MICROSEMI MS2213

140 COMMERCE DRIVE
MONTGOMERYVILLE, PA
18936-1013
PHONE: (215) 631-9840
FAX: (215) 631-9855
MS2213
RF & MICROWAVE TRANSISTORS
SPECIALITY AVIONICS/JTIDS APPLICATIONS
Features
•
•
•
•
•
•
•
•
REFRACTORY/GOLD METALLIZATION
EMITTER SITE BALLASTED
15:1 VSWR CAPABILITY
LOW RF THERMAL RESISTANCE
INPUT/OUTPUT MATCHING
OVERLAY GEOMETRY
METAL/CERAMIC HERMETIC PACKAGE
POUT = 30 W MIN. WITH 7.8 dB Gain
DESCRIPTION:
The MS2213 device is a high power Class C transistor specifically
designed for JTIDS pulsed output and driver applications.
The device is capable of operation over a wide range of pulse
widths, duty cycles and temperatures and is capable of
withstanding 15:1 output VSWR at rated RF conditions.
Low RF thermal resistance and computerized automatic wire
bonding techniques ensure high reliability and product
consistency.
The MS2213 is supplied in the hermetic metal/ceramic package
with internal input matching structures.
ABSOLUTE MAXIMUM RATINGS (Tcase = 25°°C)
Symbol
PDISS
IC
VCC
TJ
TSTG
Parameter
Power Dissipation *
(TC ≤ 85°°C)
Device Current *
Collector - Supply Voltage *
Junction Temperature (Pulsed RF Operation)
Storage Temperature
Value
Unit
75
3.5
40
250
- 65 to + 200
W
A
V
°C
°C
2.2
° C/W
Thermal Data
RTH(j-c)
Junction-Case Thermal Resistance
* Applies only to rated RF amplifier operation
MSC0920.PDF 9-23-98
MS2213
ELECTRICAL SPECIFICATIONS (Tcase
(Tcase = 25°
25° C)
STATIC
Symbol
BVCBO
BVEBO
BVCER
ICES
hFE
Test Conditions
IC = 10 mA
IE =
1 mA
IC = 20 mA
VCE = 35 V
VCE =
5V
RBE =10Ω
IC = 1.0 A
Min.
Value
Typ.
Max.
Unit
55
3.5
55
---15
----------------
---------5.0
150
V
V
V
mA
----
Min.
Value
Typ.
Max.
Unit
30
40
7.8
36
45
8.6
----------
W
%
dB
DYNAMIC
Symbol
POUT
VC
GP
Note:
Test Conditions
f = 960 - 1215 MHz
f = 960 - 1215 MHz
f = 960 - 1215 MHz
PIN = 5.0 W
PIN = 5.0 W
PIN = 5.0 W
VCC = +35 V
VCC = +35 V
VCC = +35 V
Pulse format: 6.4 µ s on 6.6 µ s off, repeat for 3.3 ms, then off for 4.5125 ms.
Duty Cycle: Burst 49.2%, Overall 20.8%
MSC0920.PDF 9-23-98
MS2213
PACKAGE MECHANICAL DATA
MSC0920.PDF 9-23-98