Imaging ■ CMOS CMOS CAMERA MODULES Camera Modules Module configuration: CMOS image sensor, CDS/AGC/10-bit ADC, timing generator, DSP, lens Color filter: R, G, B primary color mosaic filters Operating temperature: –20 to 60°C Lens 1/2.4 type Optical function Model No. OIS function, auto focus function RJ63GC600 21M Auto focus function RJ63GCE00 Video performance 21M 24 fps 4K2K 30 fps 1 080p 60 fps (Normal/HDR) 5 344 x 4 016 Horizontal ConfiguF No. viewing ration angle (°) F2.0 Outline Supply dimensions*2 Package*1 voltage (D x W x H) (V) TYP. TYP. (mm) 64 RAW 3.0/2.5/ (Mipi, 4 lanes) 1.8/1.1 6 pcs. F2.2 Output signal 74.5 12.0 x 12.0 x 6.52 FPC type 10.6 x 10.8 x 5.125 *1 Contact a SHARP sales office regarding FPC type package. *2 Height (H) includes the protruding lens section. RJ63GC600 RJ63GCE00 Notice In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Except where specially indicated, models listed on this page comply with the RoHS Directive*. For details, please contact SHARP. *RoHS Directive: Prohibits use of lead, cadmium, hexavalent chromium, mercury and specific brominated flame retardants (PBBs and PBDEs), with certain exceptions. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. CMOS Image Sensors/ CCDs Optical Image format format Output pixels (H x V) MAX. 7 Imaging ■ CMOS Optical format 1 type 2/3 type 8 CMOS IMAGE SENSORS FOR DIGITAL CAMERAS/ DIGITAL CAMCORDERS Image Sensors for Digital Cameras/Digital Camcorders Total pixels 13 110 k 2 320 k Color filter Model No. R, G, B primary color mosaic filters RJ5DY1BA0LT B/W RJ5DY2BA0LT R, G, B primary color mosaic filters RJ52N1BA0LT B/W RJ52N2BA0LT Video performance Resolution Image pixels (H × V) Pixel size H × V (µm) 4K2K 60 fps 4 144 × 3 096 3.1 × 3.1 Sensitivity (mV/Lux-sec) TYP. Package 1 420 N-LCC120-R898 2 390 3 240 1 080p 120 fps 1 984 × 1 116 5.0 × 5.0 N-LCC120-R898A 6 080 Notice In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Except where specially indicated, models listed on this page comply with the RoHS Directive*. For details, please contact SHARP. *RoHS Directive: Prohibits use of lead, cadmium, hexavalent chromium, mercury and specific brominated flame retardants (PBBs and PBDEs), with certain exceptions. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. Imaging PROGRESSIVE CCDs High-Sensitivity Image Sensors for Security Usage Optical format Total pixels CCDs Model No. RJ33B3AA0DT *2 350 k RJ33B4AA0DT *2 RJ33B3AD0DT *2 RJ33B4AD0DT *2 B/W Primary color VGA 200 fps (2 ch output) NTSC 650 TV lines 610 k RJ3341AA0PB PAL 650 TV lines RJ33J3BA0DT 2 170 k RJ33J4BA0DT RJ33J3CA0DT *2 2 130 k 660 x 494 7.4 x 7.4 Primary color 4 500 3 000 976 x 494 5.0 x 7.4 976 x 582 5.0 x 6.3 1 500 1 320 x 976 3.75 x 3.75 1 190 950 470 RJ33N4AA0LT *2 RJ33N3AD0LT *2 RJ31N4EA0DT *2 RJ31N3ED0DT *2 RJ31N3AA0DT RJ31N4AA0DT RJ31N3AD0DT RJ31N4AD0DT RJ31P4AA0DT *2 RJ31P3AD0DT *2 RJ31P4AD0DT *2 1 080p 50 fps (2 ch output) 1 080p 25 fps (1 ch output) 1 080p 50 fps (2 ch output) 2M 25 fps (1 ch output) 2M 50 fps (2 ch output) 2.8M 17 fps (1 ch output) 2.8M 30 fps (2 ch output) B/W Primary color 1 928 x 1 088 2.8 x 2.8 650 470 B/W 650 Primary color 750 B/W Primary color 1 928 x 1 088 3.65 x 3.65 1 150 750 B/W 1 150 Primary color 1 100 B/W Primary color 1 644 x 1 236 4.4 x 4.4 1 650 1 100 B/W 1 650 Primary color 750 B/W Primary color B/W –125 P-DIP024-0400 –120 P-DIP016-0450 –120 P-DIP024-0400 –110 N-LCC040-R350B 790 RJ33N3AA0LT *2 1 080p 25 fps (1 ch output) Package 4 500 1 430 RJ31P3AA0DT *2 2 960 k B/W 1.3M 30 fps 720p 30 fps (1 ch output) Smear ratio (dB) TYP. 3 000 B/W RJ31N4ED0DT *2 1/1.8 type Complementary color Complementary color Primary color Sensitivity*1 (mV) TYP. Primary color RJ31N3EA0DT *2 2 100 k Pixel size H x V (µm) RJ33J4CA0DT *2 RJ33N4AD0LT *2 2 170 k Resolution Image pixels (H x V) B/W RJ3331AA0PB 1 350 k Color filter Primary color VGA 120 fps (1 ch output) 520 k 1/3 type 1/2 type Video performance 1 940 x 1 460 3.69 x 3.69 1 150 750 CMOS Image Sensors/ CCDs ■ Progressive –115 –120 P-DIP028-0566 –115 1 150 *1 The average G signal output voltage (the average output voltage in the case of the complementary color filter) when a 1,000-lux light source with a 90% reflector is imaged by a lens of F4 at 1/30 sec (1/25 sec in the case of RJ3341AA0PB) frame accumulation. *2 This model is the next-generation model. Light efficiency including the near-infrared light region has been drastically improved by our process technology. Notice In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Except where specially indicated, models listed on this page comply with the RoHS Directive*. For details, please contact SHARP. *RoHS Directive: Prohibits use of lead, cadmium, hexavalent chromium, mercury and specific brominated flame retardants (PBBs and PBDEs), with certain exceptions. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. 9 Imaging PROGRESSIVE CCDs ★ Under ■ Progressive Optical format Total pixels CCDs (cont'd) Model No. RJ32S3AA0DT RJ32S4AA0DT 2/3 type 5 240 k RJ32S3AD0DT RJ32S4AD0DT RJ32S3AF0DT *2 RJ32S4AF0DT *2 RJ3DT3AA0DT *2 RJ3DT4AA0DT *2 6 090 k 1/1 type RJ3DT3AD0DT *2 RJ3DT4AD0DT *2 RJ3DT3AF0DT *2 RJ3DT4AF0DT *2 8 290 k 4/3 type 8 340 k development RJ3DV3AF0DT *2 RJ3DV4AF0DT *2 ★RJ3EV3EF0DT *2 ★RJ3EV4EF0DT *2 Video performance 5M 9 fps (1 ch output) 5M 15 fps (2 ch output) 5M 30 fps (4 ch output) 6M 8 fps (1 ch output) 6M 15 fps (2 ch output) 6M 30 fps (4 ch output) 8M 25 fps (4 ch output) 8M 25 fps (4 ch output) Color filter Resolution Image pixels (H x V) Pixel size H x V (µm) Primary color B/W Primary color B/W 800 2 456 x 2 058 3.45 x 3.45 530 800 B/W 1 750 2 758 x 2 208 4.54 x 4.54 1 150 1 750 Primary color 1 150 B/W 1 750 Primary color B/W Primary color B/W –110 P-DIP064-1000 870 1 150 B/W Package P-DIP028-0566 580 2 456 x 2 056 Primary color Primary color Smear ratio (dB) TYP. 530 B/W Primary color Sensitivity*1 (mV) TYP. 3 320 x 2 496 3.88 x 3.88 3 848 x 2 168 5.14 x 5.14 750 1 100 1 500 2 250 –125 P-DIP064-1000 –120 –125 P-DIP064-1000B *1 The average G signal output voltage when a 1,000-lux light source with a 90% reflector is imaged by a lens of F4 at 1/30 sec frame accumulation. *2 This model is the next-generation model. Light efficiency including the near-infrared light region has been drastically improved by our process technology. 10 Notice In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Except where specially indicated, models listed on this page comply with the RoHS Directive*. For details, please contact SHARP. *RoHS Directive: Prohibits use of lead, cadmium, hexavalent chromium, mercury and specific brominated flame retardants (PBBs and PBDEs), with certain exceptions. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. Imaging Total pixels CCDs Standard 270 k NTSC 320 k PAL 410 k NTSC Color 470 k PAL 520 k NTSC 610 k PAL Model No. Resolution Horizontal Image pixels TV lines (H x V) RJ2315EA0PB RJ2315FA0PB *2 RJ2325EA0PB 512 x 492 RJ2355DA0PB RJ2365DA0PB RJ2331BA0PB RJ2341BA0PB 512 x 582 9.6 x 6.34 768 x 494 6.4 x 7.5 480 RJ2365EA0PB *2 RJ2331CA0PB*2 9.6 x 7.5 330 RJ2325FA0PB *2 RJ2355EA0PB *2 Pixel size H x V (µm) 752 x 582 6.53 x 6.39 976 x 494 5.0 x 7.4 650 976 x 582 RJ2341CA0PB*2 5.0 x 6.3 Sensitivity*1 (mV) TYP. Smear ratio (dB) TYP. Package 4 200 4 500 4 200 –140 4 500 2 700 3 000 2 700 –135 P-DIP016-0450 3 000 2 400 2 600 2 400 –125 2 600 CMOS Image Sensors/ CCDs ■ 1/3-type 1/3-TYPE CCDs / 1/4-TYPE CCDs *1 The average output voltage measured when imaging a 90% reflector illuminated by a 1,000-lux light source through an optical system set at an f number of F4.0. *2 This model is the next-generation model. Light efficiency including the near-infrared light region has been drastically improved by our process technology. ■ 1/4-type Total pixels CCDs Standard 270 k NTSC Model No. Resolution Horizontal Image pixels TV lines (H x V) RJ2411FA0PB Pixel size H x V (µm) Sensitivity*1 TYP. (mV) 512 x 492 7.2 x 5.6 1 800 512 x 582 7.2 x 4.73 1 650 768 x 494 4.9 x 5.6 330 320 k 410 k PAL RJ2421FA0PB NTSC RJ2455DA0PB Color Smear ratio TYP. (dB) Package –130 480 1 350 470 k PAL RJ2465DA0PB 752 x 582 5.0 x 4.77 520 k NTSC RJ2431AA0PB 976 x 494 3.75 x 5.56 610 k PAL RJ2441AA0PB 976 x 582 3.75 x 4.47 P-DIP014-0400A –120 650 1 400 *1 The average output voltage measured when imaging a 90% reflector illuminated by a 1,000-lux light source through an optical system set at an f number of F4.0. Notice In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Except where specially indicated, models listed on this page comply with the RoHS Directive*. For details, please contact SHARP. *RoHS Directive: Prohibits use of lead, cadmium, hexavalent chromium, mercury and specific brominated flame retardants (PBBs and PBDEs), with certain exceptions. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. 11 Imaging ■ DSPs for CCDs Description CDS/PGA/ADC + DSP 12 DSPs FOR CCDs Model No. LR36B16 Features <CDS/PGA/ADC> High-speed S/H circuit, high-gain PGA circuit, 12-bit ADC <DSP> 75-ohm video amplifier, mechanical iris control function, 10-bit DAC, synchronous signal generation circuit, CCD drive timing generator, AE control function, AWB control function, LED light control function, DWDR (gamma transition function), For 270-k/320-k/410-k/470-k/ lens shading correction function, 520-k/610-kpixel CCDs auto white blemish compensation function, mirror image function, OSD function (5 languages: En., Ch., Fr., Por., Sp.), privacy mask function, highlight compensation, motion detection function, 2D noise reduction, high resolution function, AF detection value output, NTSC/PAL analog output, Y/C analog output, UYVY digital output (ITU-R BT656 compatible) Package P-HQFN072-1010 Notice In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Except where specially indicated, models listed on this page comply with the RoHS Directive*. For details, please contact SHARP. *RoHS Directive: Prohibits use of lead, cadmium, hexavalent chromium, mercury and specific brominated flame retardants (PBBs and PBDEs), with certain exceptions. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. Imaging CCD PERIPHERAL ICs/LSIs System Configuration Examples •<Color Security Camera System with Three-chip Configuration> EEP ROM Analog output for NTSC/PAL CDS/PGA/12-bit ADC + DSP LR36B16 V driver Analog output for Y/C Digital output for UYVY (ITU-R BT656 compatible) Power supply voltage 3.3 V Four-power-supply CCDs and peripheral ICs/LSIs CCD 270 kpixels 320 kpixels 410 kpixels 1/3 type 470 kpixels 520 kpixels 610 kpixels 1/4 type CDS/PGA/ADC + DSP + Video amplifier CMOS Image Sensors/ CCDs Four-power-supply CCD RJ2315EA0PB RJ2315FA0PB RJ2325EA0PB RJ2325FA0PB RJ2355DA0PB RJ2355EA0PB RJ2365DA0PB RJ2365EA0PB RJ2331BA0PB RJ2331CA0PB LR36B16 RJ2341BA0PB RJ2341CA0PB 270 kpixels RJ2411FA0PB 320 kpixels RJ2421FA0PB 410 kpixels RJ2455DA0PB 470 kpixels RJ2465DA0PB 520 kpixels RJ2431AA0PB 610 kpixels RJ2441AA0PB Notice In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Except where specially indicated, models listed on this page comply with the RoHS Directive*. For details, please contact SHARP. *RoHS Directive: Prohibits use of lead, cadmium, hexavalent chromium, mercury and specific brominated flame retardants (PBBs and PBDEs), with certain exceptions. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. 13 LSI TOUCH PANEL SYSTEM ☆New ■ Touch Panel Features • product System 1. By adopting Sharp’s proprietary method, approximately eight times more sensitivity (comparison by Sharp) has been achieved compared with the conventional sequential driving method.* Capable of sensing a φ2 mm pen touch, multi-touch operation and touch operation using a glove. 2. Contributes to a thinner design of a touch panel display. A thinner design is achievable because the design is insusceptible to the noise effect, which makes space for the sensor sheets and the display modules unnecessary. 3. Common user interface from small to large screens allows for a reduction in software development cost. ** When When comparing comparing an an S/N S/N ratio ratio of of 3.58 3.58 determined determined through through the the conventional conventional sequential sequential driving driving method method using using pen-touch pen-touch writing writing on on aa 20-inch 20-inch screen screen with with an an S/N S/N ratio ratio of of 30.65 determined through Sharp’s proprietary parallelparallel drivingdriving methodmethod (measured by Sharp). 30.65 determined through Sharp’s proprietary (measured by Sharp). •System Configuration Touch panel, 7 to 10 inches Touch panel, 10 to 15.6 inches Touch panel, 20 to 32 inches LR388K5 LR388K4 LR0G964 LR0G967 ☆LR0G969 HOST HOST HOST HOST HOST Touch panel, up to 5 inches Touch panel, above 32 inches Product lines •Application Examples Interactive whiteboard Table computer Smart TV PC monitor Digital signage Tablet Notebook PC Smartphone eBook Multiple people can input on the screen simultaneously, which makes it more useful on educational sites. Multi-touch UI on a large screen for browsing or layout editing. Pen touch input is possible. Operation with a glove is possible. 