700 MHz to 1000 MHz, 1 W RF Driver Amplifier ADL5605 14 NC 13 NC 16 NC Operation from 700 MHz to 1000 MHz Gain of 23 dB at 943 MHz OIP3 of 44.2 dBm at 943 MHz P1dB of 30.9 dBm at 943 MHz Noise figure of 4.8 dB at 943 MHz Power supply: 5 V Power supply current: 307 mA typical Internal active biasing Fast power-up/power-down function Compact 4 mm × 4 mm, 16-lead LFCSP ESD rating of ±1 kV (Class 1C) Pin-compatible with the ADL5606 (1800 MHz to 2700 MHz) 15 NC FUNCTIONAL BLOCK DIAGRAM FEATURES 12 RFOUT RFIN 1 PWDN DISABLE 2 VCC 3 11 RFOUT 10 RFOUT VBIAS 9 VBIAS 4 RFOUT 09353-001 NC 8 NC 7 NC 6 NC 5 ADL5605 Figure 1. APPLICATIONS Wireless infrastructure Automated test equipment ISM/AMR applications 0 GENERAL DESCRIPTION –10 The ADL5605 is a broadband, two-stage, 1 W RF driver amplifier that operates over a frequency range of 700 MHz to 1000 MHz. –40 –50 –60 –70 946MHz –80 –90 0 2 4 6 8 10 12 14 16 18 20 22 POUT (dBm) 09353-002 The ADL5605 is fabricated on a GaAs HBT process and is packaged in a compact 4 mm × 4 mm, 16-lead LFCSP that uses an exposed paddle for excellent thermal impedance. The ADL5605 operates from −40°C to +85°C. A fully populated evaluation board tuned to 943 MHz is also available. –30 ACPR (dBc) The ADL5605 operates on a 5 V supply voltage and a supply current of 307 mA. The driver also incorporates a fast powerup/power-down function for TDD applications, applications that require a power saving mode, and applications that intermittently transmit data. –20 Figure 2. ACPR vs. Output Power, 3GPP, TM1-64, at 946 MHz Rev. 0 Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners. One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 www.analog.com Fax: 781.461.3113 ©2011 Analog Devices, Inc. All rights reserved. ADL5605 TABLE OF CONTENTS Features .............................................................................................. 1 943 MHz Frequency Tuning Band ........................................... 10 Applications ....................................................................................... 1 General......................................................................................... 11 General Description ......................................................................... 1 Applications Information .............................................................. 13 Functional Block Diagram .............................................................. 1 Basic Layout Connections ......................................................... 13 Revision History ............................................................................... 2 ADL5605 Matching .................................................................... 14 Specifications..................................................................................... 3 ACPR and EVM ......................................................................... 15 Typical Scattering Parameters ..................................................... 5 Thermal Considerations............................................................ 15 Absolute Maximum Ratings............................................................ 6 Thermal Resistance ...................................................................... 6 Soldering Information and Recommended PCB Land Pattern .......................................................................................... 15 ESD Caution .................................................................................. 6 Evaluation Board ............................................................................ 