BAL-NRF01D3 50 ohm balun transformer for 2G45 ISM matched Nordic Semiconductor chips with ultralow power transceivers Datasheet production data Features 50 nominal input / conjugate match to Nordic Semiconductor chips nRF24LE1 QFN32, nRF24AP2-1CH, nRF24AP2-8CH, nRF51422 and nRF51822 Low insertion loss Low amplitude imbalance Low phase imbalance Small footprint: < 1.5 mm2 Lead-free Flip-Chip package 5 bumps Benefits Very low profile: < 595 µm after reflow Figure 1. Pinout diagram (top view) 3 DIFF 2 A SE DIFF VCC RF BOM and area reduction 1 GND High RF performance B Applications 2.45 GHz impedance matched balun filter Optimized for Nordic's chip set nRF24LE1/AP2 and nRF51 series C Description STMicroelectronics BAL-NRF01D3 is an ultraminiature balun. The BAL-NRF01D3 integrates matching network and harmonics filter. Matching impedance has been customized for the following Nordic Semiconductor circuits: nRF24LE1 QFN-32 pins, nRF24AP2-1CH, nRF24AP2-8CH, nRF51422 and nRF51822. The BAL-NRF01D3 uses STMicroelectronics IPD technology on non-conductive glass substrate which optimize RF performances. The BAL-NRF01D3 has been tested and approved by Nordic Semiconductor in their nRF2723 and nRF2752 nRFgo modules. March 2013 This is information on a product in full production. DocID023215 Rev 3 1/9 www.st.com 9 Characteristics 1 BAL-NRF01D3 Characteristics Table 1. Absolute maximum ratings (limiting values) Value Symbol Parameter Unit Min. Typ. Input Power RFIN PIN VESD TOP Max. 20 ESD ratings MIL STD883C (HBM: C = 100 pF, R = 1.5 k, air discharge) 2000 ESD ratings charge device model (JESD22-C101-C) 500 ESD ratings machine model (MM: C = 200 pF, R = 25 , L = 500 nH) 200 Operating temperature -40 dBm V +85 °C Table 2. Impedances (Tamb = 25 °C) Value Symbol Parameter Unit Min. ZOUT ZIN Nominal differential output impedance Typ. Max. conjugate match to nRF24LE1/AP2, nRF51422, nRF51822 50 Nominal input impedance Table 3. RF performance (Tamb = 25 °C) Value Symbol Parameter Test condition Unit Min. 2/9 F Frequency range (bandwidth) IL Insertion loss in bandwidth RL Typ. 2400 Max. 2540 MHz 2.25 dB Return loss in bandwidth 10 dB imb Phase imbalance 3 ° Aimb Amplitude imbalance 0.1 dB 2f0 2nd harmonic filtering 4880 MHz 10 dB 3f0 3rd harmonic filtering 7320 MHz 20 dB DocID023215 Rev 3 BAL-NRF01D3 1.1 Characteristics On-board simulations Figure 2. Transmission (Tamb = 25 °C) -0 Figure 3. Return loss on SE port (Tamb = 25 °C) dB -5 dB -5 -7.5 -10 -10 -15 -20 -12.5 -25 F (GHz) F (GHz) -15 -30 0 1 2 3 4 5 6 7 Figure 4. Return loss on DIFF port (Tamb = 25 °C) -20 2.40 2.41 2.42 2.43 2.44 2.45 2.46 2.47 2.48 2.49 2.50 8 dB Figure 5. Amplitude imbalance (Tamb = 25 °C) 0.5 dB 0.4 -25 0.3 0.2 -30 0.1 0.0 -35 -0.1 -0.2 -40 -0.3 F (GHz) -45 2.40 2.41 2.42 2.43 2.44 2.45 2.46 2.47 2.48 2.49 2.50 F (GHz) -0.4 -0.5 2.40 2.41 2.42 2.43 2.44 2.45 2.46 2.47 2.48 2.49 2.50 Figure 6. Phase imbalance (Tamb = 25 °C) 10 degrees 8 6 4 2 0 -2 -4 -6 F (GHz) -8 -10 2.40 2.41 2.42 2.43 2.44 2.45 2.46 2.47 2.48 2.49 2.50 DocID023215 Rev 3 3/9 Application information 2 BAL-NRF01D3 Application information Figure 7. Application schematic (courtesy of Nordic Semiconductor) BAL-NRF01D3 Figure 8. nRF2723 application board (courtesy of Nordic Semiconductor) BAL-NRF01D3 4/9 DocID023215 Rev 3 BAL-NRF01D3 Application information Figure 9. nRF2752 application board (courtesy of Nordic Semiconductor) BAL-NRF01D3 DocID023215 Rev 3 5/9 Package information 3 BAL-NRF01D3 Package information Epoxy meets UL94, V0 Lead-free package In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Figure 10. Package dimensions (top and side view) 630 µm ± 60 400 µm 600 µm 50 0 DIFF µm DIFF 1010 ± 50 µm 500 µm GND SE VCC 433 µm 205 µm 1475 ± 50µm Figure 11. Footprint - non solder mask defined Figure 12. Footprint - solder mask defined Copper pad diameter: 220µm recommended 180µm minimum 260µm maximum Solder mask opening: 220µm recommended 180µm minimum 260µm maximum Solder mask opening: 320µm recommended 300µm minimum 340µm maximum Copper pad diameter: 320µm recommended 300µm minimum Solder stencil opening: 220µm recommended Solder stencil opening : 220µm recommended Line to connect copper pad on solder mask opening shopuld be smaller than copper pad diameter 6/9 DocID023215 Rev 3 BAL-NRF01D3 Package information Figure 13. Marking Dot, ST logo ECOPACK grade xx = marking z = manufacturing location yww = datecode x x z y ww Figure 14. Flip Chip tape and reel specifications Dot identifying Pin A1 location 2.0 Ø 1.55 4.0 xxz yww ST 3.5 1.1 xxz yww ST xxz yww ST 8.0 1.57 1.75 0.22 4.0 0.71 All dimensions are typical values in mm Note: User direction of unreeling More information is available in the STMicroelectronics Application notes: AN2348 Flip-Chip: “Package description and recommendations for use” AN4111: “BAL-NRF01D3 matched balun with integrated harmonics filter for Nordic Semiconductor chips with ultralow power transceivers” DocID023215 Rev 3 7/9 Ordering information 4 BAL-NRF01D3 Ordering information Table 4. Ordering information 5 Order code Marking Weight Base Qty Delivery mode BAL-NRF01D3 SC 1.82 mg 5000 Tape and Reel Revision history Table 5. Document revision history 8/9 Date Revision Changes 15-Oct-2012 1 Initial release 13-Nov-2012 2 Added references to nRF51 series. Added Figure 9. Updated y-axis labels in Figure 2. 04-Mar-2013 3 Updated footprint illustrations in Figure 11, and Figure 12. 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