REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Changes in accordance with NOR 5962-R119-93. 93-04-12 M. L. Poelking B Changes in accordance with NOR 5962-R122-94. 94-03-03 M. L. Poelking C Add device class level V. Update boilerplate. 97-06-06 M. L. Poelking D Changes in accordance with NOR 5962-R161-98. 98-09-10 M. L. Poelking E Update boilerplate to MIL-PRF-38535 requirements. - CFS 03-10-07 Thomas M. Hess F Update boilerplate to current MIL-PRF-38535 requirements to include radiation hardness assurance (RHA) requirements. - CFS 08-10-01 Thomas M. Hess REV SHEET REV F F F F F F F F F F SHEET 15 16 17 18 19 20 21 22 23 24 REV STATUS REV F F F F F F F F F F F F F F OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY Christopher A. Rauch STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 http://www.dscc.dla.mil CHECKED BY Charles Reusing APPROVED BY THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE William K. Heckman DRAWING APPROVAL DATE MICROCIRCUIT, DIGITAL, DRIVER-RECEIVER, MONOLITHIC SILICON 89-12-05 AMSC N/A REVISION LEVEL F SIZE CAGE CODE A 67268 SHEET DSCC FORM 2233 APR 97 1 OF 5962-88644 24 5962-E352-08 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels is reflected in the PIN. 1.2 PIN. The PIN is as shown in the following examples. For device classes M and Q: 5962 - Federal stock class designator \ 88644 RHA designator (see 1.2.1) 01 U X Device type (see 1.2.2) Case outline (see 1.2.4) Lead finish (see 1.2.5) 01 V U X Device type (see 1.2.2) Device class designator (see 1.2.3) Case outline (see 1.2.4) Lead finish (see 1.2.5) / \/ Drawing number For device class V: 5962 - Federal stock class designator \ 88644 RHA designator (see 1.2.1) / \/ Drawing number 1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type 01 02 03 04 05 06 07 08 Generic number Circuit function UT63M105 UT63M107 UT63M115 UT63M117 UT63M125 UT63M127 UT63M135 UT63M137 Single transceiver Single transceiver Single transceiver Single transceiver Multichip dual transceiver Multichip dual transceiver Multichip dual transceiver Multichip dual transceiver STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 VCC +5 to +15 V +5 to +12 V +5 to +15 V +5 to +12 V +5 to +15 V +5 to +12 V +5 to +15 V +5 to +12 V VEE Idle -15 V -12 V -15 V -12 V -15 V -12 V -15 V -12 V Low Low High High Low Low High High SIZE 5962-88644 A REVISION LEVEL F SHEET 2 1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as listed below. Since the device class designator has been added after the original issuance of this drawing, device classes M and Q designators will not be included in the PIN and will not be marked on the device. Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style U X Y Z See figure 1 See figure 1 See figure 1 See figure 1 24 36 36 36 Dual-in-line Dual-in-line Flat pack Flat pack 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. 1.3 Absolute maximum ratings. 1/ VDD ............................................................................................................................ VEE ............................................................................................................................ VCC ............................................................................................................................ Input voltage range (receiver) .................................................................................... Logic input voltage ..................................................................................................... Output current (transmitter) ........................................................................................ Power dissipation (PD) (per channel).......................................................................... Maximum thermal resistance junction-to-heatsink (θJS) ............................................. Storage temperature range ........................................................................................ Maximum junction temperature (TJ) ........................................................................... +7.0 V -22 V +22 V 42 VPP line to line -0.3 V to +5.5 V 190 mA 4W 6°C/W 2/ -65°C to +150°C +150°C 1.4 Recommended operating conditions. Case operating temperature range (TC) ..................................................................... Operating temperature junction.................................................................................. Supply voltage (VDD) .................................................................................................. Supply voltage (VEE): Device types 01, 03, 05, and 07 ............................................................................. Device types 02, 04, 06, and 08 ............................................................................. Supply voltage (VCC): Device types 01, 03, 05, and 07 ............................................................................. Device types 02, 04, 06, and 08 ............................................................................. Input high voltage (VIH)............................................................................................... Input low voltage (VIL)................................................................................................. -55°C to +125°C -55°C to +150°C +4.5 V dc to +5.5 V dc -14.25 V dc to -15.75 V dc -11.4 V dc to -12.6 V dc +4.75 V dc to +15.75 V dc +4.75 V dc to +12.6 V dc +2.0 V dc minimum +0.8 V dc maximum _______ 1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. 2/ All packages should mount to or contact a heat removal rail located in the printed circuit board. To insure proper heat transfer between the package and the heat removal rail, use a thermally conductive material between the package and the heat removal rail. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-88644 A REVISION LEVEL F SHEET 3 1.5 Radiation features. Maximum total dose available (dose rate = 50 – 300 krad/s): Device types 01 and 05 .......................................................................................... ≥ 100k Rads 13 2 Neutron fluence (MIL-STD-883, method 1017) .......................................................... ≥ 1 x 10 neutrons/cm 1/ 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 MIL-STD-1835 - Test Method Standard Microcircuits. Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 MIL-HDBK-780 - List of Standard Microcircuit Drawings. Standard Microcircuit Drawings. (Copies of these documents are available online at http://assist.daps.dla.mil/quicksearch/ or http://assist.daps.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with MIL-PRF-38535 and as specified herein or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. __________ 1/ Limits are guaranteed by design or process but not production tested unless specified by the customer through the purchase order or contract. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-88644 A REVISION LEVEL F SHEET 4 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 herein and figure 1. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2. 3.2.3 Functional block diagram. The functional block diagram shall be as specified on figure 3. 3.2.4 Timing waveforms and test circuits. The timing waveforms and test circuits shall be as specified on figure 4. 3.2.5 Radiation exposure circuit. The radiation exposure circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing activity and acquiring activity upon request. 