PC3H7J00000F Series PC3H7J00000F Series Mini-flat Half Pitch Package, General Purpose Photocoupler ■ Description ■ Agency approvals/Compliance PC3H7J00000F Series contains an IRED optically coupled to a phototransistor. It is packaged in a 4-pin Mini-flat package, Half ptich type. Input-output isolation voltage(rms) is 2.5kV. Collector-emitter voltage is 80V and CTR is 20% to 400% at input current of 1mA. 1. Recognized by UL1577 (Double protection isolation), file No. E64380 (as model No. PC3H7) 2. Approved by VDE, DIN EN60747-5-2 (∗) (as an option), file No. 40009162 (as model No. PC3H7) 3. Package resin : UL flammability grade (94V-0) ■ Features ■ Applications 1. 4-pin Mini-flat Half pitch package (Lead pitch : 1.27mm) 2. Double transfer mold package (Ideal for Flow Soldering) 3. High collector-emitter voltage (VCEO : 80V) 4. Current transfer ratio (CTR : MIN. 20% at IF=1mA, VCE=5V) 5. Several CTR ranks available 6. Isolation voltage between input and output (Viso(rms) : 2.5kV) 7. RoHS directive compliant 1. Programmable controllers (∗) DIN EN60747-5-2 : successor standard of DIN VDE0884 Notice The content of data sheet is subject to change without prior notice. In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. 1 Sheet No.: D2-A01902FEN Date Jun. 30. 2005 © SHARP Corporation PC3H7J00000F Series ■ Internal Connection Diagram 1 1 4 2 3 2 3 4 Anode Cathode Emitter Collector ■ Outline Dimensions (Unit : mm) VDE option 3 H7 4.4±0.2 Epoxy resin VDE Indenfication mark Epoxy resin 0.2±0.05 (1.7) 0.1±0.1 2.0±0.2 0.2±0.05 3 5.3±0.3 (1.7) 0.5+0.4 −0.2 3H7 4 2 4.4±0.2 5.3±0.3 7.0+0.2 −0.7 4 0.5+0.4 −0.2 7.0+0.2 −0.7 *( ) : Reference Dimensions 0.1±0.1 2.0±0.2 3 2 Date code 1 0.4±0.1 4 2.6±0.3 1 1.27±0.25 SHARP mark "S" Anode mark Date code 0.4±0.1 1.27±0.25 2.6±0.3 SHARP mark "S" Anode mark *( ) : Reference Dimensions Product mass : approx. 0.05g Product mass : approx. 0.05g Plating material : SnCu (Cu : TYP. 2%) Sheet No.: D2-A01902FEN 2 PC3H7J00000F Series Date code (2 digit) A.D. 1990 1991 1992 1993 1994 1995 1996 1997 1998 1999 2000 2001 1st digit Year of production A.D Mark 2002 A 2003 B 2004 C 2005 D 2006 E 2007 F 2008 H 2009 J 2010 K 2011 L 2012 M ·· N · Mark P R S T U V W X A B C ·· · 2nd digit Month of production Month Mark January 1 February 2 March 3 April 4 May 5 June 6 July 7 August 8 September 9 October O November N December D repeats in a 20 year cycle Country of origin Japan Rank mark Refer to the Model Line-up table Sheet No.: D2-A01902FEN 3 PC3H7J00000F Series ■ Absolute Maximum Ratings Output Input Parameter Symbol IF Forward current *1 Peak forward current IFM Reverse voltage VR P Power dissipation Collector-emitter voltage VCEO Emitter-collector voltage VECO Collector current IC Collector power dissipation PC Total power dissipation Ptot Operating temperature Topr Storage temperature Tstg *2 Isolation voltage Viso (rms) *3 Soldering temperature Tsol Rating 50 1 6 70 80 6 50 150 170 −30 to +100 −40 to +125 2.5 260 (Ta=25˚C) Unit mA A V mW V V mA mW mW ˚C ˚C kV ˚C *1 Pulse width≤100µs, Duty ratio : 0.001 *2 40 to 60%RH, AC for 1 minute, f=60Hz *3 For 10s ■ Electro-optical Characteristics Input Output Transfer characteristics Symbol Parameter VF Forward voltage Reverse Current IR Terminal capacitance Ct Collector dark current ICEO Collector-emitter breakdown voltage BVCEO Emitter-collector breakdown voltage BVECO Collector current IC Collector-emitter saturation