REVISIONS LTR DESCRIPTION A DATE (YR-MO-DA) APPROVED 15-04-16 Charles F. Saffle Added the RHA designator "R" to paragraph 1.2. Made correction to paragraph 4.3.5.1.3, removed the last sentence. Table I: corrected Output voltage low max limit from "0.4" to "0.5". Table II: corrected the subgroups for the RHA end point electrical parameters. -sld REV SHEET REV A A SHEET 15 16 REV STATUS REV A A A A A A A A A A A A A A OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY Steve L. Duncan STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE AMSC N/A DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 CHECKED BY Greg Cecil http://www.landandmaritime.dla.mil/ APPROVED BY Charles F.Saffle DRAWING APPROVAL DATE MICROCIRCUIT, OCTAL PRECISION CURRENT SOURCE, MONOLITHIC SILICON 14-02-06 REVISION LEVEL A SIZE CAGE CODE A 67268 SHEET DSCC FORM 2233 APR 97 5962-12232 1 OF 16 5962-E284-15 1. SCOPE 1.1 Scope. This drawing documents five product assurance classes as defined in paragraph 1.2.3 and MIL-PRF-38534. A choice of case outlines and lead finishes which are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of radiation hardness assurance levels is reflected in the PIN. 1.2 PIN. The PIN shall be as shown in the following example: 5962 R Federal stock class designator \ RHA designator (see 1.2.1) 12232 01 K X C Device type (see 1.2.2) Device class designator (see 1.2.3) Case outline (see 1.2.4) Lead finish (see 1.2.5) / \/ Drawing number 1.2.1 Radiation hardness assurance (RHA) designator. RHA marked devices shall meet the MIL-PRF-38534 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number 01 Circuit function PCS5038 Octal Precision Current Source 1.2.3 Device class designator. This device class designator shall be a single letter identifying the product assurance level. All levels are defined by the requirements of MIL-PRF-38534 and require QML Certification as well as qualification (Class H, K, and E) or QML Listing (Class G and D). The product assurance levels are as follows: Device class Device performance documentation K Highest reliability class available. This level is intended for use in space applications. H Standard military quality class level. This level is intended for use in applications where non-space high reliability devices are required. G Reduced testing version of the standard military quality class. This level uses the Class H screening and In-Process Inspections with a possible limited temperature range, manufacturer specified incoming flow, and the manufacturer guarantees (but may not test) periodic and conformance inspections (Group A, B, C and D). E Designates devices which are based upon one of the other classes (K, H, or G) with exception(s) taken to the requirements of that class. These exception(s) must be specified in the device acquisition document; therefore the acquisition document should be reviewed to ensure that the exception(s) taken will not adversely affect system performance. D Manufacturer specified quality class. Quality level is defined by the manufacturers internal, QML certified flow. This product may have a limited temperature range. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-12232 A REVISION LEVEL A SHEET 2 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator X See figure 1 Terminals Package style 40 Ceramic quad flat pack 1.2.5 Lead finish. The lead finish shall be as specified in MIL-PRF-38534. 1.3 Absolute maximum ratings. 1/ Supply voltage (VCC) ................................................................... Thermal resistance, junction-to-case (ƟJC) ................................. Power dissipation ........................................................................ Junction temperature (TJ) ........................................................... Lead temperature (soldering, 10 seconds) ................................. Storage temperature range ......................................................... +7.0 V dc 5°C/W 420 mW +150°C 300°C -65°C to +150°C 1.4 Recommended operating conditions. Supply voltage (VCC).................................................................... Case operating temperature range (TC) ...................................... +5.0 V dc -55°C to +125°C 1.5 Radiation features. 2/ 3/ Maximum Total Ionizing Dose (TID) ..(dose rate = 50 - 300 rad(Si)/s): In accordance with MIL-STD-883, method 1019, condition A. 100 krad(Si) 4/ 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATIONS MIL-PRF-38534 - Hybrid Microcircuits, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard for Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http://quicksearch.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) _________ 1/ Stresses above the absolute maximum ratings may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. 2/ See section 4.3.5 for the manufacturer's radiation hardness assurance analysis and testing. 3/ Bipolar device types may degrade from displacement damage from radiation which could affect RHA levels. This device has not been characterized for displacement damage. 4/ The device will be tested every wafer diffusion lot. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-12232 A REVISION LEVEL A SHEET 3 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item performance requirements for device classes D, E, G, H, and K shall be in accordance with MIL-PRF-38534. Compliance with MIL-PRF-38534 shall include the performance of all tests herein or as designated in the device manufacturer's Quality Management (QM) plan or as designated for the applicable device class. The manufacturer may eliminate, modify, or optimize the tests and inspections herein, however, the performance requirements as defined in MIL-PRF-38534 shall be met for the applicable device class. In addition, the modification in the QM plan shall not affect the form, fit, or function of the device for the applicable device class. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38534 and herein. 3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.4 herein and figure 1. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2. 3.2.3 Block diagram. The block diagram shall be as specified on figure 3. 3.2.4 Timing diagram(s). The timing diagram(s) shall be as specified on figure 4. 3.2.5 Radiation exposure circuits. The radiation exposure circuits shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing and acquiring activity upon request. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full specified operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are defined in table I. 3.5 Marking of device(s). Marking of device(s) shall be in accordance with MIL-PRF-38534. The device shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's vendor similar PIN may also be marked. 3.6 Data. In addition to the general performance requirements of MIL-PRF-38534, the manufacturer of the device described herein shall maintain the electrical test data (variables format) from the initial quality conformance inspection group A lot sample, for each device type listed herein. Also, the data should include a summary of all parameters manually tested, and for those which, if any, are guaranteed. This data shall be maintained under document revision level control by the manufacturer and be made available to the preparing activity (DLA Land and Maritime -VA) upon request. 3.7 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to supply to this drawing. The certificate of compliance (original copy) submitted to DLA Land and Maritime -VA shall affirm that the manufacturer's product meets the performance requirements of MIL-PRF-38534 and herein. 3.8 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38534 shall be provided with each lot of microcircuits delivered to this drawing. 