm) Figure 27. ACPR vs. POUT, 3GPP 3.5 TM1-64 at 1966 MHz Figure 24. Gain Distribution at 2140 MHz Rev. B | Page 12 of 24 Data Sheet ADL5604 –40 7 –45 6 –50 5 –55 4 EVM (%) –60 3 –65 SYSTEM 2 –70 1 –75 0 –10 2 4 6 10 8 12 14 16 18 20 POUT (dBm) 08220-028 –80 0 2140MHz –5 0 5 10 15 20 25 POUT (dBm) Figure 28. ACPR vs. POUT, 3GPP 3.5 TM1-64 at 2140 MHz 08220-031 ACPR (dBc) 2140MHz Figure 31. EVM vs. POUT at 2140 MHz 10 500 9 450 SUPPLY CURRENT (mA) 8 EVM (%) 7 6 5 4 3 400 5.25V 350 5V 300 4.75V 250 200 2 5 10 15 20 25 POUT (dBm) 100 –40 –30 –20 –10 6 400 SUPPLY CURRENT (mA) 420 4 3 2 1966MHz 0 5 30 40 50 60 70 80 380 360 340 +85°C 320 –40°C 300 +25°C 280 10 15 POUT (dBm) 20 25 08220-030 EVM (%) 5 –5 20 Figure 32. Supply Current vs. Supply Voltage and Temperature at 2140 MHz 7 0 –10 10 TEMPERATURE (°C) Figure 29. EVM vs. POUT at 946 MHz 1 0 08220-032 0 260 –6 –4 –2 0 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 POUT (dBm) Figure 33. Supply Current vs. POUT and Temperature, VCC = 5 V at 2140 MHz Figure 30. EVM vs. POUT at1966 MHz Rev. B | Page 13 of 24 08220-133 –5 08220-029 0 –10 150 946MHz 1 ADL5604 Data Sheet 960mV 08220-033 CH1 50mV Ω DS CH2 500mV Ω M10ns 10GS/s A CH2 IT 40ps/pt 25.5ns CH1 50mV Ω DS CH2 500mV Ω M10ns 10GS/s A CH2 IT 40ps/pt 25.5ns Figure 34. Turn-Off Time, 50% of Control Pulse to 50% of RF Burst 960mV 08220-034 1 2 1 2 Figure 35. Turn -On Time, 50% of Control Pulse to 50% of RF Burst Rev. B | Page 14 of 24 Data Sheet ADL5604 APPLICATIONS INFORMATION BASIC LAYOUT CONNECTIONS The basic connections for operating the ADL5604 are shown in Figure 36. 16 RFIN C3 1.3pF C1 0Ω 15 14 13 GND GND GND GND C4 2.7pF 1 RFIN RFOUT 12 2 RFIN RFOUT 11 C5 2.4pF ADL5604 C11 10nF C9 10nF 3 VBIAS RFOUT 10 4 VCC2 RFOUT 9 RFOUT L1 16nH GND GND GND GND C12 0.1µF 5 6 7 R9 0Ω 8 C10 0.1µF VBIAS C2 22pF R6 0Ω L2 OPEN R10 0Ω R8 0Ω C6 10nF VCC2 C7 0.1µF R2 0Ω C8 10µF R5 0Ω VCC1 GND1 NOTE 1 GND2 GND3 R4 OPEN –VS C15 0.1µF R1 301Ω R3 OPEN U2 C14 0.1µF AD8009 VBIAS NOTES 1. THE COMPONENTS CONTAINED INSIDE THE DASHED BOX ARE ONLY REQUIRED IF IT IS DESIRED TO POWER DOWN THE ADL5604. 08220-035 +VS Figure 36. Basic Connections Power Supply The voltage supply for the ADL5604, which ranges from 4.75 V to 5.25 V, should be connected to the VCC1 pin. The dc bias to the output stage is supplied through L1 and is connected to the RFOUT pin. Three decoupling capacitors, C6, C7, and C8, are used to prevent RF signals from propagating on the dc lines. The VBIAS and VCC2 pins are connected to the main supply voltage, VCC1, through the R2 and R5 resistors. Additional decoupling capacitors, C9, C10, C11, and C12, are required on the VCC2 and VBIAS pins. RF Input Interface Pin 1 and Pin 2 are the RF input pins for ADL5604. The RF input is easily matched with two or three components and a microstrip line used as an inductor. If additional inductance is required, C3 can be replaced with an inductor. See the ADL5604 Match section for the component values and spacing for the different frequency bands. RF Output Interface Pin 9 to Pin 12 are used as the RF output pins. The C5 shunt capacitor and the inductance from the microstrip line match RF output to 50 Ω. See the ADL5604 Match section for the component values and spacing for the