TVS Diode Arrays (SPA™ Family of Products) Lightning Surge Protection - SP3304N Series SP3304N Series 3.3V 20A Diode Array RoHS Pb GREEN The SP3304N integrates 4 channels of low capacitance diodes with an additional zener diode to protect sensitive I/O pins against lightning induced surge events and ESD. This robust device can safely absorb up to 20A per IEC61000-4-5 (tP=8/20μs) without performance degradation and a minimum ±30kV ESD per IEC61000-4-2 international standard. The low loading capacitance makes the SP4062 ideal for protecting high-speed signal pins. Pinout Features 1 3 5 GND 9 SD, IEC61000-4-2, • E ±30kV contact, ±30kV air • L ow capacitance of 3.5pF (TYP) per I/O • E FT, IEC61000-4-4, 40A (tp=5/50ns) • L ow leakage current of 1µA (MAX) at 3.3V • L ightning, IEC61000-4-5, 20A (tp=8/20µs) 7 Functional Block Diagram 9 Applications 7 5 • 10/100/1000 Ethernet Interfaces • VoIP Phones • Customer Premise Equipment (CPE) • PBX Systems • Set Top Boxes Application Example RJ-45 Connector *Package is shown as transparent Ethernet PHY Tx+ J1 Tx- 1 GND 3 SP3304N PHY Rx+ J8 Rx- Life Support Note: Not Intended for Use in Life Support or Life Saving Applications The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated. ©2012 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com for current information. 1 Revision: August 14, 2012 SP3304N SP3304N Description TVS Diode Arrays (SPA™ Family of Products) Lightning Surge Protection - SP3304N Series Absolute Maximum Ratings Symbol Thermal Information Parameter Value Parameter Units Rating Units -65 to 150 °C Peak Current (tp=8/20μs) 20.0 A PPK Peak Pulse Power (tp=8/20µs) 300 W Maximum Junction Temperature 150 °C TOP Operating Temperature -40 to 85 ºC Maximum Lead Temperature (Soldering 20-40s) 260 °C TSTOR Storage Temperature -50 to 150 °C SP4062 IPP Storage Temperature Range CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Electrical Characteristics (TOP=25ºC) Parameter Symbol Reverse Standoff Voltage VRWM Test Conditions Min Max Units 3.3 V 1.0 µA IPP=1A, tp=8/20µs, Fwd 6.0 V IPP=5A, tp=8/20µs, Fwd 7.0 V IPP=10A, tp=8/20µs, Fwd 8.0 V IPP=20A, tp=8/20µs, Fwd 11.5 V Snap Back Voltage VSB ISB=50mA Reverse Leakage Current ILEAK VR=2.5V, I/O to GND Clamp Voltage1 VC Dynamic Resistance RDYN ESD Withstand Voltage1 VESD Typ 2.8 V 0.5 (VC2-VC1)/(IPP2-IPP1) 0.25 Ω IEC61000-4-2 (Contact) ±30 kV IEC61000-4-2 (Air) ±30 kV Diode Capacitance 1 CI/O-GND Reverse Bias=0V 3.5 Diode Capacitance 1 CI/O-I/O Reverse Bias=0V 2.0 5.0 pF pF Note: 1. Parameter is guaranteed by design and/or device characterization. Pulse Waveform Clamping Voltage vs. IPP 110% 12.0 100% 10.0 90% 8.0 70% Clamp Voltage (VC) Percent of IPP 80% 60% 50% 40% 30% 20% 10% 6.0 4.0 2.0 0.0 0% 0.0 5.0 10.0 15.0 20.0 25.0 30.0 0 Time (μs) SP3304N Series 5 10 15 20 Peak Pulse Current-IPP (A) 2 Revision: August 14, 2012 ©2012 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. TVS Diode Arrays (SPA™ Family of Products) Lightning Surge Protection - SP3304N