MMBT3906TT1(SC 89)

WILLAS
General Purpose Transistor
1.0A SURFACE MOUNT SCHOTTKY BARRIER RECTIFIERS -20V- 200V
SOD-123+ PACKAGE
FM120-M+
THRU
MMBT3906TT1
FM1200-M+
Pb Free Product
Package outline
Features
• Batch process design, excellent power dissipation offers
better reverse leakage current and thermal resistance.
SOD-123H
• Low profile surface mounted application in order to
optimize
board space.
PNP Silicon
• Low power loss, high efficiency.
FEATURE
current capability, low forward voltage drop.
• High
Circuit Design.
ƽSimplifies
surge capability.
• High
overvoltage
protection.
• Guardring
ƽ RoHSfor
product for packing
code suffix "G"
high-speed
• Ultra Halogen
freeswitching.
product for packing code suffix "H"
• Silicon epitaxial planar chip, metal silicon junction.
INFORMATION
Lead-free parts meet environmental standards of
• ORDERING
MIL-STD-19500
/228 Marking
Device
0.146(3.7)
0.130(3.3)
0.012(0.3) Typ.
0.071(1.8)
0.056(1.4)
Shipping
• RoHS product for packing code suffix "G"
MMBT3906TT1
2A code suffix
3000/Tape
Halogen
free product for packing
"H" & Reel
SC-89
Mechanical data
• Epoxy : UL94-V0 rated flame retardant
MAXIMUM RATINGS
plastic, SOD-123H
• Case : MoldedRating
Symbol ,
• Terminals
:Plated
Collector–Emitterterminals,
Voltage solderable per MIL-STD-750
V CEO
Method
2026
Collector–Base
Voltage
Polarity
: Indicated
by cathode band
Emitter–Base
Voltage
•
CollectorPosition
Current —
Continuous
: Any
• Mounting
• Weight : Approximated 0.011 gram
0.040(1.0)
0.024(0.6)
Value
Unit
0.031(0.8) Typ.
3
COLLECTOR
0.031(0.8) Typ.
V CBO
V EBO
– 40
– 40
– 5.0
Vdc
Vdc
Vdc
IC
– 200
mAdc
Dimensions in inches and (millimeters)
1
BASE
2
EMITTER
THERMAL CHARACTERISTICS
MAXIMUM
RATINGS AND ELECTRICAL
Characteristic
SymbolCHARACTERISTICS
Max
Unit
Total ambient
Device Dissipation
FR–
4 Board(1)
PD
Ratings at 25℃
temperature
unless
otherwise specified.
°C 60Hz, resistive of inductive load.
Single phaseThalf
wave,
A =25
above 25°C
For capacitiveDerate
load, derate
current by 20%
200
mW
1.6
mW/°C
Thermal Resistance
R θJA FM130-MH600
°C/W FM160-MH FM180-MH FM1100-MH FM1150-MH FM1200-MH UNIT
FM140-MH FM150-MH
RATINGS Junction to Ambient SYMBOL FM120-MH
P12D
mW
13 300 14
15
16
18
10
115
120
FR-4 Board
T A = Voltage
25°C
20
30
40
50
60
80
100
150
200
Maximum Recurrent
Peak (2),
Reverse
Volts
VRRM
Derate
above
25°C
2.4
mW/°C
Volts
14
21
28
35
42
56
70
105
140
Maximum RMS Voltage
VRMS
Junction to Ambient VDC
R20
°C/W
θJA
Volts
Maximum DCThermal
BlockingResistance
Voltage
30 400 40
50
60
80
100
150
200
Junction and Storage Temperature
T J , T stg
–55 to +150
°C
Amps
Maximum Average Forward Rectified Current
IO
1.0
Peak Forward
Surge Current
8.3 ms single half sine-wave
DEVICE
MARKING
30
IFSM
Amps
superimposed MMBT3906TT1
on rated load (JEDEC
= 2Amethod)
℃/W
40
Typical Thermal Resistance (Note 2)
RΘJA
PF
120
Typical Junction Capacitance (Note 1)
C
J
ELECTRICAL CHARACTERISTICS (T A = 25°C unless otherwise noted)
-55 to +125
-55 to +150
Operating Temperature Range
TJ
℃
Characteristic
Symbol
Min
Max
Unit
- 65 to +175
Storage Temperature Range
TSTG
℃
Marking CodeTotal Device Dissipation
OFF CHARACTERISTICS
Collector–Emitter Breakdown Voltage (3)
CHARACTERISTICS
V
Vdc
(BR)CEO
SYMBOL FM120-MH FM130-MH FM140-MH FM150-MH FM160-MH FM180-MH FM1100-MH FM1150-MH FM1200-MH UNIT
= –1.0 mAdc,
(I CVoltage
B = 0)
Maximum Forward
at 1.0AIDC
VF
Collector–Base Breakdown Voltage
Maximum Average Reverse Current at @T A=25℃
IR
(I C = –10 µAdc, I E = 0)
@T A=125℃
Rated DC Blocking Voltage
Emitter–Base Breakdown Voltage
(I E = –10 µAdc, I C = 0)
NOTES:
1- Measured at 1 MHZ
applied
reverse voltage of 4.0 VDC.
