GP1S195HCPSF

GP1S195HCPSF
GP1S195HCPSF
Gap : 1.5mm, Slit : 0.3mm
Phototransistor Output,
Compact Transmissive
Photointerrupter
■Description
■Agency approvals/Compliance
1. Compliant with RoHS directive (2002/95/EC)
GP1S195HCPSF is a compact and low-profile,
transmissive photointerrupter with photo-transistor
output and detects an object between the emitter
and the detector.
The compact package has been molded by a unique
technology that is a combination of transfer and
injection molding.
■Applications
1. General purpose detection of object presence or
motion.
Example : Printer, lens control for camera
■Features
1. Transmissive with phototransistor output
2. Compact Gap Width : 1.5mm
3. Slit Width (detector side): 0.3mm
4. Package : 3.4×2.0×2.7mm
5. RoHS directive compliant
Notice
The content of data sheet is subject to change without prior notice.
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP
devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
Sheet No.: OP13029EN
1
GP1S195HCPSF
■Outline
Drawing No.CY12948i02
Scale : 10/1
Unit : mm
Sheet No.: OP13029EN
2
GP1S195HCPSF
■Absolute maximum ratings
Parameter
Input
Output
Ta=25°C
Unit
Symbol
Rating
Forward current
IF
30
mA
Reverse voltage
VR
6
V
Power dissipation
P
75
mW
Collector-emitter voltage
VCEO
35
V
Emitter-collector voltage
VECO
6
V
Collector current
Ic
20
mA
Collector power dissipation
Pc
75
mW
Total power dissipation
Ptot
100
mW
Operating temperature
Topr
-25 to +85
°C
Storage temperature
Tstg
-40 to +100
°C
Tsol
260
°C
* soldering temperature
* Soldering time : 3 s or less
■Electro-optical characteristics
Input
Output
Parameter
Symbol
Forward voltage
VF
Reverse current
IR
Collector dark current
ICEO
Collector current
Transfer
characteris tics
Response time
Conditions
Ta=25°C
MAX.
Unit
MIN.
TYP.
IF=20mA
-
1.2
1.4
V
VR=3V
-
-
10
μA
VCE=20V
-
-
100
nA
150
-
600
μA
Ic
VCE=5V, IF=5mA
(Rise)
tr
-
50
150
μs
(Fall)
tf
VCE=5V, Ic=100μA
RL=1kΩ
-
50
150
μs
VCE(sat)
IF=10mA, Ic=40μA
-
-
0.4
V
Collector-emitter
saturation voltage
(Test circuit for response time)
Vcc
RL
Input
Test pin
Output
10%
90%
tr
tf
Sheet No.: OP13029EN
3
GP1S195HCPSF
Foward current IF (mA)
Foward current vs. ambient temperature
50
40
30
20
10
5
0
-25
0
40
25
50
75 85
100
Power dissipation P, Pc, Ptot (mW)
Ambient temperature Ta (°C)
Power dissipation vs. ambient temperature
100
Total power dissipation
80 Input and output power dissipation
75
60
40
20
15
0
-25
0
25
50
75
85
100
Ambient temperature Ta (°C)
Sheet No.: OP13029EN
4
GP1S195HCPSF
Shield
－
100
90
80
60
50
40
20
0
1
2
＋
Sensor
Test condition
IF=5.0mA
VCE=5V
Ta=25°C
10
-1
０
Shield distance L
Relative collector current (%)
Relative collector current vs. shield distance 1 (Reference value)
3
Shield distance L (mm)
Relative collector current vs. shield distance 2 (Reference value)
－
100
90
０
Shield distance L
Relative collector current (%)
Shield
80
60
50
40
＋
Sensor
20
10
-1
0
1
2
3
Shield distance L (mm)
Test condition
IF=5.0mA
VCE=5V
Ta=25°C
Sheet No.: OP13029EN
5
GP1S195HCPSF
■Supplements
●Parts
Refer to the attached sheet, Page 8.
●Packing
Refer to the attached drawing No. CY12949i09A, Page 9.
●ODS materials
This product shall not contain the following materials.
Also, the following materials shall not be used in the production process for this product.
Materials for ODS : CFCS, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methyl chloroform)
●Specified brominated flame retardants
Specified brominated flame retardants (PBB and PBDE) are not used in this device at all.