Series Capacitance vs. Bias Ordering Information 5.0 Part Number Package Marking Min. Order Qty. SP3304NUTG µDFN-10 UH4 3000 SP3304N Capacitance (pF) 4.0 3.0 2.0 1.0 0.0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 Bias Voltage (V) Soldering Parameters Pb – Free assembly Pre Heat - Temperature Min (Ts(min)) 150°C - Temperature Max (Ts(max)) 200°C - Time (min to max) (ts) 60 – 180 secs Average ramp up rate (Liquidus) Temp (TL) to peak 3°C/second max TS(max) to TL - Ramp-up Rate 3°C/second max Reflow - Temperature (TL) (Liquidus) 217°C - Temperature (tL) 60 – 150 seconds 260+0/-5 °C Time within 5°C of actual peak Temperature (tp) 20 – 40 seconds Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (TP) 8 minutes Max. Do not exceed 260°C Pre-Plated Frame Lead Material Copper Alloy Lead Coplanarity 0.0004 inches (0.102mm) Substitute Material Silicon Body Material Molded Epoxy Flammability tL Ramp-do Ramp-down Preheat TS(min) tS time to peak temperature Time Part Numbering System SP 3304N U T G G= Green Silicon Protection Array (SPATM) Family of TVS Diode Arrays Product Characteristics Lead Plating Critical Zone TL to TP Ramp-up TL TS(max) 25 Peak Temperature (TP) tP TP Temperature Reflow Condition T= Tape & Reel Package U= µDFN-10 Series Part Marking System U* 4 Number of Product Series Channels U = SP3304N Assembly Site UL 94 V-0 Notes : 1. All dimensions are in millimeters 2. Dimensions include solder plating. 3. Dimensions are exclusive of mold flash & metal burr. 4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. 5. Package surface matte finish VDI 11-13. ©2012 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com for current information. 3 Revision: August 14, 2012 SP3304N TVS Diode Arrays (SPA™ Family of Products) Lightning Surge Protection - SP3304N Series Package Dimensions — µDFN-10 Top View µDFN-10 (2.6x2.6mm) JEDEC MO-229 Millimeters Symbol A D Package A B Max Min Nom Max 0.45 0.50 0.55 0.018 0.020 0.022 0.130 Ref 0.005 Ref b 0.17 0.22 0.27 0.006 0.008 0.010 D 2.50 2.60 2.70 0.097 0.101 0.105 0.085 D2 2.10 2.15 2.20 0.081 0.083 E 2.50 2.60 2.70 0.097 0.101 0.105 E2 1.21 1.26 1.31 0.046 0.049 0.051 0.45 0.014 0.50 BSC e 0.35 L Side View 0.10 C Nom A3 E Inches Min 0.020 BSC 0.40 0.016 0.018 Recommended Solder Pads µDFN-10L 2.6x2.6mm A3 A Seating Plane 0.05 C C b B 0.10 M C B A Z F G C Bottom View D2 Y 2X C X P Dimension Symbol Millimeters Inches B 2.30 0.091 C 2.20 0.087 F 1.41 0.056 G 1.65 0.065 P 0.50 0.020 X 0.37 0.015 Y 0.55 0.022 Z 2.75 0.108 E2 e Embossed Carrier Tape & Reel Specification — µDFN-10 (2.6x2.6mm) P0 P2 P1 D0 E A0 F T W D1 5º MAX B0 K0 Pin 1 Location 5º MAX Symbol Millimeters A0 2.82 +/- 0.05 B0 2.82 +/- 0.05 D0 Ø1.50 + 0.10 D1 Ø 0.50 + 0.05 E 1.75 +/- 0.10 F 3.50 +/- 0.05 K0 0.76 +/- 0.05 P0 4.00 +/- 0.10 P1 4.00 +/- 0.10 P2 2.00 +/- 0.05 T 0.25 +/- 0.02 W 8.00 + 0.30 /- 0.10 User Feeding Direction SP3304N Series 4 Revision: August 14, 2012 ©2012 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information.