Microcomputer Components 8-Bit CMOS Single-Chip Microcontroller SAB 80C517/80C537 Data Sheet 04.95 High-Performance 8-Bit CMOS Single-Chip Microcontroller SAB 80C517/80C537 Advanced Information SAB 80C517 SAB 80C537 ● ● ● ● ● ● ● Microcontroller with factory mask-programmable ROM Microcontroller for external ROM Versions for 12 MHz and 16 MHz operating frequency 8 K × 8 ROM (SAB 80C517 only) 256 × 8 on-chip RAM Superset of SAB 80C51 architecture: 1 µs instruction cycle time at 12 MHz 750 ns instruction cycle time at 16 MHz 256 directly addressable bits Boolean processor 64 Kbyte external data and program memory addressing Four 16-bit timer/counters Powerful 16-bit compare/capture unit (CCU) with up to 21 high-speed or PWM output channels and 5 capture inputs Versatile "fail-safe" provisions ● ● ● ● ● ● ● ● ● ● Fast 32-bit division, 16-bit 2 multiplication, 32-bit normalize and shift by peripheral MUL/DIV unit (MDU) Eight data pointers for external memory addressing Fourteen interrupt vectors, four priority levels selectable 8-bit A/D converter with 12 multiplexed inputs and programmable ref. voltages Two full duplex serial interfaces Fully upward compatible with SAB 80C515 Extended power saving modes Nine ports: 56 I/O lines, 12 input lines Two temperature ranges available: 0 to 70 oC – 40 to 85 oC Plastic packages: P-LCC-84, P-MQFP-100-2 SAB 80C517/80C537 Semiconductor Group 1 04.95 SAB 80C517/80C537 The SAB 80C517/80C537 is a high-end member of the Siemens SAB 8051 family of microcontrollers. It is designed in Siemens ACMOS technology and based on the SAB 8051 architecture. ACMOS is a technology which combines high-speed and density characteristics with low-power consumption or dissipation. While maintaining all the SAB 80C515 features and operating characteristics the SAB 80C517 is expanded in its arithmetic capabilities, "fail-safe" characteristics, analog signal processing and timer capabilities. The SAB 80C537 is identical with the SAB 80C517 except that it lacks the on-chip program memory. The SAB 80C517/SAB 80C537 is supplied in a 84 pin plastic leaded chip carrier package (P-LCC-84) and in a 100-pin plastic quad metric flat package (P-MQFP-100-2). Ordering Information Type Ordering Code Package Description 8-bit CMOS Microcontroller SAB 80C517-N Q67120-C397 SAB 80C517-M TBD with factory mask-programmaP-MQFP-100-2 ble ROM, 12 MHz SAB 80C537-N Q67120-C452 P-LCC-84 SAB 80C537-M TBD P-MQFP-100-2 SAB 80C517-N-T40/85 Q67120-C483 P-LCC-84 SAB 80C517-M-T40/85 TBD SAB 80C537-N-T40/85 Q67120-C484 SAB 80C537-M-T40/85 TBD for external ROM, 12 MHz, P-MQFP-100-2 ext. temperature – 40 to 85 °C SAB 80C517-N16 Q67120-C723 P-LCC-84 SAB 80C517-M16 TBD SAB 80C537-N16 Q67120-C722 P-LCC-84 SAB 80C537-M16 TBD P-MQFP-100-2 P-LCC-84 for external memory, 12 MHz with factory mask-programmable ROM, 12 MHz, P-MQFP-100-2 ext. temperature – 40 to 85 °C P-LCC-84 with mask-programmable ROM,16 MHz ext. temperature P-MQFP-100-2 – 40 to 110 °C for external memory, 16 MHz SAB 80C517-N16-T40/85 Q67120-C724 P-LCC-84 with mask-programmable ROM, 16 MHz ext. temperature – 40 to 85 °C SAB 80C517-16-N-T40/85 Q67120-C725 P-LCC-84 with factory mask-programmable ROM, 12 MHz Semiconductor Group 2 SAB 80C517/80C537 Logic Symbol Semiconductor Group 3 SAB 80C517/80C537 Pin Configuration (P-LCC-84) Semiconductor Group 4 SAB 80C517/80C537 Pin Configuration (P-MQFP-100-2) Semiconductor Group 5 SAB 80C517/80C537 Pin Definitions and Functions Symbol I/O *) Function Pin Number P-LCC-84 P-MQFP-100-2 P4.0 – P4.7 1– 3, 5 – 9 64 - 66, 68 - 72 I/O Port 4 is a bidirectional I/O port with internal pull-up resistors. Port 4 pins that have 1 s written to them are pulled high by the internal pull-up resistors, and in that state can be used as inputs. As inputs, port 4 pins being externally pulled low will source current (IIL, in the DC characteristics) because of the internal pull-up resistors. This port also serves alternate compare functions. The secondary functions are assigned to the pins of port 4 as follows: – CM0 (P4.0): Compare Channel 0 – CM1 (P4.1): Compare Channel 1 – CM2 (P4.2): Compare Channel 2 – CM3 (P4.3): Compare Channel 3 – CM4 (P4.4): Compare Channel 4 – CM5 (P4.5): Compare Channel 5 – CM6 (P4.6): Compare Channel 6 – CM7 (P4.7): Compare Channel 7 PE/SWD 67 I Power saving modes enable/ Start Watchdog Timer A low level on this pin allows the software to enter the power down, idle and slow down mode. In case the low level is also seen during reset, the watchdog timer function is off on default. Use of the software controlled power saving modes is blocked, when this pin is held on high level. A high level during reset performs an automatic start of the watchdog timer immediately after reset. When left unconnected this pin is pulled high by a weak internal pull-up resistor. * 4 I = Input O = Output Semiconductor Group 6 SAB 80C517/80C537 Pin Definitions and Functions (cont’d) Symbol I/O *) Function Pin Number P-LCC-84 P-MQFP-100-2 RESET 10 73 VAREF 11 78 Reference voltage for the A/D converter. VAGND 12 79 Reference ground for the A/D converter. P7.7 -P7.0 13 - 20 80 - 87 * I I I = Input O = Output Semiconductor Group 7 RESET A low level on this pin for the duration of one machine cycle while the oscillator is running resets the SAB 80C517. A small internal pull-up resistor permits power-on reset using only a capacitor connected to VSS. Port 7 is an 8-bit unidirectional input port. Port pins can be used for digital input, if voltage levels meet the specified input high/low voltages, and for the lower 8-bit of the multiplexed analog inputs of the A/D converter, simultaneously. SAB 80C517/80C537 Pin Definitions and Functions (cont’d) Symbol P3.0 - P3.7 I/O *) Function Pin Number P-LCC-84 P-MQFP-100-2 21 - 28 90 - 97 I/O Port 3 is a bidirectional I/O port with internal pull-up resistors. Port 3 pins that have 1 s written to them are pulled high by the internal pull-up resistors, and in that state can be used as inputs. As inputs, port 3 pins being externally pulled low will source current (IIL, in the DC characteristics) because of the internal pull-up resistors. Port 3 also contains the interrupt, timer, serial port 0 and external memory strobe pins that are used by various options. The output latch corresponding to a secondary function must be programmed to a one (1) for that function to operate. The secondary functions are assigned to the pins of port 3, as follows: – R × D0 (P3.0): receiver data input (asynchronous) or data input/output (synchronous) of serial interface – T × D0 (P3.1): transmitter data output (asynchronous) or clock output (synchronous) of serial interface 0 – INT0 (P3.2): interrupt 0 input/timer 0 gate control – INT1 (P3.3): interrupt 1 input/timer 1 gate control – T0 (P3.4): counter 0 input – T1 (P3.5): counter 1 input – WR (P3.6): the write control signal latches the data byte from port 0 into the external data memory – RD (P3.7): the read control signal enables the external data memory to port 0 * I = Input O = Output Semiconductor Group 8 SAB 80C517/80C537 Pin Definitions and Functions (cont’d) Symbol P1.7 - P1.0 I/O *) Function Pin Number P-LCC-84 P-MQFP-100-2 29 - 36 98 - 100, 1, 6 - 9 I/O Port 1 is a bidirectional I/O port with internal pull-up resistors. Port 1 pins that have 1 s written to them are pulled high by the internal pull-up resistors, and in that state can be used as inputs. As inputs, port 1 pins being