UT8ER512K32 Design In Fact Sheet

Design Information Fact Sheet
UT8ER512K32 Monolithic 16M RadHard SRAM
INTRODUCTION
FEATURES
‰ 20ns read, 10ns write maximum access times
‰ Functionally compatible with traditional 512K x 32 SRAM
devices
‰ CMOS compatible inputs and output levels, three-state
bidirectional data bus
- 3.3 volt I/O, 1.8 volt core
‰ Radiation performance
- Total-dose: >100Krad(Si)
The UT8ER512K32 is a high-performance CMOS static RAM
organized as 524,288 words by 32 bits. Easy memory expansion
is provided by active LOW and HIGH chip enables (E1, E2), an
active LOW output enable (G), and three-state drivers. This
device has a power-down feature that reduces power
consumption by more than 90% when deselected.
Writing to the device is accomplished by driving chip enable one
(E1) input LOW, chip enable two (E2) HIGH and write enable
(W) input LOW. Data on the 32 I/O pins (DQ0 through DQ31)
is then written into the location specified on the address pins (A0
through A18). Reading from the device is accomplished by
taking chip enable one (E1) and output enable (G) LOW while
forcing write enable (W) and chip enable two (E2) HIGH. Under
these conditions, the contents of the memory location specified
by the address pins will appear on the I/O pins.
- SEL Immune: 100MeV-cm2/mg
- SEU error rate = 6.01x10-16 errors bit/day assuming
geosynchronous orbit, Adam’s 90% worst environment,
and 156KHz default scrub rate (=99.4% SRAM
availability)
- Neutron Fluence: 3.0E14n/cm2
‰ Packaging options:
- 68-lead ceramic quad flatpack (6.898 grams)
‰ Standard Microcircuit Drawing 5962-06261
- QML compliant part
The 32 input/output pins (DQ0 through DQ31) are placed in a
high impedance state when the device is deselected (E1 HIGH
or E2 LOW), the outputs are disabled (G HIGH), or during a
write operation (E1 LOW, E2 HIGH and W LOW).
UT8ER512K32 Master or Slave Options
To reduce bit error rates caused by single event phenomenon in
space, the UT8ER512K32 employs an embedded EDAC (error
detection and correction) with code engine with auto scrubbing.
When a double bit error occurs in a word, the UT8ER512K32
asserts an MBE output to the host.
The UT8ER512K32 is offered in two options: Master or Slave.
The UT8ER512K32M (Master) is a full function device capable
of autonomous EDAC scrubbing which can also be used to
demand scrub cycles on the UT8ER512K32S (Slave) by
connecting the SCRUB pins on each device. The
UT8ER512K32S (Slave) only performs EDAC scrub cycles
when its SCRUB pin is driven by an external controller. The
scrub-on-demand feature allows multiple UT8ER512K32S
(Slave) devices to be controlled by one UT8ER512K32M
(Master) device. The SCRUB function is a no connect (NC) on
the UT8ER512K32S (Slave), and is used by the
UT8ER512K32M (Master) to generate wait states in the
memory controller. The BUSY function is an output on the
Master device while on the Slave device it is an input.
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RadHard 16M Monolithic SRAM Design Examples
E2
RAM S*
E 1*
RW E*
W*
RAM DE*
G*
M aster
BUSY*
D
U T 699R H
SPARC
SDCLK
D
Q
Q
Q
SCRUB *
M BE
Q
S lave D rive
BRDY*
IN T
E2
IN T
D
E 1*
Q
W*
C on tro l
Q
G*
BUSY*
System Interface:
- BUSY generates wait-states
- Scrub cycle controlled by
D
Q
C on tro l
SCRUB *
Q
M BE
S lave D rive
Figure 1. SPARC System Utilizing Master/Slave SRAMs with Auto-Scrub and Wait States
E2
RAMS*
RWE*
RAMD
E*
E1*
W*
G*
BUS
Y*
SCRU
UT8ER512K
TIMER
HOST
D Q
ConE2
D Q
E1*
W*
G*
BUS
Y*
Con-
SCRU
UT8ER512K
Figure 2. Slave Devices with Scrub-on-Command
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S lave
16M SRAM Comparison to 4M SRAM
Design Factor
Industry Standard 4M
SRAM
Aeroflex 16M
SRAM
SEU Error Rate
(errors / bit day)
1.10-10
6x10-16(4)
Total Power
Dissipation
(16Mbit solution)
1.5W (1,2)
0.6W (1,3)
Total Land Area
(16Mbit solution)
4.8 sq-in (2)
3.0 sq-in (3)
(1) Operating at 25 MHz and 125oC, VDD = 3.3V
(2) Assumes four 4M memory devices
(3) Including 1.8V linear regulator
(4) Error rate assumes default 156KHz scrub frequency+
Value Proposition of RadHard 16M Monolithic SRAM
No need for external EDAC memory bits
Improved system speed
Reduces memory power consumption by 60% savings over individual components
Lower system cost (16M ASP is 2.5x a 4M)
40% area savings over 4M SRAMs using offchip EDAC device
Increased bits per square inch
Fast access time (50MHz operation)
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Internet Resources:
Visit www.aeroflex.com/RadHardSRAM to download:
RadHard SRAM Data Sheets
Applications Notes
IBIS Models
Tutorial "How to Design with the RadHard 16M Monolithic SRAM"
Visit www.aeroflex.com/RadHard to see the latest
Aeroflex Colorado Springs’ RadHard products for space applications!
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