Baseand
Cutoff
Current
(V CE From
= –30Junction
Vdc, VtoEBAmbient
= –3.0 Vdc)
2- Thermal Resistance
Collector Cutoff Current
(V CE = –30 Vdc, V EB = –3.0 Vdc)
1. FR-4 Minimum Pad.
2. FR-4 1.0 x 1.0 Inch Pad.
0.50
V (BR)CBO
– 40
0.70
– 40
V (BR)EBO
—
0.5
10
0.85
Vdc
0.9
0.92
Volts
mAmp
—
Vdc
– 5.0
—
—
– 50
—
– 50
I BL
nAdc
I CEX
nAdc
3. Pulse Width <300 µs; Duty Cycle <2.0%.
2012-06
2014-01
WILLAS ELECTRONIC CORP.
WILLAS ELECTRONIC CORP.
WILLAS
FM120-M+
THRU
MMBT3906TT1
General
Transistor
FM1200-M+
1.0A
SURFACE Purpose
MOUNT SCHOTTKY
BARRIER RECTIFIERS -20V- 200V
Pb Free Product
SOD-123+ PACKAGE
Package outline
Features
• Batch process design, excellent power dissipation offers
better reverse leakage
current and thermal
resistance.
(T A = 25°C
unless otherwise noted) (Continued)
ELECTRICAL
CHARACTERISTICS
application in order to
• Low profile surface mounted
Characteristic
SOD-123H
Symbol
optimize board space.
(3)
LowCHARACTERISTICS
power loss, high efficiency.
• ON
DC Current
Gain low forward voltage drop.
capability,
• High current
(I
=
–0.1
mAdc,
C
capability. V CE = –1.0 Vdc)
• High surge
(I C = for
–1.0
mAdc, V CE =protection.
–1.0 Vdc)
overvoltage
• Guardring
switching.
• Ultra high-speed
(I C = –10 mAdc,
V CE = –1.0 Vdc)
planar
metal
silicon junction.
• Silicon(Iepitaxial
V chip,
Vdc)
C = –50 mAdc,
CE = –1.0
• Lead-free
(I C =parts
–100 meet
mAdc,environmental
V CE = –1.0 Vdc)standards of
Min
Max
hFE
MIL-STD-19500 /228
Collector–Emitter Saturation Voltage
(I C = –10 mAdc, I B = –1.0 mAdc)
Halogen free product for packing code suffix "H"
(I C = –50 mAdc, I B = –5.0 mAdc)
Mechanical
data
Base–Emitter Saturation Voltage
rated flame retardant
• Epoxy(I: UL94-V0
C = –10 mAdc, I B = –1.0 mAdc)
plastic, SOD-123H
• Case :(IMolded
C = –50 mAdc, I B = –5.0 mAdc)
Unit
0.146(3.7)
0.130(3.3)
––
0.012(0.3) Typ.
60
80
100
60
30
––
––
300
––
––
––
––
– 0.25
– 0.4
– 0.65
––
– 0.85
– 0.95
0.071(1.8)
0.056(1.4)
VCE(sat)
• RoHS product for packing code suffix "G"
V
• Terminals :Plated terminals, solderable per MIL-STD-750
Vdc
Vdc
0.031(0.8) Typ.
,
0.040(1.0)
0.024(0.6)
BE(sat)
0.031(0.8) Typ.
Method CHARACTERISTICS
2026
SMALL–SIGNAL
• Polarity
: Indicated —
byBandwidth
cathode band
Current–Gain
Product
(I
=
–10
mAdc,
V
=
–20
Vdc,
f = 100 MHz)
C
CE
• Mounting Position : Any
Output Capacitance
• Weight : Approximated 0.011 gram
Dimensions
in inches and (millimeters) MHz
fT
250
pF
(V CB= –5.0 Vdc, I E = 0, f = 1.0 MHz)
––
Input
Capacitance
C
ibo
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
(V EB = –0.5 Vdc, I C = 0, f = 1.0 MHz)
––
Ratings at 25℃ ambient
temperature unless otherwise specified.
Input Impedance
h ie
Single phase half wave, 60Hz, resistive of inductive load.