externally pulled low will source current (IIL, in the DC characteristics) because of the internal pull-up resistors. It is used for the low order address byte during program verifi-cation. It also contains the interrupt, timer, clock, capture and compare pins that are used by various options. The output latch must be programmed to a one (1) for that function to operate (except when used for the compare functions). The secondary functions are assigned to the port 1 pins as follows: – INT3/CC0 (P1.0): interrupt 3 input/ compare 0 output / capture 0 input – INT4/CC1 (P1.1): interrupt 4 input / compare 1 output /capture 1 input – INT5/CC2 (P1.2): interrupt 5 input / compare 2 output /capture 2 input – INT6/CC3 (P1.3): interrupt 6 input / compare 3 output /capture 3 input – INT2/CC4 (P1.4): interrupt 2 input / compare 4 output /capture 4 input – T2EX (P1.5): timer 2 external reload trigger input – CLKOUT (P1.6): system clock output – T2 (P1.7): counter 2 input * I = Input O = Output Semiconductor Group 9 SAB 80C517/80C537 Pin Definitions and Functions (cont’d) Symbol Pin Number I/O *) Function P-LCC-84 P-MQFP-100-2 XTAL2 39 12 – XTAL2 Input to the inverting oscillator amplifier and input to the internal clock generator circuits. XTAL1 40 13 – XTAL1 Output of the inverting oscillator amplifier. To drive the device from an external clock source, XTAL2 should be driven, while XTAL1 is left unconnected. There are no requirements on the duty cycle of the external clock signal, since the input to the internal clocking circuitry is devided down by a divide-by-two flip-flop. Minimum and maximum high and low times as well as rise/fall times specified in the AC characteristics must be observed. P2.0 - P2.7 41 - 48 14 - 21 I/O Port 2 is a bidirectional I/O port with internal pull-up resistors. Port 2 pins that have 1 s written to them are pulled high by the internal pull-up resistors, and in that state can be used as in-puts. As inputs, port 2 pins being externally pulled low will source current (IIL, in the DC characteristics) because of the internal pull-up resistors. Port 2 emits the highorder address byte during fetches from external program memory and during accesses to external data memory that use 16-bit addresses (MOVX @DPTR). In this application it uses strong internal pull-up resistors when issuing 1 s. During accesses to external data memory that use 8-bit addresses (MOVX @Ri), port 2 issues the contents of the P2 special function register. * I = Input O = Output Semiconductor Group 10 SAB 80C517/80C537 Pin Definitions and Functions (cont’d) Symbol Pin Number I/O *) Function P-LCC-84 P-MQFP-100-2 PSEN 49 22 O The Program Store Enable output is a control signal that enables the external program memory to the bus during external fetch operations. It is activated every six oscillator periodes except during external data memory accesses. Remains high during internal pro-gram execution. ALE 50 23 O The Address Latch Enable output is used for latching the address into external memory during normal operation. It is activated every six oscillator periodes except during an external data memory access EA 51 24 I External Access Enable When held at high level, instructions are fetched from the internal ROM when the PC is less than 8192. When held at low level, the SAB 80C517 fetches all instructions from external program memory. For the SAB 80C537 this pin must be tied low P0.0 - P0.7 52 - 59 26 - 27, 30 - 35 I/O Port 0 is an 8-bit open-drain bidirectional I/O port. Port 0 pins that have 1 s written to them float, and in that state can be used as high-impedance inputs. Port 0 is also the multiplexed low-order address and data bus during accesses to external program or data memory. In this application it uses strong internal pull-up resistors when issuing 1 s. Port 0 also outputs the code bytes during program verification in the SAB 83C517. External pull-up resistors are required during program verification. * I = Input O = Output Semiconductor Group 11 SAB 80C517/80C537 Pin Definitions and Functions (cont’d) Symbol Pin Number I/O *) Function P-LCC-84 P-MQFP-100-2 P5.7 - P5.0 61 - 68 37 - 44 I/O Port 5 is a bidirectional I/O port with internal pull-up resistors. Port 5 pins that have 1 s written to them are pulled high by the internal pull-up resistors, and in that state can be used as inputs. As inputs, port 5 pins being externally pulled low will source current (IIL, in the DC characteristics) because of the internal pull-up resistors. This port also serves the alternate function "Concurrent Compare". The secondary functions are assigned to the port 5 pins as follows: – CCM0 (P5.0): concurrent compare 0 – CCM1 (P5.1): concurrent compare 1 – CCM2 (P5.2): concurrent compare 2 – CCM3 (P5.3): concurrent compare 3 – CCM4(P5.4): concurrent compare 4 – CCM5 (P5.5): concurrent compare 5 – CCM6 (P5.6): concurrent compare 6 – CCM7(P5.7): concurrent compare 7 OWE 69 45 I Oscillator Watchdog Enable A high level on this pin enables the oscillator watchdog. When left unconnected this pin is pulled high by a weak internal pull-up resistor. When held at low level the oscillator watchdog function is off. * I = Input O = Output Semiconductor Group 12 SAB 80C517/80C537 Pin Definitions and Functions (cont’d) Symbol P6.0 - P6.7 Pin Number P-LCC-84 P-MQFP-100-2 70 - 77 46 - 50, 54 - 56 I/O *) Function I/O Port 6 is a bidirectional I/O port with internal pull-up resistors. Port 6 pins that have 1 s written to them are pulled high by the internal pull-up resistors, and in that state can be used as inputs. As inputs, port 6 pins being externally pulled low will source current (IIL, in the DC characteristics) because of the internal pull-up resistors. Port 6 also contains the external A/D converter control pin and the transmit and receive pins for serial channel 1. The output latch corresponding to a secondary function must be programmed to a one (1) for that function to operate. The secondary functions are assigned to the pins of port 6, as follows: – ADST (P6.0): external A/D converter start pin – R × D1 (P6.1): receiver data input of serial interface 1 – T × D1 (P6.2): transmitter data output of serial interface 1 P8.0 - P8.3 * 78 - 81 57 - 60 I I = Input O = Output Semiconductor Group 13 Port 8 is a 4-bit unidirectional input port. Port pins can be used for digital input, if voltage levels meet the specified input high/low voltages, and for the higher 4-bit of the multiplexed analog inputs of the A/D converter, simultaneously SAB 80C517/80C537 Pin Definitions and Functions (cont’d) Symbol Pin Number I/O *) Function P-LCC-84 P-MQFP-100-2 RO 82 61 O Reset Output This pin outputs the internally synchronized reset request signal. This signal may be generated by an external hardware reset, a watchdog timer reset or an oscillator watch-dog reset. The reset output is active low. VSS 37,60, 83 10, 62 – Circuit ground potential VCC 38,84 11, 63 – Supply Terminal for all operating modes N.C. – 2 - 5, 25, 28 - 29, 36, 51 - 53, 74 - 77; 88 - 89 – Not connected * I = Input O = Output Semiconductor Group 14 SAB 80C517/80C537 Figure 1 Block Diagram Semiconductor Group 15 SAB 80C517/80C537 Functional Description The SAB 80C517 is based on 8051 architecture. It is a fully compatible member of the Siemens SAB 8051/80C51 microcontroller family being a significantly enhanced SAB 80C515. The SAB 80C517 is therefore 100 % compatible with code written for the