Microcomputer Components 8-Bit CMOS Microcontroller C504 Data Sheet 05.96 C504 Revision History: Current Version: 05.96 Previous Version: Page Page Subjects (major changes since last revision) (in previous ( i n new Version) Version) Edition 05.96 This edition was realized using the software system FrameMaker. Published by Siemens AG, Bereich Halbleiter, MarketingKommunikation, Balanstraße 73, 81541 München © Siemens AG 1996. All Rights Reserved. Attention please! As far as patents or other rights of third parties are concerned, liability is only assumed for components, not for applications, processes and circuits implemented within components or assemblies. The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. 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Critical components1 of the Semiconductor Group of Siemens AG, may only be used in life-support devices or systems2 with the express written approval of the Semiconductor Group of Siemens AG. 1 A critical component is a component used in a life-support device or system whose failure can reasonably be expected to cause the failure of that life-support device or system, or to affect its safety or effectiveness of that device or system. 2 Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain and sustain human life. If they fail, it is reasonable to assume that the health of the user may be endangered. 8-Bit CMOS Microcontroller C504 Advance Information • • • • • • • • • • • • • • • • • • • Fully compatible to standard 8051 microcontroller Up to 40 MHz operating frequency 16 K×8 ROM (C504-2R only, optional ROM protection) 256×8 RAM 256×8 XRAM Four 8-bit ports, (2 ports with mixed analog/digital I/O capability) Three 16-bit timers/counters (timer 2 with up/down counter feature) Capture/compare unit for PWM signal generation and signal capturing - 3-channel, 16-bit capture/compare unit - 1-channel, 10-bit compare unit Compare unit USART 10-bit A/D Converter with 8 multiplexed inputs Twelve interrupt sources with two priority levels On-chip emulation support logic (Enhanced Hooks Technology TM) Programmable 15-bit Watchdog Timer Oscillator Watchdog Fast Power On Reset Power Saving Modes M-QFP-44 package Temperature ranges: SAB-C504 TA : 0 to 70°C SAF-C504 TA : – 40 to 85°C SAH-C504 TA : – 40 to 110°C (max. operating frequency.: TBD) SAK-C504 TA : – 40 to 125°C (max. operating frequency.: 12 MHz) Semiconductor Group 3 05.96 C504 The C504 with its capture compare unit (CCU) especially provides a functionality, which allows to use the microcontroller in motor control applications. Further, the C504 is functionally upward compatible with the SAB 80C52/C501 microcontroller and can replace it in existing applications. The C504-2R contains a non-volatile 16K×8 read-only program memory, a volatile on-chip 512×8 read/write data memory, four 8-bit wide ports, three 16-bit timers/counters, a 16-bit capture/ compare unit with compare timer, a 10-bit compare timer, a twelve source, two priority level interrupt structure, a serial port, versatile fail save mechanisms, on-chip emulation support logic, and a genuine 10-bit A/D converter. The C504-L is identical to the C504-2R, except that it lacks the program memory on chip. Therefore, the term C504 refers to all versions within this data sheet unless otherwise noted. Ordering Information Type Ordering Code Package Description (8-Bit CMOS microcontroller) SAB-C504-LM Q67120-C1048 P-MQFP-44 for external memory (12 MHz) SAB-C504-L24M Q67120-C1049 P-MQFP-44 for external memory (24 MHz) SAB-C504-L40M Q67120-C1050 P-MQFP-44 for external memory (40 MHz) SAB-C504-2RM Q67120-DXXXX P-MQFP-44 with mask-programmable ROM (12 MHz) SAB-C504-2R24M Q67120-DXXXX P-MQFP-44 with mask-programmable ROM (24 MHz) SAB-C504-2R40M Q67120-DXXXX P-MQFP-44 with mask-programmable ROM (40 MHz) Note: Versions for extended temperature ranges – 40 ˚C to 110 ˚C (SAH-C504) and – 40 ˚C to 125 ˚C (SAK-C504) are available on request. The ordering number of ROM types (DXXXX extensions) is defined after program release (verification) of the customer. Semiconductor Group 4 C504 Figure 1 Logic Symbol Semiconductor Group 5 C504 Figure 2 Pin Configuration (top view) Semiconductor Group 6 C504 Table 1 Pin Definitions and Functions Symbol P1.0-P1.7 Pin Number (P-MQFP-44) 40-44, 1-3 I/O *) Function I/O Port 1 is an 8-bit bidirectional port. Port pins can be used for digital input/output. P1.0 - P1.3 can also be used as analog inputs of the A/D-converter. As secondary digital functions, port 1 contains the timer 2 pins and the capture/compare inputs/outputs. Port 1 pins are assigned to be used as analog inputs via the register P1ANA. The functions are assigned to the pins of port 1 as follows: P1.0 / AN0 / T2 Analog input channel 0 / input to counter 2 P1.1 / AN1 / T2EX Analog input channel 1 / capture/reload trigger of timer 2 / up-down count P1.2 / AN2 / CC0 Analog input channel 2 / input/output of capture/compare channel 0 P1.3 / AN3 / COUT0 Analog input channel 3 / output of capture/compare channel 0 P1.4 / CC1 Input/output of capture/compare channel 1 P1.5 / COUT1 Output of capture/compare channel 1 P1.6 / CC2 Input/output of capture/compare channel 2 P1.7 / COUT2 Output of capture/compare channel 2 I RESET A high level on this pin for one machine cycle while the oscillator is running resets the device. An internal diffused resistor to VSS permits power-on reset using only an external capacitor to VCC. 40 41 42 43 44 1 2 3 RESET *) 4 I = Input O = Output Semiconductor Group 7 C504 Table 1 Pin Definitions and Functions (cont’d) Symbol P3.0-P3.7 Pin Number (P-MQFP-44) 5, 7-13 I/O *) Function I/O Port 3 is an 8-bit bidirectional port. P3.0 (R×D) and P3.1 (T×D) operate as defined for the C501. P3.2 to P3.7 contain the external interrupt inputs, timer inputs, input and as an additional optinal function four of the analog inputs of the A/D-converter. Port 3 pins are assigned to be used as analog inputs via the bits of SFR P3ANA. P3.6/WR can be assigned as a third interrupt input. The functions are assigned to the pins of port 3 as follows: P3.0 / RxD Receiver data input (asynch.) or data input/output (synch.) of serial interface P3.1 / TxD Transmitter data output (asynch.) or clock output (synch.) of serial interface P3.2 / AN4 / INT0 Analog input channel 4 / external interrupt 0 input / timer 0 gate control input P3.3 / AN5 / INT1 Analog input channel 5 / external interrupt 1 input / timer 1 gate control input P3.4 / AN6 / T0 Analog input channel 6 / timer 0 counter input P3.5 / AN7 / T1 Analog input channel 7 / timer 1 counter input P3.6 / WR / INT2 WR control output; latches the data byte from port 0 into the external data memory / external interrupt 2 input RD control output; enables the P3.7 / RD external data memory I CCU Trap Input With CTRAP = low the compare outputs of the CAPCOM unit are switched to the logic level as defined in the COINI register (if they are enabled by the bits in SFR TRCON). CTRAP is an input pin with an internal pullup resistor. For power saving reasons, the signal source which drives the CTRAP input should be at high or floating level during power-down mode. 5 7 8 9 10 11 12 13 CTRAP *) 6 I = Input O = Output Semiconductor Group 8 C504 Table 1 Pin Definitions and Functions (cont’d) Symbol Pin Number (P-MQFP-44) I/O *) Function XTAL2 14 – XTAL2 Output of the inverting oscillator amplifier. XTAL1 15 – XTAL1 Input to the inverting oscillator amplifier and input to the internal clock generator circuits. To drive the device from an external clock source, XTAL1 should be driven, while XTAL2 is left unconnected. There are no requirements on the duty cycle of the external clock signal, since the input to the internal clocking circuitry is divided down by a divide-by-two flip-flop. Minimum and maximum high and low times as well as rise/fall times specified in the AC characteristics must be observed. P2.0-P2.7 18-25 I/O Port 2 is a bidirectional I/O port with internal pullup resistors. Port 2 pins that have 1s written to them are pulled high by the internal pullup resistors, and in that state can be used as inputs. As inputs, port 2 pins being externally pulled low will source current (IIL, in the DC characteris-tics) because of the internal pullup resistors. Port 2 emits the high-order address byte during fetches from external program memory and during accesses to external data memory that use 16-bit addresses (MOVX @DPTR). In this application it uses strong internal pullup resistors when issuing 1s. During accesses to external data memory that use 8-bit addresses (MOVX @Ri), port 2 issues the contents of the P2 special function register. PSEN 26 O The Program Store Enable output is a control signal that enables the external program memory to the bus during external fetch operations. It is activated every six oscillator periodes except during external data memory accesses. Remains high during internal program execution. ALE 27 O The Address Latch Enable output is used for latching the low-byte of the address into external memory during normal operation. It is activated every six oscillator periodes except during an external data memory access. When instructions are executed from internal ROM (EA=1) the ALE generation can be disabled by bit EALE in SFR SYSCON. *) I = Input O = Output Semiconductor Group 9 C504 Table 1 Pin Definitions and Functions (cont’d) Symbol Pin Number (P-MQFP-44) I/O *) Function COUT3 28 O 10-Bit compare channel output This pin is used for the output signal of the 10-bit compare timer 2 unit. COUT3 can be disabled and set to a high or low state. EA 29 I External Access Enable When held at high level, instructions are fetched from the internal ROM (C504-2R only) when the PC is less than 4000 H .When held at low level, the C504 fetches all instructions from external program memory. For the C504-L this pin must be tied low. P0.0-P0.7 37-30 I/O Port 0 is an 8-bit open-drain bidirectional I/O port. Port 0 pins that have 1s written to them float, and in that state can be used as high-impendance inputs.Port 0 is also the multiplexed low-order address and data bus during accesses to external program or data memory. In this application it uses strong internal pullup resistors when issuing 1 s. Port 0 also outputs the code bytes during program verification in the C504-2R. External pullup resistors are required during program (ROM) verification. VAREF 38 – Reference voltage for the A/D converter. VAGND 39 – Reference ground for the A/D converter. VSS 16 – Ground (0V) VCC 17 – Power Supply (+5V) *) I = Input O = Output Semiconductor Group 10 C504 Functional Description The C504 basic architecture is fully compatible to the standard 8051 microcontroller family. While maintaining all architectural and operational characteristics of the SAB 80C52 / C501, the C504 incorporates some enhancements such as on-chip XRAM, A/D converter, fail save mechanisms, and a versatile capture/compare unit. Figure 3 shows a block diagram of the C504. Figure 3 Block Diagram of the C504 Semiconductor Group 11 C504 CPU The C504 is efficient both as a controller and as an arithmetic processor. It has extensive facilities for binary and BCD arithmetic and excels in its bit-handling capabilities. Efficient use of program memory results from an instruction set consisting of 44 % one-byte, 41 % two-byte, and 15 % threebyte instructions. With a 12 MHz crystal, 58 % of the instructions are executed in 1.0µs (24 MHz: 500 ns, 40 MHz : 300 ns). Special Function Register PSW (Address D0H) Reset Value : 00H Bit No. MSB D0H LSB D7H D6H D5H D4H D3H D2H D1H D0H CY AC F0 RS1 RS0 OV F1 P Bit Function CY Carry Flag Used by arithmetic instruction. AC Auxiliary Carry Flag Used by instructions which execute BCD operations. F0 General Purpose Flag RS1 RS0 Register Bank select control bits These bits are used to select one of the four register banks. PSW RS1 RS0 Function 0 0 Bank 0 selected, data address 00H-07H 0 1 Bank 1 selected, data address 08H-0FH 1 0 Bank 2 selected, data address 10H-17H 1 1 Bank 3 selected, data address 18H-1FH OV Overflow Flag Used by arithmetic instruction. F1 General Purpose Flag P Parity Flag Set/cleared by hardware after each instruction to indicate an odd/even number of "one" bits in the accumulator, i.e. even parity. Semiconductor Group 12 C504 Memory Organization The C504 CPU manipulates operands in the following four address spaces: – up to 64 Kbyte of external program memory – up to 64 Kbyte of external data memory – 256 bytes of internal data memory – 256 bytes of internal XRAM data memory – a 128 byte special function register area Figure 4 illustrates the memory address spaces of the C504. Figure 4 C504 Memory Map The XRAM in the C504 is a memory area that is logically located at the upper end of the external memory space, but is integrated on the chip. Because the XRAM is used in the same