●Compliance with each regulation
1) The RoHS directive(2002/95/EC)
This product complies with the RoHS directive(2002/95/EC)
Object substances: mercury,lead, cadmium,hexavalent chromium,polybrominated biphenyls (PBB)
and polybrominated diphenyl ethers (PBDE)
2) Content of six substances specified in Management Method for Control of Pollution Caused by Electronic
Information Products Regulation (Chinese : 电子信息产品污染控制管理办法).
Toxic and hazardous substances
Hexavalent
Polybrominated
Polybrominated
Category
Lead
Mercury
Cadmium
chromium
biphenyls
diphenyl ethers
(Pb)
(Hg)
(Cd)
(Cr6+)
(PBB)
(PBDE)
Photointerrupter
✓
✓
✓
✓
✓
✓
✓: indicates that the content of the toxic and hazardous substance in all the homogeneous materials of the part
is below the concentration limit requirement as described in SJ/T 11363-2006 standard.
●Product mass : Approximately 22mg
●Taping specification : Refer to the attachment-2.
●Moisture-proof package specification : Refer to the attachment-3.
●Country of origin : Japan and China
Sheet No.: OP13029EN
6
GP1S195HCPSF
■Notes
●Circuit design
In circuit designing, make allowance for the degradation of the light emitting diode output that results
from long continuous operation. (50% degradation/5 years)
●Prevention of detection error
To prevent photointerrupter from faulty operation caused by external light, do not set the detecting face to the
external light.
●Position of opaque board
Opaque board shall be installed at place 1.4mm or more from the top of elements.
(Example)
1.4mm or more
1.4mm or more
●Print circuit board design
Because a portion of the internal lead may be exposed at the back of the product, please consider it in the
pattern design for a print circuit board design.
●Soldering
(1) Reflow soldering
Please do only two soldering at the temperature and the time within the temperature profile in attachment-1.
(2) Hand soldering
To solder onto lead pins, please iron ahead temperature at 260°C for 3seconds or less.
Please also take care not to let mechanical stress exert on package and lead pins when soldering.
Please have soldering adjustment, etc. after GP1S195HCPSF is cooled down, and also note that the outer
mold resin may be meltdown by heating for a long time.
Since the tip of the lead has exposed lead frame base material, there is a case not to be soldered, so please
consider the soldering pattern on a print circuit board to solder well with the bottom and side surface
of the lead.
●Cleaning
Cleaning shall be carried out under the below conditions to avoid keeping solvent, solder and flux on the device.
(1) Solvent cleaning : Solvent temperature 45°C or less, Immersion for 3min. or less
(2) Ultrasonic cleaning : Since the influence to the product may changes by the conditions of the ultrasonic
power, time, the tank size, PCB size, the product installation condition, etc., please evaluate with actual
conditions and confirm before usage.
(3) The cleaning shall be carried out with solvent below.
Solvent :Ethyl alcohol, Methyl alcohol
●Lead pin
Lead terminals of this product are tin copper alloy plated. Before usage, please evaluate solder ability
with actual conditions and confirm. The uniformity in color for the lead terminals are not specified.
●Storage and management after open
1-1 Storage condition : Storage shall be in accordance with the below conditions.
Storage temp. : 5 to 30°C
Storage humidity : 70%RH or less
1-2 Treatment after open
(1) After open, please mount at the conditions of humidity 60%RH or less and temperature 5 to 25°C within 2 days.
(2) In case of long time storage after open, please storage at the conditions of humidity 70%RH or less
and temperature 5 to 30°C by using dry box or resealing with desiccant in moisture-proof bag by sealer
and mount within 2 weeks.
1-3 Baking before mounting
In case that it could not carry out the above treatment, it is able to mount with baking treatment.
However baking treatment shall be limited only 1 time. Although it is possible to have baking treatment
with taping package, please bake it by putting a reel with standing situation. Please do not lay it down since
it may change the reel shape and occur a mounting problem. Since a label and a fixing tape for the carrier
tape does not have enough heat resistance, there may be a case to leave some paste.
Recommended baking conditions : 100°C, 16 to 24 hours
Sheet No.: OP13029EN
7
GP1S195HCPSF
■Parts
This product uses the below parts.