(V = –10 Vdc, I C = –1.0 mAdc, f = 1.0 kHz)
2.0
For capacitive load,CEderate current
by 20%
Voltage Feedback Ratio
h re
FM130-MH FM140-MH FM150-MH FM160-MH FM180-MH
(V CE=RATINGS
–10 Vdc, I C = –1.0 mAdc, f = SYMBOL
1.0 kHz) FM120-MH
0.1
Marking Code
12
13
14
15 h fe 16
18
Small–Signal Current Gain
20
30
40
50
60
Maximum Recurrent
Peak
Reverse
Voltage
V
RRM
(V CE= –10 Vdc, I C = –1.0 mAdc, f = 1.0 kHz)
100 80
14
21
28
35 * h oe 42
56
Maximum RMS Voltage
VRMS
Output Admittance
Maximum DC Blocking
VDC
(V CE=Voltage
–10 Vdc, I C = –1.0 mAdc, f = 1.0
kHz)
20
30
40
Noise
Figure
Maximum Average
Forward
Rectified Current
50
60
NF
IO
(V CE= –5.0Vdc, I C = –100 µAdc, R S =1.0 kΩ, f =1.0kHz)
Peak Forward Surge Current 8.3 ms single half sine-wave
IFSM
SWITCHING
CHARACTERISTICS
Typical Thermal
Resistance
(Note 2)
RΘJA
Typical Junction
Capacitance
(Note 1)(V CC = – 3.0 Vdc, V C
Delay
Time
BEJ= 0.5 Vdc,
Operating Temperature
Rise TimeRange
Storage Temperature Range
Storage Time
IC
TJ–1.0 mAdc)
= –10 mAdc, I B1 =
TSTG
(V CC = –3.0 Vdc, I C = –10 mAdc,
t
d
-55 to +125
td
ts
—
—
—
3.0 80
40
120
4.5
pF
10
kΩ
12
X 10
–4
FM1100-MH FM1150-MH FM1200-MH UNI
10
10
100
400
70
60100
— 115
150
105
µmhos
150
120
200
Volts
140
Volts
200
Volts
dB
1.0
––
30
superimposed on rated load (JEDEC method)
––
C obo
4.0
Amp
Amp
35
35
- 65 to +175
225
℃/W
-55 to +150
PF
ns
ns
℃
℃
t f FM140-MH FM150-MH
— FM160-MH FM180-MH
75
Fall Time
I B1 = I B2 = –1.0 mAdc)
FM1100-MH FM1150-MH FM1200-MH UNIT
CHARACTERISTICS
SYMBOL FM120-MH FM130-MH
Volts
0.9
0.92
VF
0.50
0.70
0.85
3. Pulse Test: Pulse Width <300 µs; Duty Cycle <2.0%.
0.5
Maximum Average Reverse Current at @T A=25℃
IR
mAm
10
@T A=125℃
Rated DC Blocking Voltage
Maximum Forward Voltage at 1.0A DC
NOTES:
1- Measured at 1 MHZ and applied reverse voltage of 4.0 VDC.
2- Thermal Resistance From Junction to Ambient
2012-06
2014-01
WILLAS ELECTRONIC CORP.
WILLAS ELECTRONIC CORP.
WILLAS
FM120-M+
THRU
MMBT3906TT1
General
Transistor
FM1200-M+
1.0A
SURFACE Purpose
MOUNT SCHOTTKY
BARRIER RECTIFIERS -20V- 200V
Pb Free Product
SOD-123+ PACKAGE
Package outline
Features
• Batch process design, excellent power dissipation offers
better reverse leakage current and thermal resistance.
SOD-123H
• Low profile surface mounted application in
3 Vorder to
+ 9.1 V
optimize board space.
Low power loss, high efficiency.
275
High current capability,
low forward voltage drop.
<1 ns
+ 0.5 V
10 k
High surge capability.
•
•
•
0
0
for overvoltage protection.
• Guardring
• Ultra high-speed switching.
C S < 4.0 pF*
– 10.6 Vepitaxial planar300ns
chip, metal silicon junction.
• Silicon
10 < t 1 < 500 µs
environmental
standards of
• Lead-free parts
DUTYmeet
CYCLE
= 2%
DUTY CYCLE = 2%
3V
<1ns
0.146(3.7)
0.130(3.3)
275
0.012(0.3) Typ.
10 k
1N916
t1
C < 4.0 pF*
0.071(1.8)
S
0.056(1.4)
10.9 V
MIL-STD-19500 /228
RoHS product for packing code suffix "G"
*Total shunt capacitance of test jig and connectors
Halogen free product for packing code suffix "H"
•
Figure
1. Delay and Rise Time
Mechanical
data
Figure 2. Storage and Fall Time
Test Circuit
rated flame retardant
• Epoxy : UL94-V0Equivalent
Equivalent Test Circuit
0.040(1.0)
0.024(0.6)
• Case : Molded plastic, SOD-123H
0.031(0.8) Typ.