different frequency bands. Power-Down Circuit Device U2 and its associated circuitry can be used to power down the ADL5604. To connect U2, remove the R2 resistor and place a 0 Ω resistor in place of R4. Rev. B | Page 15 of 24 ADL5604 Data Sheet ADL5604 MATCH The extended length allows the bias inductor to be placed close to the chip, where the impedance is lowest, while allowing a low inductance path to a shunt capacitor to ground. This extra length allows for alternative matching but is also included in the output match at all frequencies. Table 5 and Table 6 detail the component spacing and values for the input and output matching networks for the ADL5604 for the different frequencies. Figure 37 through Figure 42 show the matching networks. The ADL5604 is easily matched with three matching components and a microstrip line used as inductance. If spacing is tight, an external inductor can take the place of the microstrip line. The output match includes a short (76 mils, including the portion that is used as the pad for the chip) non 50 Ω line to accommodate the four output pins and allow for easier low inductance output matching. The pads for Pin 9 to Pin 12 are included on this microstrip line, as well as the pad for the L1 bias inductor. Table 5. Component Spacing Frequency 748 MHz 880 MHz 943 MHz 1960 MHz 2140 MHz 2630 MHz λ1 (mils) 67 75 N/A 35 45 55 λ2 (mils) 348 138 118 N/A 182 182 λ3 (mils) 41 41 41 41 41 41 λ4 (mils) 272 181 220 232 197 126 λ5 (mils) 106 154 95 N/A N/A N/A Table 6. Component Values Frequency 748 MHz 880 MHz 943 MHz 1960 MHz 2140 MHz 2630 MHz C1 (pF) 100 pF 100 pF 100 pF 22 pF 0Ω 22 pF C2 (pF) 100 pF 100 pF 100 pF 22 pF 22 pF 22 pF C3 (pF) 10.0 pF N/A 12.0 pF 0Ω 1.3 pF N/A R1 5.1Ω λ1 C3 10pF C4 20pF λ2 C5 (pF) 7.0 pF 6.0 pF 6.2 pF 2.2 pF 2.4 pF 1.8 pF 16 15 14 13 GND GND GND GND 1 RFIN RFOUT 12 2 RFIN RFOUT 11 ADL5604 RFOUT 10 RFOUT 9 L1 (nH) 16 nH 16 nH 16 nH 16 nH 16 nH 16 nH L2 (nH) N/A 2.4 nH N/A N/A N/A 4.3 nH C5 7pF λ4 λ5 λ3 LOUT 2.7nH Lout (nH) 2.7 nH 3.6 nH 3.0 nH N/A N/A N/A RFOUT C2 100pF L1 16nH 08220-037 RFIN C1 100pF C4 (pF) 20.0 pF 9.0 pF N/A 4.3 pF 2.7 pF 2.2 pF Figure 37. ADL5604 Match Parameters, 748 MHz Rev. B | Page 16 of 24 Data Sheet RFIN ADL5604 C4 9pF C1 100pF λ1 16 15 14 13 GND GND GND GND 1 RFIN RFOUT 12 2 RFIN RFOUT 11 λ2 L2 2.4nH ADL5604 λ5 RFOUT 10 LOUT 3.6nH C2 100pF L1 16nH λ3 9 RFOUT 08220-038 RFOUT C5 6pF λ4 Figure 38. ADL5604 Match Parameters, 880 MHz C1 100pF C3 12 pF 16 15 14 13 GND GND GND GND 1 RFIN RFOUT 12 2 RFIN RFOUT 11 λ2 ADL5604 λ5 RFOUT 10 C2 100pF L1 16nH λ3 9 LOUT 3nH RFOUT 08220-039 RFOUT C5 6.2pF λ4 Figure 39. ADL5604 Match Parameters, 943 MHz RFIN C1 22pF C3 0Ω C4 4.3pF λ1 16 15 14 13 GND GND GND GND 1 RFIN RFOUT 12 2 RFIN RFOUT 11 ADL5604 C5 2.2pF λ4 C2 22pF RFOUT 10 RFOUT 9 RFOUT λ3 L1 16nH 08220-040 RFIN Figure 40. ADL5604 Match Parameters, 1960 MHz Rev. B | Page 17 of 24 ADL5604 RFIN Data Sheet C1 0Ω C3 1.3pF C4 2.7pF λ1 1 RFIN 2 RFIN 16 15 14 13 GND GND GND GND RFOUT 12 λ2 RFOUT 11 C5 2.4pF λ4 ADL5604 C2 22pF RFOUT 10 9 L1 16nH λ3 08220-041 RFOUT RFOUT Figure 41. ADL5604 Match Parameters, 2140 MHz C1 22pF L2 4.3nH C4 2.2pF λ1 λ2 16 15 14 13 GND GND GND GND 1 RFIN RFOUT 12 2 RFIN RFOUT 11 ADL5604 C5 1.8pF λ4 C2 22pF RFOUT 10 