4. VERIFICATION 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38534 or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-12232 A REVISION LEVEL A SHEET 4 TABLE I. Electrical performance characteristics. Test Symbol Conditions Group A Device subgroups type -55°C ≤ TC ≤ +125°C VCC +5.0 V dc ± 5% unless otherwise specified PCS and comparator groups 1,2,3 01 enabled, ENA_PCS_H ≥ VIH, ENA_GRP1_H ≥ VIH, IPCS = 2 mA, ENA_GRP2_H ≥ VIH, R_ISET = 1 kΩ, CMP(OUT1:8) = VIH Supply current 1/ ICC Quiescent current 1/ ICCQ PCS and comparator groups disabled, ENA_PCS_H ≤ VIL, ENA_GRP1_H ≤ VIL, ENA_GRP2_H ≤ VIL Short circuit current 2/ ISC PCS and comparator groups enabled, R_ISET = 0Ω, TC = +25°C Precision current source out 1/ IPCSON Limits Min Unit Max 30 mA 1,2,3 01 10 mA 1 01 60 mA ENA_PCS_H ≥ VIH, ENA_GRP1_H ≥ VIH, ENA_GRP2_H ≥ VIH, 100 µA ≤ IPCS ≤ 2 mA, External set resistor tolerence = ±0.1% 1,2,3 01 IPCS +0.75% mA IPCSOFF ENA_PCS_H ≤ VIL, ENA_GRP1_H ≥ VIH, ENA_GRP2_H ≥ VIH, 100 µA ≤ IPCS ≤ 2 mA, External set resistor tolerence = ±0.1% 1,2,3 01 1000 nA Current source matching accuracy 1/ IMATCH Relative to mean of IPCSON(1:8) at TC = +25°C 1 01 -0.75 +0.75 % Comparator in voltage 2/ VIN Input or reference 1,2,3 01 0 3.0 V Comparator reference in current IREF VREF_GRP1 = VREF_GRP2 = 0 V 1,2,3 01 2.0 µA Enable input voltage low ENA_PCS_H (pin 33), ENA_GRP1_H (pin 32), ENA_GRP2_H (pin 31) VIL 1,2,3 01 0.8 V Enable input voltage high ENA_PCS_H (pin 33), ENA_GRP1_H (pin 32), ENA_GRP2_H (pin 31) VIH 1,2,3 01 Output voltage low 1/ CMPOUT(1:8), (pins 1-4 and 12-15) VOL ISINK ≤ 2.0 mA 1,2,3 01 Output voltage high 1/ CMPOUT(1:8), (pins 1-4 and 12-15) VOH No load 1,2,3 01 4.4 Internal output pull-up 2/ resistor RINT 1,2,3 01 8 Input open circuit voltage VINOC 1,2,3 01 R_ISET pin voltage 1/ VSET 1 01 R_ISET temperature coefficient VSET-TC 1,2,3 01 TC = +25°C IPCS 0.75% 2.0 V 0.5 V V 12 kΩ VCC V 1.990 2.010 V -0.75 +0.75 % See footnotes at end of table. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-12232 A REVISION LEVEL A SHEET 5 TABLE I. Electrical performance characteristics - Continued. Test Band gap output voltage 1/ BGR_VREF (pin 26) Band gap load regulation BGR_VREF (pin 26) 2/ Symbol 1 01 2,3 ∆VBG ∆IBG tDHL1 Comparator enable delay 3/ tDLH2 IPCS enable delay 3/ tDLH3 tDHL2 tDHL3 2/ 3/ Group A Device subgroups type VBG Comparator pulse delay 3/ tDLH1 1/ Conditions -55°C ≤ TC ≤ +125°C VCC +5.0 V dc ± 5% unless otherwise specified BG IOUT ≤ 2 mA Limits Unit Min Max 1.990 2.010 1.980 2.020 V 1,2,3 01 5 mV CL = 30 pF, VREF = 1.0 V dc, VIN overdrive ≥ 50 mV, See figure 4 9,10,11 01 300 ns CL = 30 pF, VREF = 1.0 V dc, VIN = 1.05 V dc, See figure 4 9,10,11 CL = 30 pF, VREF = 1.0 V dc, RIN = 1 KΩ, R_ISET = 1 KΩ, IPCS = 2 mA, See figure 4 9,10,11 1000 01 1500 ns 1000 01 10 µs 750 ns The active element that makes up this device has been tested to 150 krad(Si)) to assure RHA designator level "R" (100 krad(Si)) of Method 1019, condition A of MIL-STD-883 at +25°C for these parameters. Not tested. Shall be guaranteed by design, characterization, or correlation to other test parameters. Includes text fixture node capacitance plus 10 pF scope capacitance. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-12232 A REVISION LEVEL A SHEET 6 FIGURE 1. Case outline. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-12232 A REVISION LEVEL A SHEET 7 Case outline X - Continued. Symbol A A1 A2 b c D/E D1 e F J L L1 L2 L3 L4 N S1 S2 Inches Min Max .120 .111 .005 .011 .0135 .0195 .004 .008 .590 .610 .444 .456 .050 BSC .200 TYP .035 TYP 2.490 2.510 2.580 1.700 1.740 2.090 2.110 .750 TYP 40 .030 TYP .015 TYP Millimeters Min Max 3.05 2.82 .13 .28 .343 .495 .10 .20 14.99 15.49 11.28 11.58 1.27 BSC 5.08 TYP .89 TYP 63.25 63.75 65.53 43.18 44.20 53.09 53.60 19.05 TYP 40 .76 TYP .38 TYP NOTES: 1. Pin 1 is indicated by the ESD marking on top of the package and the extended lead on the bottom of the package. 