,
• Terminals :Plated terminals, solderable per MIL-STD-750
TYPICAL TRANSIENT CHARACTERISTICS
Method 2026
• Polarity : Indicated by cathode band
• Mounting Position : Any
• Weight : Approximated 0.011 gram
10.0
Dimensions in inches and (millimeters)
T J = 25°C
T J = 125°C
5000
V CC = 40 V
3000
7.0
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
I C / I B = 10
2000
Ratings 5.0
at 25℃ ambient temperature
C obo unless otherwise specified.
Single phase half wave, 60Hz, resistive of inductive load.
For capacitive load, derate currentCby 20%
Maximum Recurrent Peak Reverse Voltage
VRRM
12
20
Maximum RMS Voltage
VRMS
14
Q, CHARGE (pC)
CAPACITANCE (pF)
Maximum DC Blocking Voltage
VDC
20
ibo
3.0
RATINGS
1000
700
500
SYMBOL FM120-MH FM130-MH FM140-MH FM150-MH FM160-MH FM180-MH FM1100-MH FM1150-MH FM1200-MH UNI
Marking Code
2.0
1.0
Maximum Average
Forward Rectified Current
0.1
0.2 0.3 0.5 0.7 1.0
2.0 3.0
5.0 7.0 10 IO
REVERSE BIAS (VOLTS) Peak Forward Surge Current 8.3 ms single half sine-wave
IFSM
13
30
300
200
14
40
15
Q T 50
16
60
18
80
21
100
28
35
42
30
70
40
50
60
50
20 30 40
1.0
Range
Storage Temperature Range
CHARACTERISTICS
TIME (ns)
Maximum
30
Average
NOTES:
t d@V of
=0V
1- Measured 7at 1 MHZ and applied reverse voltage
OB 4.0 VDC.
2- Thermal Resistance
From
to Ambient
1.0
2.0
3.0Junction
5.0 7.0
10
20
2012-06
2014-01
30
15 V
IR
@T A=125℃
10
5
140
Volt
80
100
150
200
Volt
20
30
50 70 100
Amp
200
Amp
300
℃/W
PF
V CC = 40 V
-55 to +150
I B1 = I B2
℃
- 65 to +175
I C /I B = 20
100
℃
70
SYMBOL FM120-MH FM130-MH FM140-MH FM150-MH FM160-MH FM180-MH FM1100-MH FM1150-MH FM1200-MH UNI
t r @V CC=3.0V
VF
Reverse Current at @T A=25℃
20
Rated DC Blocking
Voltage
t r , FALL TIME (ns)
50
Volt
105
40
120
500
-55 to +125
200
100
70
1.0
5.0 7.0 10
120
200
I C , COLLECTOR
CURRENT (mA)
30
TSTG
Maximum Forward Voltage at 1.0A DC
CIJC /I B = 10
TJ
Typical Junction Capacitance (Note 1)
300
Operating200
Temperature
RΘJA
Typical Thermal
Resistance (Note 2)
500
2.0 3.0
115
150
56
10
100
QA
70
Figure 4. Charge Data
Figure
3. Capacitance
superimposed on rated load (JEDEC
method)
0.031(0.8) Typ.
40 V
2.0 V
50 70 100
50
0.50
0.70
0.9
0.85
30
0.5
20
I C /I B = 10
10
0.92
Volt
mAm
10
7
200
5
1.0
2.0 3.0
5.0 7.0 10
20
30
50 70 100
I C , COLLECTOR CURRENT (mA)
I C , COLLECTOR CURRENT (mA)
Figure 5. Turn–On Time
Figure 6. Fall Time
200
WILLAS ELECTRONIC CORP.
WILLAS ELECTRONIC CORP.
WILLAS
FM120-M+
THRU
MMBT3906TT1
General
Transistor
FM1200-M+
1.0A
SURFACE Purpose
MOUNT SCHOTTKY
BARRIER RECTIFIERS -20V- 200V
Pb Free Product
SOD-123+ PACKAGE
Package outline
Features
TYPICAL AUDIO SMALL–SIGNAL CHARACTERISTICS
• Batch process design, excellent power dissipation offers
NOISE
FIGURE VARIATIONS
better reverse leakage current and thermal
resistance.
SOD-123H
in
order
to
• Low profile surface mounted application
(V CE = – 5.0 Vdc, T A = 25°C, Bandwidth = 1.0 Hz)
optimize board space.