16 Pin Configuration and Function Descriptions ............................. 7 Outline Dimensions ....................................................................... 18 Typical Performance Characteristics ............................................. 8 Ordering Guide .......................................................................... 18 748 MHz Frequency Tuning Band ............................................. 8 881 MHz Frequency Tuning Band ............................................. 9 REVISION HISTORY 7/11—Revision 0: Initial Version Rev. 0 | Page 2 of 20 ADL5605 SPECIFICATIONS VCC1 = 5 V and TA = 25°C, unless otherwise noted. 1 Table 1. Parameter OVERALL FUNCTION Frequency Range FREQUENCY = 748 MHz ± 20 MHz Gain vs. Frequency vs. Temperature vs. Supply Output 1 dB Compression Point (P1dB) vs. Frequency vs. Temperature vs. Supply Output Third-Order Intercept (OIP3) vs. Frequency vs. Temperature vs. Supply Noise Figure FREQUENCY = 881 MHz ± 13 MHz Gain vs. Frequency vs. Temperature vs. Supply Output 1 dB Compression Point (P1dB) vs. Frequency vs. Temperature vs. Supply Output Third-Order Intercept (OIP3) vs. Frequency vs. Temperature vs. Supply Noise Figure FREQUENCY = 943 MHz ± 18 MHz Gain vs. Frequency vs. Temperature vs. Supply Output 1 dB Compression Point (P1dB) vs. Frequency vs. Temperature vs. Supply Adjacent Channel Power Ratio (ACPR) Output Third-Order Intercept (OIP3) vs. Frequency vs. Temperature vs. Supply Noise Figure Test Conditions/Comments Min Typ 700 ±20 MHz −40°C ≤ TA ≤ +85°C 4.75 V to 5.25 V ±20 MHz −40°C ≤ TA ≤ +85°C 4.75 V to 5.25 V ∆f = 1 MHz, POUT = 14 dBm per tone ±20 MHz −40°C ≤ TA ≤ +85°C 4.75 V to 5.25 V ±13 MHz −40°C ≤ TA ≤ +85°C 4.75 V to 5.25 V ±13 MHz −40°C ≤ TA ≤ +85°C 4.75 V to 5.25 V ∆f = 1 MHz, POUT = 14 dBm per tone ±13 MHz −40°C ≤ TA ≤ +85°C 4.75 V to 5.25 V ±18 MHz −40°C ≤ TA ≤ +85°C 4.75 V to 5.25 V ±18 MHz −40°C ≤ TA ≤ +85°C 4.75 V to 5.25 V POUT = 18 dBm, one-carrier W-CDMA, 64 DPCH, frequency = 946 MHz ∆f = 1 MHz, POUT = 14 dBm per tone ±18 MHz −40°C ≤ TA ≤ +85°C 4.75 V to 5.25 V Rev. 0 | Page 3 of 20 Max Unit 1000 MHz 24.3 +0.01/−0.19 ±0.8 ±0.07 31.4 −0.68/+0.08 +0.94/−1.99 −0.24/−0.05 41.9 −0.22/+0.16 +0.07/−1.56 +0.04/+0.09 4.8 dB dB dB dB dBm dB dB dB dBm dB dB dB dB 23.0 −0.03/−0.08 ±0.7 ±0.05 31.4 −0.18/−0.11 ±0.6 −0.4/+0.3 43.4 −0.32/+0.40 −0.19/−0.99 +0.21/−0.03 4.7 dB dB dB dB dBm dB dB dB dBm dB dB dB dB 23.0 +0.28/−0.04 ±0.8 ±0.04 30.9 +0.39/−0.08 +0.7/−0.9 −0.43/+0.35 51 dB dB dB dB dBm dB dB dB dBc 44.2 −0.47/−0.10 +0.7/−1.6 −0.08/+0.07 4.8 dBm dB dB dB dB ADL5605 Parameter POWER-DOWN INTERFACE Logic Level to Enable Logic Level to Disable DISABLE Pin Current VCC1 Pin Current1 Enable Time Disable Time POWER INTERFACE Supply Voltage Supply Current vs. Temperature 1 Test Conditions/Comments DISABLE pin VDISABLE decreasing VDISABLE increasing VDISABLE = 5 V VDISABLE = 5 V 10% of control pulse to 90% of RFOUT 10% of control pulse to 90% of RFOUT RFOUT pin Min 1.4 4.75 −40°C ≤ TA ≤ +85°C VCC1 is the supply to the DUT through the RFOUT pins. Rev. 0 | Page 4 of 20 Typ Max Unit 0 5 1.4 5.5 75 20 1.1 V V mA mA ns ns 5 307 −20/+1 5.25 385 V mA mA ADL5605 TYPICAL SCATTERING PARAMETERS VCC1 = 5 V and TA = 25°C; the effects of the test fixture have been de-embedded up to the pins of the device. 