way as external data memory the same instruction types (MOVX instructions) must be used for accessing the XRAM. The XRAM can be enabled and disabled by the XMAP bit in the SYSCON register. ROM Protection The C504-2R ROM version allows to protect the content of the internal ROM against read out by non authorized people. The type of ROM protection (protected or unprotected) is fixed with the ROM mask. Therefore, the customer of a C504-2R ROM version has to define whether ROM protection has to be selected or not. Semiconductor Group 13 C504 Special Function Registers All registers, except the program counter and the four general purpose register banks, reside in the special function register area. The 63 special function register (SFR) include pointers and registers that provide an interface between the CPU and the other on-chip peripherals. There are also 128 directly addressable bits within the SFR area. The SFRs of the C504 are listed in table 2 and table 3. In table 2 they are organized in groups which refer to the functional blocks of the C504. Table 3 illustrates the contents of the SFRs in numeric order of their addresses. Semiconductor Group 14 C504 Table 2 Special Function Registers - Functional Blocks Block Symbol Name Address Contents after Reset CPU ACC B DPH DPL PSW SP Accumulator B-Register Data Pointer, High Byte Data Pointer, Low Byte Program Status Word Register Stack Pointer SYSCON System Control Register E0H 1) F0H 1) 83H 82H D0H 1) 81H B1H 00H 00H 00H 00H 00H 07H XX10XXX0B 3) Interrupt System IEN0 IEN1 CCIE 2) IP0 IP1 ITCON Interrupt Enable Register 0 Interrupt Enable Register 1 Capture/Compare Interrupt Enable Reg. Interrupt Priority Register 0 Interrupt Priority Register 1 Interrupt Trigger Condition Register A8H1) A9H D6H B8H 1) B9H 9AH 0X000000B 3) XX000000B 3) 00H XX000000B 3) XX000000B 3) 00101010B Ports P0 P1 P1ANA 2) P2 P3 P3ANA 2) Port 0 Port 1 Port 1 Analog Input Selection Register Port 2 Port 3 Port 3 Analog Input Selection Register 80H 1) 90H 1) 90H 1) 4) A0H 1) B0H 1) B0H 1) 4) FFH FFH XXXX1111B 3) FFH FFH XX1111XXB 3) A/DConverter ADCON0 ADCON1 A/D Converter Control Register 0 A/D Converter Control Register 1 ADDATH A/D Converter Data Register High Byte ADDATL A/D Converter Data Register Low Byte P1ANA 2) Port 1 Analog Input Selection Register P3ANA 2) Port 3 Analog Input Selection Register D8H 1 DCH D9H DAH 90H 4) B0H 4) XX000000B 3) 01XXX000B 3) 00H 00XXXXXXB 3) XXXX1111B 3) XX1111XXB 3) Serial Channels PCON 2) SBUF SCON Power Control Register Serial Channel Buffer Register Serial Channel Control Register 87H 99H 98H 1) 000X0000B XXH 3) 00H Timer 0/ Timer 1 TCON TH0 TH1 TL0 TL1 TMOD Timer 0/1 Control Register Timer 0, High Byte Timer 1, High Byte Timer 0, Low Byte Timer 1, Low Byte Timer Mode Register 88H 1) 8CH 8DH 8AH 8BH 89H 00H 00H 00H 00H 00H 00H 1) Bit-addressable special function registers 2) This special function register is listed repeatedly since some bits of it also belong to other functional blocks. 3) X means that the value is undefined and the location is reserved 4) SFR is located in the mapped SFR area. For accessing this SFR, bit RMAP in SFR SYSCON must be set. Semiconductor Group 15 C504 Table 2 Special Function Registers - Functional Blocks (cont’d) Block Symbol Name Address Contents after Reset Timer 2 T2CON T2MOD RC2H RC2L TH2 TL2 Timer 2 Control Register Timer 2 Mode Register Timer 2 Reload Capture Register, High Byte Timer 2 Reload Capture Register, Low Byte Timer 2 High Byte Timer 2 Low Byte C8H 1) C9H CBH CAH CDH CCH 00H XXXXXXX0B 3) 00H 00H 00H 00H Capture / Compare Unit CT1CON CCPL CCPH CT1OFL CT1OFH CMSEL0 CMSEL1 COINI TRCON CCL0 CCH0 CCL1 CCH1 CCL2 CCH2 CCIR CCIE 2) CT2CON CP2L CP2H CMP2L CMP2H BCON Compare timer 1 control register Compare timer 1 period register, low byte Compare timer 1 period register, high byte Compare timer 1 offset register, low byte Compare timer 1 offset register, high byte Capture/compare mode select register 0 Capture/compare mode select register 1 Compare output initialization register Trap enable control register Capture/compare register 0, low byte Capture/compare register 0, high byte Capture/compare register 1, low byte Capture/compare register 1, high byte Capture/compare register 2, low byte Capture/compare register 2, high byte Capture/compare interrupt request flag reg. Capture/compare interrupt enable register Compare timer 2 control register Compare timer 2 period register, low byte Compare timer 2 period register, high byte Compare timer 2 compare register, low byte Compare timer 2 compare register, high byte Block commutation control register E1H DEH DFH E6H E7H E3H E4H E2H CFH C2H C3H C4H C5H C6H C7H E5H D6H C1H D2H D3H D4H D5H D7H 00010000B 00H 00H 00H 00H 00H 00H FFH 00H 00H 00H 00H 00H 00H 00H 00H 00H 00010000B 00H XXXXXX00B 3) 00H XXXXXX00B 3)) 00H Watchdog WDCON Watchdog Timer Control Register WDTREL Watchdog Timer Reload Register C0H 1) 86H XXXX0000B 3) 00H 87H 88H 000X0000B 3) 0XXXXXXXB 3) Power PCON 2) Save Mode PCON1 Power Control Register Power Control Register 1 4) 1) Bit-addressable special function registers 2) This special function register is listed repeatedly since some bits of it also belong to other functional blocks. 3) X means that the value is undefined and the location is reserved 4) SFR is located in the mapped SFR area. For accessing this SFR, bit RMAP in SFR SYSCON must be set. Semiconductor Group 16 C504 Table 3 Contents of the SFRs, SFRs in Numeric Order of their Addresses Addr Register Content Bit 7 after Reset1) Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 80H 2) P0 81H SP FFH .7 .6 .5 .4 .3 .2 .1 .0 07H .7 .6 .5 .4 .3 .2 .1 .0 82H 83H DPL 00H .7 .6 .5 .4 .3 .2 .1 .0 DPH 00H .7 .6 .5 .4 .3 .2 .1 .0 86H WDTREL 00H WDT PSEL .6 .5 .4 .3 .2 .1 .0 87H PCON 000X0000B SMOD PDS IDLS – GF1 GF0 PDE IDLE 88H 2) TCON 88H 3) PCON1 00H 0XXXXXXXB TF1 TF0 TR0 IE1 IT1 IE0 IT0 EWPD – – – – – – – 89H 8AH TMOD 00H GATE C/T M1 M0 GATE C/T M1 M0 TL0 00H .7 .6 .5 .4 .3 .2 .1 .0 8BH 8CH TL1 00H .7 .6 .5 .4 .3 .2 .1 .0 TH0 00H .7 .6 .5 .4 .3 .2 .1 .0 8DH TH1 00H .7 .6 .5 .4 .3 .2 .1 .0 90H2) P1 90H 2)3) P1ANA FFH .7 .6 .5 .4 .3 .2 T2EX T2 XXXX1111B – – – – EAN3 EAN2 EAN1 EAN0 98H 2) SCON 99H SBUF 00H XXH SM0 SM1 SM2 REN TB8 RB8 TI RI .7 .6 .5 .4 .3 .2 .1 .0 9AH 00101010B IT2 IE2 I2ETF I2ETR I1ETF I1ETR I0ETF I0ETR A0H2) P2 FFH .7 .6 .5 .4 .3 .2 .1 .0 A8H2) IEN0 0X000000B EA – ET2 ES ET1 EX1 ET0 EX0 A9H XX000000B – – ECT1 