3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the electrical performance characteristics and postirradiation parameter limits are as specified in table IA and shall apply over the full case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table IIA. The electrical tests for each subgroup are described in table I. 3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the "5962-" on the device. For RHA product using this option, the RHA designator shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be in accordance with MIL-PRF-38535, appendix A. 3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a "QML" or "Q" as required in MIL-PRF-38535. The compliance mark for device class M shall be a "C" as required in MIL-PRF-38535, appendix A. 3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6.2 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply for this drawing shall affirm that the manufacturer's product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein. 3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change for device class M. For device class M, notification to DSCC-VA of change of product (see 6.2 herein) involving devices acquired to this drawing is required for any change that affects this drawing. 3.9 Verification and review for device class M. For device class M, DSCC, DSCC's agent, and the acquiring activity retain the option to review the manufacturer's facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in microcircuit group number 53 (see MIL-PRF-38535, appendix A). STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-88644 A REVISION LEVEL F SHEET 5 TABLE I. Electrical performance characteristics. Test Symbol Conditions 1/ -55°C ≤ TC ≤ +125°C 4.5 V ≤ VDD ≤ 5.5 V 2/ unless otherwise specified Group A subgroups Device type Limits Min Unit Max Input low voltage RXEN, TXIHB, TXIN, TXIN VIL 1, 2, 3 All Input high voltage RXEN, TXIHB, TXIN, TXIN VIH 1, 2, 3 All 2.0 V Input low current RXEN, TXIHB, TXIN, TXIN IIL VIL = 0.4 V 1, 2, 3 All -1.6 mA Input high current RXEN, TXIHB, TXIN, TXIN IIH VIH = 2.4 V 1, 2, 3 All 40 μA Output low voltage RXOUT, RXOUT VOL IOL = 4.0 mA 1, 2, 3 All 0.55 V Output high voltage RXOUT, RXOUT VOH IOH = 0.4 mA 1, 2, 3 All VDD supply current for each channel IDD 0 percent duty cycle Non-transmitting 1, 2, 3 All VCC supply current for each channel VEE supply current for each channel ICC IEE 0.8 2.4 V 60 50 percent duty cycle f = 1 MHz 60 100 percent duty cycle f = 1 MHz 60 0 percent duty cycle Non-transmitting 1, 2, 3 All 10 100 percent duty cycle f = 1 MHz 10 1, 2, 3 02, 04, 06, 08 140 100 percent duty cycle f = 1 MHz 230 01, 03, 05, 07 mA 40 50 percent duty cycle f = 1 MHz 0 percent duty cycle Non-transmitting mA 10 50 percent duty cycle f = 1 MHz 0 percent duty cycle Non-transmitting V mA 40 50 percent duty cycle f = 1 MHz 140 100 percent duty cycle f = 1 MHz 230 See footnotes at end of table. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-88644 A REVISION LEVEL F SHEET 6 TABLE I. Electrical performance characteristics - Continued. Test Symbol Conditions 1/ -55°C ≤ TC ≤ +125°C 4.5 V ≤ VDD ≤ 5.5 V 2/ unless otherwise specified Group A subgroups Device type 1, 2, 3 02, 04, 06, 08 Limits Min Power dissipation for each channel PCD 0 percent duty cycle Non-transmitting VTH1 3/ Max 0.9 50 percent duty cycle f = 1 MHz 2.1 100 percent duty cycle f = 1 MHz 3.3 01, 03, 05, 07 0 percent duty cycle Non-transmitting Input threshold voltage (no response) Unit 1.0 50 percent duty cycle f = 1 MHz 2.5 100 percent duty cycle f = 1 MHz 3.8 Transformer-coupled stub, Input at f = 1 MHz, Rise/fall time 200 ns at receiver W 4, 5, 6 All 0.20 VPP L-L 4, 5, 6 All 0.28 VPP L-L 4, 5, 6 All 0.86 14.0 VPP L-L 4, 5, 6 All 1.20 20.0 2/ VPP L-L 15 0 → 1 transition Input threshold voltage (no response) VTH2 Direct-coupled stub, Input at f = 1 MHz, Rise/fall time 200 ns at receiver Input threshold voltage (response) VTH3 3/ Transformer-coupled stub, Input at f = 1 MHz, Rise/fall time 200 ns at receiver Input threshold voltage (response) VTH4 0 → 1 transition 0 → 1 transition Direct-coupled stub, Input at f = 1 MHz, Rise/fall time 200 ns at receiver 0 → 1 transition Differential (receiver) Input impedance RIZ Input capacitance CIN Common mode input voltage Input = 1 MHz, No transformer in circuit 4, 5, 6 All 3/ TXIHB, TXIN, TXIN VIN = 0 V, f = 1 MHz 4, 5, 6 All 3/ Direct-coupled stub, VIN = 1.2 VPP 4, 5, 6 All 3/ 4, 5, 6 All VIC -10 kΩ 10 pF +10 V Rise/fall time 200 ns ±25 ns f = 1 MHz Common mode rejection ratio CMRR 3/ 4/ Pass/fail See footnotes at end of table. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-88644 A REVISION LEVEL F SHEET 7 TABLE I. Electrical performance characteristics - Continued. Test Output voltage swing in accordance with MIL-STD-1553 Symbol Conditions 1/ -55°C ≤ TC ≤ +125°C 4.5 V ≤ VDD ≤ 5.5 V 2/ unless otherwise specified V01 3/ 5/ Transformer-coupled stub, V02 Direct-coupled stub, Group A subgroups Device type 4, 5, 6 All Limits Unit Min Max 18 27 6 9 6 20 VPP L-L f = 1 MHz, RL = 70Ω f = 1 MHz, RL = 35Ω Output noise voltage differential V03 3/ 5/ Transformer-coupled stub, VNS 3/ Transformer-coupled stub, f = 1 MHz, RL = 35Ω 4, 5, 6 All 14 mVRMS L-L f = dc to 10 MHz, RL = 70Ω Direct-coupled stub, 5 f = dc to 10 MHz, RL = 35Ω Output symmetry VOS 3/ Transformer-coupled stub, 4, 5, 6 All -250 +250 -90 +90 -900 +900 -300 +300 mVVPP L-L RL = 70Ω, measurement taken 2.5 μs after end of transmission Direct-coupled stub, RL = 35Ω, measurement taken 2.5 μs after end of transmission Output voltage distortion (overshoot or ring) VDIS 3/ 4, 5, 6 Transformer-coupled stub, All mVPeak L-L RL = 70Ω Direct-coupled stub, RL = 35Ω Terminal input impedance TIZ 3/ Transformer-coupled stub, f = 75 kHz to 1 MHz, Non-transmitting RL removed from circuit 4, 5, 6 All Direct-coupled stub, f = 75 kHz to 1 MHz, Non-transmitting RL removed from circuit Functional tests Transmitter output rise/fall time kΩ 2 See 4.4.1b tr, tf 1 Input f = 1 MHz, 50 percent duty cycle, 7, 8 All 9, 10, 11 All 100 300 ns direct-coupled, RL = 35Ω output at 10 through 90 percent points, TXOUT, TXOUT See footnotes at end of table. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-88644 A REVISION LEVEL F SHEET 8 TABLE I. Electrical performance characteristics - Continued. Test Zero crossing distortion Symbol tRZCD Conditions 1/ -55°C ≤ TC ≤ +125°C 4.5 V ≤ VDD ≤ 5.5 V 2/ unless otherwise specified Direct-coupled stub, Input f = 1 MHz, 3 VPP Group A subgroups Device type Limits Unit Min Max 9, 10, 11 All -150 150 ns 9, 10, 11 All -25 25 ns skew input ±150 ns, rise/fall time = 200 ns Zero crossing stability tTZCS Input TXIN and TXIN should create transmitter output zero crossing at 500 ns, 1000 ns, 1500 ns and 2000 ns (±25 ns) RXOUT delay tRXDD RXOUT to RXOUT 9, 10, 11 All -200 200 ns TXIN skew tTXDD 3/ TXIN to TXIN 9, 10, 11 All -25 25 ns Receiver saturation RXSAT TXIN to TXIN @250 kHz, VCCA = 4.75 V and 15.75 V, TXOUT = RXIN, TXOUT = RXIN 9, 10, 11 All +20 -20 ns 1/ 2/ 3/ 4/ 5/ RHA devices supplied to this drawing have been characterized through all levels M, D, P, L, and R of irradiation. However, this device is only tested at the ‘R’ level. Pre and Post irradiation values are identical unless otherwise specified in table I. When performing post irradiation electrical measurements for any RHA level, TA = +25°C. VCC = +4.75 V dc to +15.75 V dc and VEE = -14.25 V dc to -15.75 V dc for device types 01, 03, 05, and 07. VCC = +4.75 V dc to +12.6 V dc and VEE = -11.4 V dc to -12.6 V dc for device types 02, 04, 06, and 08. Guaranteed to the limit specified herein if not tested. Pass/fail criteria in accordance with MIL-HDBK-1553, appendix A, common mode rejection. Test supports all revisions of MIL-STD-1553. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-88644 A REVISION LEVEL F SHEET 9 Case U FIGURE 1. Case outlines. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-88644 A REVISION LEVEL F SHEET 10 Case X FIGURE 1. Case outlines - Continued. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-88644 A REVISION LEVEL F SHEET 11 Case Y FIGURE 1. Case outlines - Continued. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-88644 A REVISION LEVEL F SHEET 12 Case Z FIGURE 1. Case outlines - Continued. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-88644 A REVISION LEVEL F SHEET 13 Device types: 01, 02, 03, and 04 Case outline U Terminal number Terminal symbol Terminal number Terminal symbol 1 2 3 4 5 6 7 8 9 10 11 12 TXOUT TXOUT GND NC NC NC RXOUT RXEN GND RXOUT NC NC 13 14 15 16 17 18 19 20 21 22 23 24 VCC NC RXIN RXIN NC GND VEE VDD TXIHB TXIN TXIN NC NC = No connection Device types: 05, 06, 07, and 08 Case outlines X, Y, and Z Terminal number Terminal symbol Terminal number Terminal symbol 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 TXOUT TXOUT GND NC RXOUT RXEN GND RXOUT NC TXOUT TXOUT GND NC RXOUT RXEN GND RXOUT NC 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 VCC RXIN RXIN GND VEE VDD TXIHB TXIN TXIN VCC RXIN RXIN GND VEE VDD TXIHB TXIN TXIN NC = No connection FIGURE 2. Terminal connections. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-88644 A REVISION LEVEL F SHEET 14 Note: One channel is shown for clarity. FIGURE 3. Functional block diagram. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-88644 A REVISION LEVEL F SHEET 15 Direct-coupled transceiver with load Notes: 1. 2. 3. TP = test point. RL removed for terminal. TX and RX tied together. FIGURE 4. Timing waveforms and test circuits. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-88644 A REVISION LEVEL F SHEET 16 Transformer-coupled transceiver with load Notes: 1. 2. 3. 4. TP = test point. N:L ratio is dependent on power supply voltage. RL removed for terminal input impedance test. TX and RX tied together. FIGURE 4. Timing waveforms and test circuits - Continued. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-88644 A REVISION LEVEL F SHEET 17 FIGURE 4. Timing waveforms and test circuits - Continued. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-88644 A REVISION LEVEL F SHEET 18 Transmitter output characteristics (VDIS, VOS, VNS, and VO) Transmitter output zero crossing stability (TTZCS, tr, and tf) Receiver input zero crossing distortion (tRZCD) FIGURE 4. Timing waveforms and test circuits - Continued. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-88644 A REVISION LEVEL F SHEET 19 4. VERIFICATION 4.1 Sampling and inspection. For device classes Q and V, sampling and inspection procedures shall be in accordance with MIL-PRF-38535 or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. For device class M, sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. For device classes Q and V, screening shall be in accordance with MIL-PRF-38535, and shall be conducted on all devices prior to qualification and technology conformance inspection. For device class M, screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. 4.2.1 Additional criteria for device class M. a. b. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015. (2) TA = +125°C, minimum. Interim and final electrical test parameters shall be as specified in table IIA herein. 4.2.2 Additional criteria for device classes Q and V. a. The burn-in test duration, test condition and test temperature, or approved alternatives shall be as specified in the device manufacturer's QM plan in accordance with MIL-PRF-38535. The burn-in test circuit shall be maintained under document revision level control of the device manufacturer's Technology Review Board (TRB) in accordance with MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015 of MIL-STD-883. b. Interim and final electrical test parameters shall be as specified in table IIA herein. c. Additional screening for device class V beyond the requirements of device class Q shall be as specified in MIL-PRF-38535, appendix B. 4.3 Qualification inspection for device classes Q and V. Qualification inspection for device classes Q and V shall be in accordance with MIL-PRF-38535. Inspections to be performed shall be those specified in MIL-PRF-38535 and herein for groups A, B, C, D, and E inspections (see 4.4.1 through 4.4.4). 