1 Table 2. Frequency (MHz) 100 150 200 250 300 350 400 450 500 550 600 650 700 750 800 850 900 950 1000 1050 1100 1150 1200 1250 1300 1350 1400 1450 1500 1550 1600 1650 1700 1750 1800 1850 1900 1950 2000 1 S11 Magnitude (dB) −2.38 −2.63 −2.95 −3.50 −4.41 −4.58 −5.11 −6.82 −7.26 −7.66 −8.25 −8.86 −9.58 −10.59 −11.75 −13.27 −15.44 −18.94 −26.34 −26.92 −18.87 −15.30 −13.83 −13.51 −13.68 −14.26 −14.96 −15.76 −16.83 −17.90 −19.28 −20.56 −22.42 −24.45 −26.42 −28.73 −29.99 −29.61 −27.80 Angle (°) 162.05 153.17 144.23 135.13 127.84 124.74 110.20 108.32 106.20 101.35 95.77 89.58 82.66 75.33 66.62 57.13 46.13 29.27 −2.06 −130.02 −171.63 163.88 145.18 129.85 117.81 108.51 99.61 92.58 86.52 79.79 73.87 67.65 60.60 51.72 38.39 21.43 −4.11 −32.34 −55.73 S21 Magnitude (dB) 5.53 14.11 18.99 22.75 25.46 23.14 17.94 22.16 21.56 20.40 19.42 18.55 17.89 17.40 17.07 16.89 16.84 16.93 16.96 16.77 16.17 14.89 13.13 11.09 8.95 6.91 4.91 3.04 1.23 −0.47 −2.09 −3.63 −5.10 −6.53 −7.92 −9.27 −10.56 −11.84 −13.07 Angle (°) 133.84 95.13 67.83 39.76 −7.79 −63.51 −30.49 −61.71 −87.12 −105.19 −118.96 −130.30 −140.88 −150.63 −160.56 −170.83 178.03 165.27 150.36 132.88 113.62 94.11 76.86 62.33 50.66 41.54 33.49 26.87 21.09 16.01 11.40 7.32 3.62 0.23 −3.05 −6.05 −8.66 −11.11 −13.38 VCC1 is the supply to the DUT through the RFOUT pins. Rev. 0 | Page 5 of 20 S12 Magnitude (dB) −48.08 −47.50 −55.96 −55.27 −61.09 −61.80 −52.49 −67.98 −62.64 −61.53 −61.21 −61.13 −59.03 −61.26 −57.17 −56.35 −56.74 −54.82 −52.26 −54.70 −54.77 −53.44 −55.60 −55.37 −57.24 −59.07 −60.44 −61.45 −57.41 −62.00 −56.83 −57.60 −59.47 −58.70 −55.11 −58.19 −61.08 −57.28 −56.29 Angle (°) 12.48 2.17 −119.96 52.76 77.07 140.72 171.89 −27.39 −21.99 34.70 99.93 129.82 107.89 91.70 92.00 107.58 99.86 107.20 73.48 68.96 47.54 43.95 11.97 33.66 20.12 24.50 14.20 45.66 62.21 53.37 57.90 58.62 77.96 76.85 66.53 37.40 43.12 78.91 83.05 S22 Magnitude (dB) −1.30 −0.55 −0.68 −1.24 −1.10 −1.06 −1.15 −1.11 −0.87 −0.92 −0.78 −0.87 −0.87 −0.90 −0.93 −0.93 −0.96 −0.96 −0.98 −0.94 −0.81 −0.76 −0.72 −0.66 −0.68 −0.66 −0.69 −0.63 −0.69 −0.66 −0.69 −0.68 −0.68 −0.67 −0.68 −0.67 −0.68 −0.67 −0.68 Angle (°) −147.53 −172.43 −173.81 −171.76 −176.42 −177.13 −176.29 −177.02 −177.37 −179.14 179.80 179.43 178.46 178.01 177.54 177.22 176.90 176.66 176.43 176.27 176.15 175.49 174.79 173.83 173.19 172.57 171.85 171.46 170.87 170.42 169.98 169.51 168.99 168.59 168.10 167.72 167.18 166.94 166.45 ADL5605 ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE Table 3. Parameter Supply Voltage, VCC11 Input Power (50 Ω Impedance) Internal Power Dissipation (Paddle Soldered) Maximum Junction Temperature Lead Temperature (Soldering 60 sec) Operating Temperature Range Storage Temperature Range 1 Rating 6.5 V 20 dBm 2W 150°C 240°C −40°C to +85°C −65°C to +150°C VCC1 is the supply to the DUT through the RFOUT pins. Table 4 lists the junction-to-air thermal resistance (θJA) and the junction-to-paddle thermal resistance (θJC) for the ADL5605. For more information, see the Thermal Considerations section. Table 4. Thermal Resistance Package Type 16-Lead LFCSP (CP-16-10) ESD CAUTION Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Rev. 0 | Page 6 of 20 θJA 52.1 θJC 12.1 Unit °C/W ADL5605 12 RFOUT 11 RFOUT 10 RFOUT 9 RFOUT 14 NC NOTES 1. THE EXPOSED PADDLE SHOULD BE SOLDERED TO A LOW IMPEDANCE ELECTRICAL AND THERMAL GROUND PLANE. 2. NC = NO CONNECT. DO NOT CONNECT TO THIS PIN. 09353-003 NC 8 NC 7 TOP VIEW (Not to Scale) NC 5 VBIAS 4 ADL5605 NC 6 VCC 3 13 NC PIN 1 INDICATOR RFIN 1 DISABLE 2 15 NC 16 NC PIN CONFIGURATION AND FUNCTION DESCRIPTIONS Figure 3. Pin Configuration Table 5. Pin Function Descriptions Pin No. 1 2 Mnemonic RFIN DISABLE 3 VCC 4 5, 6, 7, 8, 13, 14, 15, 16 9, 10, 11, 12 VBIAS NC RFOUT EP Description RF Input. Requires a dc blocking capacitor. Connect this pin to 5 V to disable the part. In the disabled state, the part draws approximately 5 mA of current from the power supply and 1.4 mA from the DISABLE pin. Under