ECCM ECT2 ECEM EX2 EADC FFH RD WR T1 T0 INT0 RxD ITCON IEN1 B0H2) P3 TR1 INT1 TxD 1) X means that the value is undefined and the location is reserved 2) Bit-addressable special function registers 3) SFR is located in the mapped SFR area. For accessing this SFR, bit RMAP in SFR SYSCON must be set. Semiconductor Group 17 C504 Table 3 Contents of the SFRs, SFRs in Numeric Order of their Addresses (cont’d) Addr Register Content Bit 7 after Reset1) Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 B0H2)3) P3ANA EAN5 EAN4 – – B1H XX1111XXB – – EAN7 EAN6 SYSCON XX10XXX0B – – EALE RMAP – – – XMAP PX1 PT0 PX0 B8H2) IP0 XX000000B – – PT2 PS B9H XX000000B – – PCT1 PCCM PCT2 XXXX0000B – – – – OWDS WDTS WDT SWDT IP1 C0H2) WDCON PT1 PCEM PX2 PADC C1H CT2CON 00010000B CT2P ECT2O STE2 CT2 RES CT2R CLK2 CLK1 CLK0 C2H C3H CCL0 00H .7 .6 .5 .4 .3 .2 .1 .0 CCH0 00H .7 .6 .5 .4 .3 .2 .1 .0 C4H C5H CCL1 00H .7 .6 .5 .4 .3 .2 .1 .0 CCH1 00H .7 .6 .5 .4 .3 .2 .1 .0 C6H C7H CCL2 00H .7 .6 .5 .4 .3 .2 .1 .0 CCH2 00H .7 .6 .5 .4 .3 .2 .1 .0 C8H2) T2CON 00H TF2 EXF2 RCLK TCLK EXEN2 TR2 C/T2 CP/ RL2 C9H T2MOD XXXXXXX0B – – – – – – – DCEN CAH RC2L 00H .7 .6 .5 .4 .3 .2 .1 .0 CBH RC2H 00H .7 .6 .5 .4 .3 .2 .1 .0 CCH TL2 00H .7 .6 .5 .4 .3 .2 .1 .0 CDH TH2 00H .7 .6 .5 .4 .3 .2 .1 .0 CFH TRCON 00H TRPEN TRF TREN5 TREN4 TREN3 TREN2 TREN1 TREN0 00H 00H CY AC F0 RS1 RS0 OV F1 P .7 .6 .5 .4 .3 .2 .1 .0 D0H2) PSW D2H CP2L 1) X means that the value is undefined and the location is reserved 2) Bit-addressable special function registers 3) SFR is located in the mapped SFR area. For accessing this SFR, bit RMAP in SFR SYSCON must be set. Semiconductor Group 18 C504 Table 3 Contents of the SFRs, SFRs in Numeric Order of their Addresses (cont’d) Addr Register Content Bit 7 after Reset1) Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 D3H CP2H XXXX. XX00B – – – – – – .1 .0 D4H CMP2L 00H .7 .6 .5 .4 .3 .2 .1 .0 D5H CMP2H XXXX. XX00B – – – – – – .1 .0 D6H CCIE 00H ECTP ECTC CC2 FEN CC2 REN CC1 FEN CC1 REN CC0 FEN CC0 REN D7H BCON 00H BCMP PWM1 PWM0 EBCE BCEM BCERR BCEN BCM1 BCM0 D8H2) ADCON0 XX000000B – – IADC BSY ADM MX2 MX1 MX0 D9H DAH ADDATH 00H ADDATL 00XXXXXXB .9 .8 .7 .6 .5 .4 .3 .2 .1 .0 – – – – – – DCH ADCON1 01XXX000B ADCL1 ADCL0 – – – MX2 MX1 MX0 DEH CCPL 00H .7 .6 .5 .4 .3 .2 .1 .0 DFH CCPH 00H .7 .6 .5 .4 .3 .2 .1 .0 .7 .6 .5 .4 .3 .2 .1 .0 E1H 00H CT1CON 00010000B CTM ETRP STE1 CT1 RES CT1R CLK2 CLK1 CLK0 E2H COINI COUT 3I COUTX COUT I 2I CC2I COUT 1I CC1I COUT 0I CC0I E3H CMSEL0 00H CMSEL CMSEL CMSEL CMSEL CMSEL CMSEL CMSEL CMSEL 13 12 11 10 03 02 01 00 E4H CMSEL1 00H 0 E5H CCIR E6H CT1OFL 00H CT1OFH 00H E0H 2) E7H ACC F0H2) B FFH 00H 00H 0 0 0 CMSEL CMSEL CMSEL CMSEL 23 22 21 20 CT1FP CT1FC CC2F CC2R CC1F CC1R CC0F CC0R .7 .6 .5 .4 .3 .2 .1 .0 .7 .6 .5 .4 .3 .2 .1 .0 .7 .6 .5 .4 .3 .2 .1 .0 1) X means that the value is undefined and the location is reserved 2) Bit-addressable special function registers Semiconductor Group 19 C504 Timer / Counter 0 and 1 Timer/Counter 0 and 1 can be used in four operating modes as listed in table 4. Table 4 Timer/Counter 0 and 1 Operating Modes Mode Description TMOD Input Clock Gate C/T M1 M0 internal external (max) 0 8-bit timer/counter with a divide-by-32 prescaler X X 0 0 fOSC/12 × 32 fOSC/24 × 32 1 16-bit timer/counter X X 1 1 fOSC/12 fOSC/24 2 8-bit timer/counter with 8-bit autoreload X X 0 0 fOSC/12 fOSC/24 3 Timer/counter 0 used as one 8-bit timer/counter and one 8-bit timer Timer 1 stops X X 1 1 fOSC/12 fOSC/24 In the “timer” function (C/T = ‘0’) the register is incremented every machine cycle. Therefore the count rate is fOSC/12. In the “counter” function the register is incremented in response to a 1-to-0 transition at its corresponding external input pin (P3.4/T0, P3.5/T1). Since it takes two machine cycles to detect a falling edge the max. count rate is fOSC/24. External inputs INT0 and INT1 (P3.2, P3.3) can be programmed to function as a gate to facilitate pulse width measurements. Figure 5 illustrates the input clock logic. Figure 5 Timer/Counter 0 and 1 Input Clock Logic Semiconductor Group 20 C504 Timer 2 Timer 2 is a 16-bit Timer/Counter with an up/down count feature. It can operate either as timer or as an event counter which is selected by bit C/T2 (T2CON.1). It has three operating modes as shown in table 5. Table 5 Timer/Counter 2 Operating Modes T2CON Mode T2MOD T2CON R×CLK or T×CLK CP/ RL2 TR2 0 0 0 16-bit Autoreload 16-bit Capture Input Clock P1.1/ Remarks T2EX DCEN EXEN 1 0 0 X 0 1 0 1 ↓ 0 0 0 0 1 1 1 1 X X 0 1 0 1 1 X 0 X 0 1 1 X 1 ↓ Baud Rate Generator 1 X 1 X 0 X 1 X 1 X 1 ↓ off X X 0 X X X Note: ↓ = falling edge Semiconductor Group 21 internal external (P1.0/T2) reload upon overflow reload trigger (falling edge) Down counting Up counting fOSC/12 max fOSC/24 16 bit Timer/ Counter (only up-counting) capture TH2, TL2 → RC2H, RC2L fOSC/12 max fOSC/24 no overflow interrupt request (TF2) extra external interrupt (“Timer 2”) fOSC/2 max fOSC/24 Timer 2 stops – – C504 Capture/Compare Unit The Capture / Compare Unit (CCU) of the C504 is built up by a 16-bit 3-channel capture/compare unit (CAPCOM) and a 10-bit 1-channel compare unit (COMP). In compare mode, the CAPCOM unit provides two output signals per channel, which can have inverted signal polarity and nonoverlapping pulse transitions. The COMP unit can generate a single PWM output signal and is further used to modulate the CAPCOM output signals. In capture mode, the value of the compare timer 1 is stored in the capture registers if a signal transition occurs at the pins CCx. Figure 6 shows the block diagram of the CCU. Figure 6 Block Diagram of the CCU Semiconductor Group 22 C504 The compare timer 1 and 2 are free running, processor clock coupled 16-bit / 10-bit timers which have each a count rate with a maximum of fOSC/2 up to fOSC/256. The compare timer operations with its possible compare output signal waveforms are shown in figure 7. Figure 7 Basic Operating Modes of the CAPCOM Unit Compare timer 1 runs only in operating mode 1 with one output signal of selectable signal polarity at the pin COUT3. Semiconductor Group 23 C504 Serial Interface (USART) The serial port is full duplex and can operate in four modes (one synchronous mode, three asynchronous modes) as illustrated in table 6. The possible baudrates can be calculated using the formulas given in table 6. Table 6 USART Operating Modes Mode SCON Baudrate Description SM0 SM1 0 0 0 fOSC/12 1 0 1 Timer 1/2 overflow rate 2 1 0 fOSC/32 or fOSC/64 3 1 1 Timer 1/2 overflow rate Serial data enters and exits through R×D. T×D outputs the shift clock. 