REG Power-Loss Voltage Regulators • TO-220 Type PQ30RV11J00H 1 1.4 2 3.3, 5, 9, 12 3.3, 5, 9, 12 24 15 20 ○ ○ ○ ○ A ±2.5 1.0 ○ ○ ○ ○ A ○ ○ △*6 ○ ○ 2 3 1.5 to 30 18 35 ○ ○ △*6 ○ ○ B 2 ○ ○ △*6 ○ ○ B ±2*4 0.5 20 Lead forming available Variable output voltage Package Package shape type*7 TO-220 B At self-cooling With infinite heat sink attached The xxx in the model No. refer to the output voltage values of the model (e.g. 050 for 5 V, 120 for 12 V, 015 for 1.5 V). Reference voltage precision Current ratings are defined individually. △ : Available by adding circuit Refer to page 31 Mount Type Low Power-Loss Voltage Regulators •SOT-89 Type (Ta = 25°C) PQ1LAxx5MSPQ▲ Compact, high radiation package, ceramic capacitor compatible Ceramic capacitor compatible, variable output voltage PQ1LAX95MSPQ▲ 0.5 15 0.9 Output voltage Vo*2 (V) TYP. Output Dropout voltage voltage precision VI-O*3 (V) (%) 1.2, 1.5, 1.8, 2.5, 3.3, 5.0 ±2.0 1.5 to 9.0 ±2.0*4 0.7 ○ ○ ○ ○ ○ ○ ○ ○ Variable output voltage Features Built-in functions Low dissipation current at OFF state Power Output Input dissipacurrent voltage tion Io Vin Pd*1 (A) (V) (W) Model No. Electrical characteristics ON/OFF control Absolute maximum ratings Overcurrent protection ■ Surface Overheat protection *1 *2 *3 *4 *5 *6 *7 0.5 15 1.5 PQ30RV31J00H Low dissipation current at OFF state 1 Variable output voltage ±3 Power Output Input dissipation Output Output Dropout (W) current voltage voltage voltage voltage Io Vin Vo*3 precision VI-O*5 (V) TYP. (%) (V) (A) (V) Pd*1 Pd*2 PQxxxRDA1SZH series ASO protection function, low dissipation current at PQxxxRDA2SZH series OFF state (Iqs: 5 µA (MAX.)) PQ30RV21J00H ON/OFF control Features Built-in functions Overcurrent protection Model No. (Ta = 25°C) Absolute maximum ratings Electrical characteristics Overheat protection ■ Low LOW POWER-LOSS VOLTAGE REGULATORS / SURFACE MOUNT TYPE LOW POWER-LOSS VOLTAGE REGULATORS ○ Package SOT-89 *1 When mounted on a board *2 The xx in the model No. refer to the output voltage values of the model (e.g. 25 for 2.5 V, 50 for 5.0 V). *3 Current ratings are defined individually. *4 Reference voltage precision The model marked with ▲ may not be available in the near future. Contact with SHARP for details before use. 16 Notice In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Except where specially indicated, models listed on this page comply with the RoHS Directive*. For details, please contact SHARP. *RoHS Directive: Prohibits use of lead, cadmium, hexavalent chromium, mercury and specific brominated flame retardants (PBBs and PBDEs), with certain exceptions. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. SURFACE MOUNT TYPE LOW POWER-LOSS VOLTAGE REGULATORS •SC-63 Type (1) Output Voltage Fixed Type PQxxxDNA1ZPH series PQxxxENA1ZPH series▲ PQxxxGN1HZPH series 24 8 ○ Minimum operating input voltage: 2.35 V, PQxxxENB1ZPH series▲ ceramic capacitor compatible, solder dip compatible lead shape PQxxxENAHZPH series▲ PQxxxGN01ZPH series ○ Minimum operating input voltage: 1.7 V (Dual power supply type), ceramic capacitor compatible, solder dip compatible lead shape 8 ○ 10 5 ○ ○ 3.3, 5, 9, 12 ○ 1.0, 1.2 Taped package Package shape type*4 ○ ○ ○ ○ – ○ F ○ ○ ○ ○ – ○ F 0.3 ○ ○ ○ ○ – ○ 0.9 ○ ○ ○ ○ – ○ F ○ ○ – ○ F ○ ○ – ○ F ±2.5 0.5 1.5, 1.8, 2.5, 3.3 1.2, 1.5, 1.8, 2.5, ±2.0 3.3 1.5, 1.8, 2.5, 3.3 8 5.5 Package ±30 mV – SC-63 F Power Devices/ Analog ICs Ceramic capacitor compatible, ASO protection function, low dissipation current at OFF state (Iqs: 5 µA (MAX.)), solder dip compatible lead shape Output Output Dropout voltage voltage voltage Vo*2 preciVI-O*3 (V) sion (V) TYP. (%) Built-in functions Low dissipation current at OFF state Variable output voltage Features Electrical characteristics ON/OFF control Model No. (Ta = 25°C) Absolute maximum ratings Output