14 Notice In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Except where specially indicated, models listed on this page comply with the RoHS Directive*. For details, please contact SHARP. *RoHS Directive: Prohibits use of lead, cadmium, hexavalent chromium, mercury and specific brominated flame retardants (PBBs and PBDEs), with certain exceptions. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. ☆New ■ Touch Model No. Panel System / System LSIs Function LR388K5 Touch panel controller for small-size screens (up to 5 inches) LR388K4 Touch panel controller for tablets (7 to 10 inches) ■ Touch Model No. product Features • 10-finger multi-touch detection • Scanning speed: 120 Hz • Capable of sensing a φ2 mm pen touch • I2C/SPI interface • 10-finger multi-touch detection • Scanning speed: 240 Hz • Capable of sensing a φ2 mm pen touch • USB/I2C/SPI interface • Built-in palm cancellation feature Supply voltage (V) Package I/O: 1.62 to 3.6 Analog: 2.7 to 3.6 P-VFBGA96P-0606 Core: 1.2±0.12 I/O: 3.3±0.3 Analog: 3.3±0.3 P-VFBGA360P-0613 Supply voltage (V) Outline dimensions (W × D) (mm) 5 74 × 46 5 60 × 80 5 130 × 100 (Main) 220 × 100 (AFE) System LSIs LSI TOUCH PANEL SYSTEM / SYSTEM LSIs / TOUCH PANEL SYSTEM / TOUCH PANELCONTROLLER MODULE Panel System / Touch Panel Controller Module Function LR0G964 Touch panel controller module for midium-size screens (10 to 15.6 inches) LR0G967 Touch panel controller module for midium-size screens (15 to 32 inches) ☆LR0G969 Touch panel controller module for large-size screens (Over 32 inches) Features • 10-finger multi-touch detection • Scanning speed: 240 Hz • Capable of sensing a φ2 mm pen touch • Built-in palm cancellation feature • USB interface • Built-in power supply circuit • 10-finger multi-touch detection • Scanning speed: 240 Hz • Capable of sensing a φ2 mm pen touch • Built-in palm cancellation feature • USB interface • Built-in power supply circuit • 50-finger multi-touch detection • Scanning speed: 240 Hz • Capable of sensing a φ2 mm pen touch • Built-in palm cancellation feature • USB interface • Built-in power supply circuit Notice In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Except where specially indicated, models listed on this page comply with the RoHS Directive*. For details, please contact SHARP. *RoHS Directive: Prohibits use of lead, cadmium, hexavalent chromium, mercury and specific brominated flame retardants (PBBs and PBDEs), with certain exceptions. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. 15 LSI CSP ■ CSP (Chip Size Package) •CSP The FBGA (commonly known as CSP) has an area array terminal structure with solder balls on the bottom, to give it a near chip-size footprint. This high-density, compact and low-profile package technology will greatly help in the design of compact mobile equipment, such as mobile phones and digital cameras. ● Compact FBGA (CSP) and lightweight Ability to create a near-chip size and lighter-weight package in comparison with conventional plastic packages. ● High reliability Comparable high reliability with that of conventional plastic packages. ● Mountability Conventional mounting system is available for CSP. SOP and QFP can be mounted together with CSP. Terminal pitch 0.8 mm 0.65 mm 0.5 mm 0.4 mm Maximum terminal counts 352 (16 mm x 16 mm) 352 (16 mm x 16 mm) 372 (16 mm x 16 mm) 264 (10 mm x 10 mm) Nominal dimensions 5 mm x 5 mm to 10 mm x 10 mm 6 mm x 6 mm to 16 mm x 16 mm Gold wire IC Mold resin Packages Features Package height 0.8 mm to 1.5 mm (MAX.) Cross section example Substrate Cu pattern Solder ball Terminal pitch : 0.8 mm 0.65 mm 0.5 mm 0.4 mm Diameter : 0.45 mm 0.4 mm 0.3 mm 0.25 mm CSP • Wafer-level The wafer-level CSP (WL-CSP) is a kind of chip-size package which is manufactured by assembling directly onto the finished wafer. ● Compact and thinner size It makes it possible to create an almost IC-size and lighter-weight package. ● Mountability Features The conventional CSP mounting system can be also used in that of wafer-level CSP, which facilitates chip mounting more than bare-chip mounting does. It can be mounted together with other existing packages and passive