8-bit are transmitted/received (LSB first) 8-bit UART 10 bits are transmitted (through T×D) or received (R×D) 9-bit UART 11 bits are transmitted (T×D) or received (R×D) 9-bit UART Like mode 2 except the variable baud rate Figure 8 Block Diagram of Baud Rate Generation for the Serial Interface Semiconductor Group 24 C504 The possible baudrates can be calculated using the formulas given in table 7. Table 7 Formulas for Calculating Baudrates Baud Rate derived from Interface Mode Oscillator 0 2 Baudrate f (2 /12 OSC SMOD × fOSC) / 64 Timer 1 (16-bit timer) (8-bit timer with 8-bit autoreload) 1,3 1,3 × timer 1 overflow rate) /32 (2 SMOD (2 × fOSC) / (32 × 12 × (256-TH1)) Timer 2 1,3 fOSC / (32 × (65536-(RC2H, RC2L)) Semiconductor Group SMOD 25 C504 10-Bit A/D Converter The C504 has a high performance 10-bit A/D converter (figure 9) with 8 inputs included which uses successive approximation technique for the conversion of analog input voltages. Figure 9 A/D Converter Block Diagram Semiconductor Group 26 C504 The A/D converter uses two clock signals for operation : the conversion clock fADC (= 1/ tADC) and the input clock fIN (= 1/ tIN). Both clock signals are derived from the C504 system clock fOSC which is applied at the XTAL pins. The duration of an A/D conversion is a multiple of the period of the fIN clock signal. The table in figure 10 shows the prescaler ratios and the resulting A/D conversion times which must be selected for typical system clock rates. MCU System Clock fIN Rate (fOSC) [MHz] Prescaler ADCL0 fADC [MHz] A/D Conversion Time [µs] Ratio ADCL1 3.5 MHz 1.75 ÷4 0 0 .438 48 x tIN = 27.4 12 MHz 6 ÷4 0 0 1.5 48 x tIN = 8 16 MHz 8 ÷4 0 0 2 48 x tIN = 6 24 MHz 12 ÷8 0 1 1.5 96 x tIN = 8 32 MHz 16 ÷8 0 1 2 96 x tIN = 6 40 MHz 20 ÷ 16 1 0 1.25 192 x tIN = 9.6 Figure 10 A/D Converter Clock Selection The analog inputs are located at port 1 and port 3 (4 lines on each port). The corresponding port 1 and port 3 pins have a port structure, which allows to use it either as digital I/Os or analog inputs. The analog input function of these mixed digital/analog port lines is selected via the registers P1ANA and P3ANA. Semiconductor Group 27 C504 Interrupt System The C504 provides 12 interrupt sources with two priority levels. Figure 11 and 12 give a general overview of the interrupt sources and illustrate the interrupt request and control flags. Figure 11 Interrupt Request Sources (Part 1) Semiconductor Group 28 C504 Figure 12 Interrupt Request Sources (Part 2) Semiconductor Group 29 C504 Table 8 Interrupt Vector Addresses Request Flags Interrupt Source Vector Address IE0 TF0 IE1 TF1 RI + TI TF2 + EXF2 IADC IE2 TRF, BCERR CT2P CC0F-CC2F, CC0R-CC2R CT1FP, CT1FC – External interrupt 0 Timer 0 interrupt External interrupt 1 Timer 1 interrupt Serial port interrupt Timer 2 interrupt A/D converter interrupt External interrupt 2 CAPCOM emergency interrupt Compare timer 2 interrupt Capture / compare match interrupt Compare timer 1 interrupt Power-down interrupt 0003H 000BH 0013H 001BH 0023H 002BH 0043H 004BH 0053H 005BH 0063H 006BH 007BH A low-priority interrupt can itself be interrupted by a high-priority interrupt, but not by another lowpriority interrupt. A high-priority interrupt cannot be interrupted by any other interrupt source. If two requests of different priority level are received simultaneously, the request of higher priority is serviced. If requests of the same priority are received simultaneously, an internal polling sequence determines which request is serviced. Thus within each priority level there is a second priority structure determined by the polling sequence as shown in table 9. Table 9 Interrupt Source Structure Interrupt Source High Priority External Interrupt 0 Timer 0 Interrupt External Interrupt 1 Timer 1 Interrupt Serial Channel Timer 2 Interrupt Semiconductor Group Priority Low Priority A/D Converter External Interrupt 2 CCU Emergency Interrupt Compare Timer 2 Interrupt Capture / Compare Match Interrupt Compare Timer 1 Interrupt 30 High h Low C504 Fail Save Mechanisms The C504 offers enhanced fail safe mechanisms, which allow an automatic recovery from software upset or hardware failure. – 15-bit reloadable watchdog timer – Oscillator Watchdog Watchdog Timer The watchdog timer in the C504 is a 15-bit timer, which is incremented by a count rate of either fSOC/ 12 or fCYCLE/32. From the 15-bit watchdog timer count value only the upper 7 bits can be programmed. Figure 5 shows the block diagram of the programmable watchdog timer. Figure 13 Block Diagram of the Programmable Watchdog Timer The watchdog timer can be started by software (bit SWDT in SFR WDCON), but it cannot be stopped during active mode of the device. If the software fails to refresh the running watchdog timer an internal reset will be initiated. The reset cause (external reset or reset caused by the watchdog) can be examined by software (status flag WDTS in WDCON is set). A refresh of the watchdog timer is done by setting bits WDT (SFR WDCON) and SWDT consecutively. This double instruction sequence has been implemented to increase system security. It must be noted, however, that the watchdog timer is halted during the idle mode and power down mode of the processor. Therefore, it is possible to use the idle mode in combination with the watchdog timer function. Semiconductor Group 31 C504 Oscillator Watchdog The oscillator watchdog of the C504 serves for three functions : – Monitoring of the on-chip oscillator's function The watchdog supervises the on-chip oscillator's frequency; if it is lower than the frequency of an auxiliary RC oscillator, the internal clock is supplied by this RC oscillator and the C504 is put into reset state; if the failure condition again disappears, the part executes a final reset phase of typ. 1 ms in order to allow the oscillator to stabilize; then the oscillator watchdog reset is released and the part starts program execution again. – Fast internal reset after power-on The oscillator watchdog unit provides a clock supply for the reset before the on-chip oscillator has started. The oscillator watchdog unit also works identically to the monitoring function. – Control of external wake-up from software power-down mode When the power-down mode is left by a low level at the INT0 