14
C
MIL-STD-19500 /228
0.146(3.7)
0.130(3.3)
f = 1.0 kHz
product for packing code suffix "G"
• RoHS
4
Halogen free product for packing code suffix "H"
SOURCE RESISTANCE= 500Ω
Mechanical
data
2
I C = 100 µA
• Epoxy : UL94-V0 rated flame retardant
0
: Molded
plastic,
SOD-123H
• Case
0.1
0.2 0.4
1.0
2.0
4.0
10
20
40
100
,
• Terminals :Plated terminals, solderable per MIL-STD-750
0.012(0.3) Typ.
I C = 1.0 mA
12
NF, NOISE FIGURE (dB)
NF, NOISE FIGURE (dB)
Low power loss, high efficiency.
• 12
SOURCEcapability,
RESISTANCE=
low200Ω
forward voltage drop.
• High current
I
=
1.0
mA
High surge
capability.
• 10
C
protection.
• Guardring for overvoltage
SOURCE RESISTANCE=
200 Ω
high-speed Iswitching.
• Ultra
8
= 0.5 mA
C
metal silicon junction.
• Silicon epitaxial planar chip,SOURCE
RESISTANCE =1.0kΩ
parts meet environmental standards of
• Lead-free
6
I = 50 µA
I C = 0.5 mA
10
0.071(1.8)
0.056(1.4)
8
6
4
I C = 50 µA
2
I C = 100 µA
0.040(1.0)
0.024(0.6)
0
0.031(0.8) Typ.
0.1
0.2
0.4
f, FREQUENCY
(kHz)
Method
2026
1.0
2.0
4.0
10
20
0.031(0.8) Typ.
40
100
R g, SOURCE RESISTANCE (kΩ)
Figure
7. Noiseband
Figure
• Polarity : Indicated
by cathode
Figure 8.inNoise
Figure
Dimensions
inches and
(millimeters)
h PARAMETERS
• Mounting Position : Any
• Weight : Approximated 0.011 gram (V CE = 10 Vdc, f = 1.0 kHz, T A = 25°C)
300
RATINGS
70
Maximum RMS Voltage
50 Blocking Voltage
Maximum DC
VRRM
12
20
VRMS
14
VDC
20
IO
Peak Forward0.1
Surge Current
8.3 ms
0.2 0.3
0.5single half
1.0 sine-wave
2.0 3.0
IFSM5.0
superimposed on rated load
method)CURRENT (mA)
I C , (JEDEC
COLLECTOR
Typical Thermal ResistanceFigure
(Note 2)9. Current Gain RΘJA
Maximum Average Forward Rectified Current
30
Typical Junction Capacitance (Note 1)
CJ
20
Operating Temperature
Range
TJ
Storage Temperature Range
h ie, INPUT IMPEDANCE (kΩ)
CHARACTERISTICS
5.0
NOTES:
IR
@T A=125℃
0.5
2- Thermal Resistance From Junction to Ambient
0.2
2012-06
2014-01
0.2
0.3
0.5
1.0
16
60
18
80
10
100
115
150
120
200
Volts
28
35
42
56
70
105
140
Volts
40
50
60
80
100
150
200
Volts
1
0.1
1.0
0.2 0.3
0.5 30 1.0
2.0 3.0
5.0
I C , COLLECTOR CURRENT (mA)
40
Figure 10. Output
Admittance
120
-55 to +150
Amp
10
Amp
℃/W
-55 to +125
10
1.0
0.1
2
15
50
1- Measured at 1 MHZ and applied reverse voltage of 4.0 VDC.
30
5
14
40
VF
Maximum Average Reverse Current at @T A=25℃
2.0
21
10
PF
℃
- 65 to +175
7.0
℃
FM140-MH FM150-MH FM160-MH FM180-MH FM1100-MH FM1150-MH FM1200-MH UNIT
SYMBOL FM120-MH FM130-MH5.0
Maximum Forward Voltage at 1.0A DC
Rated DC Blocking Voltage
20
10
TSTG
10
13
30
h re, VOLTAGE FEEDBACK RATIO (X 10 –4 )
Maximum Recurrent Peak Reverse Voltage
50
SYMBOL FM120-MH FM130-MH FM140-MH FM150-MH FM160-MH FM180-MH FM1100-MH FM1150-MH FM1200-MH UNI
Marking Code
100
h oe , OUTPUT ADMITTANCE ( µmhos)
Ratings at 25℃ ambient temperature unless otherwise specified.
Single phase
200 half wave, 60Hz, resistive of inductive load.