current Power Input Io dissivoltage (A) pation Vin Pd*1 (V) (W) 0.5 1 1.5 Overheat protection Overcurrent protection REG *1 With infinite heat sink attached *2 The xxx in the model No. refer to the output voltage values of the model (e.g. 033 for 3.3 V, 050 for 5 V, 120 for 12 V). *3 Current ratings are defined individually. *4 Refer to page 31 The model marked with ▲ may not be available in the near future. Contact with SHARP for details before use. •SC-63 Type (2) Output Voltage Variable Type PQ070XNA1ZPH▲ PQ070XNAHZPH▲ PQ070XNA2ZPH▲ PQ070XNB1ZPH▲ PQ035ZN01ZPH PQ035ZN1HZPH PQ200WNA1ZPH PQ200WN3MZPH ○ Minimum operating input voltage: 2.35 V, ceramic capacitor compatible, solder dip compatible lead shape ○ ○ 10 8 1.5 to 7 ±2.0*2 (2 A) ○ Reference voltage (Vref): 0.6 V, ○ minimum operating input voltage: 1.7 V (Dual power supply type), ceramic capacitor compatible, ○ solder dip compatible lead shape Minimum operating input voltage: 3.5 V, ASO protection function, low dissipation current at OFF ○ state (Iqs: 5 µA (MAX.)), ceramic capacitor compatible, solder dip compatible lead shape Minimum operating input voltage: 5.5 V, ○ low dissipation current at OFF (0.3) state (Iqs: 5 µA (MAX.)), ceramic capacitor compatible, current limit: 800 mA 5 1.2 to 7 0.8 to 3.5 5.5 ±30 mV Taped package Low dissipation current at OFF state Variable output voltage ON/OFF control Features Built-in functions Overheat protection Overcurrent protection Model No. (Ta = 25°C) Absolute maximum ratings Electrical characteristics Output current Power Output Output Input Dropout Io dissi- voltage voltage voltage voltage (A) pation Vo preciVin VI-O*3 Pd*1 (V) sion (V) (V) (W) TYP. (%) 0.5 1 1.5 Package Package shape type*4 0.5 ○ ○ ○ ○ ○ ○ F 0.9 ○ ○ ○ ○ ○ ○ F 0.5 ○ ○ ○ ○ ○ ○ F 0.3 ○ ○ ○ ○ ○ ○ F – ○ ○ ○ ○ F – ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ F ○ ○ ○ ○ ○ ○ F SC-63 F 8 3.0 to 20 ±2.5*2 24 6.8 5.0 to 20 0.5 *1 With infinite heat sink attached *2 Reference voltage precision *3 Current ratings are defined individually. *4 Refer to page 31 The model marked with ▲ may not be available in the near future. Contact with SHARP for details before use. Notice In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Except where specially indicated, models listed on this page comply with the RoHS Directive*. For details, please contact SHARP. *RoHS Directive: Prohibits use of lead, cadmium, hexavalent chromium, mercury and specific brominated flame retardants (PBBs and PBDEs), with certain exceptions. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. 17 •SOP-8 Type (Ta = 25°C) Features PQ1DX095MZPQ▲ Built-in sink source function (For DDR II memory) Built-in functions Output current Io (A) Input voltage Vin (V) Power dissipation Pd*1 (W) Output voltage Vo (V) TYP. Output voltage precision*2 (mV) Taped package Model No. Electrical characteristics Overcurrent protection Absolute maximum ratings Overheat protection REG SURFACE MOUNT TYPE LOW POWER-LOSS VOLTAGE REGULATORS / SURFACE MOUNT TYPE CHOPPER REGULATORS Package ±0.8 6 0.6 VDD x 1/2 (VDDQ: 1.5 V (MIN.)) ±25 ○ ○ ○ SOP-8 *1 When mounted on a board *2 Reference voltage precision The model marked with ▲ may not be available in the near future. Contact with SHARP for details before use. ■ Surface Mount Type Chopper Regulators (DC-DC Converters) Model No. Absolute maximum ratings Switch- Power Input ing dissipa- voltage range current tion Vin Isw Pd*1 (W) (V) (A) Features • High switching voltage: 40 V (MAX.) • For tuner power supply • Variable oscillation frequency • Ceramic capacitor compatible • PWM chopper regulator (high oscillation frequency) PQ1CN38M2ZPH • Output ON/OFF control function • Overcurrent/overheat protection circuits • For light load • PWM chopper regulator PQ1CN41H2ZPH (high oscillation frequency) • Overcurrent/overheat