pin, the oscillator watchdog unit assures that the microcontroller resumes operation (execution of the power-down wake-up interrupt) with the nominal clock rate. In the power-down mode the RC oscillator and the onchip oscillator are stopped. Both oscillators are started again when power-down mode is released. When the on-chip oscillator has a higher frequency than the RC oscillator, the microcontroller starts operation after a final delay of typ. 1 ms in order to allow the on-chip oscillator to stabilize. Figure 14 Block Diagram of the Programmable Watchdog Timer Semiconductor Group 32 C504 Power Saving Modes Two power down modes are available, the idle mode and power down mode. – In the idle mode the oscillator of the C504 continues to run, but the CPU is gated off from the clock signal. However, the interrupt system, the serial port, the A/D converter, and all timers with the exception of the watchdog timer are further provided with the clock. The CPU status is preserved in its entirety: the stack pointer, program counter, program status word, accumulator, and all other registers maintain their data during idle mode. – In the power down mode, the RC oscillator and the on-chip oscillator which operates with the XTAL pins is stopped. Therefore all functions of the microcontroller are stopped and only the contents of the on-chip RAM, XRAM and the SFR's are maintained. The port pins, which are controlled by their port latches, output the values that are held by their SFR's. Table 10 gives a general overview of the power saving modes. Table 10 Power Saving Modes Overview Mode Entering 2-Instruction Example Leaving by Remarks Idle mode ORL PCON, #01H ORL PCON, #20H Ocurrence of an interrupt from a peripheral unit CPU clock is stopped; CPU maintains their data; peripheral units are active (if enabled) and provided with clock Hardware Reset Power-Down Mode ORL PCON, #02H ORL PCON, #40H Hardware Reset Oscillator is stopped; Wake-up from power contents of on-chip RAM and SFR’s are maintained; down In the power down mode of operation, VCC can be reduced to minimize power consumption. It must be ensured, however, that VCC is not reduced before the power down mode is invoked, and that VCC is restored to its normal operating level, before the power down mode is terminated. The idle mode can be terminated by activating any enabled peripheral interrupt or by resetting the C504. The power down mode can be terminated using an interrupt by a short low pulse at the pin P3.2/AN4/INT0 or by resetting the C504. If a power saving mode is left through an interrupt, the microcontroller state (CPU, ports, peripherals) remains preserved. If a power saving mode is left by a reset operation, the microcontroller state is disturbed and replaced by the reset state of the C504. Semiconductor Group 33 C504 Absolute Maximum Ratings Ambient temperature under bias (TA) .............................................................. 0 ˚C to + 70 ˚C Storage temperature (TST)................................................................................– 65 ˚C to + 150 ˚C Voltage on VCC pins with respect to ground (VSS) ............................................– 0.5 V to 6.5 V Voltage on any pin with respect to ground (VSS) ..............................................– 0.5 V to VCC + 0.5 V Input current on any pin during overload condition ..........................................– 10 mA to + 10 mA Absolute sum of all input currents during overload condition ..........................| 100 mA | Power dissipation.............................................................................................TBD Note: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage of the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for longer periods may affect device reliability. During overload conditions (VIN > VCC or VIN < VSS) the Voltage on VCC pins with respect to ground (VSS) must not exceed the values defined by the absolute maximum ratings. Semiconductor Group 34 C504 DC Characteristics TA = 0 to 70 °C TA = – 40 to 85 °C TA = – 40 to 110 °C TA = – 40 to 125 °C VCC = 5 V + 10%, – 15%; VSS = 0 V Parameter Symbol Limit Values min. max. for the SAB-C504 for the SAF-C504 for the SAH-C504 for the SAK-C504 Unit Test Condition Input low voltage (except EA, RESET, CTRAP) VIL – 0.5 0.2 VCC – 0.1 V – Input low voltage (EA) VIL1 – 0.5 0.2 VCC – 0.3 V – Input low voltage (RESET, CTRAP) VIL2 – 0.5 0.2 VCC + 0.1 V – 0.2 VCC + 0.9 VCC + 0.5 V – Input high voltage (except XTAL1, VIH RESET and CTRAP) Input high voltage to XTAL1 VIH1 0.7 VCC VCC + 0.5 V – Input high voltage to RESET and CTRAP VIH2 0.6 VCC VCC + 0.5 V – Output low voltage (ports 1, 2, 3, COUT3) VOL – 0.45 V IOL = 1.6 mA 1) Output low voltage (port 0, ALE, PSEN) VOL1 – 0.45 V IOL = 3.2 mA 1) 2.4 0.9 VCC – – V IOH = – 80 µA, IOH = – 10 µA Output high voltage (ports 1, 2, 3) VOH Output high voltage (ports 1,3 pins in push-pull mode and COUT3) VOH1 0.9 VCC – V IOH = – 800 µA Output high voltage (port 0 in external bus mode, ALE, PSEN) VOH2 2.4 0.9 VCC – – V IOH = – 800 µA 2), IOH = – 80 µA 2) Logic 0 input current (ports 1, 2, 3) IIL – 10 – 50 µA VIN = 0.45 V Logical 1-to-0 transition current (ports 1, 2, 3) ITL – 65 – 650 µA VIN = 2 V Input leakage current (port 0, EA) ILI – ±1 µA 0.45 < VIN < VCC Pin capacitance CIO – 10 pF fc = 1 MHz, TA = 25 °C Overload current IOV – ±5 mA Semiconductor Group 35 7) 8) C504 Parameter Power supply current: Active mode, 12 MHz 4) Idle mode, 12 MHz 5) Active mode, 24 MHz 4) Idle mode, 24 MHz 5) Active mode, 40 MHz 4) Idle mode, 40 MHz 5) Power-down mode Symbol ICC ICC ICC ICC ICC ICC IPD Limit Values typ. 9) max. 16 8 25 13 38 17 1 TBD TBD TBD TBD TBD TBD 50 Unit Test Condition mA mA mA mA mA mA µA VCC = 5 V, 4) VCC = 5 V, 5) VCC = 5 V, 4) VCC = 5 V, 5) VCC = 5 V, 4) VCC = 5 V, 5) VCC = 2…5.5 V 3) 1) Capacitive loading on ports 0 and 2 may cause spurious noise pulses to be superimposed on the VOL of ALE and port 3. The noise is due to external bus capacitance discharging into the port 0 and port 2 pins when these pins make 1-to-0 transitions during bus operation. In the worst case (capacitive loading > 100 pF), the noise pulse on ALE line may exceed 0.8 V. In such cases it may be desirable to qualify ALE with a schmitt-trigger, or use an address latch with a schmitt-trigger strobe input. 2) Capacitive loading on ports 0 and 2 may cause the VOH on ALE and PSEN to momentarily fall below the 0.9 VCC specification when the address lines are stabilizing. 