components. Chip size* 4 mm x 4 mm 3.5 mm x 3.5 mm 3 mm x 3 mm Pad pitch 0.5 mm 0.4 mm 0.5 mm 0.4 mm 0.5 mm 0.4 mm Maximum terminal counts 49 (7 x 7) 81 (9 x 9) 36 (6 x 6) 49 (7 x 7) 25 (5 x 5) 36 (6 x 6) * Rectangular chip form is also available. Cu pattern IC Cross section example Package height 0.5 mm to 1 mm (MAX.) Passivation layer Solder ball 23 LSI ■ SiP • SiP (System in Package) System in Package is SHARP’s original high-density mounting technology that achieves high-density memory capacity and multiple functions by stacking multiple ICs or multiple packages. The System in Package technology means chip-stacked package technology that can achieve up to 5-chip mounting by stacking ICs in a single package. The System in Package technology contributes to higher functionality of applications, such as mobile phones and digital cameras, as well as to reduction in size and weight. Chip Stacked CSP ● Wide variety of lineup It is possible to provide a wide lineup of stacked CSPs, including 2-chip, 3-chip, 4-chip and 5-chip stacked CSPs, to respond to customer needs. ● Compact and thinner size Encapsulating multiple ICs into an existing plastic package contributes to decreasing the mounting area. In addition, SHARP’s wafer thinning technology makes it possible to achieve 1.4 mm (MAX.) package height. ● Multiple Features functions Multiple ICs of different sizes and functions, such as logic LSIs and memories, can be incorporated in a single package, making possible multiple functions. ● Same-size IC stacking technology SHARP's stacking technology enables stacking of multiple same-size ICs, contributing to higher memory density. (4-chip stacked CSP) When using a SHARP four-chip stacked CSP, the mounting area and weight of a package can be decreased by half in comparison with using two 2-chip stacked CSPs, or a 3-chip stacked CSP and a conventional CSP. (5-chip stacked CSP) Gold wire IC Mold resin Cross section example Package height 1.4 mm (MAX.)* 1.6 mm (MAX.)* Cu pattern Substrate Diameter : 0.45 mm 0.30 mm 24 Solder ball Terminal pitch : 0.8 mm 0.5 mm * At 0.8 mm terminal pitch Notice In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Except where specially indicated, models listed on this page comply with the RoHS Directive*. For details, please contact SHARP. *RoHS Directive: Prohibits use of lead, cadmium, hexavalent chromium, mercury and specific brominated flame retardants (PBBs and PBDEs), with certain exceptions. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. LSI SiP •Chip Stacked TSOP/QFP*/VQFN/HQFN ● Decreased mounting area By encapsulating two identical or different types of ICs into a single conventional plastic package, the mounting area of the package can be decreased. Features ● Multiple functions Thanks to the incorporation of different sizes and functions of multiple ICs, such as logic LSIs and memories, the functionality increases. ● Higher memory density When incorporating two identical memory ICs into a single package, memory density doubles on the same mounting area. (TSOP, QFP*) (Hamburger type) (Turtle stack type) Cross section example Gold wire IC Gold wire Packages IC (HQFN) (VQFN) Gold wire Mold resin Gold wire Package height 1.0 mm (MAX.) Mold resin Package height 1.0 mm (MAX.) * Including TQFP and LQFP. Notice In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Except where specially indicated, models listed on this page comply with the RoHS Directive*. For details, please contact SHARP. *RoHS Directive: Prohibits use of lead, cadmium, hexavalent chromium, mercury and specific brominated flame retardants (PBBs and PBDEs), with certain exceptions. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. 