2. The U.S. preferred system of measurement is the metric SI. This item was designed using inch-pound units of measurement. In case of problems involving conflicts between the metric and inch-pound units, the inch-pound units shall rule. 3. N equals 40, the total number of leads on the package. 4. Pin numbers are for reference only. FIGURE 1. Case outline - Continued. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-12232 A REVISION LEVEL A SHEET 8 Device type 01 Case outline Terminal number X Terminal symbol Terminal number Terminal symbol 1 CMPOUT(1) 21 CASE_GND 2 CMPOUT(2) 22 CASE_GND 3 CMPOUT(3) 23 VCC 4 CMPOUT(4) 24 GND 5 VCC 25 R_ISET 6 GND 26 BGR_VREF 7 PCS(8) 27 CASE_GND 8 PCS(7) 28 CASE_GND 9 PCS(6) 29 R_ISET_RTN 10 PCS(5) 30 CASE_GND 11 VREF_GRP2 31 ENA_GRP2_H 12 CMPOUT(5) 32 ENA_GRP1_H 13 CMPOUT(6) 33 ENA_PCS_H 14 CMPOUT(7) 34 GND 15 CMPOUT(8) 35 VCC 16 VCC 36 PCS(4) 17 GND 37 PCS(3) 18 GND 38 PCS(2) 19 CASE_GND 39 PCS(1) 20 CASE_GND 40 VREF_GRP1 FIGURE 2. Terminal connections. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-12232 A REVISION LEVEL A SHEET 9 NOTE: Ground pins 19, 20, 21, 22, 27, 28, and 30 are connected to CASE and should be grounded. FIGURE 3. Block diagram. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-12232 A REVISION LEVEL A SHEET 10 FIGURE 4. Timing diagram(s). STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-12232 A REVISION LEVEL A SHEET 11 TABLE II. Electrical test requirements. MIL-PRF-38534 test requirements Subgroups (in accordance with MIL-PRF-38534, group A test table) Interim electrical parameters 1 Final electrical parameters 1*,2,3,9,10,11 Group A test requirements 1,2,3,9,10,11 Group C end-point electrical parameters 1,2,3,9,10,11 End-point electrical parameters for Radiation Hardness Assurance (RHA) devices 1 * PDA applies to subgroup 1. 4.2 Screening. Screening shall be in accordance with MIL-PRF-38534. The following additional criteria shall apply: a. b. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to either DLA Land and Maritime-VA or the acquiring activity upon request. Also, the test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015 of MIL-STD-883. (2) TA as specified in accordance with table I of method 1015 of MIL-STD-883. Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter tests prior to burn-in are optional at the discretion of the manufacturer. 4.3 Conformance and periodic inspections. Conformance inspection (CI) and periodic inspection (PI) shall be in accordance with MIL-PRF-38534 and as specified herein. 4.3.1 Group A inspection (CI). Group A inspection shall be in accordance with MIL-PRF-38534 and as follows: a. Tests shall be as specified in table II herein. b. Subgroups 4, 5, 6, 7, and 8 shall be omitted. 4.3.2 Group B inspection (PI). Group B inspection shall be in accordance with MIL-PRF-38534. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-12232 A REVISION LEVEL A SHEET 12 4.3.3 Group C inspection (PI). Group C inspection shall be in accordance with MIL-PRF-38534 and as follows: a. End-point electrical parameters shall be as specified in table II herein. b. Steady-state life test, method 1005 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to either DLA Land and Maritime-VA or the acquiring activity upon request. Also, the test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1005 of MIL-STD-883. (2) TA as specified in accordance with table I of method 1005 of MIL-STD-883. (3) Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883. 4.3.4 Group D inspection (PI). Group D inspection shall be in accordance with MIL-PRF-38534. 