Package PDF(362KB)

LSI
CSP
■ CSP
(Chip Size Package)
•CSP
The FBGA (commonly known as CSP) has an area array terminal structure with solder balls on the
bottom, to give it a near chip-size footprint. This high-density, compact and low-profile package
technology will greatly help in the design of compact mobile equipment, such as mobile phones and
digital cameras.
● Compact
FBGA (CSP)
and lightweight
Ability to create a near-chip size and lighter-weight package in comparison with conventional plastic packages.
● High
reliability
Comparable high reliability with that of conventional plastic packages.
● Mountability
Conventional mounting system is available for CSP. SOP and QFP can be mounted together with CSP.
Terminal pitch
0.8 mm
0.65 mm
0.5 mm
0.4 mm
Maximum terminal counts
352 (16 mm x 16 mm)
352 (16 mm x 16 mm)
372 (16 mm x 16 mm)
264 (10 mm x 10 mm)
Nominal dimensions
5 mm x 5 mm to 10 mm x 10 mm
6 mm x 6 mm to 16 mm x 16 mm
Gold wire
IC
Mold resin
Packages
Features
Package height
0.8 mm to 1.5 mm (MAX.)
Cross
section
example
Substrate
Cu pattern
Solder ball
Terminal pitch : 0.8 mm
0.65 mm
0.5 mm
0.4 mm
Diameter : 0.45 mm
0.4 mm
0.3 mm
0.25 mm
CSP
• Wafer-level
The wafer-level CSP (WL-CSP) is a kind of chip-size package which is manufactured by assembling directly onto the finished wafer.
● Compact
and thinner size
It makes it possible to create an almost IC-size and lighter-weight package.
● Mountability
Features
The conventional CSP mounting system can be also used in that of wafer-level CSP, which facilitates chip
mounting more than bare-chip mounting does. It can be mounted together with other existing packages and
passive components.
Chip size*
4 mm x 4 mm
3.5 mm x 3.5 mm
3 mm x 3 mm
Pad pitch
0.5 mm
0.4 mm
0.5 mm
0.4 mm
0.5 mm
0.4 mm
Maximum terminal counts
49 (7 x 7)
81 (9 x 9)
36 (6 x 6)
49 (7 x 7)
25 (5 x 5)
36 (6 x 6)
* Rectangular chip form is also available.
Cu pattern
IC
Cross
section
example
Package height
0.5 mm to 1 mm (MAX.)
Passivation layer
Solder ball
23
LSI
■ SiP
•
SiP
(System in Package)
System in Package is SHARP’s original high-density mounting technology that achieves high-density memory capacity and multiple
functions by stacking multiple ICs or multiple packages. The System in Package technology means chip-stacked package technology
that can achieve up to 5-chip mounting by stacking ICs in a single package. The System in Package technology contributes to higher
functionality of applications, such as mobile phones and digital cameras, as well as to reduction in size and weight.
Chip Stacked CSP
● Wide
variety of lineup
It is possible to provide a wide lineup of stacked CSPs, including 2-chip, 3-chip, 4-chip and 5-chip stacked
CSPs, to respond to customer needs.
● Compact
and thinner size
Encapsulating multiple ICs into an existing plastic package contributes to decreasing the mounting area. In
addition, SHARP’s wafer thinning technology makes it possible to achieve 1.4 mm (MAX.) package height.
● Multiple
Features
functions
Multiple ICs of different sizes and functions, such as logic LSIs and memories, can be incorporated in a
single package, making possible multiple functions.
● Same-size
IC stacking technology
SHARP's stacking technology enables stacking of multiple same-size ICs, contributing to higher memory
density.
(4-chip stacked CSP)
When using a SHARP four-chip stacked CSP, the mounting area and weight of a package can be
decreased by half in comparison with using two 2-chip stacked CSPs, or a 3-chip stacked CSP and a
conventional CSP.