25 LSI PACKAGE LINEUP ■ Package Lineup •Surface-Mount Type Package type Appearance (Package material) Package code No. of terminals Package depth & width Terminal pitch Nominal dimensions (D x W) x mm mm (seated height [MAX.]) mm P-LFBGA048-0606 P-TFBGA048-0608 48 P-TFBGA048-0808 P-TFBGA056-0808 56 P-TFBGA060-0811 60 (48)* P-TFBGA064-0811 64 P-TFBGA072-0811 P-LFBGA072-0811 81 P-LFBGA085-0811 85 P-LFBGA087-0811 87 P-LFBGA088-0912 FBGA (CSP) D W (Plastic) 6.0 x 6.0 x (1.4) 6x 8 6.0 x 8.0 x (1.2) 8x 8 8.0 x 8.0 x (1.2) 8 x 11 72 (64)* P-TFBGA081-0808 P-LFBGA088-0811 6x 6 8.0 x 11.0 x (1.2) 8.0 x 11.0 x (1.4) / (1.6) 88 8x 8 8.0 x 8.0 x (1.2) 8 x 11 8.0 x 11.0 x (1.4) / (1.6) 9 x 12 9.0 x 12.0 x (1.4) / (1.6) 8 x 11 8.0 x 11.0 x (1.4) / (1.6) P-LFBGA090-0811 90 P-TFBGA096-1010 96 P-LFBGA107-0912 107 P-TFBGA111-1010 111 P-TFBGA112-1010 112 P-LFBGA115-0914 115 9 x 14 9.0 x 14.0 x (1.4) / (1.6) P-LFBGA116-1010 116 10 x 10 10.0 x 10.0 x (1.4) / (1.6) P-LFBGA130-1013 130 10 x 13 10.0 x 13.0 x (1.4) / (1.6) P-TFBGA144-1111 144 11 x 11 11.0 x 11.0 x (1.2) P-TFBGA160-1212 160 12.0 x 12.0 x (1.2) P-LFBGA168-1212 168 12.0 x 12.0 x (1.4) / (1.6) P-TFBGA180-1212 180 P-TFBGA184-1212 184 P-TFBGA240-1414 240 P-LFBGA280-1616 280 P-LFBGA352-1616 352 0.8 10 x 10 10.0 x 10.0 x (1.2) 9 x 12 9.0 x 12.0 x (1.4) / (1.6) 10 x 10 10.0 x 10.0 x (1.2) 12 x 12 12.0 x 12.0 x (1.2) 14 x 14 14.0 x 14.0 x (1.2) 16 x 16 16.0 x 16.0 x (1.5) 6.0 x 6.0 x (1.2) P-TFBGA064-0606 64 6x 6 P-LFBGA140-0909 140 9x 9 9.0 x 9.0 x (1.4) P-LFBGA160-1010 160 10 x 10 10.0 x 10.0 x (1.4) / (1.6) P-TFBGA180-1313 180 P-LFBGA192-1010 192 P-LFBGA208-1212 208 P-LFBGA224-1313 224 P-TFBGA260-1313 260 0.65 13 x 13 13.0 x 13.0 x (1.2) 10 x 10 10.0 x 10.0 x (1.4) / (1.6) 12 x 12 12.0 x 12.0 x (1.4) / (1.6) 13 x 13 13.0 x 13.0 x (1.4) / (1.6) 13.0 x 13.0 x (1.2) * Figures in brackets indicate available terminal counts. 26 Notice In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Except where specially indicated, models listed on this page comply with the RoHS Directive*. For details, please contact SHARP. *RoHS Directive: Prohibits use of lead, cadmium, hexavalent chromium, mercury and specific brominated flame retardants (PBBs and PBDEs), with certain exceptions. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. LSI PACKAGE LINEUP •Surface-Mount Type (cont’d) Appearance (Package material) Package code No. of terminals P-VFBGA057-0505 57 P-VFBGA075-0505 75 P-TFBGA064-0606 64 P-TFBGA068-0606 68 P-VFBGA081-0606 81 P-TFBGA084-0606 84 Package depth & width Terminal pitch Nominal dimensions (D x W) x mm mm (seated height [MAX.]) mm 5x 5 6.0 x 6.0 x (1.1) 6x 6 6.0 x 6.0 x (0.9) 7.0 x 7.0 x (0.9) 100 P-TFBGA100-0707 P-VFBGA108-0707 P-TFBGA108-0707 P-VFBGA120-0707 P-TFBGA120-0707 7.0 x 7.0 x (1.1) 7.0 x 7.0 x (0.9) 108 7x 7 132 P-TFBGA133-0808 133 7.0 x 7.0 x (1.1) 8.0 x 8.0 x (1.1) 8x 8 P-VFBGA144-0808 FBGA (CSP) 144 D W P-VFBGA171-0811 P-LFBGA171-0811 P-VFBGA176-0909 P-TFBGA176-0909 P-TFBGA180-0909 P-TFBGA188-0909 P-VFBGA188-1111 P-VFBGA208-1010 P-TFBGA208-1010 P-TFBGA245-1010 P-LFBGA245-1010 (Plastic) 8.0 x 8.0 x (0.9) 8.0 x 8.0 x (1.3) / (1.5) 0.5 8 x 11 8.0 x 11.0 x (1.3) 152 8x 8 8.0 x 8.0 x (1.1) 171 8 x 11 P-LFBGA144-0811 P-TFBGA152-0808 7.0 x 7.0 x (1.1) 7.0 x 7.0 x (0.9) 120 P-TFBGA132-0707 P-LFBGA144-0808 6.0 x 6.0 x (0.9) 6.0 x 6.0 x (1.1) P-VFBGA100-0606 P-VFBGA100-0707 5.0 x 5.0 x (0.9) 9x 9 180 188 11 x 11 10 x 10 245 P-WFBGA144-0606 144 P-WFBGA121-0606 121 P-WFBGA145-0606 145 P-TFBGA168-0707 168 P-TFBGA204-0808 204 P-WFBGA205-0808 205 P-WFBGA261-0808 261 9.0 x 9.0 x (1.1) 11.0 x 11.0 x (0.9) 10.0 x 10.0 x (0.9) 208 424 8.0 x 11.0 x (0.9) 8.0 x 11.0 x (1.3) / (1.5) 9.0 x 9.0 x (0.9) 176 P-FBGA424-1414 Packages Package type 10.0 x 10.0 x (1.1) 10.0 x 10.0 x (1.3) 14 x 14 14.0 x 14.0 x (1.8) 6.0 x 6.0 x (0.75) 6x 6 0.4 7x 7 6.0 x 6.0 x (0.8) 7.0 x 7.0 x (1.0) 8.0 x 8.0 x (1.0) 8x 8 8.0 x 8.0 x (0.8) Notice In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Except where specially indicated, models listed on this page comply with the RoHS Directive*. For details, please contact SHARP. *RoHS Directive: Prohibits use of lead, cadmium, hexavalent chromium, mercury and specific brominated flame retardants (PBBs and PBDEs), with certain exceptions. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. 