protection circuits • Bootstrap system for high efficiency (Efficiency 90% (TYP.)) PQ1CX41H2ZPQ▲ • Low voltage output: 0.8 V (MIN.) • Ceramic capacitor compatible • Bootstrap system for high efficiency (Efficiency 89% (TYP.)) PQ1CX53H2MPQ▲ • Low voltage output: 0.8 V (MIN.) • Ceramic capacitor compatible • Bootstrap system for high efficiency (Efficiency 88% (TYP.)) PQ1CX61H1ZPQ▲ • Low voltage output: 1.0 V (MIN.) • Ceramic capacitor compatible PQ6CU12X2APQ▲ 0.25 0.35 0.8 8 1.5 1.5 3.5 1.5 8 3.0 to 5.5 Electrical characteristics Package Output voltage*2 Vo (V) Output Oscillation saturation Output frequency voltage type fo (Hz) Vsat (V) TYP. TYP. up to 36 Stepup StepVREF*3 to 35 down (step-down type)/ 4.5 to REF to –30 –V 40 (inverting type) Stepdown 0.8 When 4.75 to mounted 27 on board 2 When 4.75 to mounted 27 on board 0.8 When 4.75 to mounted 28 on board (Ta = 25°C) 300 k to 800 k 300 k Outline shape type*4 Ron SOT-23-6W TYP. 1.7Ω 0.9 F SC-63 300 k 0.9 0.8 to 20 Stepdown 400 k RDSon SOP-8 TYP. 0.45Ω 0.8 to 16 Stepdown 400 k RDSon USB-8 TYP. 0.15Ω 1.0 to 18.9 Stepdown 900 k RDSon SOP-8 TYP. 0.55Ω F *1 With infinite heat sink attached or when mounted on a board listed in the specification sheets. *2 Output variable range (step-down/inversion). *3 VREF nearly equal to 1.26 V *4 Refer to page 31 The model marked with ▲ may not be available in the near future. Contact with SHARP for details before use. 18 Notice In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Except where specially indicated, models listed on this page comply with the RoHS Directive*. For details, please contact SHARP. *RoHS Directive: Prohibits use of lead, cadmium, hexavalent chromium, mercury and specific brominated flame retardants (PBBs and PBDEs), with certain exceptions. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. REG Regulators (DC-DC Converters) • TO-220 Type (Ta = 25°C) Model No. PQ1CG21H2FZH PQ1CG41H2FZH PQ1CG2032FZH PQ1CG3032FZH Absolute Electrical characteristics maximum ratings Switch- Power Input Oscillation ing dissipa- voltage Output voltage Output frequency range current tion Vo*2 type fo (kHz) (V) Vin Isw Pd*1 TYP. (W) (V) (A) Features • PWM chopper regulator • Built-in overcurrent/overheat protection circuits • Output ON/OFF control function • PWM chopper regulator (high oscillation frequency) • Built-in overcurrent/overheat protection circuits • Output ON/OFF control function • PWM chopper regulator • Built-in overcurrent/overheat protection circuits • Output ON/OFF control function • PWM chopper regulator (high oscillation frequency) • Built-in overcurrent/overheat protection circuits • Output ON/OFF control function Package Output saturation voltage Vsat (V) TYP. Outline shape type*5 100 1.0 E 300 1.0 E 1.5*3 14 40 VREF*4 to 35 (step-down type)/ Step–VREF*4 to –30 down (inverting type) TO-220 70 3.5*3 E 1.4 150 E *1 With infinite heat sink attached *2 Output voltage variable range *3 Peak current *4VREF nearly equal to 1.26 V (TYP.) *5 Refer to page 31 Notice In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Except where specially indicated, models listed on this page comply with the RoHS Directive*. For details, please contact SHARP. *RoHS Directive: Prohibits use of lead, cadmium, hexavalent chromium, mercury and specific brominated flame retardants (PBBs and PBDEs), with certain exceptions. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. Power Devices/ Analog ICs ■ Chopper CHOPPER REGULATORS 19 Analog ■ LED LED DRIVERS Drivers • Built-in Step-up Circuit Model No. IR2E58U White LED driver for backlight IR2E71Y LED driver for backlight and call alert display (auto brightness adjustment) IR2E67M White LED driver for backlight IR2E70N White LED driver for backlight *1 *2 *3 *4 *5 *6 20 Function Features Input No. of Constant Switching voltage Number Booster output current transistor range of LEDs method circuits circuit (V) •C apable of driving a maximum of 96 LEDs with 12 LEDs (in series) per channel • Built-in step-up DC-DC converter •H igh oscillation frequency (1.5 MHz) makes 8 96 PWM use of a small coil possible •C apable of controlling brightness using PWM control • Step-up output control according to LED-Vf • 2 ch (11 LEDs x 2 ch) LED driver for backlight • Auto brightness adjustment backlight LED • 6 ch RBG LED driver for illumination • Built-in switching regulator for LCD backlight Backlight Backlight 2 22 • Built-in LCD controller power supply PWM RGB RGB (+5.8 V / –5.8 V MAX.) 6 6 • LDO 1 ch • Interface for digital-output proximity sensor with ambient light sensor • Built-in general purpose input/output port (7 ch MAX.) • Built-in 10 ch. constant-current control amplifier (external output transistor) • Enables driving LEDs up to external transistor voltage limit *2 *3 • Built-in timing controller for lighting 10 • Wider range of PWM brightness control possible, from simultaneous total output control to local dimming • Step-up output control according to LED-Vf • Built-in step-up DC-DC controller for 2 ch individual control • Capable of 2 ch individual PWM brightness control *2 PWM • LED current value adjustable by external 2 signal (voltage input / PWM signal) • Brightness control possible at high contrast ratio 3000:1 • Step-up output control according to LED-Vf Output*1 Oscillation current frequency (mA) (Hz) MAX. TYP. Package 500 k to 24HQFN 1.5 M ○ ○ 4.5 to 40/ch 28 ○ ○ Backlight 10 k 3.0 to 25.5/ch to 4.5 RGB 1M 12.7/ch 35WL-CSP *4 External 4.5 to 5.5 *5 80LQFP1420 *6 External 4.5 to 5.5 8 to 28 *5 – 100 k to 24SSOP 500 k Constant current (MAX.) Determined by external transistor voltage limit. Built-in feedback voltage-generating circuit for external power supply. Built-in constant-current control amplifier (external output transistor) Determined by external resistor. Constant current can be controlled by LED anode voltage control. Notice In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Except where specially indicated, models listed on this page comply with the RoHS Directive*. For details, please contact SHARP. *RoHS Directive: Prohibits use of lead, cadmium, hexavalent chromium, mercury and specific brominated flame retardants (PBBs and PBDEs), with certain exceptions. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. AC-DC CONVERSION TYPE ICs FOR LED LIGHTING / POWER AMPLIFIERS FOR WIRELESS LAN Analog/RF ■ AC-DC Model No. Conversion Type ICs for LED Lighting Operating Dissipation Switching Supply temperature current frequency voltage range range (mA) (kHz)*1 (V) TYP. (°C) TYP. Features Overvoltage/overheat/overcurrent circuits, high-speed activation, stand-by feature, PWM brightness control IR3M92N4 −30 to +100 10 to 18 1 160 Gate driver capacity Low High (Ω) (mA) System Package MAX. 15 MIN. 40 Flyback Step-down SOP-8 *1 When operating a flyback converter Amplifiers for Wireless LAN Model No. IRM068U7 QM2A1UA003 Supply voltage Vcc (V) TYP. Application Control voltage Vbb (V) TYP. For 2.4 GHz single-band wireless LAN (IEEE802.11b/g/n) Linear Dissipation current output (mA) power*1 (dBm) TYP. Gain (dB) TYP. Detection circuit 18 115 27 ○ 20 150 28 ○ 18 170 30 ○ 20 225 31 ○ 17 100 28 17 140 30 2.8 IRM053U7 QM2A1UA004 IRM067U6 For 5 GHz single-band wireless LAN (IEEE802.11a/n) For 2.4/5 GHz dual-band wireless LAN (IEEE802.11a/b/g/n) 3.3 2.9 ○ Matching circuit Built-in (IN) Built-in (IN) Built-in (IN/OUT) Built-in (IN/OUT) Package (mm) HQFN6 pin (1.5 × 1.5 × 0.4 mm) HQFN10 pin (2 × 2 × 0.4 mm) Power Devices/ Analog ICs ■ Power Built-in HQFN16 pin (IN/OUT) (3 × 3 × 0.4 mm) *1 At time of OFDM 64QAM modulating wave input. Notice In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Except where specially indicated, models listed on this page comply with the RoHS Directive*. For details, please contact SHARP. *RoHS Directive: Prohibits use of lead, cadmium, hexavalent chromium, mercury and specific brominated flame retardants (PBBs and PBDEs), with certain exceptions. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. 21 RF ■ Front-End Model No. FRONT-END MODULE FOR WIRELESS LAN Modules for Wireless LAN Application Features • Built-in detection circuit, Front-end IC for 2.4 GHz high efficiency / high linearQM2A1UB028/ wireless LAN (802.11b/g/n/ac) output power amplifier 032A (SP3T SW + PA + LNA) • .11ac-compliant low EVM design • Low-noise amplifier with Front-end IC for 5 GHz bypass mode QM2A1UB029/ wireless LAN (802.11a/n/ac) • Built-in input/output matching 033A (SPDT SW + PA + LNA) circuit • Compact and thin package Transmitter section Receiver section Supply Control EVM Dissipation Gain: Noise voltage voltage (%)/ current Gain Normal/ figure (V) (V) Output (mA)/ (dB) Bypass TYP. TYP. power Output power TYP. (dB) (dB) TYP. (dBm) (dBm) TYP. 2/19*1 3.6 200/19 27 2 Package 13/-5.5 HQFN16 pin (2.5 × 2.5 × 0.4 mm) 3.3 2/18*2 180/18 28 2.5 13/-7 *1 MCS7 HT20 at 64QAM input *2 MCS7 HT40 at 64QAM input 22 Notice In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Except where specially indicated, models listed on this page comply with the RoHS Directive*. For details, please contact SHARP. *RoHS Directive: Prohibits use of lead, cadmium, hexavalent chromium, mercury and specific brominated flame retardants (PBBs and PBDEs), with certain exceptions. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. LSI PACKAGE LINEUP ■ Package Lineup •Surface-Mount Type Package type Appearance (Package material) Package code No. of terminals Package depth & width Terminal pitch Nominal dimensions (D x W) x mm mm (seated height [MAX.]) mm P-LFBGA048-0606 P-TFBGA048-0608 48 P-TFBGA048-0808 P-TFBGA056-0808 56 P-TFBGA060-0811 60 (48)* P-TFBGA064-0811 64 P-TFBGA072-0811 P-LFBGA072-0811 81 P-LFBGA085-0811 85 P-LFBGA087-0811 87 P-LFBGA088-0912 FBGA (CSP) D W (Plastic) 6.0 x 6.0 x (1.4) 6x 8 6.0 x 8.0 x (1.2) 8x 8 8.0 x 8.0 x (1.2) 8 x 11 72 (64)* P-TFBGA081-0808 P-LFBGA088-0811 6x 6 8.0 x 11.0 x (1.2) 8.0 x 11.0 x (1.4) / (1.6) 88 8x 8 8.0 x 8.0 x (1.2) 8 x 11 8.0 x 11.0 x (1.4) / (1.6) 9 x 12 9.0 x 12.0 x (1.4) / (1.6) 8 x 11 8.0 x 11.0 x (1.4) / (1.6) P-LFBGA090-0811 90 P-TFBGA096-1010 96 P-LFBGA107-0912 107 P-TFBGA111-1010 111 P-TFBGA112-1010 112 P-LFBGA115-0914 115 9 x 14 9.0 x 14.0 x (1.4) / (1.6) P-LFBGA116-1010 116 10 x 10 10.0 x 10.0 x (1.4) / (1.6) P-LFBGA130-1013 130 10 x 13 10.0 x 13.0 x (1.4) / (1.6) P-TFBGA144-1111 144 11 x 11 11.0 x 11.0 x (1.2) P-TFBGA160-1212 160 12.0 x 12.0 x (1.2) P-LFBGA168-1212 168 12.0 x 12.0 x (1.4) / (1.6) P-TFBGA180-1212 180 P-TFBGA184-1212 184 P-TFBGA240-1414 240 P-LFBGA280-1616 280 P-LFBGA352-1616 352 0.8 10 x 10 10.0 x 10.0 x (1.2) 9 x 12 9.0 x 12.0 x (1.4) / (1.6) 10 x 10 10.0 x 10.0 x (1.2) 12 x 12 12.0 x 12.0 x (1.2) 14 x 14 14.0 x 14.0 x (1.2) 16 x 16 16.0 x 16.0 x (1.5) 6.0 x 6.0 x (1.2) P-TFBGA064-0606 64 6x 6 P-LFBGA140-0909 140 9x 9 9.0 x 9.0 x (1.4) P-LFBGA160-1010 160 10 x 10 10.0 x 10.0 x (1.4) / (1.6) P-TFBGA180-1313 180 P-LFBGA192-1010 192 P-LFBGA208-1212 208 P-LFBGA224-1313 224 P-TFBGA260-1313 260 0.65 13 x 13 13.0 x 13.0 x (1.2) 10 x 10 10.0 x 10.0 x (1.4) / (1.6) 12 x 12 12.0 x 12.0 x (1.4) / (1.6) 13 x 13 13.0 x 13.0 x (1.4) / (1.6) 13.0 x 13.0 x (1.2) * Figures in brackets indicate available terminal counts. 26 Notice In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Except where specially indicated, models listed on this page comply with the RoHS Directive*. For details, please contact SHARP. *RoHS Directive: Prohibits use of lead, cadmium, hexavalent chromium, mercury and specific brominated flame retardants (PBBs and PBDEs), with certain exceptions. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. LSI PACKAGE LINEUP •Surface-Mount Type (cont’d) Appearance (Package material) Package code No. of terminals P-VFBGA057-0505 57 P-VFBGA075-0505 75 P-TFBGA064-0606 64 P-TFBGA068-0606 68 P-VFBGA081-0606 81 P-TFBGA084-0606 84 Package depth & width Terminal pitch Nominal dimensions (D x W) x mm mm (seated height [MAX.]) mm 5x 5 6.0 x 6.0 x (1.1) 6x 6 6.0 x 6.0 x (0.9) 7.0 x 7.0 x (0.9) 100 P-TFBGA100-0707 P-VFBGA108-0707 P-TFBGA108-0707 P-VFBGA120-0707 P-TFBGA120-0707 7.0 x 7.0 x (1.1) 7.0 x 7.0 x (0.9) 108 7x 7 132 P-TFBGA133-0808 133 7.0 x 7.0 x (1.1) 8.0 x 8.0 x (1.1) 8x 8 P-VFBGA144-0808 FBGA (CSP) 144 D W P-VFBGA171-0811 P-LFBGA171-0811 P-VFBGA176-0909 P-TFBGA176-0909 P-TFBGA180-0909 P-TFBGA188-0909 P-VFBGA188-1111 P-VFBGA208-1010 P-TFBGA208-1010 P-TFBGA245-1010 P-LFBGA245-1010 (Plastic) 8.0 x 8.0 x (0.9) 8.0 x 8.0 x (1.3) / (1.5) 0.5 8 x 11 8.0 x 11.0 x (1.3) 152 8x 8 8.0 x 8.0 x (1.1) 171 8 x 11 P-LFBGA144-0811 P-TFBGA152-0808 7.0 x 7.0 x (1.1) 7.0 x 7.0 x (0.9) 120 P-TFBGA132-0707 P-LFBGA144-0808 6.0 x 6.0 x (0.9) 6.0 x 6.0 x (1.1) P-VFBGA100-0606 P-VFBGA100-0707 5.0 x 5.0 x (0.9) 9x 9 180 188 11 x 11 10 x 10 245 P-WFBGA144-0606 144 P-WFBGA121-0606 121 P-WFBGA145-0606 145 P-TFBGA168-0707 168 P-TFBGA204-0808 204 P-WFBGA205-0808 205 P-WFBGA261-0808 261 9.0 x 9.0 x (1.1) 11.0 x 11.0 x (0.9) 10.0 x 10.0 x (0.9) 208 424 8.0 x 11.0 x (0.9) 8.0 x 11.0 x (1.3) / (1.5) 9.0 x 9.0 x (0.9) 176 P-FBGA424-1414 Packages Package type 10.0 x 10.0 x (1.1) 10.0 x 10.0 x (1.3) 14 x 14 14.0 x 14.0 x (1.8) 6.0 x 6.0 x (0.75) 6x 6 0.4 7x 7 6.0 x 6.0 x (0.8) 7.0 x 7.0 x (1.0) 8.0 x 8.0 x (1.0) 8x 8 8.0 x 8.0 x (0.8) Notice In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Except where specially indicated, models listed on this page comply with the RoHS Directive*. For details, please contact SHARP. *RoHS Directive: Prohibits use of lead, cadmium, hexavalent chromium, mercury and specific brominated flame retardants (PBBs and PBDEs), with certain exceptions. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. 27 LSI PACKAGE LINEUP •Surface-Mount Type (cont’d) Package type Appearance (Package material) No. of terminals P-TFBGAXXX-0606 to 36 6x 6 6.0 x 6.0 x (1.2) P-TFBGAXXX-0707 to 49 7x 7 7.0 x 7.0 x (1.2) P-TFBGAXXX-0808 to 81 8x 8 8.0 x 8.0 x (1.2) P-TFBGAXXX-0909 to 100 9x 9 9.0 x 9.0 x (1.2) P-TFBGAXXX-1010 to 121 10 x 10 10.0 x 10.0 x (1.2) P-TFBGAXXX-1111 to 144 11 x 11 11.0 x 11.0 x (1.2) P-TFBGAXXX-1212 to 196 12 x 12 12.0 x 12.0 x (1.2) P-TFBGAXXX-1313 to 216 13 x 13 13.0 x 13.0 x (1.2) 14 x 14 14.0 x 14.0 x (1.2) 15 x 15 15.0 x 15.0 x (1.2) P-TFBGAXXX-1414 P-TFBGAXXX-1515 FBGA (CSP) D W (Plastic) PBGA (BGA) D W (Plastic) Package depth & width Terminal pitch Nominal dimensions (D x W) x mm mm (seated height [MAX.]) mm Package code 0.8 to 240 P-TFBGAXXX-1616 to 352 16 x 16 16.0 x 16.0 x (1.2) P-TFBGAXXX-0606 to 49 6x 6 6.0 x 6.0 x (1.2) P-TFBGAXXX-0707 to 81 7x 7 7.0 x 7.0 x (1.2) P-TFBGAXXX-0808 to 121 8x 8 8.0 x 8.0 x (1.2) P-TFBGAXXX-0909 to 144 9x 9 9.0 x 9.0 x (1.2) P-TFBGAXXX-1010 to 196 10 x 10 10.0 x 10.0 x (1.2) P-TFBGAXXX-1111 to 224 11 x 11 11.0 x 11.0 x (1.2) P-TFBGAXXX-1212 to 256 12 x 12 12.0 x 12.0 x (1.2) P-TFBGAXXX-1313 to 272 13 x 13 13.0 x 13.0 x (1.2) P-TFBGAXXX-1414 to 304 14 x 14 14.0 x 14.0 x (1.2) P-TFBGAXXX-1515 to 320 15 x 15 15.0 x 15.0 x (1.2) P-TFBGAXXX-1616 to 352 16 x 16 16.0 x 16.0 x (1.2) P-TFBGAXXX-0606 to 100 6x 6 6.0 x 6.0 x (1.1) P-TFBGAXXX-0707 to 132 7x 7 7.0 x 7.0 x (1.1) P-TFBGAXXX-0808 to 164 8x 8 8.0 x 8.0 x (1.1) P-TFBGAXXX-0909 to 192 9x 9 9.0 x 9.0 x (1.1) P-TFBGAXXX-1010 to 216 10 x 10 10.0 x 10.0 x (1.1) P-TFBGAXXX-1111 to 244 11 x 11 11.0 x 11.0 x (1.1) P-TFBGAXXX-1212 to 268 12 