4.4 Conformance inspection. Technology conformance inspection for classes Q and V shall be in accordance with MIL-PRF-38535 including groups A, B, C, D, and E inspections and as specified herein. Quality conformance inspection for device class M shall be in accordance with MIL-PRF-38535, appendix A and as specified herein. Inspections to be performed for device class M shall be those specified in method 5005 of MIL-STD-883 and herein for groups A, B, C, D, and E inspections (see 4.4.1 through 4.4.4). 4.4.1 Group A inspection. a. Tests shall be as specified in table IIA herein. b. For device class M, subgroups 7 and 8 tests shall be sufficient to verify the functionality of the device. For device classes Q and V, subgroups 7 and 8 shall include verifying the functionality of the device. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-88644 A REVISION LEVEL F SHEET 20 TABLE IIA. Electrical test requirements. Test requirements Subgroups (in accordance with MIL-PRF-38535, table III) Subgroups (in accordance with MIL-STD-883, method 5005, table I) Device class M Device class Q Device class V Interim electrical parameters (see 4.2) --- --- --- Final electrical parameters (see 4.2) 1, 2, 3, 4, 5, 6, 8, 9, 10, 11 1/ 1, 2, 3, 4, 5, 6, 9, 10, 11 1/ 1, 2, 3, 4, 5, 6, 9, 10, 11 2/ 3/ 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 11 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 11 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 11 Group C end-point electrical parameters (see 4.4) 1, 2 1, 2 1, 2 Group D end-point electrical parameters (see 4.4) 1, 2 1, 2 1, 2 Group E end-point electrical parameters (see 4.4) 1, 7, 9 1, 7, 9 1, 7, 9 Group A test requirements (see 4.4) 1/ PDA applies to subgroup 1. 2/ PDA applies to subgroups 1 and 7. 3/ Delta limits as specified in table IIB shall be required where specified, and the delta limits shall be completed with reference to the zero hour electrical parameters (see table I). TABLE IIB. Burn-in and operating life test delta parameters (+25°C). Parameter Symbol Delta limits VCC supply current for each channel ICC ±0.5 mA VEE supply current for each channel IEE ±2 mA VDD supply current for each channel IDD ±3 mA Output low voltage VOL ±60 mV Output high voltage VOH ±100 mV 4.4.2 Group C inspection. The group C inspection end-point electrical parameters shall be as specified in table IIA herein. 4.4.2.1 Additional criteria for device class M. Steady-state life test conditions, method 1005 of MIL-STD-883: a. Test condition A or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1005 of MIL-STD-883. b. TA = +125°C, minimum. c. Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-88644 A REVISION LEVEL F SHEET 21 4.4.2.2 Additional criteria for device classes Q and V. The steady-state life test duration, test condition and test temperature, or approved alternatives shall be as specified in the device manufacturer's QM plan in accordance with MIL-PRF-38535. The test circuit shall be maintained under document revision level control by the device manufacturer's TRB in accordance with MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1005 of MIL-STD-883. 4.4.3 Group D inspection. The group D inspection end-point electrical parameters shall be as specified in table IIA herein. 