27 LSI PACKAGE LINEUP •Surface-Mount Type (cont’d) Package type Appearance (Package material) No. of terminals P-TFBGAXXX-0606 to 36 6x 6 6.0 x 6.0 x (1.2) P-TFBGAXXX-0707 to 49 7x 7 7.0 x 7.0 x (1.2) P-TFBGAXXX-0808 to 81 8x 8 8.0 x 8.0 x (1.2) P-TFBGAXXX-0909 to 100 9x 9 9.0 x 9.0 x (1.2) P-TFBGAXXX-1010 to 121 10 x 10 10.0 x 10.0 x (1.2) P-TFBGAXXX-1111 to 144 11 x 11 11.0 x 11.0 x (1.2) P-TFBGAXXX-1212 to 196 12 x 12 12.0 x 12.0 x (1.2) P-TFBGAXXX-1313 to 216 13 x 13 13.0 x 13.0 x (1.2) 14 x 14 14.0 x 14.0 x (1.2) 15 x 15 15.0 x 15.0 x (1.2) P-TFBGAXXX-1414 P-TFBGAXXX-1515 FBGA (CSP) D W (Plastic) PBGA (BGA) D W (Plastic) Package depth & width Terminal pitch Nominal dimensions (D x W) x mm mm (seated height [MAX.]) mm Package code 0.8 to 240 P-TFBGAXXX-1616 to 352 16 x 16 16.0 x 16.0 x (1.2) P-TFBGAXXX-0606 to 49 6x 6 6.0 x 6.0 x (1.2) P-TFBGAXXX-0707 to 81 7x 7 7.0 x 7.0 x (1.2) P-TFBGAXXX-0808 to 121 8x 8 8.0 x 8.0 x (1.2) P-TFBGAXXX-0909 to 144 9x 9 9.0 x 9.0 x (1.2) P-TFBGAXXX-1010 to 196 10 x 10 10.0 x 10.0 x (1.2) P-TFBGAXXX-1111 to 224 11 x 11 11.0 x 11.0 x (1.2) P-TFBGAXXX-1212 to 256 12 x 12 12.0 x 12.0 x (1.2) P-TFBGAXXX-1313 to 272 13 x 13 13.0 x 13.0 x (1.2) P-TFBGAXXX-1414 to 304 14 x 14 14.0 x 14.0 x (1.2) P-TFBGAXXX-1515 to 320 15 x 15 15.0 x 15.0 x (1.2) P-TFBGAXXX-1616 to 352 16 x 16 16.0 x 16.0 x (1.2) P-TFBGAXXX-0606 to 100 6x 6 6.0 x 6.0 x (1.1) P-TFBGAXXX-0707 to 132 7x 7 7.0 x 7.0 x (1.1) P-TFBGAXXX-0808 to 164 8x 8 8.0 x 8.0 x (1.1) P-TFBGAXXX-0909 to 192 9x 9 9.0 x 9.0 x (1.1) P-TFBGAXXX-1010 to 216 10 x 10 10.0 x 10.0 x (1.1) P-TFBGAXXX-1111 to 244 11 x 11 11.0 x 11.0 x (1.1) P-TFBGAXXX-1212 to 268 12 x 12 12.0 x 12.0 x (1.1) P-TFBGAXXX-1313 to 296 13 x 13 13.0 x 13.0 x (1.1) P-TFBGAXXX-1414 to 320 14 x 14 14.0 x 14.0 x (1.1) P-TFBGAXXX-1515 to 348 15 x 15 15.0 x 15.0 x (1.1) P-TFBGAXXX-1616 to 372 16 x 16 16.0 x 16.0 x (1.1) P-TFBGAXXX-0505 to 100 5x 5 5.0 x 5.0 x (1.0) P-TFBGAXXX-0606 to 144 6x 6 6.0 x 6.0 x (1.0) P-TFBGAXXX-0707 to 168 7x 7 7.0 x 7.0 x (1.0) P-TFBGAXXX-0808 to 204 8x 8 8.0 x 8.0 x (1.0) P-TFBGAXXX-0909 to 228 9x 9 9.0 x 9.0 x (1.0) P-TFBGAXXX-1010 to 264 10 x 10 10.0 x 10.0 x (1.0) 1.0 21 x 21 21.0 x 21.0 x (2.2) 1.27 35 x 35 35.0 x 35.0 x (2.63) P-BGA0356-2121 356 P-BGA0476-3535 476 P-BGA0528-3535 528 0.65 0.5 0.4 XXX: Terminal counts BGA is a trademark of Motorola Nippon Ltd. 28 Notice In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Except where specially indicated, models listed on this page comply with the RoHS Directive*. For details, please contact SHARP. *RoHS Directive: Prohibits use of lead, cadmium, hexavalent chromium, mercury and specific brominated flame retardants (PBBs and PBDEs), with certain exceptions. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. LSI PACKAGE LINEUP Package type Appearance (Package material) W Package code P-TSOP048-1220 No. of terminals 48 TSOP Package depth & width Lead frame material (D x W) x Alloy42 Copper alloy (seated height [MAX.]) mm 12 x 20 12.0 x 18.4 x (1.2) 14.0 x 18.4 x (1.2) 0.5 (Plastic) D QFP W LQFP D TQFP (Plastic) VQFN Terminal pitch Nominal dimensions mm (mil) mm (mil) W D HQFN* (Plastic) P-TSOP056-1420 56 14 x 20 P-QFP048-0707 48 7x 7 P-QFP072-1010 72 P-LQFP080-1212 80 P-LQFP100-1414 100 P-TQFP048-0707 48 P-TQFP100-1414 100 P-TQFP128-1414 128 P-VQFN020-0404 20 P-VQFN024-0404 24 P-VQFN028-0505 28 P-VQFN032-0505 32 P-VQFN036-0606 0.5 0.5 0.5 0.4 7.0 x 7.0 x (1.65) ○ ○ ○ ○ ○ ○ 10 x 10 10.0 x 10.0 x (1.8) ○ – 12 x 12 12.0 x 12.0 x (1.7) ○ – 14 x 14 14.0 x 14.0 x (1.7) ○ – 7x 7 7.0 x 7.0 x (1.2) ○ – ○ – 14 x 14 4x 4 14.0 x 14.0 x (1.2) 4.2 x 4.2 x (1.0) ○ – – ○ – ○ – ○ – ○ 5x 5 5.2 x 5.2 x (1.0) 36 6x 6 6.2 x 6.2 x (1.0) – ○ P-VQFN048-0707 48 7x 7 7.2 x 7.2 x (1.0) – ○ P-VQFN036-0505 36 5x 5 5.2 x 5.2 x (1.0) – ○ P-VQFN052-0707 52 7x 7 7.2 x 7.2 x (1.0) – ○ P-HQFN020-0404 20 4.0 x 4.0 x (1.0) – ○ 4.0 x 4.0 x (0.85) – ○ 4.2 x 4.2 x (1.0) – ○ 5x 5 5.0 x 5.0 x (1.0) – ○ 7x 7 7.2 x 7.2 x (1.0) – ○ P-HQFN024-0404 24 P-HQFN028-0505 28 P-HQFN052-0707 52 * HQFN is a higher heat dissipation package of VQFN. 0.5 0.4 0.5 0.4 4x 4 Packages •Surface-Mount Type (cont’d) 100 mil = 2.54 mm Notice In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Except where specially indicated, models listed on this page comply with the RoHS Directive*. For details, please contact SHARP. *RoHS Directive: Prohibits use of lead, cadmium, hexavalent chromium, mercury and specific brominated flame retardants (PBBs and PBDEs), with certain exceptions. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. 