1/13 SPEC. NO. ISSUE October, 19, 2001 TECHNICAL LITERATURE FOR Optical Data communication transceiver Model No. : GP2W0004YP 1. These specification sheets include materials protected under copyright of Sharp Corporation (“Sharp”). Please do not reproduce or cause anyone to reproduce them without Sharp’s consent. 2. When using this product, please observe the absolute maximum ratings and the instructions for use outlined in these specification sheets, as well as the precautions mentioned below. Sharp assumes no responsibility for any damage resulting from use of the product which dose not comply with the absolute maximum and instructions include in these specification sheets, and the precautions mentioned below. (Precautions) (1) This product is designed for use in the following application areas ; · OA equipment · Audio visual equipment · Home appliances · Telecommunication equipment (Terminal) · Measuring equipment · Tooling machines · Computers If the use of the product in the above application areas is for equipment listed in paragraphs (2) or (3), please be sure to observe the precautions given in those respective paragraphs. (2) Appropriate measures, such as fail-safe design and redundant design considering the safety design of the overall system and equipment, should be taken to ensure reliability and safety when this product is used for equipment which demands high reliability and safety in function and precision, such as ; · Transportation control and safety equipment (aircraft, train, automobile etc.) · Traffic signals · Gas leakage sensor breakers · Rescue and security equipment · Other safety equipment (3) Please do not use this product for equipment which require extremely high reliability and safety in function and precision, such as ; · Space equipment · Telecommunication equipment (for trunk lines) · Nuclear power control equipment · Medical equipment (4) Please contact and consult with a Sharp sales representative if there are any questions regarding interpretation of the above three paragraphs. 3. Please contact and consult with a Sharp sales representative any questions about this product. ** The technical literature is subject to be change without notice. ** OPTO-ELECTRONIC DEVICES DIVISION ELECTRONIC COMPONENTS GROUP SHARP CORPORATION SHARP CORPORARTION ED-01130 MODEL No. October, 19, 2001 PAGE GP2W0004YP 2/13 1. Application This specification applies to the outline and characteristics of IrDA1.3 type (Data rate 9.6kb/s to 115.2kb/s) Optical Data communication transceiver, Model No.GP2W0004YP.. 2. Outline Refer to the attached sheet, page 7. 3. Rating and characteristics Refer to the attached sheet, page 8 to 11. 4. Reliability Refer to the attached sheet, page 12. 5. Outgoing inspection Refer to the attached sheet, page 13. 6. Supplements 1) This optical data communication transceiver is satisfied with each characteristics of item3.3 in the optical system shown in *3, *5. 2) This product is built-in photodiode. 3) This device confirm eye safety IEC60825-1 class 1, and also without external resister. 4) Taping specification : Refer to the attached sheet-2-1, 2-2, 2-3. 5) Taping moisture-proof package : Refer to the attached sheete-2-4, 2-5. 6) This product shall not contain the following materials. Also, the following materials shall not be used in the production process for this product. Materials for ODS : CFCs, Halon, Carbon tetrachloride 1.1.1- Trichloroethane (Methylchloroform) 7) Brominated flame retardants Specific brominated flame retardants such as the PBBOs and PBBs are not used in this device at all. 8) Product mass : Approx. 