x 12 12.0 x 12.0 x (1.1) P-TFBGAXXX-1313 to 296 13 x 13 13.0 x 13.0 x (1.1) P-TFBGAXXX-1414 to 320 14 x 14 14.0 x 14.0 x (1.1) P-TFBGAXXX-1515 to 348 15 x 15 15.0 x 15.0 x (1.1) P-TFBGAXXX-1616 to 372 16 x 16 16.0 x 16.0 x (1.1) P-TFBGAXXX-0505 to 100 5x 5 5.0 x 5.0 x (1.0) P-TFBGAXXX-0606 to 144 6x 6 6.0 x 6.0 x (1.0) P-TFBGAXXX-0707 to 168 7x 7 7.0 x 7.0 x (1.0) P-TFBGAXXX-0808 to 204 8x 8 8.0 x 8.0 x (1.0) P-TFBGAXXX-0909 to 228 9x 9 9.0 x 9.0 x (1.0) P-TFBGAXXX-1010 to 264 10 x 10 10.0 x 10.0 x (1.0) 1.0 21 x 21 21.0 x 21.0 x (2.2) 1.27 35 x 35 35.0 x 35.0 x (2.63) P-BGA0356-2121 356 P-BGA0476-3535 476 P-BGA0528-3535 528 0.65 0.5 0.4 XXX: Terminal counts BGA is a trademark of Motorola Nippon Ltd. 28 Notice In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Except where specially indicated, models listed on this page comply with the RoHS Directive*. For details, please contact SHARP. *RoHS Directive: Prohibits use of lead, cadmium, hexavalent chromium, mercury and specific brominated flame retardants (PBBs and PBDEs), with certain exceptions. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. LSI PACKAGE LINEUP Package type Appearance (Package material) W Package code P-TSOP048-1220 No. of terminals 48 TSOP Package depth & width Lead frame material (D x W) x Alloy42 Copper alloy (seated height [MAX.]) mm 12 x 20 12.0 x 18.4 x (1.2) 14.0 x 18.4 x (1.2) 0.5 (Plastic) D QFP W LQFP D TQFP (Plastic) VQFN Terminal pitch Nominal dimensions mm (mil) mm (mil) W D HQFN* (Plastic) P-TSOP056-1420 56 14 x 20 P-QFP048-0707 48 7x 7 P-QFP072-1010 72 P-LQFP080-1212 80 P-LQFP100-1414 100 P-TQFP048-0707 48 P-TQFP100-1414 100 P-TQFP128-1414 128 P-VQFN020-0404 20 P-VQFN024-0404 24 P-VQFN028-0505 28 P-VQFN032-0505 32 P-VQFN036-0606 0.5 0.5 0.5 0.4 7.0 x 7.0 x (1.65) ○ ○ ○ ○ ○ ○ 10 x 10 10.0 x 10.0 x (1.8) ○ – 12 x 12 12.0 x 12.0 x (1.7) ○ – 14 x 14 14.0 x 14.0 x (1.7) ○ – 7x 7 7.0 x 7.0 x (1.2) ○ – ○ – 14 x 14 4x 4 14.0 x 14.0 x (1.2) 4.2 x 4.2 x (1.0) ○ – – ○ – ○ – ○ – ○ 5x 5 5.2 x 5.2 x (1.0) 36 6x 6 6.2 x 6.2 x (1.0) – ○ P-VQFN048-0707 48 7x 7 7.2 x 7.2 x (1.0) – ○ P-VQFN036-0505 36 5x 5 5.2 x 5.2 x (1.0) – ○ P-VQFN052-0707 52 7x 7 7.2 x 7.2 x (1.0) – ○ P-HQFN020-0404 20 4.0 x 4.0 x (1.0) – ○ 4.0 x 4.0 x (0.85) – ○ 4.2 x 4.2 x (1.0) – ○ 5x 5 5.0 x 5.0 x (1.0) – ○ 7x 7 7.2 x 7.2 x (1.0) – ○ P-HQFN024-0404 24 P-HQFN028-0505 28 P-HQFN052-0707 52 * HQFN is a higher heat dissipation package of VQFN. 0.5 0.4 0.5 0.4 4x 4 Packages •Surface-Mount Type (cont’d) 100 mil = 2.54 mm Notice In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Except where specially indicated, models listed on this page comply with the RoHS Directive*. For details, please contact SHARP. *RoHS Directive: Prohibits use of lead, cadmium, hexavalent chromium, mercury and specific brominated flame retardants (PBBs and PBDEs), with certain exceptions. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. 29 Imaging PACKAGE LINEUP • For CCDs Package type Appearance (Package material) W DIP D Package code No. of terminals Terminal pitch mm Nominal dimensions mm (mil) Package depth & width (D x W) x (seated height [TYP.]) mm P-DIP014-0400A 14 1.27 10.16 (400) 10.0 x 10.0 P-DIP016-0450 16 1.27 11.43 (450) 11.4 x 12.2 P-DIP020-0500 20 1.27 12.2 (500) 12.0 x 13.8 P-DIP024-0400 24 0.80 10.16 (400) 10.0 x 10.0 P-DIP028-0566 28 1.11 14.4 (566) 14.2 x 16.0 64 1.00 25.48 (1 000) 36.1 x 25.4 P-SOP014-0400A 14 1.27 12 (470) 10.0 x 10.0 x (4.1) P-SOP028-0400 28 0.69 10.16 (400) 10.0 x 10.0 x (3.5) P-SOP032-0525 32 0.78 13.3 (525) 12.0 x 13.8 x (3.92) 0.65 8.9 (350) 8.3 x 8.9 x (1.52) 0.80 11.0 (433) 11.0 x 11.0 x (1.62) P-DIP064-1000 (Plastic) W SOP D (Plastic) W P-DIP064-1000B N-LCC040-R350 (B) LCC 40 D N-LCC040-S433A (Ceramic) 100 mil = 2.54 mm • For CMOSs Package type Appearance (Package material) W LCC Package