LITTELFUSE SP3012

TVS Diode Arrays (SPA™ Family of Products)
Low Capacitance ESD Protection - SP3012 Series
SP3012 Series 0.5pF Rail Clamp Array
RoHS
Pb GREEN
The SP3012 integrates 4 channels of ultra low capacitance
rail-to-rail diodes and an additional zener diode to provide
protection for electronic equipment that may experience
destructive electrostatic discharges (ESD). This robust
device can safely absorb repetitive ESD strikes above the
maximum level specified in the IEC61000-4-2 international
standard (±8kV contact discharge) without performance
degradation. The extremely low loading capacitance also
makes it ideal for protecting high speed signal pins such as
HDMI, USB3.0, USB2.0, and IEEE 1394.
Pinout
Features
6
5
7
4
8
3
9
2
10
t &4%*&$
±12kV contact, ±25kV air
t -PXMFBLBHFDVSSFOUPG
ç"."9
BU7
t &'5*&$"
(tP=5/50ns)
t 4NBMMGPSNGBDUPSç%'/
package saves board
space
t -JHIUOJOH*&$
"UP=8/20μs)
1
t -PXDBQBDJUBODFPGQ'
(TYP) per I/O
*Pins 6, 7, 9, 10 are not internally connected but should be connected to the trace.
Functional Block Diagram
Applications
Pin 1
Pin 2
Pin 4
Pin 5
t-$%1%157T
t4FU5PQ#PYFT
t&YUFSOBM4UPSBHFT
t.PCJMF1IPOFT
t%7%#MVF3BZ1MBZFST
t/PUFCPPLT
t%FTLUPQT
t%JHJUBM$BNFSBT
t.11.1
Application Example for USB3.0
USB Port
GND (Pins 3,8)
USB Controller
VBUS
D+
D-
SP3003
Optional
NC
IC
SSTX+
SSTXGND
SP3012
SSRX+
SSRX*Package is shown as transparent
-JGF4VQQPSU/PUF
Not Intended for Use in Life Support or Life Saving Applications
The products shown herein are not designed for use in life sustaining or life saving
applications unless otherwise expressly indicated.
©2011 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/SPA for current information.
Revision: January 4, 2012
Case GND
Signal GND
SP3012 Series
SP3012
Description
TVS Diode Arrays (SPA™ Family of Products)
Low Capacitance ESD Protection - SP3012 Series
Absolute Maximum Ratings
Parameter
Value
Peak Current (tp=8/20μs)
TOP
T4503
Units
4.0
"
Operating Temperature
-55 to 125
°C
Storage Temperature
-60 to 150
°C
SP3012
Symbol
IPP
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of
the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
Electrical Characteristics (TOP=25ºC)
Parameter
Symbol
Test Conditions
Min
Typ
Max
Units
3FWFSTF4UBOEPGG7PMUBHF
V38.
I3õ˜"
5.0
V
3FWFSTF-FBLBHF$VSSFOU
I-&",
V37"OZ*0UP(/%
1.5
˜"
Clamp Voltage1
IPP"Up˜T'XE
VC
%ZOBNJD3FTJTUBODF
3%:/
&4%8JUITUBOE7PMUBHF1
VESD
1
6.6
V
IPP"Up˜T'XE
7.0
V
(VC2 - VC1) / (IPP2 - IPP1)
0.4
Ω
IEC61000-4-2 (Contact)
±12
kV
*&$"JS
±25
kV
Diode Capacitance
C*0(/%
3FWFSTF#JBT7G.)[
0.5
Q'
Diode Capacitance1
CI/O-/O
3FWFSTF#JBT7G.)[
0.3
Q'
1
/PUF Parameter is guaranteed by design and/or device characterization.
Capacitance vs. Bias Voltage
Insertion Loss (S21) I/O to GND
1.0
0
-3
-6
Attenuation (dB)
Capacitance (pF)
0.8
-9
-12
0.6
-15
-18
0.4
-21
-24
0.2
-27
-30
0.0
0.0
1.0
2.0
3.0
4.0
Bias Voltage (V)
100
5.0
Clamping Voltage vs. IPP
Frequency (MHz)
1000
Pulse Waveform
110%
10.0
100%
90%
8.0
80%
70%
Percent of IPP
Clamp Voltage (V)
6.0
4.0
60%
50%
40%
30%
20%
2.0
10%
0.0
0%
1
2
Current (A)
3
4
0.0
5.0
10.0
15.0
20.0
25.0
30.0
Time (μs)
SP3012 Series
Revision: January 4, 2012
©2011 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/SPA for current information.