(5-chip stacked CSP)
Gold wire
IC
Mold resin
Cross
section
example
Package height
1.4 mm (MAX.)*
1.6 mm (MAX.)*
Cu pattern
Substrate
Diameter : 0.45 mm
0.30 mm
24
Solder ball
Terminal pitch : 0.8 mm
0.5 mm
* At 0.8 mm terminal pitch
Notice
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in
equipment using any SHARP devices shown in catalogs, data books, etc.
Except where specially indicated, models listed on this page comply with the RoHS Directive*. For details, please contact SHARP.
*RoHS Directive: Prohibits use of lead, cadmium, hexavalent chromium, mercury and specific brominated flame retardants
(PBBs and PBDEs), with certain exceptions.
Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
LSI
SiP
•Chip Stacked TSOP/QFP*/VQFN/HQFN
● Decreased
mounting area
By encapsulating two identical or different types of ICs into a single conventional plastic package, the
mounting area of the package can be decreased.
Features
● Multiple
functions
Thanks to the incorporation of different sizes and functions of multiple ICs, such as logic LSIs and
memories, the functionality increases.
● Higher
memory density
When incorporating two identical memory ICs into a single package, memory density doubles on the
same mounting area.
(TSOP, QFP*)
(Hamburger type)
(Turtle stack type)
Cross
section
example
Gold wire
IC
Gold wire
Packages
IC
(HQFN)
(VQFN)
Gold wire
Mold resin
Gold wire
Package height
1.0 mm (MAX.)
Mold resin
Package height
1.0 mm (MAX.)
* Including TQFP and LQFP.
Notice
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in
equipment using any SHARP devices shown in catalogs, data books, etc.
Except where specially indicated, models listed on this page comply with the RoHS Directive*. For details, please contact SHARP.
*RoHS Directive: Prohibits use of lead, cadmium, hexavalent chromium, mercury and specific brominated flame retardants
(PBBs and PBDEs), with certain exceptions.
Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
25
LSI
PACKAGE LINEUP
■ Package
Lineup
•Surface-Mount Type
Package
type
Appearance
(Package material)
Package code
No. of terminals
Package depth & width
Terminal pitch Nominal dimensions
(D x W) x
mm
mm
(seated height [MAX.]) mm
P-LFBGA048-0606
P-TFBGA048-0608
48
P-TFBGA048-0808
P-TFBGA056-0808
56
P-TFBGA060-0811
60 (48)*
P-TFBGA064-0811
64
P-TFBGA072-0811
P-LFBGA072-0811
81
P-LFBGA085-0811
85
P-LFBGA087-0811
87
P-LFBGA088-0912
FBGA
(CSP)
D
W
(Plastic)
6.0 x 6.0 x (1.4)
6x 8
6.0 x 8.0 x (1.2)
8x 8
8.0 x 8.0 x (1.2)
8 x 11
72 (64)*
P-TFBGA081-0808
P-LFBGA088-0811
6x 6
8.0 x 11.0 x (1.2)
8.0 x 11.0 x (1.4) / (1.6)
88
8x 8
8.0 x 8.0 x (1.2)
8 x 11
8.0 x 11.0 x (1.4) / (1.6)
9 x 12
9.0 x 12.0 x (1.4) / (1.6)
8 x 11
8.0 x 11.0 x (1.4) / (1.6)
P-LFBGA090-0811
90
P-TFBGA096-1010
96
P-LFBGA107-0912
107
P-TFBGA111-1010
111
P-TFBGA112-1010
112
P-LFBGA115-0914
115
9 x 14
9.0 x 14.0 x (1.4) / (1.6)
P-LFBGA116-1010
116
10 x 10
10.0 x 10.0 x (1.4) / (1.6)
P-LFBGA130-1013
130
10 x 13
10.0 x 13.0 x (1.4) / (1.6)
P-TFBGA144-1111
144
11 x 11
11.0 x 11.0 x (1.2)
P-TFBGA160-1212