SAB 80C515. CPU Having an 8-bit CPU with extensive facilities for bit-handling and binary BCD arithmetics the SAB 80C517 is optimized for control applications. With a 12 MHz crystal, 58% of the instructions execute in 1 µs. Being designed to close the performance gap to the 16-bit microcontroller world, the SAB 80C517’s CPU is supported by a powerful 32-/16-bit arithmetic unit and a more flexible addressing of external memory by eight 16-bit datapointers. Memory Organisation According to the SAB 8051 architecture, the SAB 80C517 has separate address spaces for program and data memory. Figure 2 illustrates the mapping of address spaces. Figure 2 Memory Mapping Semiconductor Group 16 SAB 80C517/80C537 Program Memory The SAB 80C517 has 8 KByte of on-chip ROM, while the SAB 80C537 has no internal ROM. The program memory can externally be expanded up to 64 Kbyte. Pin EA controls whether program fetches below address 2000H are done from internal or external memory. Data Memory The data memory space consists of an internal and an external memory space. External Data Memory Up to 64 KByte external data memory can be addressed by instructions that use 8-bit or 16-bit indirect addressing. For 8-bit addressing MOVX instructions utilizing registers R0 and R1 can be used. A 16-bit external memory addressing is supported by eight 16-bit datapointers. Multiple Datapointers As a functional enhancement to standard 8051 controllers, the SAB 80C517 contains eight 16-bit datapointers. The instruction set uses just one of these datapointers at a time. The selection of the actual datapointers is done in special function register DPSEL (data pointer select, addr. 92H). Figure 3 illustrates the addressing mechanism. Internal Data Memory The internal data memory is divided into three physically distinct blocks: – the lower 128 bytes of RAM including four banks of eight registers each – the upper 128 byte of RAM – the 128 byte special function register area. A mapping of the internal data memory is also shown in figure 2. The overlapping address spaces are accessed by different addressing modes. The stack can be located anywhere in the internal data memory. Semiconductor Group 17 SAB 80C517/80C537 Figure 3 Addressing of External Data Memory Semiconductor Group 18 SAB 80C517/80C537 Special Function Registers All registers, except the program counter and the four general purpose register banks, reside in the special function register area. The 81 special function registers include arithmetic registers, pointers, and registers that provide an interface between the CPU and the on-chip peripherals. There are also 128 directly addressable bits within the SFR area. The special function registers are listed in table 1. In this table they are organized in groups which refer to the functional blocks of the SAB 80C517. Block names and symbols are listed in alphabetical order. Table 1 Special Function Register Address Register Name Register Contents after Reset CPU ACC B DPH DPL DPSEL PSW SP Accumulator B-Register Data Pointer, High Byte Data Pointer, Low Byte Data Pointer Select Register Program Status Word Register Stack Pointer 0E0H 1) 0F0H 1) 83H 82H 92H 0D0H 1) 81H 00H 00H 00H 00H XXXX.X000B 3) 00H 07H A/DConverter ADCON0 ADCON1 ADDAT DAPR A/D Converter Control Register 0 A/D Converter Control Register 1 A/D Converter Data Register D/AConverter Program Register 0D8H 1) 0DCH 0D9H 0DAH 00H XXXX.0000B 3) 00H 00H Interrupt System IEN0 CTCON 2) IEN1 IEN2 IP0 IP1 IRCON TCON 2) T2CON 2) Interrupt Enable Register 0 Com. Timer Control Register Interrupt Enable Register 1 Interrupt Enable Register 2 Interrupt Priority Register 0 Interrupt Priority Register 1 Interrupt Request Control Register Timer Control Register Timer 2 Control Register 0A8H 1) 0E1H 0B8H 1) 9AH 0A9H 0B9H 0C0H 1) 88H 1) 0C8H 00H 0XXX.0000B 00H XXXX.00X0B 3) 00H XX00 0000B 00H 00H 00H 1) 2) 3) Bit-addressable special function registers This special function register is listed repeatedly since some bits of it also belong to other functional blocks. X means that the value is indeterminate and the location is reserved Semiconductor Group 19 SAB 80C517/80C537 Table 1 Special Function Register (cont’d) Address Register Name Register Contents after Reset MUL/DIV Unit ARCON MD0 MD1 MD2 MD3 MD4 MD5 Arithmetic Control Register Multiplication/Division Register 0 Multiplication/Division Register 1 Multiplication/Division Register 2 Multiplication/Division Register 3 Multiplication/Division Register 4 Multiplication/Division Register 5 0EFH 0E9H 0EAH 0EBH 0ECH 0EDH 0EEH 0XXX.XXXXB3) XXH3) XXH3) XXH3) XXH3) XXH3) XXH3) 1) 2) 3) Bit-addressable special function registers This special function register is listed repeatedly since some bits of it also belong to other functional blocks. X means that the value is indeterminate and the location is reserved Semiconductor Group 20 SAB 80C517/80C537 Table 1 Special Function Register (cont’d) Address Register Name Register Contents after Reset Compare/ CaptureUnit (CCU) CCEN CC4EN CCH1 CCH2 CCH3 CCH4 CCL1 CCL2 CCL3 CCL4 CMEN CMH0 CMH1 CMH2 CMH3 CMH4 CMH5 CMH6 CMH7 CML0 CML1 CML2 CML3 CML4 CML5 CML6 CML7 CMSEL CRCH CRCL CTCON CTRELH CTRELL TH2 TL2 T2CON Comp./Capture Enable Reg. Comp./Capture Enable 4 Reg. Comp./Capture Reg. 1, High Byte Comp./Capture Reg. 2, High Byte Comp./Capture Reg. 3, High Byte Comp./Capture Reg. 4, High Byte Comp./Capture Reg. 1, Low Byte Comp./Capture Reg. 2, Low Byte Comp./Capture Reg. 3, Low Byte Comp./Capture Reg. 4, Low Byte Compare Enable Register Compare Register 0, High Byte Compare Register 1, High Byte Compare Register 2, High Byte Compare Register 3, High Byte Compare Register 4, High Byte Compare Register 5, High Byte Compare Register 6, High Byte Compare Register 7, High Byte Compare Register 0, Low Byte Compare Register 1, Low Byte Compare Register 2, Low Byte Compare Register 3, Low Byte Compare Register 4, Low Byte Compare Register 5, Low Byte Compare Register 6, Low Byte Compare Register 7, Low Byte Compare Input Select Com./Rel./Capt. Reg. High Byte Com./Rel./Capt. Reg. Low Byte Com. Timer Control Reg. Com. Timer Rel. Reg., High Byte Com. Timer Rel. Reg., Low Byte Timer 2, High Byte Timer 2, Low Byte Timer 2 Control Register 0C1H 0C9H 0C3H 0C5H 0C7H 0CFH 0C2H 0C4H 0C6H 0CEH 0F6H 0D3H 0D5H 0D7H 0E3H 0E5H 0E7H 0F3H 0F5H 0D2H 0D4H 0D6H 0E2H 0E4H 0E6H 0F2H 0F4H 0F7H 0CBH 0CAH 0E1H 0DFH 0DEH 0CDH 0CCH 0C8H 1) 00H X000.0000B3) 00H 00H 00H 00H 00H 00H 00H 00H 00H 00H 00H 00H 00H 00H 00H 00H 00H 00H 00H 00H 00H 00H 00H 00H 00H 00H 00H 00H 0XXX.0000B3) 00H 00H 00H 00H 00H 1) 2) 3) Bit-addressable special function registers This special function register is listed repeatedly since some bits of it also belong to other functional blocks. X means that the value is indeterminate and the location is reserved Semiconductor Group 21 SAB 80C517/80C537 Table 1 Special Function Register (cont’d) Address Register Name Register Contents after Reset Ports P0 P1 P2 P3 P4 P5 P6 P7 P8 Port 0 Port 1 Port 2 Port 3 Port 4 Port 5 Port 6, Port 7, Analog/Digital Input Port 8, Analog/Digital Input, 4-bit 80H 1) 90H 1) 0A0H 1) 0B0H 1) 0E8H 1) 0F8H 1) 0FAH 0DBH 0DDH FFH FFH FFH FFH FFH FFH FFH XXH 3) XXH 3) Pow.Sav. Modes PCON Power Control Register 87H 00H Serial Channels ADCON0 2) PCON 2) S0BUF S0CON S0RELL 4) A/D Converter Control Reg. Power Control Register Serial Channel 0 Buffer Reg. Serial Channel 0 Control Reg. Serial Channel 0, Reload