3) IPD (power-down mode) is measured under following conditions: EA = Port0 = VCC ; RESET = VSS ; XTAL2 = N.C.; XTAL1 = VSS ; VAGND = VSS ; all other pins are disconnected. 4) ICC (active mode) is measured with: XTAL1 driven with tCLCH , tCHCL = 5 ns , VIL = VSS + 0.5 V, VIH = VCC – 0.5 V; XTAL2 = N.C.; EA = Port0 = Port1 = RESET = VCC ; all other pins are disconnected. ICC would be slightly higher if a crystal oscillator is used (appr. 1 mA). 5) ICC (idle mode) is measured with all output pins disconnected and with all peripherals disabled; XTAL1 driven with tCLCH , tCHCL = 5 ns, VIL = VSS + 0.5 V, VIH = VCC – 0.5 V; XTAL2 = N.C.; RESET = EA = VSS ; Port0 = VCC ; all other pins are disconnected. 6) ICC max at other frequencies is given by: active mode: TBD idle mode: TBD where fosc is the oscillator frequency in MHz. ICC values are given in mA and measured at VCC = 5 V. 7) Overload conditions occur if the standard operating conditions are exceeded, i.e. the voltage on any pin exceeds the specified range (i.e. VOV > VCC + 0.5 V or VOV < VSS – 0.5 V). The supply voltage VCC and VSS must remain within the specified limits. The absolute sum of input currents on all port pins may not exceed 50 mA. 8) Not 100 % tested, guaranteed by design characterization. 9) The typical ICC values are periodically measured at TA = +25 ˚C but not 100% tested. Semiconductor Group 36 C504 A/D Converter Characteristics TA = 0 to 70 °C TA = – 40 to 85 °C TA = – 40 to 110 °C TA = – 40 to 125 °C VCC = 5 V + 10%, – 15%; VSS = 0 V 4V ≤ VAREF ≤ VCC + 0.1 V; VSS – 0.1 V ≤ VAGND ≤ VSS + 0.2 V; Parameter Symbol Limit Values min. max. for the SAB-C504 for the SAF-C504 for the SAH-C504 for the SAK-C504 Unit Test Condition 1) Analog input voltage VAIN VAGND VAREF V Sample time tS – 64 x tIN 32 x tIN 16 x tIN 8 x tIN ns Prescaler ÷ 32 Prescaler ÷ 16 Prescaler ÷ 8 Prescaler ÷ 4 2) Conversion cycle time tADCC – 384 x tIN 192 x tIN 96 x tIN 48 x tIN ns Prescaler ÷ 32 Prescaler ÷ 16 Prescaler ÷ 8 Prescaler ÷ 4 3) Total unadjusted error TUE – ±2 LSB VSS + 0.5V ≤ VIN ≤ VCC – 0.5V 4) – ±4 LSB VSS < VIN < VSS + 0.5V VCC – 0.5V < VIN < VCC Internal resistance of RAREF reference voltage source – Internal resistance of analog source RASRC – ADC input capacitance CAIN tADC / 250 kΩ tS / 500 kΩ tS in [ns] pF 6) – 0.25 – 50 Clock calculation table : ADCL1, 0 tADC tS tADCC ÷ 32 1 1 32 x tIN 64 x tIN 384 x tIN ÷ 16 1 0 16 x tIN 32 x tIN 192 x tIN ÷8 0 1 8 x tIN 16 x tIN 96 x tIN ÷4 0 0 4 x tIN 8 x tIN 48 x tIN Further timing conditions : tADC min = 500 ns tIN = 2 / fOSC = 2 tCLCL Semiconductor Group 5) 6) – 0.25 Notes see next page. Clock Prescaler Ratio tADC in [ns] 37 2) 6) 4) C504 Notes: 1) VAIN may exceed VAGND or VAREF up to the absolute maximum ratings. However, the conversion result in these cases will be X000H or X3FFH, respectively. 2) During the sample time the input capacitance CAIN can be charged/discharged by the external source. The internal resistance of the analog source must allow the capacitance to reach their final voltage level within tS. After the end of the sample time tS, changes of the analog input voltage have no effect on the conversion result. 3) This parameter includes the sample time tS, the time for determining the digital result and the time for the calibration. Values for the conversion clock tADC depend on programming and can be taken from the table on the previous page. 4) TUE is tested at VAREF = 5.0 V, VAGND = 0 V, VCC = 4.9 V. It is guaranteed by design characterization for all other voltages within the defined voltage range. If an overload condition occurs on maximum 2 not selected analog input pins and the absolute sum of input overload currents on all analog input pins does not exceed 10 mA, an additional conversion error of 1/2 LSB is permissible. 5) During the conversion the ADC’s capacitance must be repeatedly charged or discharged. The internal resistance of the reference source must allow the capacitance to reach their final voltage level within the indicated time. The maximum internal resistance results from the programmed conversion timing. 6) Not 100 % tested, but guaranteed by design characterization. Semiconductor Group 38 C504 AC Characteristics for C504-L / C504-2R TA = 0 to 70 °C for the SAB-C504 TA = – 40 to 85 °C for the SAF-C504 TA = – 40 to 110 °C for the SAH-C504 TA = – 40 to 125 °C for the SAK-C504 (CL for port 0, ALE and PSEN outputs = 100 pF; CL for all other outputs = 80 pF) VCC = 5 V + 10%, – 15%; VSS = 0 V Program Memory Characteristics Parameter Symbol Limit Values 12-MHz clock Unit Variable Clock 1/tCLCL = 3.5 MHz to 12 MHz min. max. min. max. ALE pulse width tLHLL 127 – 2tCLCL – 40 – ns Address setup to ALE tAVLL 43 – tCLCL – 40 – ns Address hold after ALE tLLAX 30 – tCLCL – 23 – ns ALE low to valid instr in tLLIV – 233 – 4tCLCL – 100 ns ALE to PSEN tLLPL 58 – tCLCL – 25 – ns PSEN pulse width tPLPH 215 – 3tCLCL – 35 – ns PSEN to valid instr in tPLIV – 150 – 3tCLCL – 100 ns Input instruction hold after PSEN tPXIX 0 – 0 – ns Input instruction float after PSEN tPXIZ *) – 63 – tCLCL – 20 ns Address valid after PSEN tPXAV *) 75 – tCLCL – 8 – ns Address to valid instr in tAVIV – 302 – 5tCLCL – 115 ns Address float to PSEN tAZPL 0 – 0 – *) ns Interfacing the C504 to devices with float times up to 75 ns is permissible. This limited bus contention will not cause any damage to port 0 drivers. Semiconductor Group 39 C504 AC Characteristics for C504-L / C504-2R (cont’d) External Data Memory Characteristics Parameter Symbol Limit Values 12-MHz clock Unit Variable Clock 1/tCLCL = 3.5 MHz to 12 MHz min. max. min. max. RD pulse width tRLRH 400 – 6tCLCL – 100 – ns WR pulse width tWLWH 400 – 6tCLCL – 100 – ns Address hold after ALE tLLAX2 114 – 2tCLCL – 53 – ns RD to valid data in tRLDV – 252 – 5tCLCL – 165 ns Data hold after RD tRHDX 0 – 0 – ns Data float after RD tRHDZ – 97 – 2tCLCL – 70 ns ALE to valid data in tLLDV – 517 – 8tCLCL – 150 ns Address to valid data in tAVDV – 585 – 9tCLCL – 165 ns ALE to WR or RD tLLWL 200 300 3tCLCL – 50 3tCLCL + 50 Address valid to WR or RD tAVWL 203 – 4tCLCL – 130 – ns WR or RD high to ALE high tWHLH 43 123 tCLCL – 40 tCLCL + 40 ns Data valid to WR transition tQVWX 33 – tCLCL – 50 – ns Data setup before WR tQVWH 433 – 7tCLCL – 150 – ns Data hold after WR tWHQX 33 – tCLCL – 50 – ns Address float after RD tRLAZ – 0 – 0 ns ns External Clock