160
12.0 x 12.0 x (1.2)
P-LFBGA168-1212
168
12.0 x 12.0 x (1.4) / (1.6)
P-TFBGA180-1212
180
P-TFBGA184-1212
184
P-TFBGA240-1414
240
P-LFBGA280-1616
280
P-LFBGA352-1616
352
0.8
10 x 10
10.0 x 10.0 x (1.2)
9 x 12
9.0 x 12.0 x (1.4) / (1.6)
10 x 10
10.0 x 10.0 x (1.2)
12 x 12
12.0 x 12.0 x (1.2)
14 x 14
14.0 x 14.0 x (1.2)
16 x 16
16.0 x 16.0 x (1.5)
6.0 x 6.0 x (1.2)
P-TFBGA064-0606
64
6x 6
P-LFBGA140-0909
140
9x 9
9.0 x 9.0 x (1.4)
P-LFBGA160-1010
160
10 x 10
10.0 x 10.0 x (1.4) / (1.6)
P-TFBGA180-1313
180
P-LFBGA192-1010
192
P-LFBGA208-1212
208
P-LFBGA224-1313
224
P-TFBGA260-1313
260
0.65
13 x 13
13.0 x 13.0 x (1.2)
10 x 10
10.0 x 10.0 x (1.4) / (1.6)
12 x 12
12.0 x 12.0 x (1.4) / (1.6)
13 x 13
13.0 x 13.0 x (1.4) / (1.6)
13.0 x 13.0 x (1.2)
* Figures in brackets indicate available terminal counts.
26
Notice
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in
equipment using any SHARP devices shown in catalogs, data books, etc.
Except where specially indicated, models listed on this page comply with the RoHS Directive*. For details, please contact SHARP.
*RoHS Directive: Prohibits use of lead, cadmium, hexavalent chromium, mercury and specific brominated flame retardants
(PBBs and PBDEs), with certain exceptions.
Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
LSI
PACKAGE LINEUP
•Surface-Mount Type (cont’d)
Appearance
(Package material)
Package code
No. of terminals
P-VFBGA057-0505
57
P-VFBGA075-0505
75
P-TFBGA064-0606
64
P-TFBGA068-0606
68
P-VFBGA081-0606
81
P-TFBGA084-0606
84
Package depth & width
Terminal pitch Nominal dimensions
(D x W) x
mm
mm
(seated height [MAX.]) mm
5x 5
6.0 x 6.0 x (1.1)
6x 6
6.0 x 6.0 x (0.9)
7.0 x 7.0 x (0.9)
100
P-TFBGA100-0707
P-VFBGA108-0707
P-TFBGA108-0707
P-VFBGA120-0707
P-TFBGA120-0707
7.0 x 7.0 x (1.1)
7.0 x 7.0 x (0.9)
108
7x 7
132
P-TFBGA133-0808
133
7.0 x 7.0 x (1.1)
8.0 x 8.0 x (1.1)
8x 8
P-VFBGA144-0808
FBGA
(CSP)
144
D
W
P-VFBGA171-0811
P-LFBGA171-0811
P-VFBGA176-0909
P-TFBGA176-0909
P-TFBGA180-0909
P-TFBGA188-0909
P-VFBGA188-1111
P-VFBGA208-1010
P-TFBGA208-1010
P-TFBGA245-1010
P-LFBGA245-1010
(Plastic)
8.0 x 8.0 x (0.9)
8.0 x 8.0 x (1.3) / (1.5)
0.5
8 x 11
8.0 x 11.0 x (1.3)
152
8x 8
8.0 x 8.0 x (1.1)
171
8 x 11
P-LFBGA144-0811
P-TFBGA152-0808
7.0 x 7.0 x (1.1)
7.0 x 7.0 x (0.9)
120
P-TFBGA132-0707
P-LFBGA144-0808
6.0 x 6.0 x (0.9)
6.0 x 6.0 x (1.1)
P-VFBGA100-0606
P-VFBGA100-0707
5.0 x 5.0 x (0.9)
9x 9
180
188
11 x 11
10 x 10
245
P-WFBGA144-0606
144
P-WFBGA121-0606
121
P-WFBGA145-0606
145
P-TFBGA168-0707
168
P-TFBGA204-0808
204
P-WFBGA205-0808
205
P-WFBGA261-0808
261
9.0 x 9.0 x (1.1)
11.0 x 11.0 x (0.9)
10.0 x 10.0 x (0.9)
208
424
8.0 x 11.0 x (0.9)
8.0 x 11.0 x (1.3) / (1.5)
9.0 x 9.0 x (0.9)
176
P-FBGA424-1414
Packages
Package
type
10.0 x 10.0 x (1.1)
10.0 x 10.0 x (1.3)
14 x 14
14.0 x 14.0 x (1.8)
6.0 x 6.0 x (0.75)
6x 6
0.4
7x 7
6.0 x 6.0 x (0.8)
7.0 x 7.0 x (1.0)
8.0 x 8.0 x (1.0)
8x 8
8.0 x 8.0 x (0.8)
Notice
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in
equipment using any SHARP devices shown in catalogs, data books, etc.