0.13g 9) Package specifications : Refer to the attached sheet-3. ED-01130 MODEL No. SHARP CORPORARTION October, 19, 2001 PAGE GP2W0004YP 7. Notes 1) If the surface of detector is smeared with dust or dirt, it may cause faulty operation. Caution shall be taken to avoid this. And do not touch the detector surface. 2) Cleaning condition : Solvent cleaning : Solvent temperature 45°C or less Immersion for 3 min or less Ultrasonic cleaning : The effect to device by ultrasonic cleaning differs by cleaning bath size, ultrasonic power output, cleaning time, PCB size or device mounting condition etc. Please test it in actual using condition and confirm that doesn’t occur any defect before starting the ultrasonic cleaning. The cleaning shall be carried out with solvent below. Solvent : Ethyl alcohol, Methyl alcohol, isopropyl alcohol 3) In order to prevent electrostatic discharge of integrated circuit, human body and soldering iron, etc. shall be grounded. 4) In case that things touch to the device after mounting, such external force is applied to the device, there is possibility to be caused the mounting defect such as terminal coming off. Please be careful for handling. 5) Precautions for Soldering Refer to the attached Sheet-1. 6) When the system(program) is designed, the Turn Around Time shall be designed by considering 500us or more that is specified by IrDA. Then, this Turn Around Time means the time when this device does not temporarily defect the signal light, since the transmitted light form the transceiver reaches the detector side of the same transceiver. 7) As it is necessary 200us or more (at Ta=25°C, no input signal) to return from shut-down mode to ready-operation mode, please consider this point at the system(program) designing. Also, please confirm thoroughly the operation in accrual application. 8) When there is much external disturbing light or the light source is located near this transceiver and the detector face receiver much external disturbing light, there is a case that the pulse other than signal output is generated as noise on output terminal of this transceiver. Please consider the lay-out and structure to reduce disturbing light on the detector face. 9) In case that this sensor is adopted in IR communication system, please use it according to the signal method which is specified by [Serial Infrared Physical Layer Link Specification Version 1.3] published by the Infrared Data Association. Faulty operation may happen, if different signal method Than specified one is used. 10) In circuit designing, make allowance for the degradation of the light emitting diode output that results from long continuous operation. (50% degradation/ 5years) 3/13 ED- 01130 MODEL No. SHARP CORPORARTION October, 19, 2001 PAGE 4/13 GP2W0004YP 11)Recommended external circuit 1,VLED power supply is shared. [Standard circuit] 1 LEDA 2 TXD 3 RXD 4 SD 5 Vcc RL [Noise measure circuit] 6 GND 1 LEDA 2 TXD 3 RXD 4 SD 5 Vcc CX1 RL CX1 6 GND CX2 CX2 RX CX3 CX4 TX RXD SD Vcc GND TX RXD SD Vcc GND When there is a noise ingredient which cannot be removed only by CX1 and CX2, please insert RX (1-10ohm), and CX3 and CX4 by the set, and use them after a check. In this case, please avoid insertion of only RX. 2,With independent VLED power supply [Standard circuit] 1 LEDA 2 TXD 3 RXD 4 SD 5 Vcc [Noise measure circuit] 1 LEDA 6 GND RL CX1 CX3 CX2 2 TXD 3 RXD 4 SD 5 Vcc RL 6 GND CX1 CX2 CX3 RX CX4 CX4 VLEDA TX RXD SD Vcc VLEDA TX GND RXD SD Vcc GND When there is a noise ingredient which cannot be removed only by CX1 and CX2, please insert RX (1-10ohm) and use it after a check. Components CX1 CX2,CX4 CX3 RL (Note) component