SPO-2015-AL-0001

AEROFLEX DATA EXCHANGE PROGRAM TRANSMITTAL
ALERT
1. TITLE
TOTAL IONIZING DOSE (TID) RADIATION TESTING ON A 512K X 32BIT (16MB) SRAM M/S MICROCIRCUIT
4. MANUFACTURER NAME AND ADDRESS
AEROFLEX COLORADO SPRINGS INC., DOING BUSINESS AS
COBHAM SEMICONDUCTOR SOLUTIONS
9. LDC START
10. LDC END
1010
1411
3. DATE (Year, Month, Date)
2015,Mar, 05
5. MANUFACTURER POINT OF CONTACT NAME
Lin-Chi Huang
6. MANUFACTURER POINT OF CONTACT TELEPHONE
(719) 594-8294
7. MANUFACTURER POINT OF CONTACT EMAIL
[email protected]
11. PRODUCT IDENTIFICATION
12. BASE PART
CODE
WC04, WC05, QS09-QS17
See Page 2
13. SMD NUMBER
14. DEVICE TYPE
DESIGNATOR
See Page 2
See Page 2
15. RHA LEVELS
16. QML LEVEL
100 Krad(Si)
Q and V
17. NON QML LEVEL
18. SUSPECT
☐
COUNTERFEIT?
NO
Not Applicable
4350 CENTENNIAL BOULEVARD
COLORADO SPRINGS, COLORADO 80907-3486
8. CAGE
CODE
65342
11. BLANK
2. DOCUMENT NUMBER
SPO-2015-AL-0001
19. PROBLEM DESCRIPTION / DISCUSSION / EFFECT
An internal review determined Total Ionizing Dose (TID) testing bias circuit was limiting current when performing radiation testing to 100
krad(Si) per MIL-STD-883, M1019, Condition A. As a result of this finding, samples from previously delivered wafer lots were retested
without current limiting to the bias circuit. The retested samples failed post TID functional and parametric tests at 100 krad(Si) per MIL-STD883, M1019, Condition A.
Limited sample testing was conducted at 50 krad(Si) TID per MIL-STD-883, M1019, Condition A, to verify compliance to the lower radiation level
using the improved bias setup. One wafer lot successfully passed a 22 unit sample test. Also, 2 piece samples from four different previously
manufactured wafer lots successfully passed at 50 krad(Si). This testing indicates that all delivered wafers lots may meet a TID of 50 krad(Si) per MILSTD-883, M1019, Condition A,
This product is offered as a monolithic single die device and as a multichip module (MCM). The part numbers for all of the affected delivered product
are listed on page 2 of this ADEPT.
20. ACTION TAKEN / PLANNED
The TID bias circuit was modified to prevent current limiting. An engineering validation review of bias current measurements and post
electrical test data was added after each TID test.
All wafer lots are being retested to verify meeting 50 krad(Si) per MIL-STD-883, M1019, Condition A.
All customers are being contacted to address affected shipments.
21.
DISPOSITIONARY RECOMMENDATION:
22.
ADEPT REPRESENTATIVE
Lin-Chi Huang
ADEPT ALERT FORM
USE AS IS
23.
☐
SIGNATURE
CONTACT
MANUFACTURER
☒
REMOVE &
REPLACE
☐
CHECK &
USE AS IS
24. DATE
☐
06 Mar 2015
SPO-2015-AL-0001
Page 2
Affected part number
SMD part number
5962R0626103VXA
Generic Part number
UT8ER512K32S-21WCA
5962R0626106QXC
UT8ER512K32S-21WWC
5962R0626106VXA
UT8ER512K32S-21WWA
5962R1020401QXC
UT8ER4M32M-25XFC
5962R1020501VXC
UR8R1M39-21XFC
5962R1020601QXC
UR8R2M39-22XFC
5962R1020602QXC
UR8R2M39-22XFC
5962R1020601VXC
UR8R2M39-22XFC
5962R1020701QXC
UT8R4M39-25XFC
5962R1020702QXC
UT8R4M39-25XFC
5962R1020201VXC
UT8ER1M32M-21XFC
5962R1020202QXC
UT8ER1M32S-21XFC
ADEPT ALERT FORM