GP2S700HCP

GP2S700HCP
GP2S700HCP
SMT, Detecting Distance : 3mm
Phototransistor Output,
Compact Reflective
Photointerrupter
■ Description
■Agency approvals/Compliance
1. Compliant with RoHS directive
GP2S700HCP is a compact-package, phototransistor
output, reflective photointerrupter, with emitter and detector
facing the same direction in a molding that provides
■Applications
non-contact sensing. The compact package series is formed
1. Detection of object presence or motion.
Example : printer, optical storage
by epoxy resin, that also blocks visible light to minimize false
detection.
This device has a long focal distance for this family of devices
and has a leadless (T&R) package, suitable for reflow
soldering.
■Features
1. Reflective with Phototransistor Output
2. Highlights :
• Compact Size
• Surface Mount Type (SMT), reflow soldering
• Tape and Reel (T&R) 1 000 pcs per reel
3. Key Parameters :
• Optimal Sensing Distance : 3mm
• Package : 4×3×2mm
• Visible light cut resin to prevent
4. RoHS directive compliant
Notice The content of data sheet is subject to change without prior notice.
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP
devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
1
Sheet No.:D3-A02201EN-A
GP2S700HCP
■ Internal Connection Diagram
Top view
①
④
②
③
① Emitter
② Collector
③ Cathode
④ Anode
■ Outline Dimensions
(Unit : mm)
Top view
Detector center
4
(0.8)
④
3
(2.3)
(1.5)
①
Optical center
②
③
(0.8)
Emitter center
2
(2.7)
(1)
(0.93)
(1)
0.4
(0.25)
(0.93)
(0.25)
• Unspecified tolerance : ±0.3mm.
• Dimensions in parenthesis are shown for reference.
• Dimensions on the outline drawing is the maximum value
excluding burr.
• The dimensions shown do not include burr.
• Burr's dimension : 0.15mm MAX.
Product mass : approx. 0.01g
Plating material : Au
2
Sheet No.: D3-A02201EN-A
GP2S700HCP
■ Absolute Maximum Ratings
Parameter
Forward current
Input Reverse voltage
Power dissipation
Collector-emitter voltage
Emitter-collector voltage
Output
Collector current
Collector power dissipation
Total power dissipation
Operating temperature
Storage temperature
∗1
Soldering temperature
Symbol
Rating
IF
50
VR
6
PD
75
VCEO
35
VECO
6
IC
20
PC
75
Ptot
100
Topr
−25 to +85
Tstg
−40 to +100
Tsol
260
(Ta=25˚C)
Unit
mA
V
mW
V
V
mA
mW
mW
˚C
˚C
˚C
∗
1 For 5s or less
■ Electro-optical Characteristics
Parameter
Forward voltage
Input
Reverse current
Output
Collector dark current
∗2
Collector current
Transfer ∗3
Leak current
characRise time
teristics
Response time
Fall time
∗
∗
Symbol
VF
IR
ICEO
IC
ILEAK
tr
tf
Condition
IF=20mA
VR=6V
VCE=20V
IF=4mA, VCE=2V
IF=4mA, VCE=2V
VCE=2V, IC=100μA,
RL=1kΩ, d=4mm
MIN.
−
−
−
60
−
−
−
TYP.
1.2
−
1
−
−
20
20
(Ta=25˚C)
MAX.
Unit
1.4
V
10
μA
100
nA
410
μA
700
nA
100
μs
100
2 The condition and arrangement of the reflective object are shown below.
3 Without reflective object.
● Test Condition and Arrangement for Collector Current
Aluminum evaporation
Glass plate
d=4mm
Sheet No.:D3-A02201EN-A
3
GP2S700HCP
Fig.2 Collector Power Dissipation vs.
Ambient Temperature
60
120
50
100
Power dissipation P (mW)
Forward current IF (mA)
Fig.1 Forward Current vs. Ambient
Temperature
40
30
20
60
40
20
15
0
0
-25
0
25
50
75 85 100
Ambient temperature Ta (˚C)
Fig.3 Forward Current vs. Forward Voltage
0
25
50
75 85 100
Ambient temperature Ta (˚C)
Fig.4 Collector Current vs.
Forward Current
100
3 000
75˚C
10
Collector current IC (mA)
50˚C
Ta=25˚C
d=4mm
2 500
25˚C
Forward current IF (mA)
PD, PC
80
10
-25
Ptot
-25˚C
0˚C
2 000
1 500
1 000
500
1
0
0
0.3 0.6 0.9 1.2 1.5
1.8
2.1
2.4 2.7
0
3
Fig.5 Collector Dark Current vs.
Ambient Temperature
20
30
40
50
Fig.6 Response Time vs.