TVS Diode Arrays (SPA™ Family of Products)
Low Capacitance ESD Protection - SP3012 Series
Soldering Parameters
1Co'SFFBTTFNCMZ
tP
Pre Heat
- Temperature Min (Ts(min))
150°C
- Temperature Max (Ts(max))
200°C
- Time (min to max) (ts)
60 – 180 secs
Average ramp up rate (Liquidus) Temp
(TL) to peak
3°C/second max
TS(max) to TL - Ramp-up Rate
3°C/second max
Reflow
- Temperature (TL) (Liquidus)
217°C
- Temperature (tL)
60 – 150 seconds
Temperature
TP
TL
TS(max)
tL
Ramp-do
Ramp-down
Preheat
TS(min)
tS
25
time to peak temperature
Peak Temperature (TP)
260+0/-5 °C
Time within 5°C of actual peak
Temperature (tp)
20 – 40 seconds
Ramp-down Rate
6°C/second max
Time 25°C to peak Temperature (TP)
8 minutes Max.
Do not exceed
260°C
Time
Product Characteristics
Part Numbering System
SP 3012 – 04 U T G
Silicon Protection
Array (SPATM)
Family of
TVS Diode Arrays
G= Green
T= Tape & Reel
Series
Number of
Channels
Critical Zone
TL to TP
Ramp-up
Package
μDFN-10 (2.5x1.0mm)
Lead Plating
1SF1MBUFE'SBNF
Lead Material
$PQQFS"MMPZ
Lead Coplanarity
0.0004 inches (0.102mm)
Substitute Material
Silicon
Body Material
Molded Epoxy
Flammability
6-7
/PUFT
"MMEJNFOTJPOTBSFJONJMMJNFUFST
Part Marking System
2. Dimensions include solder plating.
3. Dimensions are exclusive of mold flash & metal burr.
VH4
"MMTQFDJmDBUJPOTDPNQMZUP+&%&$41&$.0*TTVF"
5. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form.
Number of
Product Series
Channels
V = SP3012
Assembly Site
6. Package surface matte finish VDI 11-13.
Ordering Information
Part Number
Package
Marking
Min. Order Qty.
4165(
˜%'/
VH4
3000
©2011 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/SPA for current information.
Revision: January 4, 2012
SP3012 Series
SP3012
SP3010
Reflow Condition
TVS Diode Arrays (SPA™ Family of Products)
Low Capacitance ESD Protection - SP3012 Series
Embossed Carrier Tape & Reel Specification — μDFN-10
Package
P0
Symbol
Millimeters
A0
1.30 +/- 0.10
W
B0
F
D1
5º Max
μDFN-10 (2.5x1.0x0.5mm)
User Feeding Direction
E
D
T
Pin 1 Location
A0
K0
5º Max
B0
2.83 +/- 0.10
D0
Ø 1.50 + 0.10
D1
Ø 1.00 + 0.25
E
1.75 +/- 0.10
F
3.50 +/- 0.05
K0
0.65 +/- 0.10
P0
4.00 +/- 0.10
P1
4.00 +/- 0.10
P2
2.00 +/- 0.05
SP3012
0
P1
P2
T
0.254 +/- 0.02
W
8.00 + 0.30 /- 0.10
Package Dimensions — μDFN-10 (2.5x1.0x0.5mm)
μDFN-10 (2.5x1.0x0.5mm)
Top View
Millimeters
E
Side View
b1
C
Nom
Max
Min
Nom
Max
A
0.48
0.515
0.55
0.019
0.020
0.021
A1
0.00
--
0.05
0.000
b
0.15
0.20
0.25
0.006
0.008
0.012
0.35
0.40
0.45
0.014
0.016
0.018
D
2.40
2.50
2.60
0.094
0.098
0.102
E
0.90
1.00
1.10
0.035
0.039
0.043
0.43
0.012
0.50 BSC
0.30
0.365
Soldering Pad Layout Dimensions
b
0.10 M C A B
0.05 M C
Bottom View
R0.125
3FG
b1
L
0.05 C
0.022
3FG
e
A1 A3
A
Seating
Plane
Min
A3
B
0.05 C
Inches
Symbol
A
D
Inch
Millimeter
C
(0.034)
(0.875)
G
0.008
0.20
P
0.020
0.50
P1
0.039
1.00
X
0.008
0.20
X1
0.016
0.40
Y
0.027
0.675
Y1
(0.061)
(1.55)
Z
0.061
1.55
L
0.020 BSC
0.014
0.016
Recomended
Soldering Pad Layout
P1
P
Y
(Y1)
Z (C) G
X
X1
Alternative
Soldering Pad Layout
P1
2xR0.075mm (7x)
P
e
Y
(Y1)
Z (C) G
X
X1
SP3012 Series
Revision: January 4, 2012
©2011 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/SPA for current information.