Except where specially indicated, models listed on this page comply with the RoHS Directive*. For details, please contact SHARP.
*RoHS Directive: Prohibits use of lead, cadmium, hexavalent chromium, mercury and specific brominated flame retardants
(PBBs and PBDEs), with certain exceptions.
Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
27
LSI
PACKAGE LINEUP
•Surface-Mount Type (cont’d)
Package
type
Appearance
(Package material)
No. of terminals
P-TFBGAXXX-0606
to 36
6x 6
6.0 x 6.0 x (1.2)
P-TFBGAXXX-0707
to 49
7x 7
7.0 x 7.0 x (1.2)
P-TFBGAXXX-0808
to 81
8x 8
8.0 x 8.0 x (1.2)
P-TFBGAXXX-0909
to 100
9x 9
9.0 x 9.0 x (1.2)
P-TFBGAXXX-1010
to 121
10 x 10
10.0 x 10.0 x (1.2)
P-TFBGAXXX-1111
to 144
11 x 11
11.0 x 11.0 x (1.2)
P-TFBGAXXX-1212
to 196
12 x 12
12.0 x 12.0 x (1.2)
P-TFBGAXXX-1313
to 216
13 x 13
13.0 x 13.0 x (1.2)
14 x 14
14.0 x 14.0 x (1.2)
15 x 15
15.0 x 15.0 x (1.2)
P-TFBGAXXX-1414
P-TFBGAXXX-1515
FBGA
(CSP)
D
W
(Plastic)
PBGA
(BGA)
D
W
(Plastic)
Package depth & width
Terminal pitch Nominal dimensions
(D x W) x
mm
mm
(seated height [MAX.]) mm
Package code
0.8
to 240
P-TFBGAXXX-1616
to 352
16 x 16
16.0 x 16.0 x (1.2)
P-TFBGAXXX-0606
to 49
6x 6
6.0 x 6.0 x (1.2)
P-TFBGAXXX-0707
to 81
7x 7
7.0 x 7.0 x (1.2)
P-TFBGAXXX-0808
to 121
8x 8
8.0 x 8.0 x (1.2)
P-TFBGAXXX-0909
to 144
9x 9
9.0 x 9.0 x (1.2)
P-TFBGAXXX-1010
to 196
10 x 10
10.0 x 10.0 x (1.2)
P-TFBGAXXX-1111
to 224
11 x 11
11.0 x 11.0 x (1.2)
P-TFBGAXXX-1212
to 256
12 x 12
12.0 x 12.0 x (1.2)
P-TFBGAXXX-1313
to 272
13 x 13
13.0 x 13.0 x (1.2)
P-TFBGAXXX-1414
to 304
14 x 14
14.0 x 14.0 x (1.2)
P-TFBGAXXX-1515
to 320
15 x 15
15.0 x 15.0 x (1.2)
P-TFBGAXXX-1616
to 352
16 x 16
16.0 x 16.0 x (1.2)
P-TFBGAXXX-0606
to 100
6x 6
6.0 x 6.0 x (1.1)
P-TFBGAXXX-0707
to 132
7x 7
7.0 x 7.0 x (1.1)
P-TFBGAXXX-0808
to 164
8x 8
8.0 x 8.0 x (1.1)
P-TFBGAXXX-0909
to 192
9x 9
9.0 x 9.0 x (1.1)
P-TFBGAXXX-1010
to 216
10 x 10
10.0 x 10.0 x (1.1)
P-TFBGAXXX-1111
to 244
11 x 11
11.0 x 11.0 x (1.1)
P-TFBGAXXX-1212
to 268
12 x 12
12.0 x 12.0 x (1.1)
P-TFBGAXXX-1313
to 296
13 x 13
13.0 x 13.0 x (1.1)
P-TFBGAXXX-1414
to 320
14 x 14
14.0 x 14.0 x (1.1)
P-TFBGAXXX-1515
to 348
15 x 15
15.0 x 15.0 x (1.1)
P-TFBGAXXX-1616
to 372
16 x 16
16.0 x 16.0 x (1.1)
P-TFBGAXXX-0505