4.4.4 Group E inspection. Group E inspection is required only for parts intended to be marked as radiation hardness assured (see 3.5 herein). a. End-point electrical parameters shall be as specified in table IIA herein. b. For device classes Q and V, the devices or test vehicle shall be subjected to radiation hardness assured tests as specified in MIL-PRF-38535 for the RHA level being tested. For device class M, the devices shall be subjected to radiation hardness assured tests as specified in MIL-PRF-38535, appendix A for the RHA level being tested. All device classes must meet the postirradiation end-point electrical parameter limits as defined in table I at TA = +25°C ±5°C, after exposure, to the subgroups specified in table IIA herein. 4.4.4.1 Total dose irradiation testing. Total dose irradiation testing shall be performed in accordance with MIL-STD-883 method 1019, condition A, and as specified herein. 4.4.4.2 Neutron testing. When required by the customer, Neutron testing shall be performed in accordance with method 1017 of MIL-STD-883 and herein. All devices classes must meet the post irradiation end-point electrical parameter limits as defined in 12 2 table I, for the subgroups specified in table IIA herein at TA = +25°C ±5°C after an exposure of 2 x 10 neutrons/cm (minimum). 5. PACKAGING 5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. 6. NOTES 6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes. 6.1.1 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractor-prepared specification or drawing. 6.1.2 Substitutability. Device class Q devices will replace device class M devices. 6.2 Configuration control of SMD's. All proposed changes to existing SMD's will be coordinated with the users of record for the individual documents. This coordination will be accomplished using DD Form 1692, Engineering Change Proposal. 6.3 Record of users. Military and industrial users should inform Defense Supply Center Columbus (DSCC) when a system application requires configuration control and which SMD's are applicable to that system. DSCC will maintain a record of users and this list will be used for coordination and distribution of changes to the drawings. Users of drawings covering microelectronic devices (FSC 5962) should contact DSCC-VA, telephone (614) 692-0544. 6.4 Comments. Comments on this drawing should be directed to DSCC-VA, Columbus, Ohio 43218-3990, or telephone (614) 692-0547. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-88644 A REVISION LEVEL F SHEET 22 6.5 Abbreviations, symbols, and definitions. The abbreviations, symbols, and definitions used herein are defined in MIL-PRF-38535, MIL-HDBK-1331, and as follows: Pin description Name Pin number 1/ Type Cases 1/ Active Description U X, Y, Z TXOUT (A) TXOUT (B) 1 N/A 1 10 DO DO Transmitter outputs: TXOUT and TXOUT are differential data signals. TXOUT (A) TXOUT (B) 2 N/A 2 11 DO DO TXOUT is half-cycle complement of TXOUT. TXIHB (A) TXIHB (B) 21 N/A 34 25 TI TI TXIN (A) TXIN (B) 22 N/A 35 26 TI TI Transmitter input: TXIN and TXIN are complementary TTL-level Manchester II encoder inputs. TXIN (A) TXIN (B) 23 N/A 36 27 TI TI TXIN is the complement of TXIN input. RXOUT (A) RXOUT (B) 7 N/A 5 14 TO TO Receiver outputs: RXOUT and RXOUT are complementary Manchester II decoder outputs. RXOUT (A) RXOUT (B) 10 N/A 8 17 TO TO RXOUT is the complement of RXOUT output. RXEN (A) RXEN (B) 8 N/A 6 15 TI TI RXIN (A) RXIN (B) 15 N/A 29 20 DI DI Receiver inputs: RXIN and RXIN are bi-phase modulated Manchester II bipolar inputs from MIL-STD-1553 data bus. RXIN (A) RXIN (B) 16 N/A 30 21 DI DI RXIN is half-cycle complement of RXIN input. VDD (A) VDD (B) 20 N/A 33 24 PWR PWR +5 V dc power (±10%). VCC (A) VCC (B) 13 N/A 28 19 PWR PWR +5 V dc to +12 V dc power or +5 V dc to +15 V dc power (±5%). VEE (A) VEE (B) 19 N/A 32 23 PWR PWR -12 V dc to -15 V dc power (±5%). 