normal operation, this pin is connected to the power supply and draws a combined 307 mA of current. When this pin is grounded along with the VBIAS pin, the device is disabled and draws approximately 1.4 mA from the DISABLE pin. Applying 5 V to this pin enables the bias circuit. When this pin is grounded, the device is disabled. No Connect. Do not connect to this pin. RF Output. DC bias is provided to this pin through an inductor that is connected to the 5 V power supply. The RF path requires a dc blocking capacitor. The exposed paddle should be soldered to a low impedance electrical and thermal ground plane. Rev. 0 | Page 7 of 20 ADL5605 TYPICAL PERFORMANCE CHARACTERISTICS 748 MHZ FREQUENCY TUNING BAND 42 –40°C 38 35 P1dB (dBm) P1dB (dBm) GAIN (dB) 25 20 34 38 –40°C 32 36 +25°C NF (dB) 5 733 738 743 748 34 +85°C 28 10 40 +85°C 30 15 42 +25°C 36 30 44 32 26 753 758 763 768 FREQUENCY (MHz) OIP3 (dBm) 40 OIP3 (dBm) 40 0 728 46 30 24 728 733 738 743 748 753 758 28 768 763 09353-007 45 09353-004 NOISE FIGURE, GAIN, P1dB, OIP3 (dB, dBm) 50 FREQUENCY (MHz) Figure 4. Noise Figure, Gain, P1dB, and OIP3 vs. Frequency (OIP3 at POUT = 14 dBm per Tone) Figure 7. P1dB and OIP3 vs. Frequency and Temperature (OIP3 at POUT = 14 dBm per Tone) 44 28 27 43 768MHz 26 –40°C 42 OIP3 (dBm) GAIN (dB) 25 +25°C 24 +85°C 23 748MHz 728MHz 41 40 22 733 738 743 748 753 758 763 768 FREQUENCY (MHz) 38 –2 09353-005 20 728 0 2 4 6 8 10 12 14 16 18 POUT PER TONE (dBm) Figure 5. Gain vs. Frequency and Temperature 09353-008 39 21 Figure 8. OIP3 vs. POUT and Frequency 0 7 S22 –10 6 NOISE FIGURE (dB) –20 –30 –40 5 +25°C 4 –40°C S12 733 738 743 748 753 758 763 768 FREQUENCY (MHz) 2 728 738 748 758 FREQUENCY (MHz) Figure 9. Noise Figure vs. Frequency and Temperature Figure 6. Input Return Loss (S11), Output Return Loss (S22), and Reverse Isolation (S12) vs. Frequency Rev. 0 | Page 8 of 20 768 09353-009 –60 728 +85°C 3 –50 09353-006 S-PARAMETERS (dB) S11 ADL5605 881 MHZ FREQUENCY TUNING BAND 40 46 +25°C OIP3 (dBm) 45 44 38 40 36 35 42 GAIN (dB) 25 20 15 34 40 –40°C +25°C 38 32 +85°C 30 OIP3 (dBm) P1dB (dBm) 30 36 10 NF (dB) 34 28 5 873 878 883 888 893 FREQUENCY (MHz) 26 32 868 870 872 874 876 878 880 882 884 886 888 890 892 894 09353-013 0 868 FREQUENCY (MHz) Figure 13. P1dB and OIP3 vs. Frequency and Temperature (OIP3 at POUT = 14 dBm per Tone) Figure 10. Noise Figure, Gain, P1dB, and OIP3 vs. Frequency (OIP3 at POUT = 14 dBm per Tone) 45 27 894MHz 26 44 881MHz 25 43 OIP3 (dBm) –40°C 24 GAIN (dB) +85°C –40°C P1dB (dBm) 09353-010 NOISE FIGURE, GAIN, P1dB, OIP3 (dB, dBm) 50 +25°C 23 +85°C 22 868MHz 42 41 21 FREQUENCY (MHz) 39 –2 09353-011 19 868 870 872 874 876 878 880 882 884 886 888 890 892 894 0 2 4 6 8 10 12 14 16 POUT PER TONE (dBm) Figure 11. Gain vs. Frequency and Temperature 18 09353-014 40 20 Figure 14. OIP3 vs. POUT and Frequency 0 7 S22 S11 NOISE FIGURE (dB) 6 –20 –30 –40 873 878 5 +25°C –40°C 4 883 888 893 FREQUENCY (MHz) Figure 12. Input Return Loss (S11), Output Return Loss (S22), and Reverse Isolation (S12) vs. Frequency 2 868 878 888 FREQUENCY (MHz) Figure 15. Noise Figure vs. Frequency and Temperature Rev. 0 | Page 9 of 20 09353-015 –60 868 +85°C 3 S12 –50 09353-012 S-PARAMETERS (dB) –10 ADL5605 943 MHZ FREQUENCY TUNING BAND 40 48 OIP3 (dBm) 38 36 35 44 P1dB (dBm) +85°C P1dB (dBm) 30 GAIN (dB) 25 20 15 42 34 +25°C –40°C 32 40 30 38 +85°C 10 935 940 945 950 955 960 FREQUENCY (MHz) 26 925 930 935 940 945 950 34 960 955 09353-019 930 36 28 NF (dB) 5 0 925 46 +25°C –40°C 40 OIP3 (dBm) 45 09353-016 NOISE FIGURE, GAIN, P1dB, OIP3 (dB, dBm) 50 FREQUENCY (MHz) Figure 19. P1dB and OIP3 vs. Frequency and