●Light detector (Quantity : 1)
Type
Material
Maximum sensitivity
(nm)
Sensitivity
(nm)
Response time
(μs)
Phototransistor
Silicon
(Si)
930
700 to 1200
20
●Light emitter (Quantity : 1)
Type
Material
Maximum light emitting
wavelength (nm)
I/O Frequency
(MHz)
Infrared light emitting diode
(non-coherent)
GaAs
950
0.3
●Material
Case
Lead frame
Lead frame plating
Black PPS resin
(UL 94V-0)
42 Alloy
SnCu plating
●Others
This product shall not be proof against radiation flux.
Sheet No.: OP13029EN
8
GP1S195HCPSF
■Packing (Drawing No.:CY12949i09A)
Sheet No.: OP13029EN
9
GP1S195HCPSF
(Attachment-1)
Precautions for Soldering photointerrupter
1. In case of reflow soldering,
Please do only one soldering at the temperature and the time within the temperature profile as shown
in the figure below.
MAX
240°C
1~4°C/s
200°C
MAX
160°C
1~4°C/s
1~4°C/s
25°C
MAX10s
MAX120s
MAX30s
MAX60s
2. Other precautions
An infrared lamp used to heat up for soldering may cause a localized temperature rise in the resin.
So keep the package temperature within that specified in Item 1.
Also avoid immersing the resin part in the solder.
Even if within the temperature profile above, there is the possibility that the
gold wire in package is broken in case that the deformation of PCB gives the affection to lead pins.
Please use after confirmation the conditions fully by actual solder reflow machine.
Sheet No.: OP13029EN
10
GP1S195HCPSF
(Attachment-2-1)
Package specifications (φ330mm reel)
1. Application
This specification applies to the taping specifications and the relation items for the GP1S195HCPSF.
2. Taping method
2.1 Tape structure and Dimensions (Refer to the attached sheets-2-2)
2.1.1 The tape shall have a structure in which a cover tape is sealed heat-pressed on the carrier tape made by
polystyrene to protect against static electricity.
2.2 Reel structure and Dimensions (Refer to the attached sheets-2-3)
2.3 Direction of product insertion (Refer to the attached sheets-2-3)
2.3.1 Product direction in carrier tape shall direct to the detector at the hole side on the tape.
3. Repair method of sealing error
3.1 In case of repairing a sealing error, three sides of a cover tape matching to the product insertion portion
are opened by a cutter and it will be closed by adhesiveness tape after repairing.
4. Adhesiveness of cover tape
4.1 The exhalation force between carrier tape and cover tape shall be 0.2N to 1.0N for the angle from 160°to 180°.
5. Rolling method and quantity
5.1 Wind the tape back on the reel so that the cover tape will be outside the tape.
5.2 Attach more than 25cm of blank tape to the trailer and the leader of the tape and fix the both ends with
adhesive tape.
5.3 One reel shall contain 5,000 pcs.
6. Indication items
The contents of the carton indication conforms to EIAJ C-3 and the following items are indicated.
Model No., Internal production control name, Quantity, Packing date, Corporate name, Country of origin
7. Safety protection during shipping
There shall be no deformation of component or degradation of electrical characteristics due to shipping.
Sheet No.: OP13029EN
11
GP1S195HCPSF
(Attachment-2-2)
2.1 Tape structure and dimensions
Sheet No.: OP13029EN
12
GP1S195HCPSF
(Attachment-2-3)
2.2 Reel structure and dimensions
2.3 Direction of product insertion
Sheet No.: OP13029EN
13
GP1S195HCPSF
(Attachment-3-1)
Moisture-proof package specification
1. Application
This specification applies to the moisture-proof package for the GP1S195HCPSF.
2. Packaging specifications
2.1 Packaging material
Name
Material
Aluminum laminated sack
Aluminum polyethylene
Label
Paper(-made)
Silica gel
-
Outer case
Paper(-made)
Pad
Paper(-made)
Indicator
Paper(-made)
2.2 Packaging method
2.2.1 Seal a reel with 5,000pcs products into an aluminum laminated bag included the ruled silica gel quantity.
2.2.2 Fill up the blank of label and paste on the bag.
2.2.3 Put the moisture-proof laminated bag in the ruled case (4bag/case).
A pad is attached at both top and bottom of every bag.