to 100
5x 5
5.0 x 5.0 x (1.0)
P-TFBGAXXX-0606
to 144
6x 6
6.0 x 6.0 x (1.0)
P-TFBGAXXX-0707
to 168
7x 7
7.0 x 7.0 x (1.0)
P-TFBGAXXX-0808
to 204
8x 8
8.0 x 8.0 x (1.0)
P-TFBGAXXX-0909
to 228
9x 9
9.0 x 9.0 x (1.0)
P-TFBGAXXX-1010
to 264
10 x 10
10.0 x 10.0 x (1.0)
1.0
21 x 21
21.0 x 21.0 x (2.2)
1.27
35 x 35
35.0 x 35.0 x (2.63)
P-BGA0356-2121
356
P-BGA0476-3535
476
P-BGA0528-3535
528
0.65
0.5
0.4
XXX: Terminal counts
BGA is a trademark of Motorola Nippon Ltd.
28
Notice
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in
equipment using any SHARP devices shown in catalogs, data books, etc.
Except where specially indicated, models listed on this page comply with the RoHS Directive*. For details, please contact SHARP.
*RoHS Directive: Prohibits use of lead, cadmium, hexavalent chromium, mercury and specific brominated flame retardants
(PBBs and PBDEs), with certain exceptions.
Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
LSI
PACKAGE LINEUP
Package
type
Appearance
(Package material)
W
Package code
P-TSOP048-1220
No. of
terminals
48
TSOP
Package depth & width
Lead frame material
(D x W) x
Alloy42
Copper alloy
(seated height [MAX.]) mm
12 x 20
12.0 x 18.4 x (1.2)
14.0 x 18.4 x (1.2)
0.5
(Plastic)
D
QFP
W
LQFP
D
TQFP
(Plastic)
VQFN
Terminal pitch Nominal dimensions
mm (mil)
mm (mil)
W
D
HQFN*
(Plastic)
P-TSOP056-1420
56
14 x 20
P-QFP048-0707
48
7x 7
P-QFP072-1010
72
P-LQFP080-1212
80
P-LQFP100-1414
100
P-TQFP048-0707
48
P-TQFP100-1414
100
P-TQFP128-1414
128
P-VQFN020-0404
20
P-VQFN024-0404
24
P-VQFN028-0505
28
P-VQFN032-0505
32
P-VQFN036-0606
0.5
0.5
0.5
0.4
7.0 x 7.0 x (1.65)
○
○
○
○
○
○
10 x 10
10.0 x 10.0 x (1.8)
○
–
12 x 12
12.0 x 12.0 x (1.7)
○
–
14 x 14
14.0 x 14.0 x (1.7)
○
–
7x 7
7.0 x 7.0 x (1.2)
○
–
○
–
14 x 14
4x 4
14.0 x 14.0 x (1.2)
4.2 x 4.2 x (1.0)
○
–
–
○
–
○
–
○
–
○
5x 5
5.2 x 5.2 x (1.0)
36
6x 6
6.2 x 6.2 x (1.0)
–
○
P-VQFN048-0707
48
7x 7
7.2 x 7.2 x (1.0)
–
○
P-VQFN036-0505
36
5x 5
5.2 x 5.2 x (1.0)
–
○
P-VQFN052-0707
52
7x 7
7.2 x 7.2 x (1.0)
–
○
P-HQFN020-0404
20
4.0 x 4.0 x (1.0)
–
○
4.0 x 4.0 x (0.85)
–
○
4.2 x 4.2 x (1.0)
–
○
5x 5
5.0 x 5.0 x (1.0)
–
○
7x 7
7.2 x 7.2 x (1.0)
–
○
P-HQFN024-0404
24
P-HQFN028-0505
28
P-HQFN052-0707
52
* HQFN is a higher heat dissipation package of VQFN.