For capacitive load, derate current by 20%
h fe, DC CURRENT GAIN
100
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
2.0
3.0
5.0
10
0.50
0.70
3.0
0.9
0.85
0.92
0.5
mAm
10
2.0
Volts
1.0
0.7
0.5
0.1
0.2
0.3
0.5
1.0
2.0
3.0
5.0
I C , COLLECTOR CURRENT (mA)
I C , COLLECTOR CURRENT (mA)
Figure 11. Input Impedance
Figure 12. Voltage Feedback Ratio
10
WILLAS ELECTRONIC CORP.
WILLAS ELECTRONIC CORP.
WILLAS
FM120-M+
THRU
MMBT3906TT1
General
Transistor
FM1200-M+
1.0A
SURFACE Purpose
MOUNT SCHOTTKY
BARRIER RECTIFIERS -20V- 200V
Pb Free Product
SOD-123+ PACKAGE
Package outline
Features
• Batch process design, excellent power dissipation offers
STATIC CHARACTERISTICS
better reverse leakage current andTYPICAL
thermal resistance.
• Low profile surface mounted application in order to
SOD-123H
optimize board space.
2.0 power loss, high efficiency.
• Low
T J drop.
= +125°C
• High current capability, low forward voltage
• High surge capability.
1.0
+25°C
• Guardring for overvoltage protection.
high-speed switching.
• Ultra
0.7
• Silicon epitaxial planar chip, metal silicon junction.–55°C
0.5
parts meet environmental standards of
• Lead-free
h FE , DC CURRENT GAIN (NORMALIZED)
0.146(3.7)
0.130(3.3)
0.012(0.3) Typ.
V CE = 1.0 V
0.071(1.8)
0.056(1.4)
MIL-STD-19500 /228
• RoHS
0.3 product for packing code suffix "G"
Halogen free product for packing code suffix "H"
0.2
Mechanical
data
0.040(1.0)
0.024(0.6)
• Epoxy : UL94-V0 rated flame retardant
0.1 : Molded plastic, SOD-123H
• Case
0.1
0.2
0.3
0.5
0.7
1.0
2.0
3.0,
• Terminals :Plated terminals, solderable per MIL-STD-750
V CE, COLLECTOR EMITTER VOLTAGE (VOLTS)
10
20
30
50
0.031(0.8) Typ.
70
100
T J = 25°C
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
0.8
30 mA
mA
=1.0 mA
Ratings at 25℃ Iambient
temperature unless otherwise 10
specified.
C
Single phase half wave, 60Hz, resistive of inductive load.
0.6
For capacitive load, derate current by 20%
RATINGS
0.4
200
Dimensions in inches and (millimeters)
100 mA
SYMBOL FM120-MH FM130-MH FM140-MH FM150-MH FM160-MH FM180-MH FM1100-MH FM1150-MH FM1200-MH UNI
Marking Code
Maximum Recurrent Peak Reverse Voltage
VRRM
12
20
13
30
14
40
15
50
16
60
18
80
10
100
115
150
120
200
Volt
Maximum RMS Voltage
VRMS
14
21
28
35
42
56
70
105
140
Volt
Maximum DC Blocking Voltage
VDC
20
30
40
50
60
80
100
150
200
Volt
0.2
0
Maximum Average Forward Rectified Current
0.01
0.02
0.03
0.05
0.07
Peak Forward Surge Current 8.3 ms single half sine-wave
superimposed on rated load (JEDEC method)
Operating Temperature
Range
T J = 25°C
1.0
Storage Temperature
Range
V, VOLTAGE ( VOLTS )
VF
IR
@T A=125℃
V CE(sat) @ I C /I B =10
2- Thermal Resistance From Junction to Ambient
2012-06
2014-01
10
5.0
7.0
Amp
10
Amp
40
120
℃/W
PF
-55 to +150
θ VC for V CE(sat)
3.0
℃
- 65 to +175
+25°C TO +125°C
℃
0.50
0.70
– 0.5
0.85
–55°C
TO +25°C
0.5
0.92
Volt
mAm
+25°C TO +125°C
10
–1.0
0.9
–55°C TO +25°C
–1.5
θ VB for V BE(sat)
–2.0
0
5.0
2.0
0
FM150-MH FM160-MH FM180-MH FM1100-MH FM1150-MH FM1200-MH UNI
SYMBOL FM120-MH FM130-MH FM140-MH
1- Measured0.2at 1 MHZ and applied reverse voltage of 4.0 VDC.