Recommended values 22uF (Note) 0.1uF (Note) 6.8uF (Note) ( Table 1) (Table1) Parameter VLED power Supply Resistor(RL) Values 2.4 2.7 3.0 3.6 5.0 0 0 0 (1.2) (5.1) Unit V Ω chooses the most suitable constant of CX1, CX2, CX3, and CX4 according to the noise level and noise frequency of a power supply. Depending on the noise level of a power supply, and noise frequency, a noise may be unable to be removed only by CX of a standard circuit. At this time, pulses other than a signal may be outputted from a RXD terminal in a specific communication distance. Please confirm with the system that it is satisfactory with each transmission speed in all communication distance at the time of examination. When there is a problem, please use it after a check as a noise measure circuit. ED-01130 MODEL No. SHARP CORPORARTION October, 19, 2001 PAGE 5/13 GP2W0004YP 12)Truth table SD H L L L SW Off On On On TXD Don’t Care H L L LED Off On Off On Receiver Don’t Care Don’t Care IrDA Signal Don’t Care TR1 Off Off On TR2 RXD Off 200-400KΩ pull-up H On L Off H · Echo cancel function : When TX input is applied high(normal data input), H:High L:Low The RXD output is held high, which is the normal No Data state. When the TX input has been low for 200 us,the RXD output will again become active. · Shut down: When the SD pin is held high, the RXD output is held in the 200-400kΩ pull-up Condition. Also,the TX output is disabled and will not operate with the spplication Of a TX input signal. SD input LOW High 200-400KΩ Performance Normal mod Shut down Mode 200-400KΩ 13)Foot pattern of PCB Center of mounting area 6 0.85 5 4 3 2 0.775 2.325 3.875 1 0.3 2.3 [ Terminal arrangement ] 1 2 3 4 5 6 LED Anode Transmitter Data Input Receiver Data Output Shutdown Supply voltage Ground LEDA TXD RXD SD Vcc GND (1) Dimension in parenthesis are shown for reference. *Connect foot pattern of shield case to GND pattern. (2) Unit : mm ED-01130 MODEL No. SHARP CORPORARTION October, 19, 2001 PAGE GP2W0004YP 14) Recommendable size of solder creamed paste (Reference) 6 0.85 5 4 3 2 1 0.775 2.325 3.875 : Soldering paste area * Dimension in parenthesis are shown for reference. Unit : mm l 0.3 2.3 Please open the solder mask as below so that the size of solder creamed paste for this device before reflow soldering must be as large as one of the foot pattern land indicated at 13). Metal solder stencil should use the thickness of 0.152mm(0.006 inches). When you use the thickness of 0.127mm(0.005 inches) unavoidably, please change the size of l into 2.7mm. 6/13 ED-01130 MODEL No. SHARP CORPORARTION October, 19, 2001 PAGE GP2W0004YP PIN 1 2 3 4 5 6 1) 2) 3) Pin name LED Anode Transmitter Data Input Receiver Data Output Shutdown Supply Voltage Ground Symbol LEDA TXD RXD SD Vcc GND Name Area : Au plating. The thickness of Au plating shall be allowed max.0.375um, min.0.125um. Scale Unspecified tolerance shall be ±0.2. 10/1 Adhesion of resin to the terminal area shall be allowed Max. 0.2mm. Drawing No. 7/13 GP2W0004YP Outline Dimension Unit l=1/1mm ED-01130 MODEL No. SHARP CORPORARTION October, 19, 2001 PAGE GP2W0004YP 8/13 3.Rating andand characteristics 3. Ratings characteristics 3.1 Absolute maximum ratings Parameter Supply voltage LED supply voltage Peak forward current Operating temperature Storage temperature Soldering temperture Symbol Vcc VLEDA IFM Ratings 0 to 6.0 0 to 7.0 550 Unit V V mA Topr Tstg Tsol -25 to +85 -25 to +85 240 °C °C °C Remark Pulse width:78.1us Duty ratio:3/16 Soldering reflow time :10s 3.2 Recommended operating conditions Parameter Symbol Supply voltage LED supply voltage Vcc VLEDA operating conditions 2.4 to 5.5 MAX. Vcc+4.0 Operating temperature Data rate Topr BR -25 to +85 9.6 to 115.2 Unit Remark V V Vcc=2.4V to 5.5V °C kb/s ED-01130 MODEL No. SHARP CORPORARTION October, 19, 2001 PAGE GP2W0004YP 3. 