Temperature (OIP3 at POUT = 14 dBm per Tone) Figure 16. Noise Figure, Gain, P1dB, and OIP3 vs. Frequency (OIP3 at POUT = 14 dBm per Tone) 46 27 26 45 943MHz 25 OIP3 (dBm) GAIN (dB) 44 –40°C 24 +25°C 23 +85°C 22 925MHz 960MHz 43 42 21 930 935 940 945 950 955 960 FREQUENCY (MHz) 40 –2 09353-017 19 925 0 2 4 6 8 10 12 14 16 18 POUT PER TONE (dBm) Figure 17. Gain vs. Frequency and Temperature 09353-020 41 20 Figure 20. OIP3 vs. POUT and Frequency 0 7 S22 –10 6 NOISE FIGURE (dB) –20 –30 –40 S12 –60 925 930 935 940 +85°C 5 +25°C –40°C 4 3 945 950 955 960 FREQUENCY (MHz) Figure 18. Input Return Loss (S11), Output Return Loss (S22), and Reverse Isolation (S12) vs. Frequency 2 925 930 935 940 945 950 955 FREQUENCY (MHz) Figure 21. Noise Figure vs. Frequency and Temperature Rev. 0 | Page 10 of 20 960 09353-021 –50 09353-018 S-PARAMETERS (dB) S11 ADL5605 35 30 30 25 25 20 15 20 15 10 10 5 5 43.7 43.8 43.9 44.0 44.1 44.2 44.3 44.4 44.5 44.6 44.7 44.8 OIP3 (dBm) 0 4.45 40 0 35 –10 4.65 4.70 4.75 4.80 –20 –30 25 ACPR (dBc) 20 15 –40 –50 –60 10 –70 5 946MHz –80 30.6 30.7 30.8 30.9 31.0 31.1 31.2 31.3 31.4 31.5 P1dB (dBm) –90 09353-023 30.5 0 2 4 6 8 10 12 14 16 18 20 22 POUT (dBm) Figure 26. ACPR vs. POUT, 3GPP, TM1-64, at 946 MHz Figure 23. P1dB Distribution at 943 MHz 40 3.5 35 3.0 30 2.5 EVM (%) 25 20 2.0 1.5 15 1.0 10 946MHz 0.5 0 22.7 22.8 22.9 23.0 23.1 23.2 23.3 GAIN (dB) 23.4 09353-024 5 Figure 24. Gain Distribution at 943 MHz 0 –10 –5 0 5 10 15 20 POUT (dBm) Figure 27. EVM vs. POUT, 3GPP, TM1-64, at 946 MHz Rev. 0 | Page 11 of 20 25 09353-027 PERCENTAGE (%) 4.60 Figure 25. Noise Figure Distribution at 943 MHz 30 PERCENTAGE (%) 4.55 NOISE FIGURE (dB) Figure 22. OIP3 Distribution at 943 MHz, 14 dBm per Tone 0 4.50 09353-026 0 09353-025 PERCENTAGE (%) 35 09353-022 PERCENTAGE (%) GENERAL ADL5605 320 SUPPLY CURRENT (mA) 5.25V 5V 310 4.75V 300 3 290 0 10 20 30 40 50 60 70 80 TEMPERATURE (°C) Figure 28. Supply Current vs. Temperature and Supply Voltage at 943 MHz 3 CH3 1V Ω CH2 1V Ω M20ns 10GS/s A CH2 2.5V IT 4ps/pt 09353-029 2 Figure 29. Turn-Off Time, 10% of Control Pulse to 90% of RFOUT Rev. 0 | Page 12 of 20 CH3 1V Ω CH2 1V Ω M20ns 10GS/s A CH2 2.5V IT 4ps/pt 09353-030 280 –40 –30 –20 –10 09353-028 2 Figure 30. Turn-On Time, 10% of Control Pulse to 90% of RFOUT ADL5605 APPLICATIONS INFORMATION For complete information about component values and spacing for the different frequency tuning bands, see the ADL5605 Matching section. BASIC LAYOUT CONNECTIONS The basic connections for operating the ADL5605 are shown in Figure 31. The RF matching components correspond to the 943 MHz frequency tuning band. RF Output Interface Pin 9 to Pin 12 are the RF output pins. Inductor L2, the shunt capacitor, COUT, and the inductance from the microstrip line are used to match the RF output to 50 Ω. For complete information about component values and spacing for the different frequency tuning bands, see the ADL5605 Matching section. Power Supply The voltage supply for the ADL5605, which ranges from 4.75 V to 5.25 V, should be connected to the VCC1 test pin. The dc bias to the output stage is supplied through L1 and is connected to the RFOUT pin. Three decoupling capacitors (C7, C8, and C9) are used to prevent RF signals from propagating on the dc lines. The VBIAS and VCC pins can be directly connected to the main supply voltage. Additional decoupling capacitors (C5, C6, C11, C12, C13, and C14) are required on the VCC and VBIAS pins. Power-Down The ADL5605 can be disabled by connecting the DISABLE pin to 5 V. When disabled, the ADL5605 draws approximately 5 mA of current from the power supply and 