4.3.5. Radiation hardness assurance (RHA). RHA qualification is required only for those devices with the RHA designator as specified herein. See table IIIA and table IIIB. Table IIIA. Radiation Hardness Assurance Method Table. RHA method employed Total Dose Testing RHA level "R" (100 krad) Element level Tested at (150 krad) See 4.3.5.1.1 Worst Case Analysis Performed End point electricals after total dose Hybrid Includes Combines Combines End-of-life Element level Hybrid device level device level temperature temperature total dose and effects and radiation displacement effects effects Tested at No No No No TC = +25°C TC = +25°C (150 krad) See 4.3.5.1.1 Table IIIB. Hybrid level and element level test table. Radiation Test Total Dose Heavy Ion Low Dose Rate High Dose Rate ELDRS SET SEL (LDR) (HDR) (transient) (latch-up) Bipolar DI Not tested Tested at (150 krad) Not tested Not tested G Proton Low High Energy Energy SEE (upset) Not tested Not tested Not tested Neutron Displacement Damage (DD) Not tested NOTE: G = Guaranteed by design or process. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-12232 A REVISION LEVEL A SHEET 13 4.3.5.1 Radiation Hardness Assurance (RHA) inspection. RHA qualification is required for those devices with the RHA designator as specified herein. End-point electrical parameters for radiation hardness assurance (RHA) devices shall be specified in table II. Radiation testing will be in accordance with the qualifying activity (DLA Land and Maritime -VQ) approved plan and with MIL-PRF-38534, Appendix G. a. The hybrid device manufacturer shall establish procedures controlling component radiation testing, and shall establish radiation test plans used to implement component lot qualification during procurement. Test plans and test reports shall be filed and controlled in accordance with the manufacturer's configuration management system. b. The hybrid device manufacturer shall designate a RHA program manager to oversee component lot qualification, and to monitor design changes for continued compliance to RHA requirements. 4.3.5.1.1 Hybrid level RHA qualification. Hybrid level and element level testing are the same for this device on this Standard Microcircuit Drawing (SMD) since the active element is accessible to the device leads for test. 4.3.5.1.2. Total ionizing dose irradiation testing. A minimum of 5 biased devices of the active element used will be tested every wafer lot. This active element will be tested at HDR in accordance with condition A of method 1019 of MIL-STD-883 to 150 krad(Si) to assure 100 krad(Si) for the device parameters as specified in table I herein. 4.3.5.1.3 Accelerated annealing test. Accelerated annealing tests shall be performed on all devices requiring a RHA level greater than 5 krad(Si). The post-anneal end-point electrical parameter limits shall be as specified in table I herein and shall be the pre-irradiation end-point electrical parameter limit at 25°C ±5°C. 4.3.5.2 RHA Lot Acceptance. Each lot of this hybrid device shall be evaluated for acceptance in accordance with MIL-PRF38534 and herein. 4.3.5.2.1 Total Ionizing Dose (TID). See paragraph 4.3.5.1.2 and 4.3.5.1.3 herein. 4.3.5.2.2 Enhanced Element Evaluation. Enhanced Element Evaluation per Table IV herein including 45 devices subjected to Group C2, 1000 hours life testing, is required only for those devices with the RHA designator as specified herein. 4.3.5.2.3 Radiation Lot Acceptance Testing (RLAT). Every wafer diffusion lot of this IC used in this monolithic hybrid microcircuit device will be Radiation Lot Acceptance Testing (RLAT) tested at HDR in accordance with condition A (dose rate of 50 - 300 rad(Si)/s) of method 1019 of MIL-STD-883. A minimum of 5 samples under worst case biased conditions will be tested. 0.9000/90% statistics are applied to the device parameters as specified in table I herein. 4.3.5.2.4 RHA Device Package Type. Enhanced Element Evaluation testing per paragraph 4.3.5.2.2 and RLAT per paragraph 4.3.5.2.3 will be performed on every wafer diffusion lot with the monolithic IC die in the same package, as specified in 1.2.4 herein, used for compliant devices with the RHA designator as specified herein. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-12232 A REVISION LEVEL A SHEET 14 Table IV. Enhanced Element Evaluation For Microcircuit Die. Subgroup Class K 2 X 1 3 4 Test MIL-STD-883 Method Condition 2010 X X X Element visual Assembled into package as specified in 1.2.4 herein. Element electrical Internal visual Temperature cycling X Constant acceleration 2001 X Burn-in 1015 X X Interim electrical Burn-in 1015 X X Post burn-in Final Electrical, Group A Steady-state life 1005 5 X X Final electrical Wire bond evaluation 2011 6 X SEM 2018 Quantity (accept number) 100 percent 100 percent 2017 1010 100 percent 45(0) 45(0) 2/ C 3000g’s, Y1 direction 160 hours minimum at +125°C Reference Paragraph 1/ C.3.3.2 C.3.3.1 C.5.5 C.3.3.3 C.5.6 C.3.3.4.3 160 hours minimum at +125°C C.5.10 1000 hours minimum at +125°C 10(0) wires or 20(1) wires See method 2018 of MIL-STD-883 C.3.3.4.3 C.3.3.3 C.3.3.5 C.3.3.6 1/ See MIL-PRF-38534. 2/ Die shall be traceable to the wafer and wafer lot. The sample size shall consist of a minimum of 3 die from each wafer and a minimum of 45 die from each wafer lot. 5. PACKAGING 5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38534. 6. NOTES 6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes. 6.2 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractorprepared specification or drawing. 6.3 Configuration control of SMD's. All proposed changes to existing SMD's will be coordinated as specified in MIL-PRF38534. 6.4 Record of users. Military and industrial users shall inform DLA Land and Maritime when a system application requires configuration control and the applicable SMD to that system. DLA Land and Maritime will maintain a record of users and this list will be used for coordination and distribution of changes to the drawings. Users of drawings covering microelectronic devices (FSC 5962) should contact DLA Land and Maritime-VA, telephone (614) 692-8108. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-12232 A REVISION LEVEL A SHEET 15 6.5 Comments. Comments on this drawing should be directed to DLA Land and Maritime-VA, Columbus, Ohio 43218-3990, or telephone (614) 692-1081. 6.6 Sources of supply. Sources of supply are listed in MIL-HDBK-103 and QML-38534. The vendors, listed in MIL-HDBK103 and QML-38534, have submitted a certificate of compliance (see 3.7 herein) to DLA Land and Maritime-VA and have agreed to this drawing. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-12232 A REVISION LEVEL A SHEET 16 STANDARD MICROCIRCUIT DRAWING BULLETIN DATE: 15-04-16 Approved sources of supply for SMD 5962-12232 are listed below for immediate acquisition information only and shall be added to MIL-HDBK-103 and QML-38534 during the next revisions. MIL-HDBK-103 and QML-38534 will be revised to include the addition or deletion of sources. The vendors listed below have agreed to this drawing and a certificate of compliance has been submitted to and accepted by DLA Land and Maritime -VA. This information bulletin is superseded by the next dated revisions of MIL-HDBK-103 and QML-38534. DLA Land and Maritime maintains an online database of all current sources of supply at http://www.landandmaritime.dla.mil/Programs/Smcr/. Standard microcircuit drawing PIN 1/ Vendor CAGE number Vendor similar PIN 2/ 5962-1223201KXC 5962R1223201KXC 88379 88379 PCS5038-201-1S PCS5038-901-1S 1/ The lead finish shown for each PIN representing a hermetic package is the most readily available from the manufacturer listed for that part. If the desired lead finish is not listed contact the Vendor to determine its availability. 2/ Caution. Do not use this number for item acquisition. Items acquired to this number may not satisfy the performance requirements of this drawing. Vendor CAGE number 88379 Vendor name and address Aeroflex Plainview Incorporated, (Aeroflex Microelectronic Solutions) 35 South Service Road Plainview, NY 11803-4193 The information contained herein is disseminated for convenience only and the Government assumes no liability whatsoever for any inaccuracies in the information bulletin.