3 Rating and characteristics Parameter Current consumption Symbol MIN. TYP. MAX. Unit Icc - (110) (130) uA Iccs - 0.01 1.0 uA 4.6 Vcc 0.5 Vcc 1/3*Vcc - V V V V V at no input signal Current consumption at Shut-down mode SD high input voltage SD low input voltage TX high input voltage TX low input voltage High level VIHSD Vcc-0.5 VILSD 0 VIHTX 2/3*Vcc VILTX 0 VOH1 4.3 9/13 Ta=25°C Remark No input singnal,VISD=0V Output terminal OPEN, Vcc=3.3V No input singnal, VISD=Vcc Output terminal OPEN, Vcc=3.3V Vcc=5.0V,IOH=(500uA) *1,2,3 Output voltage VOH2 1.5 1.7 - V VOL1 - 0.22 0.4 V VOL2 - 0.17 0.3 V Vcc=2.4V,IOL=(300uA) *1,2,3 tr1,tf1 - (18) 27 ns Vcc=5.0V,CL=15pF tr2,tf2 - (60) 80 ns Vcc=5.0V,CL=50pF tr3,tf3 - (36) 55 ns Vcc=2.4V,CL=15pF tr4,tf4 - (63) 94 ns Vcc=2.4V,CL=50pF tW1 1.0 (1.7) 3.6 us BR=9.6kb/s,115.2kb/s Ф≤15° *1,2,3 L 1.0 - - 15 - - ° tl2 - (100) 200 us tsdw - (100) 200 us Radiant intensity IE 40 - - LED peak current ILED - - 550 λp 850 870 900 Low level Vcc=2.4V,IOH=(500uA) *1,2,3 Vcc=5.0V,IOL=(500uA) *1,2,3 Output voltage Rise time/Fall time Pulse width(Receiver) Maximum Reception distance Receiver viewing angle Transmit Receiver Latenc Receiver wakeup time Peak emission wavelength 2θ 1/2 0to3.0mW/cm2 Dcambien t mW/sr BR=115.2kb/s, Ф≤15° Vcc=VLED=5.0V mA RL=(5.1Ω),*4,5,6 nm ED-01130 MODEL No. SHARP CORPORARTION October, 19, 2001 PAGE GP2W0004YP V *1. Input signal waveform (Detector side) T1 T1 T2 Radiation intensity of transmitter 40mW/sr At BR=9.6kb/s : T1=104.2us, T2=1.63us At BR=115.2kb/s : T1=8.68us, T2=1.63us *2. Output waveform specification (Detector side) tr tf VOH 90% 50% 10% VOL tw *3. Standard optical system (Detector side) Ee : Detector face illuminance < 10 lx †1 Transmitter Φ Φ GP2W0004YP L Oscilloscope (Ф; indicates horizontal and vertical directions) †1 Transmitter shall use GP2W0004YP (λp=870nm TYP) which is adjusted the radiation intensity at 40mW/sr 10/13 ED-01130 MODEL No. SHARP CORPORARTION October, 19, 2001 PAGE GP2W0004YP 11/13 *4. Output waveform specification (Emitter side) 90% IE 10% tf tr *5. Standard optical system (Emitter side) GP2W0004YP Detector for Ф Radiant intensity Ф measuring (Ф; indicates horizontal and vertical directions) *6. Recommended circuit (Emitter side) Vcc=5.0V RL=(5.1Ω) 1.63us TXD LEDA GP2W0004YP VINTX=5.0V BR=115.2kb/s ED-01130 MODEL No. SHARP CORPORARTION October, 19, 2001 PAGE GP2W0004YP 12/13 4. Reliability The reliability of products shall satisfy items listed below. Confidence level : 90% LTPD : 10% / 20% Test Items * Temperature cycling * High temp. and high humidity storage * High temp. storage * Low temp. storage * Operation life Mechanical shock Variable frequency vibration Reflow solder heat Test Conditions 1 cycle –25°C to +85°C (30min) (30min) 20 cycles test +40°C, 90%RH, 240h +85°C, 240h Failure Judgement Criteria Icc>Up X 1.2 L < Low X0.8 IE < Low X0.8 IE > Up X 1.2 Samples(n) Defective(C) n=22, c=0 n=22, c=0 n=22, c=0 -25°C, 240h n=22, c=0 +25°C VDD=VLEDA=3.3V, 240h n=11, c=0 15km/s2 , 0.5ms 3 times / ±X, ±Y, ±Z direction 200m/s2 100 to 2000 to 100Hz / Approx. for 4min 48 min/ X, Y, Z direction 240°C, 10s Regarding temperature profile, Refer to attached soldering notes. n=11, c=0 Pulse width 78.1us, Duty ratio 3/16 n=11, c=0 U: Upper specification limit n=11, c=0 L: Lower specification limit In the test *mark above, the sample to be tested shall be left at normal. Temperature and humidity for 2h after it is taken out