voltage VCE (sat) Isolation resistance RISO Floating capacitance Cf Rise time tr Response time Fall time tf Conditions IF=20mA VR=4V V=0, f=1kHz VCE=50V, IF=0 IC=0.1mA, IF=0 IE=10µA, IF=0 IF=1mA, VCE=5V IF=20mA, IC=1mA DC500V, 40 to 60%RH V=0, f=1MHz VCE=2V, IC=2mA, RL=100Ω MIN. − − − − 80 6 0.2 − 5×1010 − − − TYP. 1.2 − 30 − − − − 0.1 1×1011 0.6 4 3 MAX. 1.4 10 250 100 − − 4.0 0.2 − 1.0 18 18 (Ta=25˚C) Unit V µA pF nA V V mA V Ω pF µs µs Sheet No.: D2-A01902FEN 4 PC3H7J00000F Series ■ Model Line-up Taping 3 000pcs/reel DIN EN60747-5-2 Approved PC3H7J00000F PC3H7YJ0000F PC3H7AJ0000F PC3H7Y1J000F PC3H7BJ0000F PC3H7Y2J000F PC3H7CJ0000F PC3H7Y3J000F PC3H7DJ0000F PC3H7Y4J000F PC3H7ABJ000F PC3H7Y5J000F Model No. PC3H7BCJ000F PC3H7Y6J000F PC3H7CDJ000F PC3H7Y7J000F PC3H7ACJ000F PC3H7Y8J000F PC3H7BDJ000F PC3H7Y9J000F PC3H7ADJ000F PC3H7Y0J000F Package Rank mark IC [mA] (IF=1mA, VCE=5V, Ta=25˚C) with or without A B C D A or B B or C C or D A, B or C B, C or D A, B, C or D 0.2 to 4.0 0.35 to 0.7 0.5 to 1.0 0.8 to 1.6 1.2 to 2.4 0.35 to 1.0 0.5 to 1.6 0.8 to 2.4 0.35 to 1.6 0.5 to 2.4 0.35 to 2.4 Please contact a local SHARP sales representative to inquire about production status. Sheet No.: D2-A01902FEN 5 PC3H7J00000F Series Fig.2 Diode Power Dissipation vs. Ambient Temperature Fig.1 Forward Current vs. Ambient Temperature 100 Diode power dissipation P (mW) Forward current IF (mA) 50 40 30 20 10 0 −30 0 25 50 55 75 100 80 70 60 40 20 0 −30 125 Fig.3 Collector Power Dissipation vs. Ambient Temperature 50 55 75 100 125 Fig.4 Total Power Dissipation vs. Ambient Temperature 250 Total power dissipation Ptot (mW) 250 Collector power dissipation PC (mW) 25 Ambient temperature Ta (˚C) Ambient temperature Ta (˚C) 200 150 100 50 0 −30 0 25 50 75 100 200 170 150 100 50 0 −30 125 Ambient temperature Ta (˚C) 10 000 0 25 50 75 100 125 Ambient temperature Ta (˚C) Fig.6 Forward Current vs. Forward Voltage Fig.5 Peak Forward Current vs. Duty Ratio 100 Pulse width≤100µs Ta=25˚C Forward current IF (mA) Peak forward current IFM (mA) 0 1 000 100 50˚C 75˚C 100˚C 10 25˚C 0˚C − 30˚C 1 10 10−3 10−2 10−1 0.1 1 0 Duty ratio 0.5 1 1.5 2 Forward voltage VF (V) Sheet No.: D2-A01902FEN 6 PC3H7J00000F Series Fig.7 Current Transfer Ratio vs. Forward Current Fig.8 Collector Current vs. Collector-emitter Voltage 500 IF=30mA 400 300 200 100 Ta=25˚C PC (max) 50 Collector current IC (mA) Current transfer ratio CTR (%) VCE=5V Ta=25˚C 20mA 10mA 40 30 5mA 20 10 1mA 0 0 0.1 1 10 0 100 2 Fig.9 Relative Current Transfer Ratio vs. Ambient Temperature 6 8 10 Fig.10 Collector - emitter Saturation Voltage vs. Ambient Temperature 150 0.16 Collector-emitter saturation voltage VCE (sat) (V) IF=1mA,VCE=5V Relative current transfer ratio (%) 4 Collector-emitter voltage VCE (V) Forward current IF (mA) IF=5mA,VCE=5V 100 50 IF=20mA IC=1mA 0.14 0.12 0.1 0.08 0.06 0.04 0.02 0 −40 −20 0 20 40 60 80 0 −30 100 Ambient temperature Ta (˚C) Fig.11 Collector Dark Current vs. Ambient Temperature 60 80 100 VCE=2V IC=2mA Ta=25˚C 100 Response time (µs) Collector dark current ICEO (A) 10 −7 40 1 000 VCE=50V 10 20 Fig.12 Response Time vs. Load Resistance 10−5 −6 0 Ambient temperature Ta (˚C) 10−8 10−9 tr 10 tf td ts 1 10−10 10−11 −30 0 20 40 60 80 Ambient temperature Ta (˚C) 0.1 0.01 100 0.1 1 10 100 Load resistance RL (kΩ) Sheet No.: D2-A01902FEN 7 PC3H7J00000F Series Fig.13 Test Circuit for Response Time Fig.14 Collector-emitter Saturation Voltage vs. Forward