Reg., low byte Serial Channel 0, Reload Reg., high byte Serial Channel 1 Buffer Reg., Serial Channel 1 Control Reg. Serial Channel 1 Reload Reg., low byte Serial Channel 1, Reload Reg., high byte 0D8H 1) 87H 99H 98H 1) 0AAH 00H 00H XXH 3) 00H 0D9H 0BAH XXXX.XX11B3) 9CH 9BH 9DH 0XXH 3) 0X00.000B 3) 00H 0BBH XXXX.XX11B 3) S0RELH 4) S1BUF S1CON S1REL S1RELH 4) Timer 0/ Timer 1 TCON TH0 TH1 TL0 TL1 TMOD Timer Control Register Timer 0, High Byte Timer 1, High Byte Timer 0, Low Byte Timer 1, Low Byte Timer Mode Register 88H 1) 8CH 8DH 8AH 8BH 89H 00H 00H 00H 00H 00H 00H Watchdog IEN0 2) IEN1 2) IP0 2) IP1 2) WDTREL Interrupt Enable Register 0 Interrupt Enable Register 1 Interrupt Priority Register 0 Interrupt Priority Register 1 Watchdog Timer Reload Reg. 0A8H 1) 0B8H 1) 0A9H 0B9H 86H 00H 00H 00H XX00.0000B 3) 00H 1) 2) 3) 4) Bit-addressable special function registers. This special function register is listed repeatedly since some bits of it also belong to other functional blocks. X means that the value is indeterminate and the location is reserved. These registers are available in the CA step and later steps. Semiconductor Group 22 SAB 80C517/80C537 A/D Converter The SAB 80C517 contains an 8-bit A/D Converter with 12 multiplexed input channels which uses the successive approximation method. It takes 7 machine cycles to sample an analog signal (during this sample time the input signal should be held constant); the total conversion time (including sample time) is 13 machine cycles (13 µs at 12 MHz oscillator frequency). Conversion can be programmed to be single or continuous; at the end of a conversion an interrupt can be generated. A unique feature is the capability of internal reference voltage programming. The internal reference voltages VIntAREF and VIntAGND for the A/D converter are both programmable to one of 16 steps with respect to the external reference voltages. This feature permits a conversion with a smaller internal reference voltage range to gain a higher resolution. In addition, the internal reference voltages can easily be adapted by software to the desired analog input voltage range (see table 2). Table 2 Adjustable Internal Reference Voltages Step DAPR (.3-.0) DAPR (.7-.4) VIntAGND VIntAREF 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 0000 0001 0010 0011 0100 0101 0110 0111 1000 1001 1010 1011 1100 1101 1110 1111 0.0 0.3125 0.625 0.9375 1.25 1.5625 1.875 2.1875 2.5 2.8125 3.125 3.4375 3.75 – – – 5.0 – – – 1.25 1.5625 1.875 2.1875 2.5 2.8125 3.125 3.4375 3.75 4.0625 4.375 4.68754 Semiconductor Group 23 SAB 80C517/80C537 Figure 4 Block Diagram A/D Converter Semiconductor Group 24 SAB 80C517/80C537 Compare/Capture Unit (CCU) The compare capture unit is a complex timer/register array for applications that require high speed I/O, pulse width modulation and more timer/counter capabilities. The CCU contains – one 16-bit timer/counter (timer 2) with 2-bit prescaler, reload capability and a max. clock frequency of fOSC /12 (1 MHz with a 12 MHz crystal). – one 16-bit timer (compare timer) with 8-bit prescaler, reload capability and a max. clock frequency of fOSC/2 (6 MHz with a 12 MHz crystal). – thirteen 16-bit compare registers. – five of which can be used as 16-bit capture registers. – up to 21 output lines controlled by the CCU. – seven interrupts which can be generated by CCU-events. Figure 5 shows a block diagram of the CCU. Eight compare registers (CM0 to CM7) can individually be assigned to either timer 2 or the compare timer. Diagrams of the two timers are shown in figures 6 and 7. The four compare/capture registers and the compare/reload/capture register are always connected to timer 2. Dependent on the register type and the assigned timer two compare modes can be selected. Table 3 illustrates possible combinations and the corresponding output lines. Table 3 CCU Configuration Assigned Timer Compare Register Compare Output at Possible Modes Timer 2 CRCH/CRCL CC1H/CC1L CC2H/CC2L CC3H/CC3L CC4H/CC4L P1.0/INT3/CC0 P1.0/INT4/CC1 P1.0/INT5/CC2 P1.0/INT6/CC3 P1.0/INT2/CC4 Comp. mode 0, 1 + Reload Comp. mode 0, 1 Comp. mode 0, 1 Comp. mode 0, 1 Comp. mode 0, 1 CC4H/CC4L : CC4H/CC4L P5.0/CCM0 : P5.7/CCM7 Comp. mode 1 : Comp. mode 1 CM0H/CM0L : CM7H/CM7L P4.0/CM0 : P4.7/CM7 Comp. mode 1 : Comp. mode 1 CM0H/CM0L P4.0/CM0 : : CM7H/CM7L : : P4.7/CM7 Comp. mode 0 (with add. latches) : : Comp. mode 0 (with shadow latches) Compare timer Semiconductor Group 25 SAB 80C517/80C537 Figure 5 Block Diagram of the Compare/Capture Unit Semiconductor Group 26 SAB 80C517/80C537 Compare In the compare mode, the 16-bit values stored in the dedicated compare registers are compared to the contents of the timer 2 register or the compare timer register. If the count value in the timer registers matches one of the stored values, an appropriate output signal is generated and an interrupt is requested. Two compare modes are provided: Mode 0: Upon a match the output signal changes from low to high. It goes back to low level when the timer overflows. Mode 1: The transition of the output signal can be determined by software. A timer overflow signal doesn’t affect the compare-output. Compare registers CM0 to CM7 use additional compare latches when operated in mode 0. Figure 8 shows the function of these latches. The latches are implemented to prevent from loss of compare matches which may occur when loading of the compare values is not correlated with the timer count. The compare latches are automatically loaded from the compare registers at every timer overflow. Capture This feature permits saving of the actual timer/counter contents into a selected register upon an external event or a software write operation. Two modes are provided to latch the current 16-bit value of timer 2 registers into a dedicated capture register. Mode 0: Capture is performed in response to a transition at the corresponding port pins CC0 to CC3. Mode 1: Write operation into the low-order byte of the dedicated capture register causes the timer 2 contents to be latched into this register. Reload of Timer 2 A 16-bit reload can be performed with the 16-bit CRC register, which is a concatenation of the 8-bit registers CRCL and CRCH. There are two modes from which to select: Mode 0: Reload is caused by a timer overflow (auto-reload). Mode 1: Reload is caused in response to a negative transition at pin T2EX (P1.5), which also can request an interrupt. Timer/Counters 0 and 1 These timer/counters are fully compatible with timer/counter 0 or 1 of the SAB 8051 and can operate in four modes: Mode 0: 8-bit timer/counter with 32:1 prescaler Mode 1: 16-bit timer/counter Mode 2: 8-bit timer/counter with 8-bit auto reload Mode 3: Timer/counter 0 is configured as one 8-bit timer; timer/counter 1 in this mode holds its count. External inputs INT0 and INT1 can be programmed to function as a gate for timer/counters 0 and 1 to facilitate pulse width measurements. Semiconductor Group 27 SAB 80C517/80C537 Figure 6 Block Diagram of Timer 2 Semiconductor Group 28 SAB 80C517/80C537 Figure 7 Block Diagram of the Compare Timer Semiconductor Group 29 SAB 80C517/80C537 Figure 8 Compare-Mode 0 with Registers CM0 to CM7 Semiconductor Group 30 SAB 80C517/80C537 Interrupt Structure The SAB 80C517 has 14 interrupt vectors with the following vector addresses and request flags. Table 4 Interrupt Sources and Vectors Source (Request Flags) Vector Address Vector IE0 TF0 IE1 TF1 RI0/TI0 