TVS Diode Arrays (SPA™ Family of Products) Low Capacitance ESD Protection - SP3012 Series SP3012 Series 0.5pF Rail Clamp Array RoHS Pb GREEN The SP3012 integrates 4 channels of ultra low capacitance rail-to-rail diodes and an additional zener diode to provide protection for electronic equipment that may experience destructive electrostatic discharges (ESD). This robust device can safely absorb repetitive ESD strikes above the maximum level specified in the IEC61000-4-2 international standard (±8kV contact discharge) without performance degradation. The extremely low loading capacitance also makes it ideal for protecting high speed signal pins such as HDMI, USB3.0, USB2.0, and IEEE 1394. Pinout Features 6 5 7 4 8 3 9 2 10 t &4%*&$ ±12kV contact, ±25kV air t -PXMFBLBHFDVSSFOUPG ç"."9 BU7 t &'5*&$" (tP=5/50ns) t 4NBMMGPSNGBDUPSç%'/ package saves board space t -JHIUOJOH*&$ "UP=8/20μs) 1 t -PXDBQBDJUBODFPGQ' (TYP) per I/O *Pins 6, 7, 9, 10 are not internally connected but should be connected to the trace. Functional Block Diagram Applications Pin 1 Pin 2 Pin 4 Pin 5 t-$%1%157T t4FU5PQ#PYFT t&YUFSOBM4UPSBHFT t.PCJMF1IPOFT t%7%#MVF3BZ1MBZFST t/PUFCPPLT t%FTLUPQT t%JHJUBM$BNFSBT t.11.1 Application Example for USB3.0 USB Port GND (Pins 3,8) USB Controller VBUS D+ D- SP3003 Optional NC IC SSTX+ SSTXGND SP3012 SSRX+ SSRX*Package is shown as transparent -JGF4VQQPSU/PUF Not Intended for Use in Life Support or Life Saving Applications The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated. ©2011 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com/SPA for current information. Revision: January 4, 2012 Case GND Signal GND SP3012 Series SP3012 Description TVS Diode Arrays (SPA™ Family of Products) Low Capacitance ESD Protection - SP3012 Series Absolute Maximum Ratings Parameter Value Peak Current (tp=8/20μs) TOP T4503 Units 4.0 " Operating Temperature -55 to 125 °C Storage Temperature -60 to 150 °C SP3012 Symbol IPP CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Electrical Characteristics (TOP=25ºC) Parameter Symbol Test Conditions Min Typ Max Units 3FWFSTF4UBOEPGG7PMUBHF V38. I3õ" 5.0 V 3FWFSTF-FBLBHF$VSSFOU I-&", V37"OZ*0UP(/% 1.5 " Clamp Voltage1 IPP"UpT'XE VC %ZOBNJD3FTJTUBODF 3%:/ &4%8JUITUBOE7PMUBHF1 VESD 1 6.6 V IPP"UpT'XE 7.0 V (VC2 - VC1) / (IPP2 - IPP1) 0.4 Ω IEC61000-4-2 (Contact) ±12 kV *&$"JS ±25 kV Diode Capacitance C*0(/% 3FWFSTF#JBT7G.)[ 0.5 Q' Diode Capacitance1 CI/O-/O 3FWFSTF#JBT7G.)[ 0.3 Q' 1 /PUF Parameter is guaranteed by design and/or device characterization. Capacitance vs. Bias Voltage Insertion Loss (S21) I/O to GND 1.0 0 -3 -6 Attenuation (dB) Capacitance (pF) 0.8 -9 -12 0.6 -15 -18 0.4 -21 -24 0.2 -27 -30 0.0 0.0 1.0 2.0 3.0 4.0 Bias Voltage (V) 100 5.0 Clamping Voltage vs. IPP Frequency (MHz) 1000 Pulse Waveform 110% 10.0 100% 90% 8.0 80% 70% Percent of IPP Clamp Voltage (V) 6.0 4.0 60% 50% 40% 30% 20% 2.0 10% 0.0 0% 1 2 Current (A) 3 4 0.0 5.0 10.0 15.0 20.0 25.0 30.0 Time (μs) SP3012 Series Revision: January 4, 2012 ©2011 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com/SPA for current information. TVS Diode Arrays (SPA™ Family of