1.4 mA from the DISABLE pin. Decoupling Capacitor C3 is recommended to prevent the propagation of RF signals. To completely shut down the device, connect the VCC pin, the VBIAS pin, and the VCC1 test pin to ground. In this state, the part draws approximately 1.4 mA from the DISABLE pin. RF Input Interface Pin 1 is the RF input pin for the ADL5605. The RF input is easily matched to 50 Ω with only one shunt capacitor and the microstrip line used as an inductor. For the 881 MHz and 943 MHz frequency tuning bands, the input requires no external matching components. C1 100pF RFIN C3 10pF DISABLE VCC C11 10µF C6 0.01µF C5 100pF 16 15 14 13 NC NC NC NC 1 RFIN RFOUT 12 2 DISABLE RFOUT 11 3 VCC RFOUT 10 4 VBIAS ADL5605 RFOUT 9 NC NC NC NC 5 6 7 8 COUT 8pF C2 100pF RFOUT L2 1.6nH L1 18nH C7 100pF C8 0.01µF C14 10µF C13 0.01µF C12 100pF C9 10µF VCC1 Figure 31. Basic Connections Rev. 0 | Page 13 of 20 09353-031 VBIAS ADL5605 ADL5605 MATCHING Figure 32 to Figure 34 show the matching networks. The RF input of the ADL5605 can be easily matched to 50 Ω with at most one external component and the microstrip line used as an inductor. The RF output requires one series inductor, one shunt capacitor, and the microstrip line used as an inductor. Table 6 lists the required matching component values. Capacitors CIN and COUT are Murata GRM155 series (0402 size), and Inductor L2 is a Coilcraft® 0603CS series (0603 size). Table 6. Recommended Components for Basic Connections For all frequency tuning bands, the placement of CIN, L2, and COUT is critical. Table 7 lists the recommended component spacing for the various frequency tuning bands. The component spacing is referenced from the center of the component to the edge of the package. Table 7. Matching Component Spacing C1 RFIN 100pF CIN 2.4pF λ1 Frequency (MHz) 728 to 768 868 to 894 925 to 961 CIN (pF) 2.4 N/A N/A Frequency (MHz) 728 to 768 868 to 894 925 to 961 16 15 14 13 NC NC NC NC 1 RFIN RFOUT 12 2 DISABLE RFOUT 11 ADL5605 RFOUT 10 λ2 (mils) 94.5 94.5 94.5 COUT 12pF L2 2.7nH COUT (pF) 12.0 8.0 8.0 RFOUT C2 100pF L1 18nH 9 09353-032 RFOUT λ1 (mils) 63 N/A N/A λ3 λ2 L2 (nH) 2.7 1.6 1.6 Figure 32. ADL5605 Match Parameters, 748 MHz Frequency Tuning Band C1 RFIN 100pF CIN OPEN 16 15 14 13 NC NC NC NC 1 RFIN RFOUT 12 2 DISABLE RFOUT 11 ADL5605 RFOUT 10 λ2 L2 1.6nH RFOUT C2 100pF L1 18nH 9 09353-033 RFOUT COUT 8pF λ3 Figure 33. ADL5605 Match Parameters, 881 MHz Frequency Tuning Band C1 RFIN 100pF 15 14 13 NC NC NC 1 RFIN RFOUT 12 2 DISABLE RFOUT 11 ADL5605 RFOUT 10 RFOUT 9 COUT 8pF λ3 λ2 L2 1.6nH RFOUT C2 100pF L1 18nH 09353-034 CIN OPEN 16 NC Figure 34. ADL5605 Match Parameters, 943 MHz Frequency Tuning Band Rev. 0 | Page 14 of 20 λ3 (mils) 169 268 240 ADL5605 ACPR AND EVM All adjacent channel power ratio (ACPR) and error vector magnitude (EVM) measurements were made using a single W-CDMA carrier and Test Model 1-64. The signal is generated by a very low ACPR source and is measured at the output by a high dynamic range spectrum analyzer. For ACPR measurements, the filter setting was chosen for low ACPR; for EVM measurements, the low EVM setting was selected. The spectrum analyzer incorporates an instrument noise correction function, and highly linear amplifiers were used to boost the power levels for ACPR measurements. Figure 26 shows ACPR vs. POUT at 946 MHz. For power levels up to 18 dBm, an ACPR of 51 dBc or better can be achieved at 946 MHz. Figure 27 shows EVM vs. POUT at 946 MHz. The EVM measured is 0.5% for power levels up to 18 dBm at 946 MHz. The baseline composite EVM for the signal source was approximately 0.5%. When operated in the