TF2 + EXF2 IADC IEX2 IEX3 IEX4 IEX5 IEX6 RI1/TI1 CTF 0003H 000BH 0013H 001BH 0023H 002BH 0043H 004BH 0053H 005BH 0063H 006BH 0083H 009BH External interrupt 0 Timer 0 overflow External interrupt 1 Timer 1 overflow Serial channel 0 Timer 2 overflow/ext. reload A/D converter External interrupt 2 External interrupt 3 External interrupt 4 External interrupt 5 External interrupt 6 Serial channel 1 Compare timer overflow Each interrupt vector can be individually enabled/disabled. The response time to an interrupt request is more than 3 machine cycles and less than 9 machine cycles. External interrupts 0 and 1 can be activated by a low-level or a negative transition (selectable) at their corresponding input pin, external interrupts 2 and 3 can be programmed for triggering on a negative or a positive transition. The external interrupts 2 to 6 are combined with the corresponding alternate functions compare (output) and capture (input) on port 1. For programming of the priority levels the interrupt vectors are combined to pairs or triples. Each pair or triple can be programmed individually to one of four priority levels by setting or clearing one bit in special function register IP0 and one in IP1. Figure 9 shows the interrupt request sources, the enabling and the priority level structure. Semiconductor Group 31 SAB 80C517/80C537 Figure 9 Interrupt Structure Semiconductor Group 32 SAB 80C517/80C537 Figure 9 (cont’d) Interrupt Structure Semiconductor Group 33 SAB 80C517/80C537 Multiplication/Division Unit This on-chip arithmetic unit provides fast 32-bit division, 16-bit multiplication as well as shift and normalize features. All operations are integer operations. Operation Result Remainder Execution Time 32-bit/16-bit 16-bit/16-bit 32-bit 16-bit 16-bit 16-bit 6 t cy 1) 4 t cy 16-bit ∗ 16-bit 32-bit – 4 t cy 32-bit normalize – – 6 t cy 2) 32-bit shift left/right – – 6 t cy 2) 1) 2) 1 tcy = 1 µs @ 12 MHz oscillator frequency. The maximal shift speed is 6 shifts/cycle. The MDU consists of six registers used for operands and results and one control register. Operation of the MDU can be divided in three phases: Figure 10 Operation of the MDU To start an operation, register MD0 to MD5 (or ARCON) must be written to in a certain sequence according to table 5 or 6. The order the registers are accessed determines the type of the operation. A shift operation is started by a final write operation to register ARCON (see also the register description). Semiconductor Group 34 SAB 80C517/80C537 Table 5 Programming the MDU for Multiplication and Division Operation 32-Bit/16-Bit 16-Bit/16-Bit 16-Bit * 16-Bit First Write MD0 MD1 MD2 MD3 MD4 MD5 D'endL D'end D'end D'endH D'orL D'orH MD0 MD1 MD0 MD4 M'andL M'orL MD1 M'andH MD5 D'endL D'end D'end D'endH D'orL D'orH MD5 M'orH MD0 MD1 MD2 MD3 MD4 MD5 QuoL Quo Quo QuoH RemL RemH MD0 MD1 QuoL QuoH MD0 MD1 PrL MD4 RemL MD2 MD5 RemH MD3 Last Write First Read Last Read MD4 PrH Table 6 Shift Operation with the CCU Operation Normalize, Shift Left, Shift Right First Write MD0 MD1 MD2 MD3 ARCON Last Write First Read Last Read MD0 MD1 MD2 MD3 least significant byte most significant byte start of conversion least significant byte most significant byte Abbreviations D'end D'or M'and M'or Pr Rem Quo ...L ...H : : : : : : : : : Dividend, 1st operand of division Divisor, 2nd operand of division Multiplicand, 1st operand of multiplication Multiplicator, 2nd operand of multiplication Product, result of multiplication Remainder Quotient, result of division means, that this byte is the least significant of the 16-bit or 32-bit operand means, that this byte is the most significant of the 16-bit or 32-bit operand Semiconductor Group 35 SAB 80C517/80C537 I/O Ports The SAB 80C517 has seven 8-bit I/O ports and two input ports (8-bit and 4-bit wide). Port 0 is an open-drain bidirectional I/O port, while ports 1 to 6 are quasi-bidirectional I/O ports with internal pull-up resistors. That means, when configured as inputs, ports 1 to 6 will be pulled high and will source current when externally pulled low. Port 0 will float when configured as input. Port 0 and port 2 can be used to expand the program and data memory externally. During an access to external memory, port 0 emits the low-order address byte and reads/writes the data byte, while port 2 emits the high-order address byte. In this function, port 0 is not an open-drain port, but uses a strong internal pullup FET. Port 1, 3, 4, 5 and port 6 provide several alternate functions. Please see the "Pin Description" for details. Port pins show the information written to the port latches, when used as general purpose port. When an alternate function is used, the port pin is controlled by the respective peripheral unit. Therefore the port latch must contain a "one" for that function to operate. The same applies when the port pins are used as inputs. Ports 1, 3, 4 and 5 are bit- addressable. The SAB 80C517 has two dual-purpose input ports. The twelve port lines at port 7 and port 8 can be used as analog inputs for the A/D converter. If input voltages at P7 and P8 meet the specified digital input levels (VIL and VIH) the port can also be used as digital input port. Semiconductor Group 36 SAB 80C517/80C537 Power Saving Modes The SAB 80C517 provides – due to Siemens ACMOS technology – three modes in which power consumption can be significantly reduced. – The Slow Down Mode The controller keeps up the full operating functionality, but is driven with the eighth part of its normal operating frequency. Slowing down the frequency greatly reduces power consumption. – The Idle Mode The CPU is gated off from the oscillator, but all peripherals are still supplied by the clock and able to work. – The Power Down Mode Operation of the SAB 80C517 is stopped, the oscillator is turned off. This mode is used to save the contents of the internal RAM with a very low standby current. All of these modes are entered by software. Special function register PCON (power control register, address is 87H) is used to select one of these modes. Hardware Enable for Power Saving Modes A dedicated Pin (PE/SWD) of the SAB 80C517 allows to block the power saving modes. Since this pin is mostly used in noise-critical application it is combined with an automatic start of the Watchdog Timer (see there for further description). PE/SWD = VIH (logic high level): Using of the power saving modes is not possible. The instruction sequences used for entering of these modes will not affect the normal operation of the device. PE/SWD = VIL (logic low level): All power saving modes can be activated by software. When left unconnected, Pin PE/SWD is pulled to high level by a weak internal pullup. This is done to provide system protection on default. The logic-level applied to pin PE/SWD can be changed during program execution to allow or to block the use of the power saving modes without any effect on the on-chip watchdog circuitry. Power Down Mode The power down mode is entered by two consecutive instructions directly following each other. The first instruction has to set the flag PDE (power down enable) and must not set PDS (power down set). The following instruction has to set the start bit PDS. Bits PDE and PDS will automatically be cleared after having been set. The instruction that sets bit PDS is the last instruction executed before going into power down mode. The only exit from power down mode is a hardware