of the chamber. (No dew point) ED-01130 MODEL No. SHARP CORPORARTION October, 19, 2001 PAGE 13/13 GP2W0004YP 5. Outgoing inspection (1) Inspection lot Inspection shall be carried out per each delivery lot. (2) Inspection method A single sampling plan, normal inspection level 2 based on ISO 2859 shall be adopted. Parameter Major defect Minor defect Inspection items and test method 1 Disconnection, short 2 Inverse polarity on terminal 3 Soldering defect (Obstacle to use) 4 Electrical characteristics defect in parameter 3.3 1 Appearance defect Parameter Split, Chip. Scratch Stain, Blur Judgment criteria One which affects the characteristics of Parameter 3.3 shall be defect. AQL(%) 0.1 0.25 EDMODEL No. SHARP CORPORARTION October 19, 2001 PAGE GP2W0004YP Attach Sheet-1 Precautions for Soldering 1. In case of solder reflow Reflow is allowed only two times at the temperature and the time within the temperature profile as shown in the figure below. Reflow interval shall be within two days under conditions, 10 to 30°C, 70%RH or less. MAX 240°C 200°C 1-4°C /S MAX 165°C 1-4°C /S 1-4°C /S 25°C MAX10S MAX120S 2. Other precautions MAX60S MAX90S An infrared lamp used to heat up for soldering may cause a localized temperature rise in the resin. Also avoid immersing the resin part in the soldering. Even if within the temperature profile above, there is the possibility that the gold wire in package is broken in case that the deformation of PCB gives the affection to lead pins. Please use after confirmation the conditions fully actual solder reflow machine. 3. Soldering · Soldering iron shall be less than 25W,and temperature of point soldering iron shall use at less than 300°C. · Soldering time shall be within 5s. · Soldered product shall treat at normal temperature. · Solder : 6/4 solder or included Ag soder. EDMODEL No. SHARP CORPORARTION October 19, 2001 PAGE GP2W0004YP Taping specifications 1. Application This packing specification sheets specify the taping specifications for GP2W0004YP. 2. Taping method 2-1.Taping material Name Reel Carrier tape Cover tape Material PPE PC PET ESD measure Coped(Conductivity) Coped(Conductivity) Coped(Conductivity) 2-2.Tape structure and Dimensions (Refer to the attached sheets-2-2.) The tape shall have a structure in which a cover tape is sealed heat-pressed on the carrier tape of conductive PC. 2-3.Reel structure and Dimensions (Refer to the attached sheets-2-3.) The taping reel shall be conductive plastic with its dimensions as shown in the attached drawing. 2-4.Direction of product insertion (Refer to the attached sheets-2-3.) Product direction in carrier tape shall be that electrode side or product places on the cover tape side and lens side of product places on the hold side of the tape. 2-5.The way to repair taped failure devices The way to repair taped failure devices cut a bottom of carrier tape with a cutter, and after replacing to good devices, the cutting portion shall be sealed with adhesive tape. 3. Adhesiveness of cover tape The exfoliation force between carrier tape cover tape shall be 0.2N to 1N for the angle from 160°C to 180°C. 4. Rolling method and quantity Wind the tape back on the reel so that the cover tape will be outside the tape. Attach more than 20cm of blank tape to the trailer and the leader of the rape and fix the both ends with adhesive tape. One reel shall contain 2000pcs. 5. Safety protection during shipping There shall be no deformation of component or degradation of electrical characteristics due to shipping. Attach Sheets-2-1 EDMODEL No. SHARP CORPORARTION October 19, 2001 PAGE GP2W0004YP Attach Sheets-2-2 2-1. Tape structure