3, 9, 18 N/A 3, 7, 31 12, 16, 22 GND GND Ground reference. GND (A) GND (B) 1/ AH AH AH AH Transmitter inhibit. Receiver enable/disable. Abbreviations: TI = TTL input, DO = Differential output, ( ) = Channel designator, TO = TTL output, DI = Differential input, AH = Active high STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-88644 A REVISION LEVEL F SHEET 23 6.6 Sources of supply. 6.6.1 Sources of supply for device classes Q and V. Sources of supply for device classes Q and V are listed in QML-38535. The vendors listed in QML-38535 have submitted a certificate of compliance (see 3.6 herein) to DSCC-VA and have agreed to this drawing. 6.6.2 Approved sources of supply for device class M. Approved sources of supply for class M are listed in MIL-HDBK-103. The vendors listed in MIL-HDBK-103 have agreed to this drawing and a certificate of compliance (see 3.6 herein) has been submitted to and accepted by DSCC-VA. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-88644 A REVISION LEVEL F SHEET 24 STANDARD MICROCIRCUIT DRAWING BULLETIN DATE: 08-10-01 Approved sources of supply for SMD 5962-88644 are listed below for immediate acquisition information only and shall be added to MIL-HDBK-103 and QML-38535 during the next revision. MIL-HDBK-103 and QML-38535 will be revised to include the addition or deletion of sources. The vendors listed below have agreed to this drawing and a certificate of compliance has been submitted to and accepted by DSCC-VA. This information bulletin is superseded by the next dated revision of MIL-HDBK-103 and QML-38535. DSCC maintains an online database of all current sources of supply at http://www.dscc.dla.mil/Programs/Smcr/ . Standard microcircuit drawing PIN 1/ Vendor CAGE number Vendor similar PIN 2/ 5962-8864401UA 65342 UT63M105PBA 5962-8864401UC 65342 UT63M105PBC 5962R8864401VUA 65342 UT63M105PVA 5962R8864401VUC 65342 UT63M105PVC 5962-8864402UA 3/ UT63M107PBA 5962-8864402UC 3/ UT63M107PBC 5962-8864403UA 3/ UT63M115PBA 5962-8864403UC 3/ UT63M115PBC 5962-8864404UA 3/ UT63M117PBA 5962-8864404UC 3/ UT63M117PBC 5962-8864405XA 65342 UT63M125BBA 5962-8864405XC 65342 UT63M125BBC 5962R8864405VXA 65342 UT63M125BVA 5962R8864405VXC 65342 UT63M125BVC 5962-8864405YA 65342 UT63M125DBA 5962-8864405YC 65342 UT63M125DBC 5962R8864405VYA 65342 UT63M125DVA 5962R8864405VYC 65342 UT63M125DVC 5962-8864405ZA 65342 UT63M125CBA 5962-8864405ZC 65342 UT63M125CBC 5962R8864405VZA 65342 UT63M125CVA 5962R8864405VZC 65342 UT63M125CVC 5962-8864406XA 3/ UT63M127BBA 5962-8864406XC 3/ UT63M127BBC 5962-8864406YA 3/ UT63M127DBA 5962-8864406YC 3/ UT63M127DBC 5962-8864406ZA 3/ UT63M127CBA 5962-8864406ZC 3/ UT63M127CBC Continued on the next sheet. Sheet 1 of 2 STANDARD MICROCIRCUIT DRAWING BULLETIN - CONTINUED DATE: 08-10-01 Standard microcircuit drawing PIN 1/ Vendor CAGE number Vendor similar PIN 2/ 5962-8864407XA 3/ UT63M135BBA 5962-8864407XC 3/ UT63M135BBC 5962-8864407YA 3/ UT63M135DBA 5962-8864407YC 3/ UT63M135DBC 5962-8864407ZA 3/ UT63M135CBA 5962-8864407ZC 3/ UT63M135CBC 5962-8864408XA 3/ UT63M137BBA 5962-8864408XC 3/ UT63M137BBC 5962-8864408YA 3/ UT63M137DBA 5962-8864408YC 3/ UT63M137DBC 5962-8864408ZA 3/ UT63M137CBA 5962-8864408ZC 3/ UT63M137CBC 1/ The lead finish shown for each PIN representing a hermetic package is the most readily available from the manufacturer listed for that part. If the desired lead finish is not listed contact the vendor to determine its availability. 2/ Caution. Do not use this number for item acquisition. Items acquired to this number may not satisfy the performance requirements of this drawing. 3/ Not available from an approved source of supply. Vendor CAGE number Vendor name and address 65342 Aeroflex Colorado Springs, Inc. 4350 Centennial Blvd. Colorado Springs, CO 80907-3486 The information contained herein is disseminated for convenience only and the Government assumes no liability whatsoever for any inaccuracies in the information bulletin. Sheet 2 of 2