29 Imaging PACKAGE LINEUP • For CCDs Package type Appearance (Package material) W DIP D Package code No. of terminals Terminal pitch mm Nominal dimensions mm (mil) Package depth & width (D x W) x (seated height [TYP.]) mm P-DIP014-0400A 14 1.27 10.16 (400) 10.0 x 10.0 P-DIP016-0450 16 1.27 11.43 (450) 11.4 x 12.2 P-DIP020-0500 20 1.27 12.2 (500) 12.0 x 13.8 P-DIP024-0400 24 0.80 10.16 (400) 10.0 x 10.0 P-DIP028-0566 28 1.11 14.4 (566) 14.2 x 16.0 64 1.00 25.48 (1 000) 36.1 x 25.4 P-SOP014-0400A 14 1.27 12 (470) 10.0 x 10.0 x (4.1) P-SOP028-0400 28 0.69 10.16 (400) 10.0 x 10.0 x (3.5) P-SOP032-0525 32 0.78 13.3 (525) 12.0 x 13.8 x (3.92) 0.65 8.9 (350) 8.3 x 8.9 x (1.52) 0.80 11.0 (433) 11.0 x 11.0 x (1.62) P-DIP064-1000 (Plastic) W SOP D (Plastic) W P-DIP064-1000B N-LCC040-R350 (B) LCC 40 D N-LCC040-S433A (Ceramic) 100 mil = 2.54 mm • For CMOSs Package type Appearance (Package material) W LCC Package code No. of terminals Terminal pitch mm Nominal dimensions mm (mil) Package depth & width (D x W) x (seated height [TYP.]) mm 120 0.65 22.8 (898) 20.0 x 22.8 x (2.67) N-LCC120-R898 D (Ceramic) N-LCC120-R898A 100 mil = 2.54 mm Nominal dimensions FBGA (CSP) PBGA (BGA) VQFN HQFN SOP SSOP MFP TSOP DIP LCC QFP LQFP TQFP FBGA : fine-pitch ball grid array package MFP PBGA : plastic ball grid array package TSOP : thin small outline package VQFN : very thin quad flat non-leaded package SOP QFP HQFN : heat sink quad flat non-leaded package : small outline package SSOP : shrink small outline package : mini flat package : quad flat package LQFP : low profile quad flat package TQFP : thin quad flat package DIP : dual inline package LCC : leadless chip carrier Ball Grid Array and BGA are trademarks of Motorola Nippon Ltd. 30 Notice In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Except where specially indicated, models listed on this page comply with the RoHS Directive*. For details, please contact SHARP. *RoHS Directive: Prohibits use of lead, cadmium, hexavalent chromium, mercury and specific brominated flame retardants (PBBs and PBDEs), with certain exceptions. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. REG PACKAGE LINEUP • Lead-Inserting Type Packages [For regulators: PQ series] Appearance (Package material) Package type No. of terminals Terminal pitch mm Outline dimensions (Width x Thickness x Height) mm Lead frame material 4 2.54 10.2 (MAX.) x 4.5 x 29.1*2 Cu 4 2.54 10.2 (MAX.) x 4.5 x 29.1*2 Cu 5 (1.7)*1 10.2 (MAX.) x 4.5 x 24.6*2 Cu 5 (1.7)*1 10.2 (MAX.) x 4.5 x 24.6*2 Cu 5 (1.7)*1 10.2 (MAX.) x 4.5 x 24.6*2 Cu A TO-220 (Plastic) B TO-220 (Full mold) (Plastic) (Plastic) D TO-220 [Lead forming type] (Plastic) Packages TO-220 (Full mold) [Lead forming type] C E TO-220 [Lead forming type] (Plastic) *1 The figure in parentheses indicates reference value. *2 Including lead length •Surface-Mount Type Packages [For regulators/LED drivers: PQ series] Appearance (Package material) Package type No. of terminals Terminal pitch mm Outline dimensions (Width x Height x Thickness) mm Lead frame material 5 (Heat sink included) (1.27)*1 6.6 (MAX.) x 9.7 (MAX.)*2 x 2.1 Cu 8 1.27 5 x 6.2*2 x 1.55*2 Cu 6 1.5 4.5 x 4.3*2 x 1.5 Cu F SC-63 (Plastic) SOP-8 (Plastic) SOT-89 (Plastic) *1 The figure in parentheses indicates reference value. *2 Including lead length Notice In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Except where specially indicated, models listed on this page comply with the RoHS Directive*. For details, please contact SHARP. *RoHS Directive: Prohibits use of lead, cadmium, hexavalent chromium, mercury and specific brominated flame retardants (PBBs and PBDEs), with certain exceptions. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. 31 REG PACKAGE LINEUP •Surface-Mount Type Packages [For regulators/LED drivers: PQ series] (cont’d) Package type Appearance (Package material) SOT-23-6 No. of terminals Terminal pitch mm Outline dimensions (Width x Height x Thickness) mm Lead frame material 6 0.95 2.9 x 2.8*2 x 1.3 Cu 6 0.95 2.9 x 2.8*2 x 1.3 Cu 6 (0.95)*1 (3.4)*1 x 3.3*2 x 1.4 (MAX.) Cu 5 (0.95)*1 (2.9)*1 x 2.8*2 x 1.3 (MAX.) Cu 9 (Including radiating fin) 1.0 5.0 x 4.5 x 0.75 (MAX.) Cu (Plastic) SOT-23-6W (Plastic) SOT-23-L (Plastic) SOT-23-5 (Plastic) USB-8 *1 The figure in parentheses indicates reference value. *2 Including lead length 32 Notice In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Except where specially indicated, models listed on this page comply with the RoHS Directive*. For details, please contact SHARP. *RoHS Directive: Prohibits use of lead, cadmium, hexavalent chromium, mercury and specific brominated flame retardants (PBBs and PBDEs), with certain exceptions. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.