and Dimensions F E D G J I C B H A K Unit Symbol mm Unit Symbol mm A 16.0±0.3 G Ф1.5+0.1 B 7.5±0.1 H 9.56±0.1 C 1.75±0.1 I 0.33±0.05 D E F 8.0±0.1 2.0±0.1 4.0±0.1 J K 3.06±0.1 4.04±0.1 EDMODEL No. SHARP CORPORARTION October 19, 2001 PAGE GP2W0004YP Attach Sheets-2-3 2-2. Reel structure and Dimensions f e d g c b a Unit Symbol mm Check word a b c d e f g Ф330±2 17.5±1 Ф100±1 Ф13±0.2 Ф21±0.8 22.5±0.1 2±0.5 2-3. Direction of product insertion Pull out direction Lens side Label EDMODEL No. SHARP CORPORARTION October 19, 2001 PAGE GP2W0004YP Attach Sheets-2-4 Taping moisture-proof packing 1. Application This packing specification sheets apply to the moist-proof packing for the GP2W0004YP in the taping package. 2. Packaging specifications 2.1 Packaging material Name Aluminum laminate bag Label Siccative Outer case Pads Humidity indicator Material Aluminum polyethylene Paper(-made) Paper Paper Paper ESD measure Coped(Conductivity) Not coped Not coped Not coped Not coped Not coped Q`ty Refer to 2.2 - 2.2 Packaging method (1) Seal the aluminum laminated bag that contains tape reel (contains 2,000 devices per reel) and siccative. (2) Fill necessary information to the label and paste it on the aluminum laminate bag. (3) Pack 4 aluminum laminated bags (contains 1 reel each) into the designated outer case, where paper pads are placed on the bottom and top of the outer case, as well as each layer of the aluminum laminated bags. Package shape Tape reel (Ф330mm) Product 1 model Q`ty 2,000 pcs./reel Moisture-proof sack Q`ty 1reel / laminated bag Minimum order / shipment Q`ty should be 1 laminated bag. (4) The outer case would be then sealed with the craft tape, with indication of model name, quantity, and outgoing inspection date on the case. (total of 8,000 pcs. per carton) SHARP CORPORARTION EDMODEL No. October 19, 2001 PAGE GP2W0004YP Attach Sheets-2-5 3. Storage and Treatment after Unsealed 3.1 Storage conditions The delivered product should be stored with the conditions shown below : Storage temperature : 10 to 30°C Humidity : below 70%RH 3.2 Treatment after open (1) After unsealed, devices should be mounted under the temperature condition of 10 to 30°C, at the humidity condition of below 70%RH, within 2 days. (2) In case that log term storage is needed, devices should either be stored in dry box, or re-sealed to moist-proof bag with siccative and leave them in the environment where the temperature is 10 to 30°C, at the humidity condition of below 70%RH. Devices must be mounted within 2 weeks. 3.3 Baking before mounting In the event that the devices are not maintained in the storage conditions described above, or the enclosed siccative indicator already turned its color to pink, backing must be applied before devices are to be mounted: Please also note that baking should only be applied once. Recommended condition : 100 to 110°C, 12 to 24 hours * Baking will not properly done in packing condition. To complete the baking properly, devices should either be temporary mounted to PCB with adhesive, or placed to the metal tray. (The temporary mounting shall not be done by soldering, but by adhesive etc.) SHARP CORPORARTION EDMODEL No. October 19, 2001 PAGE GP2W0004YP Attach Sheet-3 Package method (1) Seal the aluminum laminated bag included the tape reel with 2,000pcs. and siccative. <Fig.1> (2) Fill up the model name, quantity etc. in the blank of label and paste on the bag. <Fig.2> (3) Put the four moisture-poof laminated bag in the ruled case <Fig.3> (4) The case seals with craft tape, and indicate model name and quantity. (8,000pcs. / package) <Fig.4> Total packaged mass : Approx 3.3kg