Drive Parameter Symbol Limit Values Unit Variable Clock Freq. = 3.5 MHz to 12 MHz min. max. Oscillator period tCLCL 83.3 294 ns High time tCHCX 20 tCLCL – tCLCX ns Low time tCLCX 20 tCLCL – tCHCX ns Rise time tCLCH – 20 ns Fall time tCHCL – 20 ns Semiconductor Group 40 C504 AC Characteristics for C504-L24 / C504-2R24 TA = 0 to 70 °C for the SAB-C504 TA = – 40 to 85 °C for the SAF-C504 (CL for port 0, ALE and PSEN outputs = 100 pF; CL for all other outputs = 80 pF) VCC = 5 V + 10 %, – 15 %; VSS = 0 V Program Memory Characteristics Parameter Symbol Limit Values 24-MHz clock Unit Variable Clock 1/tCLCL = 3.5 MHz to 24 MHz min. max. min. max. ALE pulse width tLHLL 43 – 2tCLCL – 40 – ns Address setup to ALE tAVLL 17 – tCLCL – 25 – ns Address hold after ALE tLLAX 17 – tCLCL – 25 – ns ALE low to valid instr in tLLIV – 80 – 4tCLCL – 87 ns ALE to PSEN tLLPL 22 – tCLCL – 20 – ns PSEN pulse width tPLPH 95 – 3tCLCL – 30 – ns PSEN to valid instr in tPLIV – 60 – 3tCLCL – 65 ns Input instruction hold after PSEN tPXIX 0 – 0 – ns Input instruction float after PSEN tPXIZ *) – 32 – tCLCL – 10 ns Address valid after PSEN tPXAV *) 37 – tCLCL – 5 – ns Address to valid instr in tAVIV – 148 – 5tCLCL – 60 ns Address float to PSEN tAZPL 0 – 0 – ns *) Interfacing the C504 to devices with float times up to 37 ns is permissible. This limited bus contention will not cause any damage to port 0 drivers. Semiconductor Group 41 C504 AC Characteristics for C504-L24 / C504-2R24 (cont’d) External Data Memory Characteristics Parameter Symbol Limit Values 24-MHz clock Unit Variable Clock 1/tCLCL = 3.5 MHz to 24 MHz min. max. min. max. RD pulse width tRLRH 180 – 6tCLCL – 70 – ns WR pulse width tWLWH 180 – 6tCLCL – 70 – ns Address hold after ALE tLLAX2 56 – 2tCLCL – 27 – ns RD to valid data in tRLDV – 118 – 5tCLCL – 90 ns Data hold after RD tRHDX 0 0 – ns Data float after RD tRHDZ – 63 – 2tCLCL – 20 ns ALE to valid data in tLLDV – 200 – 8tCLCL – 133 ns Address to valid data in tAVDV – 220 – 9tCLCL – 155 ns ALE to WR or RD tLLWL 75 175 3tCLCL – 50 3tCLCL + 50 ns Address valid to WR tAVWL 67 – 4tCLCL – 97 – ns WR or RD high to ALE high tWHLH 17 67 tCLCL – 25 tCLCL + 25 ns Data valid to WR transition tQVWX 5 – tCLCL – 37 – ns Data setup before WR tQVWH 170 – 7tCLCL – 122 – ns Data hold after WR tWHQX 15 – tCLCL – 27 – ns Address float after RD tRLAZ – 0 – 0 ns External Clock Drive Parameter Symbol Limit Values Unit Variable Clock Freq. = 3.5 MHz to 24 MHz min. max. Oscillator period tCLCL 41.7 294 ns High time tCHCX 12 tCLCL – tCLCX ns Low time tCLCX 12 tCLCL – tCHCX ns Rise time tCLCH – 12 ns Fall time tCHCL – 12 ns Semiconductor Group 42 C504 AC Characteristics for C504-L40 / C504-2R40 TA = 0 to 70 °C for the SAB-C504 TA = – 40 to 85 °C for the SAF-C504 (CL for port 0, ALE and PSEN outputs = 100 pF; CL for all other outputs = 80 pF) VCC = 5 V + 10 %, – 15 %; VSS = 0 V Program Memory Characteristics Parameter Symbol Limit Values 40-MHz clock Unit Variable Clock 1/tCLCL = 3.5 MHz to 40 MHz min. max. min. max. ALE pulse width tLHLL 35 – 2tCLCL – 15 – ns Address setup to ALE tAVLL 10 – tCLCL – 15 – ns Address hold after ALE tLLAX 10 – tCLCL – 15 – ns ALE low to valid instr in tLLIV – 55 – 4tCLCL – 45 ns ALE to PSEN tLLPL 10 – tCLCL – 15 – ns PSEN pulse width tPLPH 60 – 3tCLCL – 15 – ns PSEN to valid instr in tPLIV – 25 – 3tCLCL – 50 ns Input instruction hold after PSEN tPXIX 0 – 0 – ns Input instruction float after PSEN tPXIZ *) – 20 – tCLCL – 5 ns Address valid after PSEN tPXAV *) 20 – tCLCL – 5 – ns Address to valid instr in tAVIV – 65 – 5tCLCL – 60 ns Address float to PSEN tAZPL –5 – –5 – ns *) Interfacing the C504 to devices with float times up to 25 ns is permissible. This limited bus contention will not cause any damage to port 0 drivers. Semiconductor Group 43 C504 AC Characteristics for C504-L40 / C504-2R40 (cont’d) External Data Memory Characteristics Parameter Symbol Limit Values 40-MHz clock Unit Variable Clock 1/tCLCL = 3.5 MHz to 40 MHz min. max. min. max. RD pulse width tRLRH 120 – 6tCLCL – 30 – ns WR pulse width tWLWH 120 – 6tCLCL – 30 – ns Address hold after ALE tLLAX2 35 – 2tCLCL – 15 – ns RD to valid data in tRLDV – 75 – 5tCLCL – 50 ns Data hold after RD tRHDX 0 0 – ns Data float after RD tRHDZ – 38 – 2tCLCL – 12 ns ALE to valid data in tLLDV – 150 – 8tCLCL – 50 ns Address to valid data in tAVDV – 150 – 9tCLCL – 75 ns ALE to WR or RD tLLWL 60 90 3tCLCL – 15 3tCLCL + 15 ns Address valid to WR tAVWL 70 – 4tCLCL – 30 – ns WR or RD high to ALE high tWHLH 10 40 tCLCL – 15 tCLCL + 15 ns Data valid to WR transition tQVWX 5 – tCLCL – 20 – ns Data setup before WR tQVWH 125 – 7tCLCL – 50 – ns Data hold after WR tWHQX 5 – tCLCL – 20 – ns Address float after RD tRLAZ – 0 – 0 ns External Clock Drive Parameter Symbol Limit Values Unit Variable Clock Freq. = 3.5 MHz to 40 MHz min. max. Oscillator period tCLCL 25 294 ns High time tCHCX 10 tCLCL – tCLCX ns Low time tCLCX 10 tCLCL – tCHCX ns Rise time tCLCH – 10 ns Fall time tCHCL – 10 ns Semiconductor Group 44 C504 Figure 15 Program Memory Read Cycle Figure 16 Data Memory Read Cycle Semiconductor Group 45 C504 Figure 17 Data Memory Write Cycle Figure 18 External Clock Cycle Semiconductor Group 46 C504 ROM Verification Characteristics for C504-2R ROM Verification Mode 1 Parameter Symbol Limit Values min. max. Unit Address to valid data tAVQV – 48tCLCL ns ENABLE to valid data tELQV – 48tCLCL ns Data float after ENABLE tEHQZ 0 48tCLCL ns Oscillator frequency 1/tCLCL 4 6 MHz Figure 19 ROM Verification Mode 1 Semiconductor Group 47 C504 ROM Verification Mode 2 Parameter Symbol Limit Values Unit min. typ max. ALE pulse width tAWD – 2 tCLCL – ns ALE period tACY – 12 tCLCL – ns Data valid after ALE tDVA – – 4 tCLCL ns Data stable after ALE tDSA 8 tCLCL – – ns P3.5 setup to ALE low tAS – tCLCL – ns Oscillator frequency 1/tCLCL 4 – 6 MHz Figure 20 ROM Verification Mode 2 Semiconductor Group 48 C504 AC Inputs during testing are driven at VCC – 0.5 V for a logic ’1’ and 0.45 V for a logic ’0’. Timing measurements are made at VIHmin for a logic ’1’ and VILmax for a logic ’0’. Figure 21 AC Testing: Input, Output Waveforms For timing purposes a port pin is no longer floating when a 100 mV change from load voltage occurs and begins to float when a 100 mV change from the loaded VOH/VOL level occurs. IOL/IOH ≥ ± 20 mA Figure 22 AC Testing : Float Waveforms Figure 23 Recommended Oscillator Circuits for Crystal Oscillator Semiconductor Group 49