2.0
1.0
30
1.0
1.0
0.5
V BE @ V CE =1.0 V
0.6
Maximum Average
Reverse Current at @T A=25℃
1.0
0.7
-55 to +125
TSTG
Maximum Forward Voltage at 1.0A DC
0.4
V BE(sat) @ I C /I B =10 TJ
NOTES:
0.5
CJ
CHARACTERISTICS
Rated DC Blocking Voltage
0.3
I B , BASE CURRENT (mA)
RΘJA
0.8
0.2
Figure 14. Collector Saturation Region
Typical Thermal Resistance (Note 2)
Typical Junction
Capacitance (Note 1)
1.2
IO
0.1
IFSM
COEFFICIENT (mV/ °C)
0.031(0.8) Typ.
Figure 13. DC Current Gain
• Polarity : Indicated by cathode band
• Mounting Position : Any
1.0
• Weight
: Approximated 0.011 gram
7.0
I C , COLLECTOR CURRENT (mA)
Method 2026
5.0
20
50
100
200
0
20
40
60
80
100
120
140
160
180
C , COLLECTOR CURRENT (mA)
I C , COLLECTOR CURRENT (mA)
Figure 15. “ON” Voltages
Figure 16. Temperature Coefficients
200
WILLAS ELECTRONIC CORP.
WILLAS ELECTRONIC CORP.
WILLAS
FM120-M+
THRU
MMBT3906TT1
FM1200-M+
General Purpose Transistor
1.0A SURFACE MOUNT SCHOTTKY BARRIER RECTIFIERS -20V- 200V
SOD-123+ PACKAGE
Pb Free Product
Package outline
Features
• Batch process design, excellent power dissipation offers
Outline Drawing
SC-89
better reverse leakage current and thermal resistance.
SOD-123H
• Low profile surface mounted application in order to
optimize board space.
• Low power loss, high efficiency.
• High current capability, low forward voltage drop.
• High surge capability.
• Guardring for overvoltage protection.
• Ultra high-speed switching.
• Silicon epitaxial planar chip, metal silicon junction.
• Lead-free parts meet environmental standards of
0.146(3.7)
0.130(3.3)
Halogen free product for packing code suffix "H"
Mechanical data
.067(1.70)
.059(1.50)
• Epoxy : UL94-V0 rated flame retardant
• Case : Molded plastic, SOD-123H
,
• Terminals :Plated terminals, solderable per MIL-STD-750
0.031(0.8) Typ.
Method 2026
• Polarity : Indicated by cathode band
• Mounting Position : Any
• Weight : Approximated 0.011 gram
.067(1.70)
.059(1.50)
MIL-STD-19500 /228
.012(0.30)MIN.
0.071(1.8)
0.056(1.4)
• RoHS product for packing code suffix "G"
.040(0.95)
.030(0.75)
0.012(0.3) Typ.
0.040(1.0)
0.024(0.6)
0.031(0.8) Typ.
Dimensions in inches and (millimeters)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
RATINGS
.008(0.20)
13
14
.004(0.10)
30
40
SYMBOL FM120-MH FM130-MH FM140-MH FM150-MH FM160-MH FM180-MH FM1100-MH FM1150-MH FM1200-MH UNIT
Marking Code
Maximum Recurrent Peak Reverse Voltage
VRRM
12
20
Maximum RMS Voltage
VRMS
14
21
VDC
20
30
.043(1.10)
Maximum DC Blocking Voltage
.035(0.90)
Maximum Average Forward Rectified Current
Peak Forward Surge Current 8.3 ms single half sine-wave
superimposed on rated load (JEDEC method)
IO
IFSM
RΘJA
Typical Thermal Resistance (Note 2)
Typical Junction Capacitance (Note 1)
CJ
Operating Temperature Range
TJ
Storage Temperature Range
TSTG
15
50
16
60
18
80
10
100
115
150
120
200
Volts
28
35
42
56
70
105
140
Volts
40
50
60
80
100
150
200
Volts
1.0
30
.031(0.80)
.024(0.60)
Ratings at 25℃ ambient temperature unless otherwise specified.
Single phase half wave, 60Hz, resistive of inductive load.
For capacitive load, derate current by 20%
40
120
-55 to +125
Amps
Amps
℃/W
PF
-55 to +150
℃
- 65 to +175
℃
CHARACTERISTICS
SYMBOL FM120-MH FM130-MH FM140-MH FM150-MH FM160-MH FM180-MH FM1100-MH FM1150-MH FM1200-MH UNIT
VF
Maximum Forward Voltage at 1.0A DC
Maximum Average Reverse Current at @T A=25℃
Rated DC Blocking Voltage
NOTES:
@T A=125℃
IR
0.50
0.70
0.85
0.9
0.92
0.5
Volts
mAmps
10
.013(0.33)
1- Measured at 1 MHZ and applied reverse voltage of 4.0 VDC.
.009(0.23)
2- Thermal Resistance From Junction to Ambient
Dimensions in inches and (millimeters)
2012-06
2014-01
Rev.D
WILLAS ELECTRONIC CORP.