RFOUT 9 RFOUT λ3 L1 16nH 08220-042 RFIN Figure 42. ADL5604 Match Parameters, 2630 MHz Rev. B | Page 18 of 24 Data Sheet ADL5604 ACPR AND EVM All adjacent channel power ratio (ACPR) and error vector magnitude (EVM) measurements were made using a single W-CDMA carrier and Test Model 1-64. The signal is generated by a very low ACPR source and is measured at the output by a high dynamic range spectrum analyzer. For ACPR measurements, the filter setting was chosen for low ACPR and for EVM measurements the low EVM setting was selected. The baseline composite EVM for the signal source used was around 0.5%. Highly linear amplifiers were used to measure ACPR and EVM at higher output power levels. Figure 26 shows the plot of ACPR vs. POUT at 946 MHz. Shown on the same plot is the system ACPR. For power levels up to 11 dBm, an ACPR of 65 dBc or better can be achieved. Figure 27 shows the ACPR vs. POUT at 1966 MHz. Shown on the same plot is the system ACPR. For power levels up to 11 dBm, an ACPR of 65 dBc or better can be achieved. Figure 28 shows ACPR vs. POUT at 2140 MHz. Shown on the same plot is the system ACPR. For power levels up to 12 dBm, an ACPR of 65 dBc or better can be achieved. Figure 29 shows the plot of EVM vs. POUT at 946 MHz. The EVM measured is less than 1% for power levels up to 15 dBm. LFCSP. The above thermal resistance numbers assume a minimum of nine thermal vias arranged in a 3 × 3 array with a diameter of 8 mils and a pitch of 16 mils. Because the top and bottom leads of the package are ground, the ground pattern on the evaluation board is extended on the top and bottom to improve thermal efficiency (see the Evaluation Board section). SOLDERING INFORMATION AND RECOMMENDED PCB LAND PATTERN Figure 43 shows the recommended land pattern for the ADL5604. To minimize thermal impedance, the exposed paddle on the 4 mm × 4 mm LFCSP package is soldered down to a ground plane along with Pin 5 to Pin 8 and Pin 13 to Pin 16. To improve thermal dissipation, nine thermal vias are arranged in a 3 × 3 array under the exposed paddle. Areas above and below the paddle are tied with regular vias. If multiple ground layers exist, they should be tied together using vias. For more information on land pattern design and layout, see the AN-772 Application Note, A Design and Manufacturing Guide for the Lead Frame Chip Scale Package (LFCSP). Figure 30 shows the EVM vs. POUT at 1966 MHz. The EVM measured is less than 1% for power levels up to 18 dBm. Figure 31 shows the EVM vs. POUT at 2140 MHz. The EVM measured is less than 1% for power levels up to 18 dBm. 16 When operated in the linear region, there is little or no contribution to EVM by the amplifier. 13 RFIN RFOUT 8 MIL FILLED VIAs THERMAL CONSIDERATIONS THERMAL VIAS For the best thermal performance, it is recommended to add as many thermal vias as possible under the exposed pad of the Rev. B | Page 19 of 24 5 8 16 MIL FILLED VIAs 08220-043 The ADL5604 is packaged in a thermally efficient 4 mm × 4 mm, 16-lead LFCSP. The thermal resistance from junction to air (θJA) is 32.1oC/W. The thermal resistance for the product was extracted assuming a standard 4-layer JEDEC board with nine copper filled thermal vias. The thermal resistance from junction to case (θJC) is 6oC/W