Da ta Sh e et , V 1 .1 , Oct o be r 20 0 5 TLE4946H TLE4946-1L High Precision Bipolar Hall-Effect Latch Sen s ors Edition 2005-10 Published by Infineon Technologies AG, St.-Martin-Strasse 53, 81669 München, Germany © Infineon Technologies AG 2005. All Rights Reserved. Attention please! The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics (“Beschaffenheitsgarantie”). With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of noninfringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. TLE4946H TLE4946-1L Revision History: 2005-10 Previous Version: 1.0 V 1.1 Page Subjects (major changes since last revision) 6 Figure 1 Correction of dimensions for package PG-SSO-3-2 14 Figure 6 Correction of dimensions 16 Figure 10 Correction of dimensions 11 Table 7 New entry: Magnetic Offset for TLE4946-1L We Listen to Your Comments Any information within this document that you feel is wrong, unclear or missing at all? Your feedback will help us to continuously improve the quality of this document. Please send your proposal (including a reference to this document) to: [email protected] Template: mc_a5_ds_tmplt.fm / 4 / 2004-09-15 TLE4946H TLE4946-1L 1 1.1 1.2 1.3 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Pin Configuration (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 2.1 2.2 General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Circuit Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 3 Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 4 Operating Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 5 Electrical and Magnetic Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Field Direction Definion . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 6 Timing Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 7 7.1 7.2 7.3 Package Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Package Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Distance between Chip and Package Surface . . . . . . . . . . . . . . . . . . . . . Package Outlines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . PCB Footprint for SC59 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Data Sheet 4 5 5 5 6 13 13 14 15 15 V 1.1, 2005-10 High Precision Bipolar Hall-Effect Latch 1 Overview 1.1 Features • • • • • • • • • • • • 2.7 V to 24 V supply voltage operation Operation from unregulated power supply High sensitivity and high stability of the magnetic switching points High resistance to mechanical stress by Active Error Compensation Reverse battery protection (– 18 V) Superior temperature stability Peak temperatures up to 195°C without damage Low jitter (typ. 1 µs) High ESD performance (± 6 kV HBM) Digital output signal SMD package SC59 (SOT23 compatible) (TLE4946H)) Leaded package PG-SSO-3-2 - (TLE4946-1L) 1.2 TLE4946H TLE4946-1L SC59 SC59 PG-SSO-3-2 Functional Description The TLE4946H and the TLE4946-1L are integrated circuit Hall-effect sensors designed specifically for highly accurate applications. Precise magnetic switching points and high temperature stability are achieved by active compensation circuits and chopper techniques on chip. Type Package TLE4946H SC59 TLE4946-1L PG-SSO-3-2 Data Sheet 5 V 1.1, 2005-10 TLE4946H TLE4946-1L Overview 1.3 Pin Configuration (top view) Center of Sensitive Area 2.08 ± 0.1 3 1.35 0.8 1 1.5 ± 0.15 2 ± 0.15 1 2 3 PG-SSO-3-2 SC59 Figure 1 Pin Definition and Center of Sensitive Area Table 1 Pin Definitions and Functions SC59 Pin No. Symbol Function 1 VS Supply voltage 2 Q Output 3 GND Ground Table 2 Pin Definitions and Functions PG-SSO-3-2 Pin No. Symbol Function 1 VS Supply voltage 2 GND Ground 3 Q Output Data Sheet ± 0.1 6 V 1.1, 2005-10 TLE4946H TLE4946-1L General 2 General 2.1 Block Diagram VS Voltage Regulator reverse polarity protected