TVS Diode Arrays (SPA® Diodes) Low Capacitance ESD Protection - SP3010 Series SP3010 Series 0.45pF Diode Array RoHS Pb GREEN Description The SP3010 integrates 4 channels of ultra-low capacitance rail-to-rail diodes and an additional zener diode to provide protection for electronic equipment that may experience destructive electrostatic discharges (ESD). This robust device can safely absorb repetitive ESD strikes at the maximum level specified in the IEC61000-4-2 international standard (Level 4, ±8kV contact discharge) without performance degradation. The extremely low loading capacitance also makes it ideal for protecting high speed signal pins such as HDMI, USB3.0, USB2.0, and IEEE 1394. Pinout Features 6 5 7 8 4 3 9 2 10 • Low leakage current of 0.1μA (TYP) at 5V • EFT, IEC61000-4-4, 40A (5/50ns) • Small form factor μDFN( JEDEC MO-229) package saves board space • Lightning, IEC61000-4-5, 3A (tP=8/20μs) 1 *Pins 6, 7, 9, 10 are not internally connected but should be connected to the trace. Functional Block Diagram Pin 1 Pin 2 Pin 4 Pin 5 • ESD, IEC61000-4-2, ±8kV contact, ±15kV air • Low capacitance of 0.45pF (TYP) per I/O Applications GND (Pins 3,8) • LCD/PDP TVs • Set Top Boxes • DVD Players • Mobile Phones • Desktops • Notebooks • MP3/PMP • Digital Cameras Application Example HDMI Port HDMI Chipset Ground Additional Information D2+ D2- Datasheet Resources Samples Outside World SP3010-04 Ground Ground D1+ D1D0+ D0- SP3010-04 Ground CLK+ CLK- * Package is shown as transparent Life Support Note: Not Intended for Use in Life Support or Life Saving Applications The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated. © 2013 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 12/20/13 Case Ground Signal Ground TVS Diode Arrays (SPA® Diodes) Low Capacitance ESD Protection - SP3010 Series Absolute Maximum Ratings Symbol Parameter Value IPP Peak Current (tp=8/20μs) TOP TSTOR Units 3.0 A Operating Temperature –40 to 125 °C Storage Temperature –55 to 150 °C CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Electrical Characteristics (TOP=25ºC) Symbol Test Conditions Reverse Standoff Voltage Parameter VRWM IR ≤ 1µA Reverse Leakage Current ILEAK Clamp Voltage1 VC Dynamic Resistance Max Units 6.0 V 0.5 µA VR=5V, Any I/O to GND 0.1 10.8 V IPP=2A, tp=8/20µs, Fwd 12.3 V (VC2 - VC1) / (IPP2 - IPP1) VESD Diode Capacitance1 Typ IPP=1A, tp=8/20µs, Fwd RDYN ESD Withstand Voltage1 Min 1.5 IEC61000-4-2 (Contact) ±8 IEC61000-4-2 (Air) ±15 CI/O-GND Ω kV kV Reverse Bias=0V 0.45 pF Note: 1 Parameter is guaranteed by design and/or device characterization. Capacitance vs. Bias Voltage Insertion Loss (S21) I/O to GND 0.6 0 -5 Attenuation (dB) I/O Capacitance (pF) 0.5 0.4 0.3 0.2 0.1 -10 -15 -20 -25 0.0 -30 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 10 100 1000 10000 Frequency (MHz) I/O Bias Voltage (V) Clamping Voltage vs. IPP Pulse Waveform 16.0 110% 100% 14.0 90% 80% 10.0 Percent of IPP Clamp Voltage (VC) 12.0 8.0 6.0 70% 60% 50% 40% 30% 4.0 20% 2.0 10% 0% 0.0 1.0 1.5 2.0 Peak Pulse Current-IPP (A) 2.5 3.0 0.0 5.0 10.0 15.0 20.0 25.0 30.0 Time (μs) © 2013 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 12/20/13 