0.5
0.4
0.5
0.4
4x 4
Packages
•Surface-Mount Type (cont’d)
100 mil = 2.54 mm
Notice
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in
equipment using any SHARP devices shown in catalogs, data books, etc.
Except where specially indicated, models listed on this page comply with the RoHS Directive*. For details, please contact SHARP.
*RoHS Directive: Prohibits use of lead, cadmium, hexavalent chromium, mercury and specific brominated flame retardants
(PBBs and PBDEs), with certain exceptions.
Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
29
Imaging
PACKAGE LINEUP
• For CCDs
Package
type
Appearance
(Package material)
W
DIP
D
Package code
No. of
terminals
Terminal pitch
mm
Nominal dimensions
mm (mil)
Package depth & width
(D x W) x
(seated height [TYP.]) mm
P-DIP014-0400A
14
1.27
10.16 (400)
10.0 x 10.0
P-DIP016-0450
16
1.27
11.43 (450)
11.4 x 12.2
P-DIP020-0500
20
1.27
12.2 (500)
12.0 x 13.8
P-DIP024-0400
24
0.80
10.16 (400)
10.0 x 10.0
P-DIP028-0566
28
1.11
14.4 (566)
14.2 x 16.0
64
1.00
25.48 (1 000)
36.1 x 25.4
P-SOP014-0400A
14
1.27
12 (470)
10.0 x 10.0 x (4.1)
P-SOP028-0400
28
0.69
10.16 (400)
10.0 x 10.0 x (3.5)
P-SOP032-0525
32
0.78
13.3 (525)
12.0 x 13.8 x (3.92)
0.65
8.9 (350)
8.3 x 8.9 x (1.52)
0.80
11.0 (433)
11.0 x 11.0 x (1.62)
P-DIP064-1000
(Plastic)
W
SOP
D
(Plastic)
W
P-DIP064-1000B
N-LCC040-R350 (B)
LCC
40
D
N-LCC040-S433A
(Ceramic)
100 mil = 2.54 mm
• For CMOSs
Package
type
Appearance
(Package material)
W
LCC
Package code
No. of
terminals
Terminal pitch
mm
Nominal dimensions
mm (mil)
Package depth & width
(D x W) x
(seated height [TYP.]) mm
120
0.65
22.8 (898)
20.0 x 22.8 x (2.67)
N-LCC120-R898
D
(Ceramic)
N-LCC120-R898A
100 mil = 2.54 mm
Nominal dimensions
FBGA (CSP)
PBGA (BGA)
VQFN
HQFN
SOP
SSOP
MFP
TSOP
DIP
LCC
QFP
LQFP
TQFP
FBGA : fine-pitch ball grid array package
MFP
PBGA : plastic ball grid array package
TSOP : thin small outline package
VQFN : very thin quad flat non-leaded package
SOP
QFP
HQFN : heat sink quad flat non-leaded package
: small outline package
SSOP : shrink small outline package
: mini flat package
: quad flat package
LQFP : low profile quad flat package
TQFP : thin quad flat package
DIP
: dual inline package
LCC
: leadless chip carrier
Ball Grid Array and BGA are trademarks of Motorola Nippon Ltd.
30
Notice
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in
equipment using any SHARP devices shown in catalogs, data books, etc.
Except where specially indicated, models listed on this page comply with the RoHS Directive*. For details, please contact SHARP.
*RoHS Directive: Prohibits use of lead, cadmium, hexavalent chromium, mercury and specific brominated flame retardants
(PBBs and PBDEs), with certain exceptions.
Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.