Bias and Compensation Circuits Oscillator and Sequencer Q Ref Amplifier Chopped Hall Probe Figure 2 2.2 Low Pass Filter Comparator with Hysteresis GND Block Diagram Circuit Description The chopped Hall IC Switch comprises a Hall probe, bias generator, compensation circuits, oscillator, and output transistor. The bias generator provides currents for the Hall probe and the active circuits. Compensation circuits stabilize the temperature behavior and reduce technology variations. The Active Error Compensation rejects offsets in signal stages and the influence of mechanical stress to the Hall probe caused by molding and soldering processes and other thermal stresses in the package. This chopper technique together with the threshold generator and the comparator ensure high accurate magnetic switching points. Data Sheet 7 V 1.1, 2005-10 TLE4946H TLE4946-1L Maximum Ratings 3 Maximum Ratings Table 3 Absolute Maximum Ratings Tj = – 40°C to 150°C Parameter Symbol Limit Values Unit min. max. VS – 18 – 18 – 18 18 24 26 V Supply current IS through protection device – 50 + 50 mA Output voltage VQ – 0.7 – 0.7 18 26 V Continuous output current IQ – 50 + 50 mA Junction temperature Tj – – – – 155 165 175 195 °C Storage temperature TS – 40 150 °C Magnetic flux density B – unlimited mT Supply voltage Conditions for 1 h, Rs ≥ 200 Ω for 5 min, Rs ≥ 200 Ω for 5 min @ 1.2 kΩ pull up for 2000 h (not additive) for 1000 h (not additive) for 168 h (not additive) for 3 x 1 h (additive) Note: Stresses above those listed here may cause permanent damage to the device. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Table 4 Parameter ESD voltage ESD Protection 1) Symbol VESD Limit Values min. max. – ±6 Unit Notes kV HBM, R = 1.5 kΩ, C = 100 pF TA = 25°C 1) Human Body Model (HBM) tests according to: EOS/ESD Association Standard S5.1-1993 and Mil. Std. 883D method 3015.7 Data Sheet 8 V 1.1, 2005-10 TLE4946H TLE4946-1L Operating Range 4 Operating Range Table 5 Operating Range Parameter Supply voltage Output voltage Junction temperature Output current Data Sheet Symbol Limit Values Unit min. typ. max. VS VQ Tj 2.7 – 18 V – 0.7 – 18 V – 40 – 150 °C IQ 0 – 20 mA 9 Conditions V 1.1, 2005-10 TLE4946H TLE4946-1L Electrical and Magnetic Parameters 5 Electrical and Magnetic Parameters Electrical Characteristics 1). Table 6 Parameter Symbol Limit Values Unit Conditions 6 mA 0.2 1 mA 0.3 0.6 V VS = 2.7 V ... 18 V VS = – 18 V IQ = 20 mA – 0.05 10 µA for VQ = 18 V tf tr – 0.02 1 µs RL = 1.2 kΩ; CL = 50 pF – 0.4 1 µs fOSC fSW – 320 – 0 – 15 td tQJ – 13 – µs – 1 – µsRMS Typical value for square wave signal 1 kHz – 13 – µs VS ≥ 2.7 V – 100 – K/W SC59 – – 190 min. typ. max. IS ISR VQSAT 2 4 0 – Output leakage current IQLEAK Output fall time Supply current Reverse current Output saturation voltage Output rise time Chopper frequency Switching frequency Delay time 3) Output jitter 4) Power-on time 5) tPON Thermal resistance RthJA 6) see: Figure 3 “Timing Definition” on Page 12 kHz 2) kHz PG-SSO-3-2 1) over operating range, unless otherwise specified. Typical values correspond to VS =12 V and TA = 25°C 2) To operate the sensor at the max. switching frequency, the value of the magnetic signal amplitude must be 1.4 times higher than for static fields. This is due to the - 3 dB corner frequency of the low pass filter in the signal path. 3) Systematic delay between magnetic threshold reached and output switching 4) Jitter is the unpredictable deviation of the output switching delay 5) Time from applying VS ≥ 2.7 V to the sensor until the output state is valid 6) Thermal resistance from junction to ambient Calculation of the ambient temperature (SC59 example) e.g. for VS = 12.0 V, IStyp = 4 mA, VQSATtyp = 0.3 V and IQ = 20 mA : Power Dissipation: PDIS = 54.0 mW. In TA = Tj – (RthJA × PDIS) = 175°C – (100 K / W × 0.054 W) Resulting max. ambient temperature: TA = 169.6°C Data Sheet 10 V 1.1, 2005-10 TLE4946H TLE4946-1L Electrical and Magnetic Parameters Table 7 Magnetic Characteristics TLE4946H 1) Parameter Operate point Release point Hysteresis Magnetic Offset Symbol Tj [°C] BOP BRP BHYS BOFF Temperature TC compensation of magn. thresholds Repeatability of magnetic thresholds 3) Limit Values min. typ. max. – 40 25 150 11.8 11.0 6.1 15.8 14.0 9.6 19.2 17.0 13.7 – 40 25 150 11.3 11.0 10.5 15.4 15.0 14.3 19.5 19.0 18.1 – 40 25 150 – 19.2 – 15.8 – 17.0 – 14.0 – 13.7 – 9.6 – 40 25 150 – 19.5 – 15.4 – 11.3 – 19.0 – 15.0 – 11.0 – 18.1 – 14.3 – 10.5 – 40 25 150 – 22.0 – – 28.0 – – 34.0 – – 40 25 150 – 22.0 – – 30.0 – – 38.0 – – 40 25 150 – – 3.0 – – – – – 3.0 – – 40 25 150 – – 2.0 – – – – – 2.0 – – – - 2000 – - - - 350 - – 20 – BREP – 11.8 – 11.0 – 6.1 Unit Notes mT TLE4946H TLE4946-1L mT TLE4946H TLE4946-1L mT TLE4946H TLE4946-1L mT TLE4946H 2) TLE4946-1L 2) ppm/°C TLE4946H TLE4946-1L µTRMS Typ. value for ∆B / ∆t > 12 mT/ms 1) over operating range, unless otherwise specified. Typical values correspond to VS = 12 V. 2) BOFF = (BOP + BRP) / 2 3) BREP is equivalent to the noise constant Note: Typical characteristics specify mean values expected over the production spread. Data Sheet 11 V 1.1, 2005-10 TLE4946H TLE4946-1L Timing Diagram Field Direction Definion Positive magnetic fields related with south pole of magnet to the branded side of package. 6 Timing Diagram BOP Applied Magnetic Field B RP td VQ td tf tr 90% 10% Figure 3 Data Sheet Timing Definition 12 V 1.1, 2005-10 TLE4946H TLE4946-1L Package Information Package Information 7.1 Package Marking 46 ym 7 Year (y) = 0...9 Month (m) = 1...9, O - October N - November D - December AEA03643 46 1 Marking TLE4946H yww S Figure 4 Year (y) = 0 ... 9 Calendar Week (ww) = 01 ... 52 AEP03644 Figure 5 Data Sheet Marking TLE4946-1L 13 V 1.1, 2005-10 TLE4946H TLE4946-1L Package Information 7.2 Distance between Chip and Package Surface d Branded Side d: Distance chip to upper side of IC SC59: 0.545 ±0.05 mm AEA03244 Figure 6 Distance Chip SC59 to Upper Side of IC d Branded Side Hall-Probe d : Distance chip to upper side of IC PG-SSO-3-2 : 0.57 ±0.08 mm AEA02510-1 Figure 7 Data Sheet Distance Chip PG-SSO-3-2 to Upper Side of IC 14 V 1.1, 2005-10 TLE4946H TLE4946-1L Package Information 7.3 Package Outlines 1.1 ±0.1 3 ±0.1 0.1 3x0.4 +0.05 -0.1 0.2 +0.1 1.6 +0.15 -0.3 2.8 +0.2 -0.1 0.45 ±0.15 0.1 M 3 2 0.1 M 0.95 0.95 (0.55) GPS09473 1 0.15 MAX. +0.1 0.15 -0.0 5 0˚...8˚ MAX. GPS09473 Figure 8 SC59 PCB Footprint for SC59 The following picture shows a recommendation for the PCB layout. n 0.8 1.4 min 0.9 1.6 1.3 0.9 1.4 min 0.8 1.2 0.8 1.2 0.8 Reflow Soldering Figure 9 Data Sheet Wave Soldering Footprint SC59 (SOT23 compatible) 15 V 1.1, 2005-10 TLE4946H TLE4946-1L Package Information 0.8 ±0.1 x 45˚ 7˚ 2 A 1.52 ±0.05 1 MAX.1) 7˚ 0.35 ±0.1 x 45˚ 3 ±0.06 0.2 3.29 ±0.08 4.06 ±0.08 1.9 MAX. (0.25) 0.15 MAX. 4.16 ±0.05 (0.79) 0.6 MAX. 0.2 +0.1 0.4 ±0.05 1.27±0.25 1 2 3 1.27±0.25 1-1 6 ±0.5 18 ±0.5 23.8 ±0.5 9 +0.75 -0.5 38 MAX. 12.7 ±1 A Adhesive Tape Tape 6.35 ±0.4 1) No solder function area Figure 10 4 ±0.3 12.7 ±0.3 Total tolerance at 10 pitches ±1 0.39 ±0.1 GPO05358 PG-SSO-3-2 Note: You can find all of our packages, sorts of packing and others in our Infineon Internet Page “Products”: http://www.infineon.com/products. Data Sheet 0.25 -0.15 16 Dimensions in mm V 1.1, 2005-10 TLE4946H TLE4946-1L Notes Data Sheet 17 V 1.1, 2005-10 TLE4946H TLE4946-1L Notes Data Sheet 18 V 1.1, 2005-10 TLE4946H TLE4946-1L Notes Data Sheet 19 V 1.1, 2005-10 w w w . i n f i n e o n . c o m Published by Infineon Technologies AG