linear region, there is little or no contribution to EVM by the amplifier. For optimal performance, it is recommended that the thermal vias be filled with a conductive paste of the equivalent thermal conductivity specified earlier in this section; alternatively, an external heat sink can be used to dissipate heat quickly without affecting the die junction temperature. It is also recommended that the ground pattern be extended above and below the device to improve thermal efficiency (see Figure 35). SOLDERING INFORMATION AND RECOMMENDED PCB LAND PATTERN Figure 35 shows the recommended land pattern for the ADL5605. To minimize thermal impedance, the exposed paddle on the 4 mm × 4 mm LFCSP is soldered to a ground plane along with Pin 5 to Pin 8 and Pin 13 to Pin 16. To improve thermal dissipation, 25 thermal vias are arranged in a 5 × 5 array under the exposed paddle. Areas above and below the paddle are tied with regular vias. If multiple ground layers exist, they should be tied together using vias. For more information about land pattern design and layout, see the AN-772 Application Note, A Design and Manufacturing Guide for the Lead Frame Chip Scale Package (LFCSP). THERMAL CONSIDERATIONS For the best thermal performance, it is recommended that as many thermal vias as possible be added under the exposed pad of the LFCSP. The thermal resistance values assume a minimum of 25 thermal vias arranged in a 5 × 5 array with a via diameter of 8 mils, via pad of 16 mils, and a pitch of 20 mils. The vias are plated with copper, and the drill hole is filled with a conductive copper paste. 16 13 RFIN RFOUT 16 MIL VIA PAD WITH 8 MIL VIA 5 8 09353-035 The ADL5605 is packaged in a thermally efficient 4 mm × 4 mm, 16-lead LFCSP. The thermal resistance from junction to air (θJA) is 52.1°C/W. The thermal resistance for the product was extracted assuming a standard 4-layer JEDEC board with 25 copper plated thermal vias. The thermal vias are filled with conductive copper paste (AE3030 with thermal conductivity of 7.8 W/mK and thermal expansion α1 of 4 × 10−5/°C and α2 of 8.6 × 10−5/°C). The thermal resistance from junction to case (θJC) is 12.1°C/W, where the case is the exposed pad of the lead frame package. Figure 35. Recommended Land Pattern Rev. 0 | Page 15 of 20 ADL5605 EVALUATION BOARD The evaluation board has a short, non-50 Ω line on its output to accommodate the four output pins and to allow for easier low inductance output matching. The pads for Pin 9 to Pin 12 are included on this microstrip line and are included in all matches. The evaluation board uses numbers as identifiers to aid in the placement of matching components at both the RF input and RF output of the device. Figure 37 and Figure 38 show images of the board layout. The schematic of the ADL5605 evaluation board is shown in Figure 36. The evaluation board uses 25 mils wide, 50 Ω traces and is made from IS410 material with a 20 mils gap to ground. The evaluation board is tuned for operation at 943 MHz. The inputs and outputs should be ac-coupled with appropriately sized capacitors; therefore, for low frequency applications, the value of C1 and C2 may need to be increased. DC bias is provided to the output stage via an inductor (L1) connected to the RFOUT pin. A bias voltage of 5 V is recommended. C1 100pF CIN N/A C10 OPEN DISABLE C4 OPEN C3 10pF C11 10µF VCC3 R1 0Ω C6 0.01µF 15 14 13 NC NC NC 1 RFIN RFOUT 12 2 DISABLE RFOUT 11 3 VCC RFOUT 10 4 R4 OPEN 16 NC C5 100pF COUT 8pF ADL5605 VBIAS L1 18nH RFOUT 9 NC NC NC NC 5 6 7 8 L2 1.6nH C7 100pF C8 0.01µF VCC2 R5 OPEN C2 100pF RFOUT C14 10µF C13 0.01µF C12 100pF C9 10µF