WILLAS ELECTRONIC CORP.
WILLAS
General Purpose Transistor
1.0A SURFACE MOUNT SCHOTTKY BARRIER RECTIFIERS -20V- 200V
SOD-123+
PACKAGE
Features
FM120-M+
THRU
MMBT3906TT1
FM1200-M+
Pb Free Product
Package outline
• Batch process design, excellent power dissipation offers
better reverse leakage current and thermal resistance.
SOD-123H
• Low profile surface mounted application in order to
optimize board space.
0.146(3.7)
• Low power loss, high efficiency.
0.130(3.3)
Device PN Packing • High current capability, low forward voltage drop.
(1)
capability.
• High surge
MMBT3906TT1 G
‐WS Tape&Reel: 3 Kpcs/Reel • Guardring for overvoltage protection.
Note: (1) RoHS product for packing code suffix ”G”;Halogen free product for packing code suffix “H” • Ultra high-speed switching.
epitaxial planar chip, metal silicon junction.
• Silicon
• Lead-free parts meet environmental standards of
MIL-STD-19500 /228
• RoHS product for packing code suffix "G"
Halogen free product for packing code suffix "H"
Ordering Information: 0.012(0.3) Typ.
0.071(1.8)
0.056(1.4)
Mechanical
data
• Epoxy : UL94-V0 rated flame retardant
• Case : Molded plastic, SOD-123H
,
• Terminals :Plated terminals, solderable per MIL-STD-750
0.040(1.0)
0.024(0.6)
0.031(0.8) Typ.
0.031(0.8) Typ.
Method 2026
• Polarity : Indicated by cathode band
• Mounting Position : Any
• Weight : Approximated 0.011 gram
Dimensions in inches and (millimeters)
***Disclaimer*** WILLAS reserves the right to make changes without notice to any product specification herein, to make corrections, modifications, enhancements or other Ratings at 25℃ ambient temperature unless otherwise specified.
changes. WILLAS or anyone on its behalf assumes no responsibility or liability Single phase
half wave, 60Hz, resistive of inductive load.
For
capacitive
load, derate current by 20%
for any errors or inaccuracies. Data sheet specifications and its information SYMBOL FM120-MH FM130-MH FM140-MH FM150-MH FM160-MH FM180-MH FM1100-MH FM1150-MH FM1200-MH UNIT
RATINGS
contained are intended to provide a product description only. "Typical" parameters Marking Code
12
13
14
15
16
18
10
115
120
20
30
40
50
60
80
100
150
200
Maximum Recurrent
Peak
Reverse
Voltage
Volts
V
RRM
which may be included on WILLAS data sheets and/ or specifications can Volts
14
21
28
35
42
56
70
105
140
Maximum RMS Voltage
VRMS
and do vary in different applications and actual performance may vary over time. Volts
Maximum DC Blocking Voltage
20
30
40
50
60
80
100
150
200
VDC
WILLAS does not assume any liability arising out of the application or Amp
Maximum Average
Forward Rectified Current
IO
1.0
use of any product or circuit. Peak Forward
Surge Current 8.3 ms single half sine-wave
30
IFSM
Amp
superimposed
on rated load (JEDEC method)
℃/W
40
Typical Thermal Resistance (Note 2)
RΘJA
WILLAS products are not designed, intended or authorized for use in medical, PF
120
Typical Junction Capacitance (Note 1)
CJ
-55
to
+125
-55
to
+150
Operating Temperature
Range
T
J
℃
life‐saving implant or other applications intended for life‐sustaining or other related - 65 to +175
Storage Temperature Range
TSTG
℃
applications where a failure or malfunction of component or circuitry may directly CHARACTERISTICS
SYMBOL FM120-MH FM130-MH FM140-MH FM150-MH FM160-MH FM180-MH FM1100-MH FM1150-MH FM1200-MH UNIT
or indirectly cause injury or threaten a life without expressed written approval Volts
0.9
Maximum Forward Voltage at 1.0A DC
0.92
VF
0.50
0.70
0.85
of WILLAS. Customers using or selling WILLAS components for use in 0.5
Maximum Average Reverse Current at @T A=25℃
IR
mAmp
10
@T A=125℃
Rated DC Blocking
Voltage
such applications do so at their own risk and shall agree to fully indemnify WILLAS NOTES:
Inc and its subsidiaries harmless against all claims, damages and expenditures. MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
1- Measured at 1 MHZ and applied reverse voltage of 4.0 VDC.
2- Thermal Resistance From Junction to Ambient
2012-06
2014-01
WILLAS ELECTRONIC CORP.
WILLAS ELECTRONIC CORP.