Load Resistance
10-6
1000
10-7
Response time (μs)
Collector dark current ICEO (A)
10
Forward current IF (mA)
Ambient temperature Ta (˚C)
10-8
10-9
10-10
100
10
1
0
25
50
75
Ambient temperature Ta (˚C)
100
0.1
4
1
10
Load resistance RL (kΩ)
100
Sheet No.: D3-A02201EN-A
GP2S700HCP
Fig.7 Test Circuit for Response Time
Fig.8 Relative Collector Current vs. Distance
100
Relative collector current (%)
Reflector plate
VCC
RL
Input
Test
terminal
Output
10%
90%
td
ts
tr
tf
IF=4mA
VCE=2V
80
Ta=25˚C
60
40
Aluminum
evaporation
glass
20
d
0
0
2
4
6
8
10
Distance d (mm)
Fig.9 Relative Collector Current vs.
Ambient Temperature
Relative collector current (%)
120
100
80
60
40
20
0
-25
0
25
50
75 85 100
Ambient temperature Ta (˚C)
Remarks : Please be aware that all data in the graph are just for reference and not for guarantee.
5
Sheet No.: D3-A02201EN-A
GP2S700HCP
■ Design Considerations
● Design guide
1) Regarding to prevation of malfunction
To prevent photointerrupter from faulty operation caused by external light, do not set the detecting face
to the external light. Also, if some other electronic components are located close to this device, false
operation may occur.
(The light reflection caused by the other components may slip into the photodetecting portion of the
device and if may cause false operation.)
2) Distance characteristic
The distance between the photointerrupter and the object to be detected shall be determined the distance
by referencing Fig.8 "Relative collector current vs. distance".
3) For wiring on a mounting PCB
To avoid possibility for short, please do not apply pattern wiring on the back side of the device.
4) Regarding to mounting this product
There is a possibility that the opaque molded resin portion may have a crack by force at mounting etc.
Please use this product after well confirmation of conditions in your production line.
And please confirm the mounting workability beforehand when using the automatic mounting machine.
This product is not designed against irradiation and incorporates non-coherent IRED.
● Degradation
In the case of long term operation, please take the general IRED degradation (50% degradation over 5
years) into the design consideration.
● Parts
This product is assembled using the below parts.
• Light detector (qty. : 1)
Category
Material
Maximum Sensitivity
wavelength (nm)
Sensitivity
wavelength (nm)
Response time (μs)
Phototransister
Silicon (Si)
930
700 to 1 200
20
• Light emitter (qty. : 1)
Category
Material
Maximum light emitting
wavelength (nm)
I/O Frequency (MHz)
Infrared light emitting diode
(non-coherent)
Gallium arsenide (GaAs)
950
0.3
• Material
Case
PCB
Lead frame plating
Black epoxy resin
Glass epoxy resin
Au plating
Sheet No.:D3-A02201EN-A
6
GP2S700HCP
● Recommended pattern
(Unit : mm)
measure tolerance : ±0.1
area : Please do not apply the pattern wiring to avoid the possibility of short circuit.
Regarding amount of solder, if there is solder leakage in terminal wiring pattern between PCB and housing
main body, the reliability will be deteriorated.
Please check the proper amount of solder in advance not to have solder leakage into terminal wiring pattern
between PCB and housing main body.
7
Sheet No.: D3-A02201EN-A
GP2S700HCP
■ Manufacturing Guidelines
● Storage and management after open
Storage condition
Storage temp.: 5 to 30˚C, Storage humidity : 70%RH or less at regular packaging.
Treatment after opening the moisture-proof package
After opening, you should mount the products while keeping them on the condition of 5 to 25˚C and 60%RH
or less in humidity within 2 days.
After opening the bag once even if the prolonged storage is necessary, you should mount the products within
two weeks.
And when you store the rest of products you should put into a DRY BOX. Otherwise after the rest of products
and silicagel are sealed up again, you should keep them under the condition of 5 to 30˚C and 70%RH or
less in humidity.
Baking before mounting
When the above-mentioned storage method could not be executed, please process the baking treatment
before mounting the products.
However the baking treatment is permitted within one time.
Recommended condition : 125˚C, 16 to 24 hours
∗Do not process the baking treatment with the product wrapped. When the baking treatment processing, you
should move the products to a metallic tray or fix temporarily the products to substrate.
Sheet No.:D3-A02201EN-A
8
GP2S700HCP
● Soldering Method
Reflow Soldering:
Reflow soldering should follow the temperature profile shown below.
Soldering should not exceed the curve of temperature profile and time.
Please solder within one time.
MAX
240˚C
1 to 4˚C/s
200˚C
MAX
165°C
1 to 4˚C/s
1 to 4˚C/s
25˚C
MAX10s
MAX120s
MAX60s
MAX90s
Other notice
Please take care not to let any external force exert on lead pins.
Please test the soldering method in actual condition and make sure the soldering works fine, since the
impact on the junction between the device and PCB varies depending on the cooling and soldering
conditions.
● Cleaning instructions
Solvent cleaning :
Solvent temperature should be 45˚C or below. Immersion time should be 3 minutes or less.
Ultrasonic cleaning :
Do not execute ultrasonic cleaning.
Recommended solvent materials :
Ethyl alcohol, Methyl alcohol and Isopropyl alcohol.
Sheet No.:D3-A02201EN-A
9
GP2S700HCP
● Presence of ODC
This product shall not contain the following materials.
And they are not used in the production process for this product.