R2 0Ω VCC1 09353-036 RFIN Figure 36. Evaluation Board, 943 MHz Frequency Tuning Band Table 8. Evaluation Board Configuration Options, 943 MHz Frequency Tuning Band Component C1, C2 C3, C4, C5, C6, C7, C8, C9, C10, C11, C12, C13, C14 Function/Notes Input/output dc blocking capacitors. Power supply decoupling capacitors. Power supply decoupling capacitors are required to filter out the high frequency noise on the power supply. The smallest capacitor should be the closest to the ADL5605. The main bias that goes through RFOUT is the most sensitive to noise because the bias is connected directly to the RF output. CIN Input matching capacitor. To match the ADL5605 at the 943 MHz or 881 MHz frequency tuning band, CIN is not required. For the 748 MHz frequency tuning band, CIN is set at a specific distance from the device so that the microstrip line can act as inductance for the matching network (see Table 7). If space is at a premium, an inductor can take the place of the microstrip line. Output matching capacitor. The output match is set for 943 MHz and is easily changed for other frequency tuning bands. The tolerance of this capacitor should be tight. COUT is set at a specific distance from the device so that the microstrip line can act as inductance for the matching network (see Table 7). If space is at a premium, an inductor can take the place of the microstrip line. A short length of low impedance line on the output is embedded in the match. Output matching inductor. The output match is set for 943 MHz and is easily changed for other frequency tuning bands. A high Q Coilcraft inductor with tight tolerance is recommended. The main bias for the ADL5605 comes through L1 to the output stage. L1 should be high impedance for the frequency of operation while providing low resistance for the dc current. The evaluation board uses a Coilcraft 0603HP-18NX_LU inductor; this 18 nH inductor provides some of the match at 943 MHz. To provide bias to all stages through just one supply, set R1 and R2 to 0 Ω, and leave R4 and R5 open. To provide separate bias to stages, set R1 and R2 to open and R4 and R5 to 0 Ω. The paddle should be connected to both thermal and electrical ground. COUT L2 L1 R1, R2, R4, R5 Exposed Paddle Rev. 0 | Page 16 of 20 Default Value C1, C2 = 100 pF C3 = 10 pF C5, C7, C12 = 100 pF C6, C8, C13 = 0.01 μF C9, C11, C14 = 10 μF C4, C10 = open CIN = open COUT = 8.0 pF HQ L2 = 1.6 nH HQ L1 = 18 nH R1, R2 = 0 Ω R4, R5 = open Figure 37. Evaluation Board Layout, Top 09353-038 09353-037 ADL5605 Figure 38. Evaluation Board Layout, Bottom Rev. 0 | Page 17 of 20 ADL5605 OUTLINE DIMENSIONS 4.00 BSC SQ 0.60 MAX 0.60 MAX 13 12° MAX 1.00 0.85 0.80 0.65 BSC TOP VIEW 12 0.50 0.40 0.30 (BOTTOM VIEW) 9 0.80 MAX 0.65 TYP 8 5 4 0.25 MIN 1.95 BSC 0.05 MAX 0.02 NOM SEATING PLANE 2.50 2.35 SQ 2.20 EXPOSED PAD 3.75 BSC SQ 0.35 0.30 0.25 PIN 1 INDICATOR 1 0.20 REF COPLANARITY 0.08 FOR PROPER CONNECTION OF THE EXPOSED PAD, REFER TO THE PIN CONFIGURATION AND FUNCTION DESCRIPTIONS SECTION OF THIS DATA SHEET. COMPLIANT TO JEDEC STANDARDS MO-220-VGGC 082008-A PIN 1 INDICATOR 16 Figure 39. 16-Lead Lead Frame Chip Scale Package [LFCSP_VQ] 4 mm × 4 mm Body, Very Thin Quad (CP-16-10) Dimensions shown in millimeters ORDERING GUIDE Model 1 ADL5605ACPZ-R7 ADL5605-EVALZ 1 Temperature Range −40°C to +85°C Package Description 16-Lead Lead Frame Chip Scale Package [LFCSP_VQ] Evaluation Board Z = RoHS Compliant Part. Rev. 0 | Page 18 of 20 Package Option CP-16-10 ADL5605 NOTES Rev. 0 | Page 19 of 20 ADL5605 NOTES ©2011 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D09353-0-7/11(0) Rev. 0 | Page 20 of 20