where case is the exposed pad of the lead frame package. Figure 43. Recommended Land Pattern ADL5604 Data Sheet EVALUATION BOARD and are included in all matches. Figure 47 shows the close-up image of the recommended output pad. The evaluation board also has hash marks close to the input and output of the ADL5604, separated by 40 mils. The hash mark closest to the input is 127 mils from the chip, and the hash mark closest to the output is 20 mils from the chip. The schematic of the ADL5604 evaluation board is shown in Figure 44. This evaluation board uses 25 mils wide, 50 Ω traces and is made from IS410 material, with a 23 mils gap to ground. The evaluation board is tuned for operation at 2140 MHz. The inputs and outputs should be ac-coupled with appropriately sized capacitors; therefore, for low frequency applications, C1 and C2 may need to be increased. DC bias is provided to the output stage via an inductor connected to the RFOUT pin. A bias voltage of 5 V is recommended. The evaluation board has a short non 50 Ω line on its output to accommodate the four output pins and allow for easier low inductance output matching. The pads for Pin 9 to Pin 12 are included on this microstrip line RFIN 15 16 C3 1.3pF C1 0Ω U2 and its associated circuitry are required only if it is desired to power down the ADL5604. On the evaluation board, it is necessary to remove R2 and install a 0 Ω resistor in the R4 position to enable this feature. 13 14 GND GND GND GND C4 2.7pF 1 RFIN 2 RFIN RFOUT 12 C5 2.4pF RFOUT 11 ADL5604 C11 10nF C9 10nF 3 VBIAS RFOUT 10 4 VCC2 RFOUT 9 RFOUT L1 16nH GND GND GND GND C12 0.1µF 5 6 7 R9 0Ω 8 C10 0.1µF VBIAS C2 22pF R6 0Ω L2 OPEN R10 0Ω R8 0Ω C6 10nF VCC2 C7 0.1µF R2 0Ω C8 10µF R5 0Ω VCC1 GND1 NOTE 1 GND2 GND3 R4 OPEN –VS C15 0.1µF R1 301Ω R3 OPEN U2 C14 0.1µF AD8009 VBIAS NOTES 1. THE COMPONENTS CONTAINED INSIDE THE DASHED BOX ARE ONLY REQUIRED IF IT IS DESIRED TO POWER DOWN THE ADL5604. Figure 44. Evaluation Board, 2140 MHz Rev. B | Page 20 of 24 08220-044 +VS Data Sheet ADL5604 Table 7. Evaluation Board Configuration Options, 2140 MHz C3, C4 C5 L1, L2, R9, R10 C6, C7, C8, C9, C10, C11, C12, C14, C15 R6, R8 R2, R4, R5 U2, R1, R3 Default Value C1 = 0 Ω, C2 = 22 pF C3 = 1.3 pF HQ, C4 = 2.7 pF HQ C5 = 2.4 pF L1 = 16 nH, L2 = open, R9 = 0 Ω, R10 = 0 Ω C6, C9, C11 = 10 nF, C7, C10, C12, C14, C15 = 0.1 μF, C8 = 10 μF R6 = 0 Ω, R8 = 0 Ω R2, R5 = 0 Ω, R4 = open U2 = AD8009, R1 = 3.01 Ω, R3 = open The paddle should be connected to both thermal and electrical ground. 08220-045 Exposed Paddle Function/Notes Input/output dc blocking capacitors at 2140 MHz. C3 provides dc blocking; therefore, a jumper is installed in place of C1. Input matching capacitors. The input match is set for 2140 MHz but is easily changed for other frequencies. C3 is set at a specific distance from C4 so that the microstrip line can act as inductance for part of the match. If space is at a premium, an inductor can take the place of the microstrip line. The ADL5604 is sensitive to the input match; therefore, the tolerance of these components and their placement must be tight. Output matching capacitor. The output match is set for 2140 MHz but is easily changed for other frequencies. The tolerance for this capacitor should be