reset. The status of all output lines of the controller can be looked up in table 7. Semiconductor Group 37 SAB 80C517/80C537 Table 7 Status of External Pins During Idle and Power Down Outputs Last instruction executed from internal code memory Last instruction executed from external code memory Idle Power down Idle Power Down ALE High Low High Low PSEN High Low High Low Port 0 Data Data Float Float Port 1 Data/alternate outputs Data/last output Data/alternate outputs Data/last output Port 2 Data Data Address Data Port 3 Data/alternate outputs Data/last output Data/alternate outputs Data/last output Port 4 Data/alternate outputs Data/last output Data/alternate outputs Data/last output Port 5 Data/alternate outputs Data/last output Data/alternate outputs Data/last output Port 6 Data/alternate outputs Data/last output Data/alternate outputs Data/last output Idle Mode During idle mode all peripherals of the SAB 80C517 are still supplied by the oscillator clock. Thus the user has to take care which peripheral should continue to run and which has to be stopped during Idle. The procedure to enter the Idle mode is similar to entering the power down mode. The two bits IDLE and IDLS must be set by to consecutive instructions to minimize the chance of unintentional activating of the idle mode. There are two ways to terminate the idle mode: – The idle mode can be terminated by activating any enabled interrupt. This interrupt will be serviced and normally the instruction to be executed following the RETI instruction will be the one following the instruction that sets the bit IDLS. – The other way to terminate the idle mode, is a hardware reset. Since the oscillator is still running, the hardware reset must be held active only for two machine cycles for a complete reset. Normally the port pins hold the logical state they had at the time idle mode was activated. If some pins are programmed to serve their alternate functions they still continue to output during idle mode if the assigned function is on. The control signals ALE and PSEN hold at logic high levels (see table 7). Semiconductor Group 38 SAB 80C517/80C537 Table 8 Baud Rate Generation Function Serial Interface 0 Mode 8-Bit synchronous channel Mode 0 9-Bit UART – Baud rate *) 1 MHz @ f OSC = 12 MHz – Baud rate derived from f OSC – Mode 8-Bit UART Serial Interface 1 Mode 1 Mode B Baud rate *) 1 – 62.5 K 4800, 9600 1.5 – 375 K Baud rate derived from Timer 1 BD 8-bit baud rate generator Mode Mode 2 Mode 3 Mode A 1 – 62.5 K 1.5 – 375 K Timer 1 8-bit baud rate generator Baud rate *) 187.5 K/ 375 K Baud rate derived from fOSC/2 *) Baud rate values are given for 12 MHz oscillator frequency. Semiconductor Group 39 SAB 80C517/80C537 Serial Interface 0 Serial Interface 0 can operate in 4 modes: Mode 0: Shift register mode: Serial data enters and exits through RXD0. TXD0 outputs the shift clock 8 data bits are transmitted/received (LSB first). The baud rate is fixed at 1/12 of the oscillator frequency. Mode 1: 8-bit UART, variable baud rate: 10-bit are transmitted (through RXD0) or received (through RXD0): a start bit (0), 8 data bits (LSB first), and a stop bit (1). On reception, the stop bit goes into RB80 in special function register S0CON. The baud rate is variable. Mode 2: 9-bit UART, fixed baud rate: 11-bit are transmitted (through TXD0) or received (through RXD0): a start bit (0), 8 data bits (LSB first), a programmable 9th, and a stop bit (1). On transmission, the 9th data bit (TB80 in S0CON) can be assigned to the value of 0 or 1. For example, the parity bit (P in the PSW) could be moved into TB80 or a second stop bit by setting TB80 to 1. On reception the 9th data bit goes into RB80 in special function register S0CON, while the stop bit is ignored. The baud rate is programmable to either 1/32 or 1/64 of the oscillator frequency. Mode 3: 9-bit UART, variable baud rate: 11-bit are transmitted (through TXD0) or received (through RXD0): a start bit (0), 8 data bits (LSB first), a programmable 9th, and a stop bit (1). In fact, mode 3 is the same as mode 2 in all respects except the baud rate. The baud rate in mode 3 is variable. Variable Baud Rates for Serial Interface 0 Variable baud rates for modes 1 and 3 of serial interface 0 can be derived from either timer 1 or from the oscillator via a special prescaler ("BD"). Timer 1 may be operated in mode 1 (to generate slow baud rates) or mode 2. The dedicated baud rate generator "BD" provides the two standard baud rates 4800 or 9600 baud with 0.16% deviation. Table 8 shows possible configurations and the according baud rates. SAB 80C517 devices with stepping code "CA" or later provide a dedicated baud rate generator for the serial interface 0. This baud rate genertaor is a free running 10-bit timer with programmable reload registers. SMOD × f OSC 2 Mode 1.3 baud rate = ------------------------------------------------------- 10 64 × 2 – S0REL The default value after reset in the reload registers S0RELL and S0RELH prvide a baud rate of 4.8 kBaud (SMOD = 0) or 9.6 kBaud (SMOD = 1) at 12 MHz oscillator frequency. This guarantees full compatibility to the SAB 80C517 older steppings. Semiconductor Group 40 SAB 80C517/80C537 Serial Interface 1 Serial interface 1 can operate in two asynchronous modes: Mode A: 9-bit UART, variable baud rate. 11 bits are transmitted (through TXD0) or received (through RXD0): a start bit (0), 8 data bits (LSB first), a programmable 9th, and a stop bit (1). On transmission, the 9th data bit (TB81 in S1CON) can be assigned to the value of 0 or 1. For example, the parity bit (P in the PSW) could be moved into TB81 or a second stop bit by setting TB81 to 1. On reception the 9th data bit goes into RB81 in special function register S1CON, while the stop bit is ignored. Mode B: 8-bit UART, variable baud rate. 10 bits are transmitted (through TXD1) or received (through RXD1): a start bit (0), 8 data bits (LSB first), and a stop bit (1). On reception, the stop bit goes into RB81 in special function register S1CON. Variable Baud Rates for Serial Interface 1 Variable baud rates for modes A and B of serial interface 1 can be derived from a dedicated baud rate generator. baud rate clock The baud rate clock (baud rate = ---------------------------------------- ) is generated by a 8-bit free 16 running timer with programmable reload register. SAB 80C517 devices with stepping code "CA" or later provide a 10-bit free running timer for baud rate generation. f OSC Mode A, B baud rate = ----------------------------------------------------------------------- 10 32 × 2 – Reload Value Watchdog Units The SAB 80C517 offers two enhanced fail safe mechanisms, which allow an automatic recovery from hardware failure or software upset: – programmable watchdog timer (WDT), variable from 512 ms up to about 1.1 s time out period @12 MHz. Upward compatible to SAB 80515 watchdog. – oscillator watchdog (OWD), monitors the on-chip oscillator and forces the microcontroller to go into reset state, in case the on-chip oscillator fails. Programmable Watchdog Timer The WDT can be activated by hardware or software. Hardware initialization is done when pin PE/SWD (Pin 4) is held high during RESET. The SAB 80C517 then starts program execution with the WDT running. Pin PE/SWD doesn’t allow dynamic switching of the WDT. Software initialization is done by setting bit SWDT. A refresh of the watchdog timer is done by setting bits WDT and SWDT