Package shape
Product
Quantity
Moisture-proof sack Quantity
Tape-reel (φ330mm)
Single
5,000pcs./reel
1reel/bag
Minimum order Quantity : 5,000pcs (1 reel/bag)
2.2.4 The packing case is sealed off with the kraft tape.
Indicates Model No., Internal production control name, Quantity, Packing date, Corporate name,
Country of origin on the packing case. (20,000 pcs of product in a packing case)
*However 5,000pcs per one reel will be decreased when failure device is removed.
3. Storage and management after open
3.1 Storage condition : Storage shall be in accordance with the below conditions.
Storage temp. : 5 to 30°C
Storage humidity : 70%RH or less
3.2 Treatment after open
(1) After open, please mount at the conditions of humidity 60%RH or less and temperature 5 to 25°C within 2 days.
(2) In case of long time storage after open, please storage at the conditions of humidity 70%RH or less and
temperature 5 to 30°C by using dry box or resealing with desiccant in moisture-proof bag by sealer and
mount within 2 weeks.
3.3 Baking before mounting
In case that it could not carry out the above treatment, it is able to mount with baking treatment. However
baking treatment shall be limited only 1 time. Although it is possible to have baking treatment with
taping package, please bake it by putting a reel with standing situation. Please do not lay it down since it
may change the reel shape and occur a mounting problem. Since a label and a fixing tape for the
carrier tape does not have enough heat resistance, there may be a case to leave some paste.
Recommended baking conditions : 100°C, 16 to 24 hours
Sheet No.: OP13029EN
14
GP1S195HCPSF
(Attachment-3-2)
3.3 Baking treatment before mounting
3.3.1 Placement of reels in an oven
Sheet No.: OP13029EN
15
GP1S195HCPSF
■Important Notices
with equipment that requires higher reliability such as:
--- Transportation control and safety equipment (i.e.,
aircraft, trains, automobiles, etc.)
--- Traffic signals
--- Gas leakage sensor breakers
--- Alarm equipment
--- Various safety devices, etc.
(iii) SHARP devices shall not be used for or in connection
with equipment that requires an extremely high level of
reliability and safety such as:
--- Space applications
--- Telecommunication equipment [trunk lines]
--- Nuclear power control equipment
--- Medical and other life support equipment (e.g.,
scuba).
· The circuit application examples in this publication are
provided to explain representative applications of SHARP
devices and are not intended to guarantee any circuit
design or license any intellectual property rights. SHARP
takes no responsibility for any problems related to any
intellectual property right of a third party resulting from
the use of SHARP's devices.
· Contact SHARP in order to obtain the latest device
specification sheets before using any SHARP device.
SHARP reserves the right to make changes in the
specifications, characteristics, data, materials, structure,
and other contents described herein at any time without
notice in order to improve design or reliability.
Manufacturing locations are also subject to change without
notice.
· If the SHARP devices listed in this publication fall within
the scope of strategic products described in the Foreign
Exchange and Foreign Trade Law of Japan, it is necessary
to obtain approval to export such SHARP devices.
· Observe the following points when using any devices in
this publication. SHARP takes no responsibility for
damage caused by improper use of the devices which does
not meet the conditions and absolute maximum ratings to
be used specified in the relevant specification sheet nor
meet the following conditions:
(i) The devices in this publication are designed for use in
general electronic equipment designs such as:
--- Personal computers
--- Office automation equipment
--- Telecommunication equipment [terminal]
--- Test and measurement equipment
--- Industrial control
--- Audio visual equipment
--- Consumer electronics
(ii) Measures such as fail-safe function and redundant
design should be taken to ensure reliability and safety
when SHARP devices are used for or in connection
· This publication is the proprietary product of SHARP and
is copyrighted, with all rights reserved. Under the
copyright laws, no part of this publication may be
reproduced or transmitted in any form or by any means,
electronic or mechanical, for any purpose, in whole or in
part, without the express written permission of SHARP.
Express written permission is also required before any use
of this publication may be made by a third party.
· Contact and consult with a SHARP representative if there
are any questions about the contents of this publication.
Sheet No.: OP13029EN
16