tight. C5 is set at a specific distance from the input; therefore, the microstrip line can act as inductance for part of the match. If space is at a premium, an inductor can take the place of the microstrip line. There is a short length of low impedance line on the output that is embedded in the match. The ADL5604 is less sensitive to the output match than the input match, but the tolerance still must be tight. The main bias for the ADL5604 comes through L1 to its output. L1 should be high impedance for the frequency of operation, while providing low resistance for the dc current. The evaluation board uses a Coilcraft 0603HP-16NX_H inductor. It is a 16 nH inductor, which provides some of the match at 2140 MHz. As the operating frequency gets lower, the inductance must increase, but as the inductance increases, the current is more limited for a 0603 package. R9 and R10 can be removed and L2 added to allow for low frequency operation. L2 has the footprint for a Coilcraft SLC7530D-101MLB (0.4 μH). Power supply decoupling. The need for power supply decoupling capacitance is based on the noise and potential for noise on the power supply. The smallest capacitor should be the closest to the ADL5604. The main bias that goes through RFOUT is the most sensitive to noise because the bias is connected directly to the output. R6 and R8 can be removed to eliminate any parasitic elements of VBIAS and VCC2 if a fast response time is required. The ADL5604 can be shut down using VBIAS alone or VBIAS and VCC2. The ADL5604 has a shutdown current of 13 mA when only VBIAS is used. The shutdown current is < 1 μA if VBIAS and VCC2 are used. However, VCC2 draws 5 mA when biased, setting the current drive capability of the shutdown controller. R2, R4, and R5 allow custom configuration of the shutdown. If VCC2 is used to shut down the ADL5604, 5 mA must be sourced when the part is enabled. U2, R1, and R3 are configured as a buffer to source the 5 mA. 08220-046 Component C1, C2 Figure 46. Evaluation Board Layout, Bottom Side Figure 45. Evaluation Board Layout, Topside Rev. B | Page 21 of 24 ADL5604 Data Sheet 33 MILS 76 MILS 24 MILS 08220-036 90 MILS Figure 47. Evaluation Board Layout, Output Pad Rev. B | Page 22 of 24 Data Sheet ADL5604 OUTLINE DIMENSIONS 4.10 4.00 SQ 3.90 0.60 MAX 1.95 REF 0.60 MAX 13 1 12 3.75 BSC SQ 0.65 BSC 2.25 2.10 SQ 1.95 EXPOSED PAD 9 0.75 0.60 0.50 TOP VIEW 1.00 0.85 0.80 12° MAX 0.80 MAX 0.65 TYP 0.35 0.30 0.25 SEATING PLANE 0.05 MAX 0.02 NOM COPLANARITY 0.08 0.20 REF 4 8 5 BOTTOM VIEW 0.25 MIN FOR PROPER CONNECTION OF THE EXPOSED PAD, REFER TO THE PIN CONFIGURATION AND FUNCTION DESCRIPTIONS SECTION OF THIS DATA SHEET. COMPLIANT TO JEDEC STANDARDS MO-220-VGGC 02-26-2013-B PIN 1 INDICATOR PIN 1 INDICATOR 16 Figure 48. 16-Lead Lead Frame Chip Scale Package [LFCSP_VQ] 4 mm × 4 mm Body, Very Thin Quad (CP-16-4) Dimensions shown in millimeters ORDERING GUIDE Model 1 ADL5604ACPZ-R7 ADL5604-EVALZ 1 Temperature Range −40°C to +85°C Package Description 16-Lead Lead Frame Chip Scale Package [LFCSP_VQ] Evaluation Board Z = RoHS Compliant Part. Rev. B | Page 23 of 24 Package Option CP-16-4 ADL5604 Data Sheet NOTES ©2010–2013 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D08220-0-9/13(B) Rev. B | Page 24 of 24