TVS Diode Arrays (SPA® Diodes) Low Capacitance ESD Protection - SP3010 Series Soldering Parameters Pb – Free assembly Pre Heat - Temperature Min (Ts(min)) 150°C - Temperature Max (Ts(max)) 200°C - Time (min to max) (ts) 60 – 180 secs Average ramp up rate (Liquidus) Temp (TL) to peak 3°C/second max TS(max) to TL - Ramp-up Rate 3°C/second max Reflow - Temperature (TL) (Liquidus) 217°C - Temperature (tL) 60 – 150 seconds 260+0/-5 °C Time within 5°C of actual peak Temperature (tp) 20 – 40 seconds Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (TP) 8 minutes Max. Do not exceed 260°C SP 3010 04 U T G G= Green T= Tape & Reel Series Number of Channels tL Ramp-do Ramp-down Preheat TS(min) tS time to peak temperature Time Product Characteristics Part Numbering System TVS Diode Arrays (SPA® Diodes) Critical Zone TL to TP Ramp-up TL TS(max) 25 Peak Temperature (TP) tP TP Temperature Reflow Condition Package µDFN-10 (2.5x1.0mm) -04 = 4 Channel Lead Plating Pre-Plated Frame Lead Material Copper Alloy Lead Coplanarity 0.0004 inches (0.102mm) Substitute Material Silicon Body Material Molded Epoxy Flammability UL 94 V-0 Notes : 1. All dimensions are in millimeters Part Marking System 2. Dimensions include solder plating. 3. Dimensions are exclusive of mold flash & metal burr. Q* 4 4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. 5. Package surface matte finish VDI 11-13. Number of Product Series Channels Q = SP3010 Assembly Site Ordering Information Part Number Package Marking Min. Order Qty. SP3010-04UTG µDFN-10 Q*4 3000 © 2013 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 12/20/13 TVS Diode Arrays (SPA® Diodes) Low Capacitance ESD Protection - SP3010 Series Embossed Carrier Tape & Reel Specification — µDFN-10 P0 T User Feeding Direction Package µDFN-10 (2.5x1.0x0.5mm) Symbol Millimeters A0 1.30 ± 0.10 B0 F W E D 0 P1 P2 D1 5º Max Pin 1 Location D K0 Ø 1.50 + 0.10 D1 Ø 1.00 + 0.25 E 1.75 ± 0.10 F 3.50 ± 0.05 0.65 ± 0.10 P0 4.00 ± 0.10 A P1 P2 2.00 ± 0.05 E 5º Max 2.83 ± 0.10 D0 K0 Top View A0 B0 4.00 ± 0.10 T 0.254 ± 0.02 W 8.00 + 0.30 /- 0.10 B Package Dimensions — µDFN-10 (2.5x1.0x0.5mm) Side View 0.05 C Seating Plane A1 A3 A Package Top View Millimeters 0.10 M C A B Min Nom 0.05 M C 0.48 0.515 A A3 B Side View 0.05 C b Max 0.019 0.020 0.021 0.05 0.000 0.022 0.005 Ref R0.125 0.15 0.20 0.25 0.006 0.008 0.012 0.35 0.40 0.45 0.014 0.016 0.018 D LE 2.40 2.50 2.60 0.094 0.098 0.102 0.90 1.00 1.10 0.035 0.039 0.043 0.43 0.012 L 0.50(7x) BSC 2xR0.075mm 0.30 0.365 e Recomended Soldering Pad Layout P1 0.05 M C Y (Y1) Z (C) G Bottom View X 0.020 BSC 0.014 0.016 Soldering Pad Layout Dimensions P X1 Alternative Soldering Pad Layout L Nom 0.55 b 0.10 M C A B R0.125 Min Bottom View0.125 Ref e 0.05 C b1 C -- Inches Max b1 A1 A3 A Seating Plane 0.00 A1 E MO-229 b Symbol A D µDFN-10 0.05 (2.5x1.0x0.5mm) C b1 C JEDEC Inch Millimeter C (0.034) (0.875) G 0.008 0.20 P 0.020 0.50 P1 0.039 1.00 X 0.008 0.20 X1 0.016 0.40 Y 0.027 0.675 Y1 (0.061) (1.55) Z 0.061 1.55 P1 2xR0.075mm (7x) P e Y Recomended Soldering Pad Layout P1 X P Y Z (C) G (Y1) Z (C) G (Y1) X1 © 2013 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 12/20/13