Products) Low Capacitance ESD Protection - SP3012 Series Soldering Parameters 1Co'SFFBTTFNCMZ tP Pre Heat - Temperature Min (Ts(min)) 150°C - Temperature Max (Ts(max)) 200°C - Time (min to max) (ts) 60 – 180 secs Average ramp up rate (Liquidus) Temp (TL) to peak 3°C/second max TS(max) to TL - Ramp-up Rate 3°C/second max Reflow - Temperature (TL) (Liquidus) 217°C - Temperature (tL) 60 – 150 seconds Temperature TP TL TS(max) tL Ramp-do Ramp-down Preheat TS(min) tS 25 time to peak temperature Peak Temperature (TP) 260+0/-5 °C Time within 5°C of actual peak Temperature (tp) 20 – 40 seconds Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (TP) 8 minutes Max. Do not exceed 260°C Time Product Characteristics Part Numbering System SP 3012 – 04 U T G Silicon Protection Array (SPATM) Family of TVS Diode Arrays G= Green T= Tape & Reel Series Number of Channels Critical Zone TL to TP Ramp-up Package μDFN-10 (2.5x1.0mm) Lead Plating 1SF1MBUFE'SBNF Lead Material $PQQFS"MMPZ Lead Coplanarity 0.0004 inches (0.102mm) Substitute Material Silicon Body Material Molded Epoxy Flammability 6-7 /PUFT "MMEJNFOTJPOTBSFJONJMMJNFUFST Part Marking System 2. Dimensions include solder plating. 3. Dimensions are exclusive of mold flash & metal burr. VH4 "MMTQFDJmDBUJPOTDPNQMZUP+&%&$41&$.0*TTVF" 5. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. Number of Product Series Channels V = SP3012 Assembly Site 6. Package surface matte finish VDI 11-13. Ordering Information Part Number Package Marking Min. Order Qty. 4165( %'/ VH4 3000 ©2011 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com/SPA for current information. Revision: January 4, 2012 SP3012 Series SP3012 SP3010 Reflow Condition TVS Diode Arrays (SPA™ Family of Products) Low Capacitance ESD Protection - SP3012 Series Embossed Carrier Tape & Reel Specification — μDFN-10 Package P0 Symbol Millimeters A0 1.30 +/- 0.10 W B0 F D1 5º Max μDFN-10 (2.5x1.0x0.5mm) User Feeding Direction E D T Pin 1 Location A0 K0 5º Max B0 2.83 +/- 0.10 D0 Ø 1.50 + 0.10 D1 Ø 1.00 + 0.25 E 1.75 +/- 0.10 F 3.50 +/- 0.05 K0 0.65 +/- 0.10 P0 4.00 +/- 0.10 P1 4.00 +/- 0.10 P2 2.00 +/- 0.05 SP3012 0 P1 P2 T 0.254 +/- 0.02 W 8.00 + 0.30 /- 0.10 Package Dimensions — μDFN-10 (2.5x1.0x0.5mm) μDFN-10 (2.5x1.0x0.5mm) Top View Millimeters E Side View b1 C Nom Max Min Nom Max A 0.48 0.515 0.55 0.019 0.020 0.021 A1 0.00 -- 0.05 0.000 b 0.15 0.20 0.25 0.006 0.008 0.012 0.35 0.40 0.45 0.014 0.016 0.018 D 2.40 2.50 2.60 0.094 0.098 0.102 E 0.90 1.00 1.10 0.035 0.039 0.043 0.43 0.012 0.50 BSC 0.30 0.365 Soldering Pad Layout Dimensions b 0.10 M C A B 0.05 M C Bottom View R0.125 3FG b1 L 0.05 C 0.022 3FG e A1 A3 A Seating Plane Min A3 B 0.05 C Inches Symbol A D Inch Millimeter C (0.034) (0.875) G 0.008 0.20 P 0.020 0.50 P1 0.039 1.00 X 0.008 0.20 X1 0.016 0.40 Y 0.027 0.675 Y1 (0.061) (1.55) Z 0.061 1.55 L 0.020 BSC 0.014 0.016 Recomended Soldering Pad Layout P1 P Y (Y1) Z (C) G X X1 Alternative Soldering Pad Layout P1 2xR0.075mm (7x) P e Y (Y1) Z (C) G X X1 SP3012 Series Revision: January 4, 2012 ©2011 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com/SPA for current information.