code No. of terminals Terminal pitch mm Nominal dimensions mm (mil) Package depth & width (D x W) x (seated height [TYP.]) mm 120 0.65 22.8 (898) 20.0 x 22.8 x (2.67) N-LCC120-R898 D (Ceramic) N-LCC120-R898A 100 mil = 2.54 mm Nominal dimensions FBGA (CSP) PBGA (BGA) VQFN HQFN SOP SSOP MFP TSOP DIP LCC QFP LQFP TQFP FBGA : fine-pitch ball grid array package MFP PBGA : plastic ball grid array package TSOP : thin small outline package VQFN : very thin quad flat non-leaded package SOP QFP HQFN : heat sink quad flat non-leaded package : small outline package SSOP : shrink small outline package : mini flat package : quad flat package LQFP : low profile quad flat package TQFP : thin quad flat package DIP : dual inline package LCC : leadless chip carrier Ball Grid Array and BGA are trademarks of Motorola Nippon Ltd. 30 Notice In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Except where specially indicated, models listed on this page comply with the RoHS Directive*. For details, please contact SHARP. *RoHS Directive: Prohibits use of lead, cadmium, hexavalent chromium, mercury and specific brominated flame retardants (PBBs and PBDEs), with certain exceptions. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. REG PACKAGE LINEUP • Lead-Inserting Type Packages [For regulators: PQ series] Appearance (Package material) Package type No. of terminals Terminal pitch mm Outline dimensions (Width x Thickness x Height) mm Lead frame material 4 2.54 10.2 (MAX.) x 4.5 x 29.1*2 Cu 4 2.54 10.2 (MAX.) x 4.5 x 29.1*2 Cu 5 (1.7)*1 10.2 (MAX.) x 4.5 x 24.6*2 Cu 5 (1.7)*1 10.2 (MAX.) x 4.5 x 24.6*2 Cu 5 (1.7)*1 10.2 (MAX.) x 4.5 x 24.6*2 Cu A TO-220 (Plastic) B TO-220 (Full mold) (Plastic) (Plastic) D TO-220 [Lead forming type] (Plastic) Packages TO-220 (Full mold) [Lead forming type] C E TO-220 [Lead forming type] (Plastic) *1 The figure in parentheses indicates reference value. *2 Including lead length •Surface-Mount Type Packages [For regulators/LED drivers: PQ series] Appearance (Package material) Package type No. of terminals Terminal pitch mm Outline dimensions (Width x Height x Thickness) mm Lead frame material 5 (Heat sink included) (1.27)*1 6.6 (MAX.) x 9.7 (MAX.)*2 x 2.1 Cu 8 1.27 5 x 6.2*2 x 1.55*2 Cu 6 1.5 4.5 x 4.3*2 x 1.5 Cu F SC-63 (Plastic) SOP-8 (Plastic) SOT-89 (Plastic) *1 The figure in parentheses indicates reference value. *2 Including lead length Notice In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Except where specially indicated, models listed on this page comply with the RoHS Directive*. For details, please contact SHARP. *RoHS Directive: Prohibits use of lead, cadmium, hexavalent chromium, mercury and specific brominated flame retardants (PBBs and PBDEs), with certain exceptions. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. 31 REG PACKAGE LINEUP •Surface-Mount Type Packages [For regulators/LED drivers: PQ series] (cont’d) Package type Appearance (Package material) SOT-23-6 No. of terminals Terminal pitch mm Outline dimensions (Width x Height x Thickness) mm Lead frame material 6 0.95 2.9 x 2.8*2 x 1.3 Cu 6 0.95 2.9 x 2.8*2 x 1.3 Cu 6 (0.95)*1 (3.4)*1 x 3.3*2 x 1.4 (MAX.) Cu 5 (0.95)*1 (2.9)*1 x 2.8*2 x 1.3 (MAX.) Cu 9 (Including radiating fin) 1.0 5.0 x 4.5 x 0.75 (MAX.) Cu (Plastic) SOT-23-6W (Plastic) SOT-23-L (Plastic) SOT-23-5 (Plastic) USB-8 *1 The figure in parentheses indicates reference value. *2 Including lead length 32 Notice In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Except where specially indicated, models listed on this page comply with the RoHS Directive*. For details, please contact SHARP. *RoHS Directive: Prohibits use of lead, cadmium, hexavalent chromium, mercury and specific brominated flame retardants (PBBs and PBDEs), with certain exceptions. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.