Current VCC RL Collector-emitter saturation voltage VCE (sat) (V) RD Ta=25˚C 10 Output Input Output Input 10% VCE td tr ts tf 90% Please refer to the conditions in Fig.12 IC=0.5mA 8 1mA 3mA 6 5mA 7mA 4 2 0 0 2 4 6 8 10 Forward current IF (mA) Remarks : Please be aware that all data in the graph are just for reference and not for guarantee. Sheet No.: D2-A01902FEN 8 PC3H7J00000F Series ■ Design Considerations ● Design guide While operating at IF<1.0mA, CTR variation may increase. Please make design considering this fact. This product is not designed against irradiation and incorporates non-coherent IRED. ● Degradation In general, the emission of the IRED used in photocouplers will degrade over time. In the case of long term operation, please take the general IRED degradation (50% degradation over 5 years) into the design consideration. ● Recommended Foot Print (reference) 0.8 1.27 6.3 1.5 (Unit : mm) ✩ For additional design assistance, please review our corresponding Optoelectronic Application Notes. Sheet No.: D2-A01902FEN 9 PC3H7J00000F Series ■ Manufacturing Guidelines ● Soldering Method Reflow Soldering: Reflow soldering should follow the temperature profile shown below. Soldering should not exceed the curve of temperature profile and time. Please don't solder more than twice. (˚C) 300 Terminal : 260˚C peak ( package surface : 250˚C peak) 200 Reflow 220˚C or more, 60s or less Preheat 150 to 180˚C, 120s or less 100 0 0 1 2 3 4 (min) Flow Soldering : Due to SHARP's double transfer mold construction submersion in flow solder bath is allowed under the below listed guidelines. Flow soldering should be completed below 260˚C and within 10s. Preheating is within the bounds of 100 to 150˚C and 30 to 80s. Please don't solder more than twice. Hand soldering Hand soldering should be completed within 3s when the point of solder iron is below 400˚C. Please don't solder more than twice. Other notices Please test the soldering method in actual condition and make sure the soldering works fine, since the impact on the junction between the device and PCB varies depending on the tooling and soldering conditions. Sheet No.: D2-A01902FEN 10 PC3H7J00000F Series ● Cleaning instructions Solvent cleaning: Solvent temperature should be 45˚C or below Immersion time should be 3 minutes or less Ultrasonic cleaning: The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time, size of PCB and mounting method of the device. Therefore, please make sure the device withstands the ultrasonic cleaning in actual conditions in advance of mass production. Recommended solvent materials: Ethyl alcohol, Methyl alcohol and Isopropyl alcohol In case the other type of solvent materials are intended to be used, please make sure they work fine in actual using conditions since some materials may erode the packaging resin. ● Presence of ODC This product shall not contain the following materials. And they are not used in the production process for this product. Regulation substances : CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform) Specific brominated flame retardants such as the PBBOs and PBBs are not used in this product at all. This product shall not contain the following materials banned in the RoHS Directive (2002/95/EC). •Lead, Mercury, Cadmium, Hexavalent chromium, Polybrominated biphenyls (PBB), Polybrominated diphenyl ethers (PBDE). Sheet No.: D2-A01902FEN 11 PC3H7J00000F Series ■ Package specification ● Tape and Reel package Package materials Carrier tape : PS Cover tape : PET (three layer system) Reel : PS Carrier tape structure and Dimensions F G D J I 5˚ . MAX H H A B C E L K Dimensions List A B ±0.3 12.0 5.5±0.1 H I ±0.1 7.5 0.3±0.05 C 1.75±0.1 J 2.3±0.1 D 8.0±0.1 K 3.1±0.1 E 2.0±0.1 L +0.1 φ1.6−0 F 4.0±0.1 (Unit : mm) G +0.1 φ1.5−0 Reel structure and Dimensions e d c g Dimensions List a b 330 13.5±1.5 e f 23±1.0 2.0±0.5 f a b (Unit : mm) c d 100±1.0 13±0.5 g 2.0±0.5 Direction of product insertion Pull-out direction [Packing : 3 000pcs/reel] Sheet No.: D2-A01902FEN 12 PC3H7J00000F Series ■ Important Notices with equipment that requires higher reliability such as: --- Transportation control and safety equipment (i.e., aircraft, trains, automobiles, etc.) --- Traffic signals --- Gas leakage sensor breakers --- Alarm equipment --- Various safety devices, etc. (iii) SHARP devices shall not be used for or in connection with equipment that requires an extremely high level of reliability and safety such as: --- Space applications --- Telecommunication equipment [trunk lines] --- Nuclear power control equipment --- Medical and other life support equipment (e.g., scuba). · The circuit application examples in this publication are provided to explain representative applications of SHARP devices and are not intended to guarantee any circuit design or license any intellectual property rights. SHARP takes no responsibility for any problems related to any intellectual property right of a third party resulting from the use of SHARP's devices. · Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. SHARP reserves the right to make changes in the specifications, characteristics, data, materials, structure, and other contents described herein at any time without notice in order to improve design or reliability. Manufacturing locations are also subject to change without notice. · If the SHARP devices listed in this publication fall within the scope of strategic products described in the Foreign Exchange and Foreign Trade Law of Japan, it is necessary to obtain approval to export such SHARP devices. · Observe the following points when using any devices in this publication. SHARP takes no responsibility for damage caused by improper use of the devices which does not meet the conditions and absolute maximum ratings to be used specified in the relevant specification sheet nor meet the following conditions: (i) The devices in this publication are designed for use in general electronic equipment designs such as: --- Personal computers --- Office automation equipment --- Telecommunication equipment [terminal] --- Test and measurement equipment --- Industrial control --- Audio visual equipment --- Consumer electronics (ii) Measures such as fail-safe function and redundant design should be taken to ensure reliability and safety when SHARP devices are used for or in connection · This publication is the proprietary product of SHARP and is copyrighted, with all rights reserved. Under the copyright laws, no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, for any purpose, in whole or in part, without the express written permission of SHARP. Express written permission is also required before any use of this publication may be made by a third party. · Contact and consult with a SHARP representative if there are any questions about the contents of this publication. [E183] Sheet No.: D2-A01902FEN 13