consecutively. A block diagram of the watchdog timer is shown in figure 11. When a watchdog timer reset occurs, the watchdog timer keeps on running, but a status flag WDTS is set. This flag can also be manipulated by software. Semiconductor Group 41 SAB 80C517/80C537 Figure 11 Block Diagram of the Programmable Watchdog Timer Oscillator Watchdog The oscillator watchdog monitors the on-chip quartz oscillator. A detected oscillator failure (f OSC < appr. 300 kHz) causes a hardware reset. The reset state is held until the on-chip oscillator is working again. The oscillator watchdog feature is enabled by a high level at pin OWE (pin 69). An oscillator watchdog reset sets status flag OWDS which can be examined and modified by software. Figure 12 shows a block diagram of the oscillator watchdog. Figure 12 Functional Block Diagram of the Oscillator Watchdog Semiconductor Group 42 SAB 80C517/80C537 Instruction Set Summary The SAB 80C517/80C537 has the same instruction set as the industry standard 8051 microcontroller. A pocket guide is available which contains the complete instruction set in functional and hexadecimal order. Furtheron it provides helpful information about Special Function Registers, Interrupt Vectors and Assembler Directives. Literature Information Title Ordering No. Microcontroller Family SAB 8051 Pocket Guide B158-H6497-X-X-7600 Semiconductor Group 43 SAB 80C517/80C537 Absolute Maximum Ratings Ambient temperature under bias SAB 80C517/83C537.................................................................................. 0 to 70 oC SAB 80C517/83C537-T40/85 .................................................................................... – 40 to 85 oC Storage temperature TST ............................................................................ – 65 to 150 oC Voltage on VCC pins with respect to ground (VSS) ...................................... – 0.5 V to 6.5 V Voltage on any pin with respect to ground (VSS)......................................... – 0.5 to VCC +0.5 V Input current on any pin during overload condition ..................................... – 10mA to +10mA Absolute sum of all input currents during overload condition ..................... |100mA| Power dissipation ........................................................................................ 2 W Note Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage of the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for longer periods may affect device reliability. During overload conditions (VIN > VCC or VIN < VSS) theVoltage on VCC pins with respect to ground (VSS) must not exeed the values definded by the absolute maximum ratings. DC Characteristics VCC = 5 V ± 10 %; VSS = 0 V; T A = 0 to 70 oC for the SAB 80C517/83C537 T A = – 40 to 85 oC for the SAB 80C517-/83C537-T40/85 Parameter Symbol Limit Values min. Unit Test Condition max. Input low voltage (except EA) V IL – 0.5 0.2 VCC– – 0.1 V – Input low voltage (EA) VIL1 – 0.5 0.2 VCC – V – 0.3 – Input high voltage VIH 0.2 VCC + 0.9 V C C + 0.5 V – Input high voltage to XTAL2 V IH1 0.7 VCC VCC + 0.5 V – Input high voltage to RESET V IH2 0.6 VCC VCC + 0.5 V – Output low voltage (ports 1, 2, 3, 4, 5, 6) VOL – 0.45 IOL = 1.6 mA1) Notes see page 47. Semiconductor Group 44 V SAB 80C517/80C537 DC Characteristics (cont’d) Parameter Symbol Limit Values min. Unit Test Condition max. Output low voltage (ports ALE, PSEN, RO) VOL1 – 0.45 V IOL = 3.2mA 1) Output high voltage (ports 1, 2, 3, 4, 5, 6) VOH 2.4 0.9 VCC – – V V IOH = – 80 µA IOH = – 10 µA Output high voltage (port 0 in external bus mode, ALE, PSEN, RO) VOH1 2.4 0.9 VCC – – V V IOH = – 800 µA2) IOH = – 80 µA2) Logic 0 input current (ports 1, 2, 3, 4, 5, 6) I IL – 10 – 70 µA VIN = 0.45 V Input low current to RESET for reset IIL2 – 10 –100 µA VIN = 0.45 V Input low current (XTAL2) IIL3 – – 15 µA VIN = 0.45 V Input low current (OWE, PE/SWD) I IL4 – – 20 µA VIN = 0.45 V Logical 1-to-0 transition current ITL (ports 1, 2, 3, 4, 5, 6) – 65 – 650 µA VIN = 2 V Input leakage current (port 0, EA, ports 7, 8) ILI – ± 1 µA 0.45 < VIN < VCC10) Pin capacitance C IO – 10 pF fC = 1 MHz TA = 25 oC ICC – – – – – – – 40 15 15 52.3 19 19 50 mA mA mA mA mA mA µA VCC = 5 V,4) VCC = 5 V,5) VCC = 5 V,5) VCC = 5 V,4) VCC = 5 V,5) VCC = 5 V,5) VCC = 2...5.5 V 3) Power supply current: Active mode, 12 MHz 6) Idle mode, 12 MHz 6) Slow down mode, 12 MHz 6) Active mode, 16 MHz 6) Idle mode, 16 MHz 6) Slow down mode, 16MHz6) Power down Mode ICC I PD Notes see page 47. Semiconductor Group 45 SAB 80C517/80C537 A/D Converter Characteristics V CC = 5 V ± 10 %; V SS = 0 V VAREF = VCC ± 5%; VAGND = VSS ± 0.2 V; VIntAREF - VIntAGND ≥ 1V T A = 0 to 70 oC for the SAB 80C517/83C537 T A = – 40 to 85 oC for the SAB 80C517/83C537-T40/875 Parameter Symbol Limit values min. typ. max. Unit Test Condition Analog input voltage V AINPUT VAGND – 0.2 – V AREF + 0.2 V 9) Analog input capacitance CI – 25 60 pF 7) Load time tL – – 2 t CY µs 7) Sample time (incl. load time) tS – – 7t CY µs 7) Conversion time (incl. sample time) tC – – 13 t CY µs 7) Total unadjusted error TUE – ± 2 LSB VAREF = VCC V AGND = VSS 11) Internal reference error VIntREFERR – ± 30 mV 8) VAREF supply current I REF – 5 mA 8) – Notes see page 47. Semiconductor Group 46 SAB 80C517/80C537 Notes for pages 44, 45 and 46: 1) Capacitive loading on ports 0 and 2 may cause spurious noise pulses to be superimposed on the VOL of ALE and ports 1, 3, 4, 5 and 6. The noise is due to external bus capacitance discharging into the port 0 and port 2 pins when these pins make 1-to-0 transitions during bus operation. In the worst case (capacitive loading > 100 pF), the noise pulse on ALE line may exceed 0.8 V. In such cases it may be desirable to qualify ALE with a schmitt-trigger, or use an address latch with a schmitt- trigger strobe input. 2) Capacitive loading on ports 0 and 2 may cause the VOH on ALE and PSEN to momentarily fall below the 0.9 VCC specification when the address lines are stabilizing. 3) Power down IPD is measured with all output pins disconnected; EA = RESET = VCC; Port 0 = Port 7 = Port 8 = VCC; XTAL1 = N.C.; XTAL2 = VSS; VAGND= N.C.; VAREF = VCC; PE/SWD = OWE = VSS. 4) ICC (active mode) is measured with all output pins disconnected; XTAL2 driven with clock signal according to the figure below; XTAL1 = N.C.; EA = OWE = PE/SWD = VCC; Port 0 = Port 7 = Port 8 = VCC; RESET = VSS. ICC would be slightly higher if a crystal oscillator is used. 5) IC C (idle mode,) is measured with all output pins disconnected and with all peripherals disabled; XTAL2 driven with clock signal according to the figure below; XTAL1 = N.C.; RESET = OWE = VCC; Port 0 = Port 7 = Port 8 = VCC; EA = PE/SWD = VSS. ICC (slow down mode) is measured with all output pins disconnected and with all peripherals disabled; XTAL2 driven with clock signal according to the figure below; XTAL = N.C.; Port 7 = Port 8 = VCC; EA = PE/SWD = VSS. 6) I CC (max.) at other frequencies is given by: active mode: I CC max = 3.1 * fOSC + 3.0 idle mode: I CC max = 1.0 * fOSC + 3.0 Where fOSC is the oscillator frequency in MHz. I CC values are given in mA and measured at VCC = 5 V (see also notes 4 and 5). 7) The output impedance of the analog source must be low enough to assure full loading of the sample capacitance (CI) during load time (TL ). After charging of the internal capacitance (CI) in the load time (TL) the analog input must be held constant for the rest of the sample time (TS). 