Regulation substances : CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform)
Specific brominated flame retardants such as the PBBOs and PBBs are not used in this product at all.
This product shall not contain the following materials banned in the RoHS Directive (2002/95/EC).
•Lead, Mercury, Cadmium, Hexavalent chromium, Polybrominated biphenyls (PBB), Polybrominated
diphenyl ethers (PBDE).
Content of six substances specified in Management Methods for Control of Pollution Caused by Electronic Information
Products Regulation (Chinese : 电子信息产品污染控制管理办法).
Toxic and hazardous substances
Category
Photointerrupter
Lead
Mercury
Cadmium
(Pb）
(Hg)
(Cd)
✔
✔
✔
Hexavalent
Polybrominated
Polybrominated
chromium
biphenyls
diphenyl ethers
(Cr )
(PBB)
(PBDE)
✔
✔
✔
6+
✔ : indicates that the content of the toxic and hazardous substance in all the homogeneous materials of the part is
below the concentration limit requirement as described in SJ/T 11363-2006 standard.
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Sheet No.: D3-A02201EN-A
GP2S700HCP
■ Package specification
● Tape and Reel package
Package materials
Reel : PS
Package method
1 000 pcs of products shall be packaged in a reel. One reed is endased in aluminum laminated bag.
After sealing up the bag, it encased in one case (5 bags/case).
Carrier tape structure and Dimensions
b-b’
b
b’
Dimension List
A
12
±0.3
I
＋0.2
－0
3.2
B
5.5
±0.05
J
2.2
±0.1
(Unit ： mm)
C
1.75
±0.1
K
1.2
±0.1
D
E
F
±0.1
±0.1
±0.1
8
4
L
0.3
±0.05
M
6.3
11
±0.1
2
N
＋0.2
－0
4.2
G
Φ1.55
H
±0.05
5.2±0.1
O
Φ1.6
±0.1
Sheet No.: D3-A02201EN-A
GP2S700HCP
Reel structure and Dimensions
Dimension List
(Unit ： mm)
a
b
c
180±1.5
13±1.0
0.5
60＋
－0
e
f
Φ21
±0.8
15.4
d
Φ13
±0.2
g
±1.0
2
＋0.3
－0
Direction of product insertion
[Packing : 1 000pcs/reel]
Storage method
Storage conditions should follow the condition shown below.
Storage temperature : 5 to 30°C
Storage hunidity : 70%RH or less
12
Sheet No.: D3-A02201EN-A
GP2S700HCP
■ Important Notices
· The circuit application examples in this publication are
· Telecommunication equipment (Terminal)
provided to explain representative applications of
· Measuring equipment
SHARP devices and are not intended to guarantee any
· Tooling machines · Computers
circuit design or license any intellectual property rights.
If the use of the product in the above application areas is
SHARP takes no responsibility for any problems related
for equipment listed in paragraphs (2) or (3), please be
to any intellectual property right of a third party resulting
sure to observe the precautions given in those respective
from the use of SHARP's devices.
paragraphs.
· Contact SHARP in order to obtain the latest device
(2) Appropriate measures, such as fail-safe design and
specification sheets before using any SHARP device.
redundant design considering the safety design of the
SHARP reserves the right to make changes in the
overall system and equipment, should be taken to ensure
specifications, characteristics, data, materials, structure,
reliability and safety when this product is used for
and other contents described herein at any time without
equipment which demands high reliability and safety in
notice in order to improve design or reliability.
function and precision, such as ;
Manufacturing locations are also subject to change
· Transportation control and safety equipment (aircraft,
without notice.
train, automobile etc.)
· Traffic signals
· These specification sheets include materials protected
· Gas leakage sensor breakers
· Rescue and security equipment
under copyright of Sharp Corporation ("Sharp").
· Other safety equipment
Please do not reproduce or cause anyone to reproduce
(3) Please do not use this product for equipment which
them without Sharp's consent.
require extremely high reliability and safety in function and
· When using this product, please observe the absolute
precision, such as ;
maximum ratings and the instructions for use outlined in
· Space equipment
these specification sheets, as well as the precautions
· Telecommunication equipment (for trunk lines)
mentioned below. Sharp assumes no responsibility for
· Nuclear power control equipment · Medical equipment
any damage resulting from use of the product which does
· Power generation and power transmission control
not comply with the absolute maximum ratings and the
system (Key system)
instructions included in these specification sheets, and
(4) Please contact and consult with a Sharp sales
the precautions mentioned below.
representative if there are any questions regarding
· Please do verify the validity of this part after assembling
interpretation of the above four paragraphs.
it in customer’s products, when customer wants to make
· Please contact and consult with a Sharp sales
catalogue and instruction manual based on the
representative for any questions about this product.
specification sheet of this part.
(Precautions)
· If the SHARP devices listed in this publication fall within
(1) This product is designed for use in the following
the scope of strategic products described in the Foreign
application areas ;
· OA equipment
Exchange and Foreign Trade Law of Japan, it is
· Audio visual equipment
necessary to obtain approval to export such SHARP
· Home appliances
devices.
13
Sheet No.: D3-A02201EN-A