8) The differential impedance RD of the analog reference voltage source must be less than 1 kΩ at reference supply voltage. 9) Exceeding the limit values at one or more input channels will cause additional current which is sinked sourced at these channels. This may also affect the accuracy of other channels which are operated within the specification. 10) Only valid for not selected analog inputs. 11) No missing code. Semiconductor Group 47 SAB 80C517/80C537 Clock of Waveform for ICC Tests in Active, Idle Mode and Slow Down Mode Semiconductor Group 48 SAB 80C517/80C537 AC Characteristics 0 to 70 oC for the SAB 80C517/83C537 VCC = 5 V ± 10 %; VSS = 0 V T A = T A = – 40 to 85 oC for the SAB 80C517/83C537-T40/85 (CL for port 0, ALE and PSEN outputs = 100 pF; CL for all other outputs = 80 pF)) Parameter Symbol Limit Values 12 MHz Clock min Unit Variable Clock 1/t CLCL = 3.5 MHz to 12 MHz max. min. max. Program Memory Characteristics ALE pulse width tLHLL 127 – 2 tCLCL – 40 – ns Address setup to ALE tAVLL 53 – tCLCL – 30 – ns Address hold after ALE tLLAX 48 – tCLCL – 35 – ns ALE to valid instruction in tLLIV – 233 – 4tCLCL – 100 ns ALE to PSEN tLLPL 58 – tCLCL – 25 – ns PSEN pulse width tPLPH 215 – 3 tCLCL – 35 – ns PSEN to valid instruction in tPLIV – 150 – 3tCLCL – 100 ns Input instruction hold after PSEN tPXIX 0 – 0 Input instruction float after PSEN *) tPXIX*) – 63 – tCLCL – 20 ns Address valid after PSEN *) tPXAV*) 75 – tCLCL – 8 – ns Address to valid instruction in tAVIV – 302 0 5tCLCL – 115 ns Address float to PSEN tAZPL – – – *) Interfacing the SAB 80C517 to devices with float times up to 75 ns is permissible. This limited bus contention will not cause any damage to port 0 drivers. Semiconductor Group 49 ns ns SAB 80C517/80C537 AC Characteristics (cont’d) Parameter Symbol Limit Values 12 MHz Clock min Unit Variable Clock 1/t CLCL = 3.5 MHz to 12 MHz max. min. max. External Data Memory Characteristics RD pulse width tRLRH 400 – 6 tCLCL – 100 – ns WR pulse width tWLWH 400 – 6 tCLCL – 100 – ns Address hold after ALE tLLAX2 132 – 2 tCLCL – 30 – ns RD to valid instr in tRLDV – 252 – 5 tCLCL – 165 ns Data hold after RD tRHDX 0 – 0 – ns Data float after RD tRHDZ – 97 – 2 tCLCL – 70 ns ALE to valid data in tLLDV – 517 – 8 tCLCL – 150 ns Address to valid data in tAVDV – 585 – 9 tCLCL – 165 ns ALE to WR or RD tLLWL 200 300 3 tCLCL – 50 3 tCLCL + 50 ns WR or RD high to ALE high tWHLH 43 123 tCLCL – 40 tCLCL +40 ns Address valid to WR tAVWL 203 – 4 tCLCL – 130 – ns Data valid to WR transition tQVWX 33 – tCLCL – 50 – ns Data setup before WR tQVWX 433 – 7 tCLCL – 150 – ns Data hold after WR tWHQX 33 – tCLCL – 50 – ns Address float after RD tRLAZ – 0 – 0 ns Semiconductor Group 50 SAB 80C517/80C537 AC Characteristics V CC = 5 V ± 10 %; V SS = 0 V 0 to 70 oC for the SAB 80C517-16/83C537-16 TA= T A = – 40 to 85 oC for the SAB 80C517-16/83C537-16-T40/85 (CL for port 0, ALE and PSEN outputs = 100pF; CL for all outputs = 80 pF) Parameter Symbol Limit Values 16 MHz Clock min Unit Variable Clock 1/t CLCL = 3.5 MHz to 16 MHz max. min. max. Program Memory Characteristics ALE pulse width tLHLL 85 – 2 tCLCL – 40 – ns Address setup to ALE tAVLL 33 – tCLCL – 30 – ns Address hold after ALE tLLAX 28 – tCLCL – 35 – ns ALE to valid instr. in tLLIV – 150 – 4tCLCL– 100 ns ALE to PSEN tLLPL 38 – tCLCL – 25 – ns PSEN pulse width tPLPH 153 – 3 tCLCL – 35 – ns PSEN to valid instr. in tPLIV – 88 – 3tCLCL – 100 ns Input instruction hold after PSEN tPXIX 0 – 0 – ns Input instruction float *) after PSEN tPXIZ – 43 – tCLCL – 20 ns Address valid after PSEN *) tPXAV 55 – tCLCL – 8 – ns Address to valid instr. in tAVIV – 198 0– 5tCLCL – 115 ns Address float to PSEN tAZPL 0 – 0 – ns *) Interfacing the SAB 80C517 to devices with float times up to 55 ns is permissible. This limited bus contention will not cause any damage to port 0 drivers. Semiconductor Group 51 SAB 80C517/80C537 AC Characteristics (cont’d) Parameter Symbol Limit Values 16 MHz Clock min Unit Variable Clock 1/t CLCL = 3.5 MHz to 16 MHz max. min. max. External Data Memory Characteristics RD pulse width tRLRH 275 – 6 tCLCL – 100 – ns WR pulse width tWLWH 275 – 6 tCLCL – 100 – ns Address hold after ALE tLLAX2 90 – 2 tCLCL – 35 – ns RD to valid data in tRLDV – 148 – 5 tCLCL – 165 ns Data hold after RD tRHDX 0 – 0 – ns Data float after RD tRHDZ – 55 – 2 tCLCL – 70 ns ALE to valid data in tLLDV – 350 – 8 tCLCL – 150 ns Address to valid data in tAVDV – 398 – 9 tCLCL – 165 ns ALE to WR or RD tLLWL 138 238 3 tCLCL – 50 3 tCLCL + 50 ns WR or RD high to ALE high tWHLH 23 103 tCLCL – 40 tCLCL + 40 ns Address valid to WR tAVWL 120 – 4 tCLCL – 130 – ns Data valid to WR transition tQVWX 13 – tCLCL – 50 – ns Data setup before WR tQVWH 288 – 7 tCLCL – 150 – ns Data hold after WR tWHQX 13 – tCLCL – 50 – ns Address float after RD tRLAZ – 0 – 0 ns Semiconductor Group 52 SAB 80C517/80C537 Program Memory Read Cycle Data Memory Read Cycle Semiconductor Group 53 SAB 80C517/80C537 Data Memory Write Cycle Semiconductor Group 54 SAB 80C517/80C537 AC Characteristics (cont'd) Parameter Symbol Limit Values Unit Variable Clock Frequ. = 3.5 MHz to 12 MHz min max. External Clock Drive Oscillator period tCLCL 83.3 285 ns Oscillator frequency 1/tCLCL 3.5 12 MHz High time tCHCX 20 – ns Low time tCLCX 20 – ns Rise time tCLCH – 20 ns Fall time t CHCL – 20 ns AC Characteristics (cont'd) Parameter Symbol Limit Values Unit Variable Clock Frequ. = 1 MHz to 16 MHz min max. External Clock Drive Oscillator period tCLCL 62.5 285 ns Oscillator frequency 1/tCLCL 3.5 16 MHz High time tCHCX 25 – ns Low time tCLCX 25 – ns Rise time tCLCH – 20 ns Fall time t CHCL – 20 ns Semiconductor Group 55 SAB 80C517/80C537 External Clock Cycle Semiconductor Group 56 SAB 80C517/80C537 AC Characteristics (cont’d) Parameter Symbol Limit Values 12 MHz Clock min. max. Unit Variable Clock 1/t CLCL =3.5 MHz to 12 MHz min. max. System Clock Timing ALE to CLKOUT tLLSH 543 – 7tCLCL – 40 – ns CLKOUT high time tSHSL 127 – 2tCLCL – 40 – ns CLKOUT low time tSLSH 793 – 10tCLCL – 40 – ns CLKOUT low to ALE high tSLLH 43 123 tCLCL – 40 tCLCL + 40 ns AC Characteristics (cont’d) Parameter Symbol Limit Values 16 MHz Clock min. max. Unit Variable Clock 1/t CLCL = 3.5 MHz to 16 MHz min. max. System Clock Timing ALE to CLKOUT tLLSH 398 – 7tCLCL – 40 – ns CLKOUT high time tSHSL 85 – 2tCLCL – 40 – ns CLKOUT low time tSLSH 585 – 10tCLCL – 40 – ns CLKOUT low to ALE high tSLLH 23 103 tCLCL – 40 tCLCL + 40 ns Semiconductor Group 57 SAB 80C517/80C537 System Clock Timing Semiconductor Group 58 SAB 80C517/80C537 ROM Verification Characteristics T A = 25˚C ± 5˚C; V CC = 5 V ± 10%; V SS = 0 V Parameter Symbol Limit values min Unit max. ROM Verification Address to valid data tAVQV – 48 tCLCL ns ENABLE to valid data t ELQV – 48 tCLCL ns Data float after ENABLE tEHQZ 0 48 tCLCL ns Oscillator frequency 4 6 MHz 1/tCLCL ROM Verification For timing purposes a port pin is no longer floating when a 100 mV change from load voltage occurs and begins to float when a 100 mV change from the loaded VOH/VOL level occurs. IOL/IOH ≥ ± 20 mA. Semiconductor Group 59 SAB 80C517/80C537 Recommended Oscillator Circuits AC Testing AC Inputs during testing are driven at V CC – 0.5 V for a logic 1 and 0.45 V for a logic ’0’. Timing measurements are made at V IHmin for a logic ’1’ and V ILmax for a logic ’0’. Input, Output Waveforms Float Waveforms Semiconductor Group 60